Thermal management system for data centre

Abstract

The present invention relates to a wide range of technical fields of thermal engineering, and particularly to a thermal management system (1) for a data center. The thermal management system (1) includes at least two heat removal units (5), which are in particular heat exchangers installed on server racks (3) within the data center, for effectively removing heat from the server racks (3) to the external environment or CRAC devices, thereby maintaining optimal operating conditions within the data center.

Claims

1. A thermal management system (1) for a data center, characterized in that the thermal management system comprises: At least two first heat removal units (5) are arranged in a manner that is generally parallel to each other.

2. The thermal management system (1) for a data center as described in claim 1, wherein, The length of one of the first heat removal units (5a) is longer or shorter than that of the other first heat removal unit (5b).

3. The thermal management system (1) for a data center as described in claim 1 or 2, wherein, The thermal management system (1) is a rear-door heat exchanger.

4. The thermal management system (1) for a data center as described in claim 3, wherein, Each of the first heat removal units (5) includes: at least one frame (9); a plurality of conduits (11) disposed within the frame (9) and spaced apart from each other; a multilayer heat conduction surface (13) disposed within the frame (9) and located between the spaced-apart conduits (11); at least one fluid inlet (15) for introducing at least one fluid into the plurality of conduits (11); and at least one fluid outlet (17) for discharging the fluid from the plurality of conduits (11).

5. The thermal management system (1) for a data center as described in claim 4, wherein, Each of the catheters (11) contains at least one microchannel (19) or multiple microchannels (19).

6. The thermal management system (1) for a data center as described in claim 4, wherein, The heat-conducting surface (13) is a fin-shaped element.

7. The thermal management system (1) for a data center as described in claim 4, wherein, Each of the first heat removal units (5) is a finned duct-type heat exchanger.

8. The thermal management system (1) for a data center as described in claim 4, wherein, The fluid introduced from the fluid inlet (15) into the conduit (11) is liquid, and the fluid discharged from the conduit (11) to the fluid outlet (17) is gaseous.

9. The thermal management system (1) for a data center as described in claim 1, wherein, At least one second heat removal unit (7) is disposed between the two first heat removal units (5a, 5b).

10. The thermal management system (1) for a data center as described in claim 9, wherein, The second heat removal unit (7) includes at least one exhaust fan (7a) or multiple exhaust fans (7a).

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