Multifunctional floor cleaning device for semiconductor industry

Abstract

This invention discloses a multifunctional floor cleaning device in the semiconductor field, comprising a floor cleaning unit; the floor cleaning unit includes: a control and filtration module, a motion module, and a dust removal module; the control and filtration module is located above the motion module, and includes a filtration module, a control module, and a fan module; the control module includes a dust removal control submodule and a motion control submodule, the dust removal control submodule being connected to the fan, a brush drive motor, and a height control motor; the motion module includes a drive module, a communication module, and a sensing module, the drive module including a servo motor, drive wheels, and a power supply; the communication module being connected to a host computer system; the sensing module including a laser radar and an inertial navigation sensor. This invention reduces the power burden on the fan under the same operating conditions; at the same time, the integration of the fan effectively reduces the overall size of the device and the floor space required.

Claims

1. A multifunctional floor cleaning device for the semiconductor industry, comprising: Ground cleaning device (11); The ground cleaning device (11) is characterized by having a control and filtration module (13), a motion module (14), and a dust removal module (15). The control and filtration module (13) is located above the motion module (14), and includes a filtration module (21), a control module (22), and a fan module (23). The control module (22) includes a dust removal control submodule and a motion control submodule, and the dust removal control submodule is connected to the fan (33), the brush drive motor (34), and the height control motor (35). The motion module (14) includes a drive module (24), a communication module (25), and a sensing module (26). The drive module (24) includes a servo motor, a drive wheel, and a power supply. The communication module (25) is connected to the host computer system. The sensing module (26) includes a laser radar and an inertial navigation sensor. The dust removal module (15) is located below the motion module (14) and is controlled by the dust removal control sub-module of the control and filtration module (13). The dust removal module (15) includes an ultrasonic cleaning module (28), a rotary cleaning module (29), and a brush cleaning module (27). The ultrasonic cleaning module (28) is equipped with a dust removal head (36). The filtration module (21) includes a high-efficiency filter (32).

2. The multifunctional floor cleaning device for the semiconductor field as described in claim 1, wherein, The dust removal head (36) has two spaced cavities: a positive pressure cavity (37) and a negative pressure cavity (39). The positive pressure cavity (37) is connected to the air inlet (45), and there is a blower slit (38) on the bottom surface of the positive pressure cavity (37). The negative pressure cavity (39) is connected to the air inlet (46), and there is a narrow exhaust slit at the bottom of the negative pressure cavity (39). There is a gap between the positive pressure cavity (37) and the top plate of the dust removal head (36) frame. The ratio of the height of the positive pressure cavity (37) to the height of the dust removal head (36) cavity is 2 / 3 to 3 / 4:

1.

3. The multifunctional floor cleaning device for the semiconductor field as described in claim 2, wherein, The bottom of the negative pressure chamber (39) is provided with a first exhaust slit (41), a second exhaust slit (42), and a third exhaust slit (43); the distance C1 between the air blowing slit (38) at the bottom of the dust removal head (36) and the first exhaust slit (41) is between 15 and 25 mm, and the distance C2 between the first exhaust slit (41) and the second exhaust slit (42) is between 10 and 15 mm; the air blowing slit (38) is provided with a third exhaust slit (43) at both ends, and the distance C3 between the end of the air blowing slit (38) and the third exhaust slit (43) is between 5 and 8 mm.

4. The multifunctional floor cleaning device for the semiconductor field as described in claim 1, wherein, The control module (22) includes a height control motor (35), and the filter module (21) is equipped with a primary filter (31) and a high-efficiency filter (32); the air volume ratio of the blowing gap (38) to the air volume of the first exhaust gap (41) is 1:1.5~2, the air volume of the first exhaust gap (41) is equal to the air volume of the second exhaust gap (42), and the air volume ratio of the blowing gap (38) to the air volume of the third exhaust gap (43) is 1:1.5~2; the pressure ratio of the first exhaust gap (41), the second exhaust gap (42), the third exhaust gap (43) to the pressure of the blowing gap (38) is 1:8~12.

