Modular high-frequency spring pin connection unit

TWM688467UActive Publication Date: 2026-10-11刘松哲
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Patent Information

Application Number
TW115204819
Authority / Receiving Office
TW · TW
Patent Type
Utility models
Current Assignee / Owner
Filing Date
2026-05-27
Publication Date
2026-10-11
Estimated Expiration
2036-05-26

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    Figure TWG2TB001916058_003
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Abstract

This disclosure provides a modular high-frequency spring pin connector unit, comprising: at least one spring probe having an axially compressible elastic contact structure; a dielectric material layer disposed around the spring probe to fix the relative position of the spring probe; and a metal shielding shell covering the outer side of the dielectric material layer. The outer surface of the metal shielding shell is provided with a first coupling surface and a second coupling surface, both having a preset geometric contour and positioning features. The first coupling surface is used to mechanically engage with the second coupling surface of an adjacent connector unit, thereby allowing for free combination into connector assemblies with various geometric configurations according to different application requirements.
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Claims

1. A modular high-frequency spring pin connection unit, comprising: At least one spring probe having an axially compressible elastic contact structure; A dielectric material layer is disposed around the spring probe to fix the relative position of the spring probe; and a metal shielding shell is covered outside the dielectric material layer. The outer surface of the metal shielding shell is provided with a first coupling surface and a second coupling surface. The first coupling surface and the second coupling surface both have a preset geometric contour and positioning features. The first coupling surface is used to mechanically combine with the second coupling surface of another adjacent connecting unit to form a connector assembly.

2. The modular high-frequency spring pin connection unit as described in claim 1, wherein, The connection unit includes two spring probes. When the spring probes are arranged in a group, a differential signal pair is formed between them. When the dielectric material layer is disposed around the spring probes, the dielectric material layer provides the required dielectric constant and controls the characteristic impedance of the differential signal pair. The metal shielding shell and the differential signal together form a coaxial differential transmission line structure, and the metal shielding shell after the connection units are combined forms a continuous shielding wall.

3. The modular high-frequency spring pin connection unit as described in claim 1 or 2, wherein, The first coupling surface and the second coupling surface adopt at least one of the following: groove, flange, snap-fit ​​or guide structure.

4. The modular high-frequency spring pin connection unit as described in claim 1, wherein, The connection unit includes four spring probes, and each connection unit has a compatible first coupling surface and a second coupling surface.

5. The modular high-frequency spring pin connection unit as described in claim 4, wherein, The spring probes are arranged in a 2×2 matrix within the metal shielding housing, such that the connection unit contains two pairs of differential signal pairs, which are isolated from each other by a plate-shaped dielectric material layer.

6. The modular high-frequency spring pin connection unit as described in claim 2, wherein, The differential channel of this connection unit has an insertion loss of less than 1.0 dB, a return loss of better than -15 dB, and a mode conversion of less than -40 dB in the frequency range from DC to 120 GHz. The characteristic impedance of the differential channel is 70 to 110 Ω.

7. The modular high-frequency spring pin connection unit as described in claim 2, wherein, The metal shielding shell is made of materials such as copper alloy, stainless steel, nickel-plated copper or gold-plated copper, and the metal shielding shell system is made by precision stamping, precision turning or metal injection molding.

8. The modular high-frequency spring pin connection unit as described in claim 2, wherein, The dielectric material layer is made of liquid crystal polymer, polyetheretherketone, polytetrafluoroethylene or other high-frequency, low-loss engineering plastics with a dielectric constant of less than 3.5 and a loss tangent of less than 0.

005.

9. The modular high-frequency spring pin connection unit as described in claim 2, wherein, The diameter of the spring probe is 0.1 to 0.5 mm, the length of the connecting unit is 1.5 to 5.0 mm, and the overall height and thickness of the connecting unit is 0.2 to 1.0 mm.