Heat conduction device

Abstract

The heat-conducting device of this invention includes a circuit module, a heat dissipation module, and a heat-conducting layer. The circuit module includes a circuit board, an electronic heat source, and multiple soldered structures. The electronic heat source is electrically connected to the circuit board through the multiple soldered structures. The electronic heat source has a heating surface and an operating temperature. Each of the multiple soldered structures has a melting temperature. The heat-conducting layer connects the heating surface of the electronic heat source and the heat dissipation module, and has a phase change temperature. The heat-conducting layer cannot flow when the ambient temperature is below the phase change temperature. The melting temperature is the highest, the phase change temperature is between the melting temperature and the operating temperature, and the operating temperature is the lowest.

Claims

1. A heat-conducting device, comprising: A circuit module includes a circuit board, an electronic heat source, and multiple soldering structures. The electronic heat source is electrically connected to the circuit board through the multiple soldering structures. The electronic heat source has a heating surface and an operating temperature. Each of the multiple soldering structures has a melting temperature. A heat dissipation module and a thermally conductive layer connect the heating surface of the electronic heat source and the heat dissipation module, and have a phase change temperature. The thermally conductive layer cannot flow when the ambient temperature is lower than the phase change temperature. The melting temperature is the highest, the phase change temperature is between the melting temperature and the operating temperature, and the operating temperature is the lowest.

2. The heat-conducting device as claimed in claim 1, wherein, The thermally conductive layer can flow when the ambient temperature is higher than the phase transition temperature.

3. The heat-conducting device as claimed in claim 1, wherein, The bonding force of the welding structure to the circuit board and the electronic heat source is greater than the bonding force of the thermally conductive layer to the heat dissipation module and the electronic heat source.

4. The heat-conducting device as claimed in claim 1, wherein, The material of the thermal conductive layer contains metal particles or graphite particles, but does not contain any components that can corrode aluminum or copper.

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