Electronic devices with dual-chamber heat dissipation

Abstract

This disclosure relates to an electronic device with dual-chamber heat dissipation for heat source cooling. The electronic device includes a device body and a heat dissipation structure. The device body includes a housing, which internally divides into a first chamber, a second chamber, and a partition between the first and second chambers. The partition has perforations. The heat source is located in the first chamber. The heat dissipation structure includes a heat-conducting block, a heat dissipation fin assembly, and a heat pipe. The heat-conducting block is located in the first chamber and thermally bonded to the heat source. The heat dissipation fin assembly is located in the second chamber. The heat pipe passes through the perforations, with one end thermally bonded to the heat-conducting block and the other end thermally bonded to the heat dissipation fin assembly. Therefore, the disclosed electronic device features isolation from heat conduction and heat radiation return, prevention of mutual interference between the heat source and heat dissipation, avoidance of heat accumulation problems, and improved heat dissipation efficiency.

Claims

1. An electronic device with dual-chamber heat dissipation for cooling a heat source, the electronic device comprising: An electronic device body includes a housing that internally divides a first chamber, a second chamber, and at least one partition disposed between the first chamber and the second chamber, the at least one partition having a perforation, and a heat source disposed in the first chamber; and a heat dissipation structure including a heat-conducting block, a heat dissipation fin assembly, and a heat pipe, the heat-conducting block being disposed in the first chamber and thermally attached to the heat source, the heat dissipation fin assembly being disposed in the second chamber, and the heat pipe passing through the perforation and having one end thermally attached to the heat-conducting block and the other end thermally attached to the heat dissipation fin assembly.

2. The electronic device with dual-chamber heat dissipation as claimed in claim 1, wherein the housing is provided with an air vent and an air inlet formed on the upper and lower sides of the second chamber, the heat dissipation fin assembly has a plurality of heat dissipation fins arranged vertically and spaced apart from each other, and a plurality of heat dissipation channels are formed between the plurality of heat dissipation fins, one side of which is arranged opposite to the air vent and the other side of which is arranged opposite to the air inlet.

3. The electronic device with dual-chamber heat dissipation as described in claim 2, wherein the plurality of heat dissipation fins absorb the heat energy of the heat source and generate a temperature difference to guide an external air to form an upward airflow that enters from the air inlet, flows through the plurality of heat dissipation channels, and exits from the air outlet.

4. The electronic device with dual-chamber heat dissipation as described in claim 2, wherein the heat dissipation structure further includes a centrifugal fan disposed in the second chamber and located between the heat dissipation fin assembly and the exhaust port, or located between the heat dissipation fin assembly and the air inlet, wherein the air outlet direction of the centrifugal fan is configured toward the exhaust port.

5. The electronic device with dual-chamber heat dissipation as described in claim 2, wherein the electronic device body further includes a display screen mounted on the front side of the housing, the exhaust vent being disposed on the same side as the top of the display screen, and the air inlet being disposed on the same side as the bottom of the display screen.

6. The electronic device with dual-chamber heat dissipation as claimed in claim 2, wherein the heat-conducting block is provided with a first groove, the heat dissipation fin assembly has a heat-conducting plate, the plurality of heat dissipation fins extend from the heat-conducting plate, the heat-conducting plate is provided with a second groove, and one end of the heat pipe is fitted into the first groove and the other end is fitted into the second groove.

7. The electronic device with dual-chamber heat dissipation as claimed in claim 2, wherein the housing has an inner peripheral wall formed at the periphery of the second chamber and disposed between the exhaust port and the inlet port, the inner peripheral wall enclosing a natural convection channel.

8. The electronic device with dual-chamber heat dissipation as claimed in claim 2, wherein the heat dissipation fin assembly has a heat-conducting plate and a plurality of heat dissipation fins and two air guides extending from the heat-conducting plate, the two air guides being arranged side by side on both sides of the plurality of heat dissipation fins and extending at one end to the exhaust port and at the other end to the air inlet.

9. The electronic device with dual-chamber heat dissipation as claimed in claim 8, wherein the housing has an inner peripheral wall formed at the periphery of the second chamber and disposed between the exhaust port and the inlet port, the heat-conducting plate is fixed to one side of the inner peripheral wall, the two air guide plates abut against the other side of the inner peripheral wall, and the heat-conducting plate, the two air guide plates and the inner peripheral wall form a natural convection channel.

10. The electronic device with dual-chamber heat dissipation as claimed in claim 8, wherein the two air guides have two straight sections disposed on both sides of the plurality of heat dissipation fins.

11. The electronic device with dual-chamber heat dissipation as claimed in claim 10, wherein the two air guides have two downwardly expanding inclined sections disposed between the two straight sections and the air inlet and with the spacing gradually increasing toward the air inlet.

12. The electronic device with dual-chamber heat dissipation as claimed in claim 10, wherein the two air guides have two upwardly expanding inclined sections disposed between the two straight sections and the exhaust port and with the spacing gradually increasing toward the exhaust port.

13. The electronic device with dual-chamber heat dissipation as claimed in claim 1, wherein the housing includes a front housing and a rear housing stacked front to rear, the first chamber, the second chamber and the at least one partition are formed inside the rear housing, and the electronic device body further includes a display screen mounted on the front side of the front housing.

14. The electronic device with dual-chamber heat dissipation as claimed in claim 13, further comprising a heat insulation pad sandwiched between the front housing and the rear housing.

15. The electronic device with dual-chamber heat dissipation as claimed in claim 13, wherein the rear housing includes a first housing and a second housing fixed to the rear side of the front housing and arranged side by side, the first chamber being formed inside the first housing, the second chamber being formed inside the second housing, and a plurality of partitions being formed on the sides of the first housing and the second housing adjacent to each other.

16. The electronic device with dual-chamber heat dissipation as claimed in claim 13, wherein the rear housing has a front sidewall, a rear sidewall, a top sidewall and a bottom sidewall, and a partition is installed inside the rear housing and abuts against the front sidewall, the rear sidewall, the top sidewall and the bottom sidewall to separate the interior of the rear housing into a first chamber and a second chamber disposed on both sides of the partition.

Images