Electronic devices, housing assemblies and electronic components

Abstract

An electronic device, a housing assembly, and an electronic component are disclosed. The electronic device is used to secure itself within a housing and includes the housing assembly and a motherboard assembly. The housing assembly includes a housing and a mounting structure. The mounting structure includes an assembly protrusion, two push-off portions, and a fastening portion. The assembly protrusion is fixed to the housing and protrudes beyond the housing. The assembly protrusion has a thermal contact surface and two push-off ramps. The two push-off ramps face each other and are opposite to the thermal contact surface. Each of the two push-off portions has a push-off ramp. The assembly protrusion is located between the two push-off portions. The fastening portion passes through the two push-off ramps and the two push-off ramps, and is used to secure the housing within the housing by having the two push-off ramps push against the two push-off ramps respectively. The motherboard assembly includes a motherboard and a heat source. The heat source is thermally coupled to the housing. The assembly protrusion and at least a portion of the housing are integrally formed.

Claims

1. An electronic device for being fixed in a housing and comprising: a housing assembly, comprising: a housing; and at least one mounting structure comprising an assembly protrusion, two push-off portions, and a fastening portion, the assembly protrusion being fixed to the housing and protruding beyond the housing, the assembly protrusion having a thermal contact surface and two push-receiving inclined surfaces, the two push-receiving inclined surfaces facing each other and opposite to the thermal contact surface, the thermal contact surface being for thermally contacting the housing, each of the two push-off portions having a push-receiving inclined surface, the assembly protrusion being located between the two push-off portions, the fastening portion passing through the two push-receiving inclined surfaces of the assembly protrusion and the two push-receiving inclined surfaces of the two push-off portions, and for fixing the housing in the housing by causing the two push-receiving inclined surfaces to push against the two push-receiving inclined surfaces respectively; and a motherboard assembly comprising a motherboard and at least one heat source, the at least one heat source being disposed on the motherboard, the motherboard being disposed in the housing, the at least one heat source being thermally coupled to the housing; wherein... The assembly protrusion and at least part of the housing are integrally formed.

2. The electronic device as claimed in claim 1, wherein the housing includes a top cover and a bottom cover, the top cover and the bottom cover together forming an accommodating space, the motherboard is disposed in the accommodating space, the top cover is further away from the motherboard than the bottom cover, the top cover is thermally coupled to the at least one heat source, and the assembly protrusion and the top cover are integrally formed.

3. The electronic device as claimed in claim 2, wherein the top cover includes a top plate and two first side plates, the two first side plates being respectively connected to opposite sides of the top plate, and the assembly protrusion protrudes from one of the two first side plates on the side away from the top plate.

4. The electronic device as claimed in claim 3, wherein the bottom cover includes a bottom plate and two second side plates, the two second side plates being respectively connected to opposite sides of the bottom plate, and the two first side plates being respectively fixed and in thermal contact with the two second side plates.

5. The electronic device as claimed in claim 3, wherein the number of the at least one mounting structure is two, and the two assembly protrusions of the two mounting structures respectively protrude from the side of the two first side plates away from the top plate.

6. The electronic device as claimed in claim 1, wherein the thermal contact surface is farther away from the at least one heat source than the two pushed inclined surfaces.

7. The electronic device as claimed in claim 1, wherein the width of the housing in a projecting direction of the assembly protrusion is 89 mm.

8. The electronic device as claimed in claim 1, wherein the depth of the housing in one penetration direction of the fastener is 78 mm.

9. A housing assembly for fixing to a housing and comprising: a housing; and at least one mounting structure including an assembly protrusion, two push-off portions, and a fastening portion, the assembly protrusion being fixed to the housing and protruding beyond the housing, the assembly protrusion having a thermal contact surface and two push-receiving inclined surfaces, the two push-receiving inclined surfaces facing each other and opposite to the thermal contact surface, the thermal contact surface for thermal contact with the housing, each of the two push-off portions having a push-receiving inclined surface, the assembly protrusion being located between the two push-off portions, and the fastening portion passing through the two push-receiving inclined surfaces of the assembly protrusion and the two push-receiving inclined surfaces of the two push-off portions, thereby fixing the housing to the housing by causing the two push-receiving inclined surfaces to push against the two push-receiving inclined surfaces respectively; wherein... The assembly protrusion and at least part of the housing are integrally formed.

10. An electronic component comprising: a housing having at least one mounting recess; and an electronic device comprising: a housing assembly including a housing and at least one mounting structure, the at least one mounting structure including an assembly protrusion, two push-off portions and a fastening portion, the assembly protrusion being fixed to the housing and protruding beyond the housing, the assembly protrusion having a thermal contact surface and two push-off ramps, the two push-off ramps being opposite to each other and facing away from the thermal contact surface, the thermal contact surface being in thermal contact with an inner surface of the housing forming the at least one mounting recess, each of the two push-off portions having a The assembly protrusion is located between the two pushing portions, and the fastening portion passes through the two pushing inclined surfaces of the assembly protrusion and the two pushing inclined surfaces of the two pushing portions, so that the two pushing inclined surfaces respectively push against the two pushing inclined surfaces, allowing the assembly protrusion and the two pushing portions to fix the housing in the at least one mounting groove of the housing by pressing against the inner surface; and a main board assembly, including a main board and at least one heat source, the at least one heat source being disposed on the main board, the main board being disposed in the housing, and the at least one heat source being thermally coupled to the housing; wherein. The assembly protrusion and at least part of the housing are integrally formed.

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