Polishing pad dressing and cleaning device

Abstract

This invention belongs to the field of semiconductor equipment technology and discloses a polishing pad conditioning and cleaning device, including a conditioning unit and a cleaning unit. The conditioning unit includes a first base plate, a conditioning component, and a water spraying component. The conditioning component is vertically movably disposed on the first base plate and has a conditioning state in contact with the polishing pad and a separated state away from the polishing pad. The water spraying component includes a receiving tank and a first spraying element that are interconnected, and the receiving tank stores cleaning water.

Claims

1. A polishing pad conditioning and cleaning device, comprising: The trimming unit (1) includes a first base plate (11), a trimming assembly (12), and a water spraying assembly. The trimming assembly (12) is vertically movably disposed on the first base plate (11). The trimming assembly (12) is configured to trim a polishing pad (100). The polishing pad (100) is rotatably disposed above the trimming assembly (12) about vertically. The trimming assembly (12) has a trimming state in contact with the polishing pad (100) and a separated state away from the polishing pad (100). The water spraying assembly includes a container and a first spraying element (131) that are interconnected. The container stores cleaning water. The first spraying element (131) is disposed on the first base plate (11) and is used to spray water onto the polishing pad (100). The cleaning unit (2) includes a second base plate (21), a cleaning assembly (22), and a second spraying element (23). The second base plate (21) is movably disposed on the first base plate (11) in the X direction. The cleaning assembly (22) is movably disposed on the second base plate (21) in the vertical direction. The cleaning assembly (22) has a cleaning state in parallel contact with the polishing pad (100). The second spraying element (23) is disposed on the second base plate (21). The second spraying element (23) is configured to communicate with the air supply device and the receiving box. The second spraying element (23) is capable of spraying water mist onto the polishing pad (100).

2. The polishing pad dressing and cleaning apparatus as described in claim 1, wherein, The cleaning assembly (22) includes a brush (221) and a first drive mechanism (222). The brush (221) includes a housing (2211) and bristles (2212). The housing of the first drive mechanism (222) is disposed on the second base plate (21). The output end of the first drive mechanism (222) is connected to the housing (2211) for driving the housing (2211) to move vertically. The bristles (2212) are disposed on the side of the housing (2211) away from the second base plate (21) for brushing the polishing pad (100).

3. The polishing pad dressing and cleaning apparatus as described in claim 2, wherein, The cleaning unit (2) further includes a guide structure (3), which includes a support frame (31) and a guide rod (32). The support frame (31) is disposed on the second base plate (21), and the support frame (31) has a guide through hole that extends vertically. The guide rod (32) is disposed on the housing (2211) and is vertically movably inserted into the guide through hole.

4. The polishing pad dressing and cleaning apparatus as described in claim 1, wherein, The cleaning unit (2) further includes a second driving mechanism (24), which is disposed on the first base plate (11) and is used to drive the second base plate (21) to move along the X direction.

5. The polishing pad dressing and cleaning apparatus as described in claim 4, wherein, The second drive mechanism (24) includes a first motor, a gear and a rack. A first guide rail extending along the X direction is provided on the first base plate (11). The rack is provided on the first base plate (11) and extends along the X direction. The gear is connected to the output end of the first motor and meshes with the rack. The housing of the first motor slides along the X direction with the first guide rail. The housing of the first motor is connected to the side of the second base plate (21) facing the first base plate (11).

6. The polishing pad dressing and cleaning apparatus as described in claim 4, wherein, The second drive mechanism (24) includes a second motor, a screw, and a nut. The housing of the second motor is disposed on the first base plate (11). The screw extends along the X direction. The output end of the second motor is connected to the screw in a transmission connection. The nut is sleeved on the screw and is connected to the side of the second base plate (21) facing the first base plate (11). The screw can rotate under the drive of the second motor to drive the nut to move along the screw.

7. The polishing pad dressing and cleaning apparatus as described in claim 4, wherein, The cleaning unit (2) further includes a plurality of second guide rails (25), which are spaced apart on the first base plate (11) along the Y direction and extend along the X direction, which is perpendicular to the Y direction. A plurality of sliders (26) are provided on the side of the second base plate (21) facing the first base plate (11), and the plurality of sliders (26) slide in a one-to-one correspondence with the plurality of second guide rails (25).

8. The polishing pad dressing and cleaning apparatus as described in any one of claims 1 to 7, wherein, The trimming assembly (12) includes a trimming disc (121) and a third drive mechanism (122). The housing of the third drive mechanism (122) is disposed on the first base plate (11). The output end of the third drive mechanism (122) is connected to the trimming disc (121) for transmission. The third drive mechanism (122) is used to drive the trimming disc (121) to move vertically so that the trimming disc (121) moves closer to or away from the polishing pad (100).

9. The polishing pad dressing and cleaning apparatus as described in any one of claims 1 to 7, wherein, The second spraying element (23) has a spraying port (231), the length of which is greater than the diameter of the polishing pad (100).

10. The polishing pad dressing and cleaning apparatus as described in any one of claims 1 to 7, wherein, The second jetting element (23) includes a two-fluid atomizing air knife.

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