Heat conduction device for electronic heat source

Abstract

The heat-conducting device for the electronic heat source of this invention includes a circuit board, an electronic heat source, a phase-changeable solid metal cover, and a heat dissipation module. The electronic heat source is connected to a positioning base and electrically connected to the circuit board. The positioning base surrounds the electronic heat source. The phase-changeable solid metal cover covers the electronic heat source and includes a flat cover plate and a ring wall. The flat cover plate contacts the heat-generating surface of the electronic heat source. The ring wall is connected to the flat cover plate and faces the side of the electronic heat source. The heat dissipation module is fixedly connected to the circuit board and contacts the flat cover plate of the phase-changeable solid metal cover, and is used to apply a pressure toward the circuit board to the phase-changeable solid metal cover and the electronic heat source.

Claims

1. A heat-conducting device for an electronic heat source, comprising: A circuit board having a chip mounting area and a positioning seat located in the chip mounting area; An electronic heat source is disposed in the wafer mounting area and connected to the positioning base and electrically connected to the circuit board. The electronic heat source has a heating surface, wherein the positioning base surrounds the electronic heat source. A phase-changeable solid metal cover covers the electronic heat source and includes a flat cover plate and a ring wall. The flat cover plate contacts the heating surface of the electronic heat source, and the ring wall is connected to the flat cover plate and faces the side of the electronic heat source. A heat dissipation module is fixedly connected to the circuit board and contacts the flat cover plate of the phase-changeable solid metal cover, and is used to apply a pressure toward the circuit board to the phase-changeable solid metal cover and the electronic heat source.

2. The heat-conducting device for the electronic heat source as described in claim 1, wherein, The ring wall connects to the flat cover and contacts the positioning seat, so that the phase-changeable solid metal cover and the positioning seat form a closed space.

3. The heat-conducting device for the electronic heat source as described in claim 2, wherein, The area of ​​the flat cover extends beyond the heating surface of the electronic heat source.

4. The heat-conducting device for the electronic heat source as described in claim 2, wherein, The positioning base includes a connecting portion and a protrusion. The connecting portion connects the electronic heat source and the circuit board. The protrusion is connected to the circuit board and faces the connecting portion at a distance. The ring wall of the phase-changeable solid metal cover is located between the connecting portion and the protrusion.

5. The heat-conducting device for the electronic heat source as described in claim 1 or 2, wherein, The positioning seat includes a groove into which the phase-changeable solid metal cap is inserted.

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