Grinding disc
Patent Information
- Application Number
- TW115206842
- Authority / Receiving Office
- TW · TW
- Patent Type
- Utility models
- Current Assignee / Owner
- Filing Date
- 2026-07-20
- Publication Date
- 2026-10-11
- Estimated Expiration
- 2036-07-19
Smart Images

Figure TWG2TB001916191_001 
Figure TWG2TB001916191_002 
Figure TWG2TB001916191_003
Abstract
Claims
1. A grinding disc suitable for polishing or grinding processes, comprising: A substrate having a working surface; a plurality of abrasive grains disposed on or embedded in the working surface; A ceramic layer is formed on the working surface by atomic layer deposition and is a conformal cover layer, wherein the ceramic layer is formed along the outer shape of the substrate and the abrasive grains and extends to at least one pore or interface region between the abrasive grains and the substrate to cover at least a portion of the substrate and at least a portion of the abrasive grains; wherein the ceramic layer is used to improve the wear resistance and chemical corrosion resistance of the polishing disc and reduce the probability of the abrasive grains or microparticles of the substrate falling off the polishing disc.
2. The grinding disc as claimed in claim 1, wherein the ceramic layer forms a continuous or nearly continuous protective structure around the abrasive grains, in the exposed area of the substrate, and in the at least one pore or interface region.
3. The grinding disc as claimed in claim 1, wherein the ceramic layer comprises silicon dioxide, aluminum oxide, titanium dioxide, zirconium dioxide, yttrium oxide, aluminum nitride, silicon nitride, or a combination thereof.
4. The grinding disc as claimed in claim 1, wherein the ceramic layer has a multilayer structure comprising a first ceramic sublayer and a second ceramic sublayer stacked alternately on top of each other.
5. The grinding disc as claimed in claim 4, wherein the first ceramic sublayer comprises alumina and the second ceramic sublayer comprises titanium dioxide.
6. The grinding disc as claimed in claim 1, wherein the thickness of the ceramic layer is less than the height of the exposed portion of one of the abrasive grains relative to one of the working surfaces, such that the exposed portion of the abrasive grains still protrudes from the working surface after the ceramic layer is formed and maintains the ability to finish, grind or polish.
7. The grinding disc as claimed in claim 1, wherein the substrate comprises a polymer resin, composite fiber, stainless steel, ceramic, copper, or a combination thereof.
8. The grinding disc as claimed in claim 1, wherein each of the abrasive grains has a pre-plated ceramic layer located between the abrasive grain and the substrate or a resin matrix, and serves as an interface bridging layer to improve the adhesion between the abrasive grain and the substrate or the resin matrix.
