Heat dissipation structure to improve heat dissipation efficiency

Abstract

This invention relates to a heat dissipation structure for improving heat dissipation efficiency, comprising a heat spreader, heat pipes, and heat sink elements. The heat spreader has at least one or more connection holes distributed on its top cover for assembling the heat pipes, allowing the working fluid in each assembled heat pipe to form a continuous flow circulation with the working fluid in the accommodating space formed by the top cover and bottom shell. At least one heat sink element is assembled on each heat pipe. After receiving the heat source from the electronic component, the heat spreader carries the heat source upwards and directly into each heat pipe. The heat pipe then conducts the heat source to the heat sink element assembled on the heat pipe, and the airflow carries the heat source away to cool it down, greatly improving the heat dissipation effect of the electronic component.

Claims

1. A heat dissipation structure for improving heat dissipation efficiency, comprising a heat spreader, heat pipes, and heat sink elements, characterized in that: at least one or more assembly connection holes for assembling heat pipes are distributed on the top of the heat spreader, allowing the working fluid in each assembled heat pipe to form an integrated and continuous flow circulation state with the working fluid in the heat spreader; at least one heat sink element is assembled on the heat pipe; after receiving the heat source from the electronic component, the heat spreader carries the heat source upwards and directly into each heat pipe; the heat pipe then conducts the heat source to the heat sink element assembled on the heat pipe; and the heat source is then carried away by the airflow to cool down, thereby shortening and quickly removing the heat source from the electronic component and significantly improving the heat dissipation effect of the electronic component.

2. The heat dissipation structure for improving heat dissipation efficiency as described in claim 1, wherein the heat sink element has a plurality of rows of continuous arcuate protrusions, one above and one below, and each row of continuous arcuate protrusions, one above and one below, to increase the probability of contact with air and improve the heat dissipation effect.

3. The heat dissipation structure for improving heat dissipation efficiency as described in claim 2, wherein the heat sink element has a plurality of rows of continuous arc protrusions, one above and one below, which also form holes for heat pipes to pass through, and welding is performed at each hole through which each heat pipe passes through the heat sink element so that the heat pipe can form a tight contact with the heat sink element, thereby improving the heat conduction effect.

4. The heat dissipation structure for improving heat dissipation efficiency as described in claim 1, wherein each arc protrusion of the heat sink element can be processed with a plurality of patterns to disperse heat dissipation and increase the contact rate with air, and to generate a height difference so that when the airflow blows, turbulence is generated and the heat source is carried away, thereby greatly improving the heat dissipation effect of electronic components.

5. The heat dissipation structure for improving heat dissipation efficiency as described in claim 1, wherein the heat sink element is made of a metal material with good thermal conductivity and heat dissipation properties.

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