Automatic calibration optical systems: a comprehensive wafer inspection organization

Abstract

This novel wafer macroscopic comprehensive inspection mechanism is an automatic correction optical system. It primarily consists of a first image capturing device mounted on a frame body, and a multi-axis moving device mounted inside the frame body. A rotary drive device and a wafer stage are movably mounted on the multi-axis moving device. The wafer stage is driven by the rotary drive device to rotate a wafer under test placed on it, with the wafer under test corresponding to the position of the first image capturing device. When the first image capturing device captures a macroscopic image of the wafer under test and executes an image detection algorithm, the multi-axis moving device corrects the position of the wafer stage based on the result of the image detection algorithm. This integrated, one-stop mechanism improves wafer inspection efficiency, space utilization, and reduces costs.

Claims

1. A wafer macroscopic comprehensive inspection mechanism for an automatic calibration optical system, comprising: A frame body having a top and a bottom; a first image capturing device being mounted on the top of the frame body; A multi-axis moving device is disposed at the bottom of the frame body and electrically connected to the first image capturing device; a rotary driving device is movably disposed on the multi-axis moving device; a wafer stage is pivotally mounted on the rotating shaft of the rotary driving device and is used to place a wafer under test, and the wafer under test corresponds to the position of the first image capturing device; wherein, when the first image capturing device captures a macroscopic image of the wafer under test, the first image capturing device executes an image detection algorithm based on the macroscopic image to obtain compensation information, identification code information and surface defect information, and the multi-axis moving device receives the compensation information to correct the position of the wafer stage based on the compensation information.

2. A wafer macroscopic comprehensive inspection mechanism for the automatic correction optical system as described in claim 1, wherein, The frame body includes: a first support member, which forms the top of the frame body, and the first image capturing device is provided on the first support member; a second support member, which is arranged opposite to the first support member to form the bottom of the frame body, the two sides of the second support member are connected to the two sides of the first support member, and the multi-axial moving device is provided on the second support member.

3. A wafer macroscopic comprehensive inspection mechanism for the automatic correction optical system as described in claim 2, wherein, The first support member includes: a crossbeam on which the first image capturing device is mounted; and two side plates located on both sides of the first support member, the tops of which are connected to both sides of the crossbeam, and the bottoms of which are connected to both sides of the second support member.

4. A wafer macroscopic comprehensive inspection mechanism for the automatic correction optical system as described in claim 2, wherein, The second support member includes: a plurality of columns, which are respectively located on both sides of the second support member, and the tops of the columns are respectively connected to both sides of the first support member; a base plate, which is disposed at the bottom of the columns, and the multi-axial moving device is disposed on the base plate, wherein the multi-axial moving device is located between the columns.

5. A wafer macroscopic comprehensive inspection mechanism for the automatic correction optical system as described in claim 2, wherein, The multi-axis moving device includes: a first axis assembly mounted on the second support member and electrically connected to the first image capturing device; a second axis assembly mounted on the first axis assembly and electrically connected to the first image capturing device; a third axis assembly mounted on the second axis assembly; and a connector mounted on the third axis assembly, wherein the connecting member is provided with the rotary drive device.

6. A wafer macroscopic comprehensive inspection facility for the automatic calibration optical system as described in claim 2, comprising: A fixed post is attached to one side of the second support member, and the bottom of the fixed post is attached to the second support member; A second image capturing device is mounted on the top of the fixed post; wherein the second image capturing device captures a side edge image of the wafer under test and detects whether there are defects in the side edge image, so as to generate side edge defect information.

7. The wafer macroscopic comprehensive inspection mechanism of the automatic correction optical system as claimed in claim 2, comprising a plurality of light source devices located between the first image capturing device and the wafer stage, and respectively connected to the first support member.

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