Valve assembly and semiconductor process equipment
Patent Information
- Application Number
- TW115207133
- Authority / Receiving Office
- TW · TW
- Patent Type
- Utility models
- Current Assignee / Owner
- Priority Date
- 2025-08-19
- Filing Date
- 2026-07-28
- Publication Date
- 2026-10-11
- Estimated Expiration
- 2036-07-27
Smart Images
Figure 00000000_0000_ABST
Abstract
Claims
1. A valve assembly for sealing the transfer port of a process chamber in a semiconductor manufacturing apparatus, wherein, The valve assembly includes: a baffle body, which is a plate-shaped structure for closing the transmission port; a support member connected to the baffle body for driving the baffle body closer to or further away from the transmission port; and an adjustment mechanism for adjusting the distance between the baffle body and the support member at the connection point. Multiple adjustment mechanisms are arranged sequentially between the baffle body and the support member along the length of the baffle body.
2. The valve assembly as claimed in claim 1, wherein, The transmission port is an arc-shaped opening, and the main body of the baffle is an arc-shaped plate structure; and / or, the main body of the baffle is composed of multiple unit plates spliced together, and each unit plate is connected to at least one of the adjustment mechanisms.
3. The valve assembly as claimed in claim 2, wherein, The baffle body includes: at least two rows of the unit plates arranged side by side along the length direction of the baffle body; and / or, at least two rows of the unit plates arranged side by side along the width direction of the baffle body.
4. The valve assembly as described in claim 2 or 3, wherein, The adjacent unit panels are connected by a flexible seal.
5. The valve assembly as claimed in claim 4, wherein, The side of the unit plate is provided with a groove for accommodating the flexible seal.
6. The valve assembly as claimed in claim 1, wherein, The adjustment mechanism includes: a rod-shaped connector, wherein either the baffle body or the support is threadedly connected to the rod-shaped connector, and the other is rotatably connected to the rod-shaped connector; and an elastic member, which is located between the support and the baffle body, with its two ends connected to or abutting against the support and the baffle body, respectively.
7. The valve assembly as claimed in claim 6, wherein, Among the multiple elastic elements, the closer to both ends of the baffle body along its length, the greater the initial elastic force of the elastic element.
8. A semiconductor manufacturing apparatus, comprising a process chamber, the process chamber being provided with a transfer port for conveying a workpiece, wherein, It also includes a valve assembly as described in any one of claims 1 to 7 for controlling the opening and closing of the transmission port.
9. The semiconductor manufacturing apparatus as claimed in claim 8, wherein, The transfer port includes: a first aperture segment close to the inner wall of the process chamber and communicating with the interior of the process chamber; a second aperture segment close to the outer wall of the process chamber and communicating with the first aperture segment; in the depth direction of the transfer port, the projection of the shielding surface of the baffle body on the process chamber is completely located within the second aperture segment and completely covers the first aperture segment.
10. The semiconductor manufacturing apparatus as claimed in claim 9, wherein, At the connection between the first hole segment and the second hole segment, a limiting surface is provided circumferentially for fitting against the shielding surface of the baffle body; and / or, in the direction closer to the interior of the process chamber, the cross-sectional area of the second hole segment gradually decreases.