5. The multifunctional floor cleaning device for the semiconductor field as described in claim 1, wherein, The dust removal head (36) is provided with baffles (44) on both sides; the ground cleaning device (11) includes a frame (51), the bottom of the frame (51) is provided with a dust removal head (36), the dust removal head (36) is provided with a height control motor (35) on the top of the dust removal head (36), the height control motor (35) is set on the frame (51), and the height control motor (35) is connected to the dust removal head (36).

6. The multifunctional floor cleaning device for the semiconductor field as described in claim 2, wherein, The bottom of the positive pressure chamber (37) is provided with a blowing gap (38) that is traversed by a multi-stage pulse channel (47). The multi-stage pulse channel (47) includes a double-stage expansion airway cavity (59) and a two-stage narrowing surface channel. The multi-stage pulse channel (47) is provided with the following from top to bottom: the air inlet gap D1 with varying air gap spacing, the first narrowing airway gap D2, the first stage expansion cavity gap D3 of the double-stage expansion airway cavity (59), the second narrowing airway gap D4, the second stage expansion cavity gap D5 of the double-stage expansion airway cavity (59), and the dust blowing gap (38). The air gap spacing on the multi-stage pulse channel (47) is the same for the air inlet gap D1, the first stage expansion cavity gap D3 of the double-stage expansion airway cavity (59), and the second stage expansion cavity gap D5 of the double-stage expansion airway cavity (59). The dust blowing distances of the first narrowing airway spacing D2, the second narrowing airway spacing D4, and the air blowing gap (38) are the same, and the ratio of the air inlet spacing D1 to the first narrowing airway spacing D2 is 1:1.5~2.

7. The multifunctional floor cleaning device for the semiconductor field as described in claim 1, wherein, The rotating cleaning module (29) is provided with a separate rotating module inner cavity (68) and a rotating module outer chamber (69). The rotating module inner cavity (68) of the rotating cleaning module (29) is provided with a rotating cleaning head (61). The bottom sides of the rotating cleaning head (61) are provided with downward protruding pairs of nozzles (65). The rotating cleaning head (61) is provided with spaced side partitions (66) on both sides. The pairs of nozzles (65) at the bottom of the rotating cleaning head (61) are located at the lower part of the side partitions (66). The top of the rotating module outer chamber (69) of the rotating cleaning module (29) is provided with a rotating negative pressure port (62). The bottom of the rotating module outer chamber (69) is provided with a negative pressure suction slit (67). The negative pressure suction slit (67) is located on the outer side of the bottom end of the rotating module inner cavity (68). The rotating negative pressure port (62) and the negative pressure suction slit (67) are connected through each other. The inner cavity (68) of the rotating module is located in the outer chamber (69) of the rotating module. The positive pressure port (64) of the rotating module is connected to the inner cavity (68) of the rotating module, and the negative pressure port (62) of the rotating module is connected to the outer chamber (69) of the rotating module.

8. The multifunctional floor cleaning device for the semiconductor field as described in claim 1, wherein, The dust removal head (36) is provided with a brush cleaning module (27) in front of it, and the brush cleaning module (27) is located at the bottom of the frame (51); the brush cleaning module (27) is provided with a brush (48), the brush (48) is provided with a brush cleaning plate (52) on top of it, and the brush negative pressure port (53) is provided above the brush (48).

9. The multifunctional floor cleaning device for the semiconductor field as described in claim 1, wherein, The dust removal head (36) has a positive pressure fan (54) on its air inlet (45); the dust removal head (36) has a suction port (46) on its negative pressure chamber (39), the suction port (46) is connected to a negative pressure duct (57), the negative pressure duct (57) is connected to a cyclone separator (58), the cyclone separator (58) has a high-efficiency filter (32) on its top, and the high-efficiency filter (32) has a negative pressure fan (55) on its top.

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