Refrigerant immersion heat dissipation device

TWM688240UActive Publication Date: 2026-10-01张世平
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Patent Information

Application Number
TW115206328
Authority / Receiving Office
TW · TW
Patent Type
Utility models
Current Assignee / Owner
Filing Date
2026-07-02
Publication Date
2026-10-01
Estimated Expiration
2036-07-01

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Abstract

This invention provides a refrigerant immersion-type heat dissipation device, which includes an evaporator and a heat exchange component. The evaporator has a chamber containing liquid refrigerant. The heat exchange component is disposed in the chamber and immersed in the liquid refrigerant, and includes a plurality of heat sinks with small holes, a connecting heat conduction plate, and an external equipment heat transfer plate. The connecting heat conduction plate extends out of the evaporator to enable the external equipment heat transfer plate to conduct heat to the external equipment. By directly exchanging heat with the liquid refrigerant through the heat exchange component, the heat transfer path can be shortened, and the heat exchange efficiency and heat dissipation effect can be improved.
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Claims

1. A refrigerant immersion heat dissipation device, comprising: An evaporator (1) has a chamber (11) inside which a liquid refrigerant (12) is placed; and a heat exchange assembly (2) is disposed in the chamber (11) and immersed in the liquid refrigerant (12). The heat exchange assembly (2) includes a plurality of parallel heat sinks (21) with a plurality of small holes (211), a connecting heat-conducting plate (22) connected to the heat sinks (21), and an external device heat transfer plate (23) connected to the connecting heat-conducting plate (22). The connecting heat-conducting plate (22) extends out of the evaporator (1) and is exposed to the outside, so that the external device heat transfer plate (23) can be connected to an external device (10) for heat conduction.

2. The refrigerant immersion heat dissipation device as described in claim 1, wherein, The heat exchange component (2) is made of copper.

3. The refrigerant immersion heat dissipation device as described in claim 1, wherein, The heat exchange component (2) is made of aluminum.

4. The refrigerant immersion heat dissipation device as described in claim 1, wherein, The evaporator (1) has a refrigerant inlet (13) and a refrigerant outlet (14) for refrigerant to flow into and out of the chamber (11).

5. The refrigerant immersion heat dissipation device as described in claim 4, wherein, The evaporator (1) is also connected to a refrigeration cycle system (3), which includes a compressor (31), a condenser (32) and a liquid receiver (33).

6. The refrigerant immersion heat dissipation device as described in claim 5, wherein, The connecting heat-conducting plate (22) is equipped with a temperature switch (24), which is electrically connected to the refrigeration cycle system (3) and controls the start or stop of the refrigeration cycle system (3) according to the temperature of the connecting heat-conducting plate (22).

7. The refrigerant immersion heat dissipation device as described in claim 1, wherein, The external device heat transfer plate (23) and the connecting heat conduction plate (22) are connected by welding or screwing.

8. The refrigerant immersion heat dissipation device as described in claim 1, wherein, The external device heat transfer plate (23) is welded or screwed to the external device (10).