Integrated microstructure patch manufacturing equipment

TWM688688UActive Publication Date: 2026-10-21WIN COAT CORP
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Patent Information

Application Number
TW114212250
Authority / Receiving Office
TW · TW
Patent Type
Utility models
Current Assignee / Owner
Priority Date
2024-12-30
Filing Date
2025-11-18
Publication Date
2026-10-21
Estimated Expiration
2035-11-17

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Abstract

An integrated microstructure patch manufacturing apparatus is disclosed for coating a transport component onto a microstructure patch. The microstructure patch has a patch layer and a microstructure layer disposed on the patch layer. The integrated microstructure patch manufacturing apparatus includes a housing unit, a carrier unit, a coating device, and a processing device. The housing unit defines an accommodating space. The carrier unit includes a stage disposed within the accommodating space. The stage has a support portion for supporting the microstructure patch. The coating device is disposed within the accommodating space and performs a coating process to coat the transport component onto the microstructure layer. The processing device is disposed within the accommodating space and performs a first processing process to process the microstructure patch. Therefore, the integrated microstructure patch manufacturing apparatus has the advantage of low space requirements.
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Claims

1. An integrated microstructure patch manufacturing apparatus for coating a transport component onto a microstructure patch having a patch layer and a microstructure layer disposed on the patch layer, the integrated microstructure patch manufacturing apparatus comprising: a housing unit including a housing defining an accommodating space; a carrier unit including a stage disposed in the accommodating space, the stage having a carrier portion for carrying the microstructure patch; a coating apparatus disposed in the accommodating space and used to perform a coating process to coat the transport component onto the microstructure layer; and a processing apparatus disposed in the accommodating space and used to perform a first processing process to process the microstructure patch.

2. The integrated microstructure patch manufacturing equipment as described in claim 1, wherein, The accommodating space has a coating area and a first processing area. The carrier unit also includes a moving structure for moving the carrier part of the stage between the coating area and the first processing area. When the microstructure patch is located in the coating area, the coating device performs the coating procedure on the microstructure patch. When the microstructure patch is located in the first processing area, the processing device performs the first processing procedure on the microstructure patch.

3. The integrated microstructure patch manufacturing equipment as described in claim 2, wherein, The housing unit also includes a partition disposed in the accommodating space and shielding the coating area and the first processing area.

4. The integrated microstructure patch manufacturing equipment as described in claim 3, wherein, The separator has a channel formed between the coating area and the first processing area, which is used for the microstructure patch to pass through.

5. The integrated microstructure patch manufacturing equipment as described in claim 2, wherein, The accommodating space also has a second processing area. The movable structure can drive the carrier part of the stage to move between the coating area, the first processing area and the second processing area. When the microstructure patch is located in the second processing area, the processing device performs a second processing procedure on the microstructure patch.

6. The integrated microstructure patch manufacturing equipment as described in claim 5, wherein, The first processing step is to sterilize the microstructure patch before coating, and the second processing step is to dry the transport component on the microstructure layer of the coated microstructure patch.

7. The integrated microstructure patch manufacturing equipment as described in claim 6, wherein, The processing apparatus includes a sterilization unit for irradiating the microstructure patch with ultraviolet light to perform the first processing procedure, and a drying unit for delivering gas to the microstructure patch to perform the second processing procedure.

8. The integrated microstructure patch manufacturing equipment as described in claim 6, wherein, The housing unit also includes a partition that shields the area between the coating area and the first processing area, as well as the area between the coating area and the second processing area.

9. The integrated microstructure patch manufacturing equipment as described in claim 2, wherein, The coating area and the first processing area are spaced apart by an axis. The moving structure is used to drive the platform to rotate around the axis, so that the supporting part can move between the coating area and the first processing area.

10. The integrated microstructure patch manufacturing equipment as described in claim 2, wherein, The moving structure is an xy sliding rail structure.

11. The integrated microstructure patch manufacturing equipment as described in claim 1, wherein, A groove is formed on the support portion for accommodating a tray that carries the microstructure patch.

12. The integrated microstructure patch manufacturing apparatus as described in claim 1 further includes a camera unit disposed on the coating apparatus for capturing images of the microstructure patch, and a control unit electrically connected to the coating apparatus and the camera unit, the control unit identifying the position of the microstructure patch or the microstructure layer based on the image acquired by the camera unit, and controlling the coating apparatus to coat the transport component onto the microstructure layer of the microstructure patch.

13. The integrated microstructure patch manufacturing apparatus as described in claim 1 further includes a control unit electrically connected to the carrier unit, the coating apparatus and the processing apparatus, the control unit being able to receive a control command to control at least one of the carrier unit, the coating apparatus and the processing apparatus to perform an automated processing procedure or a manual processing procedure.

14. The integrated microstructure patch manufacturing equipment as described in claim 1, wherein, The coating apparatus includes a spraying unit that can move within the accommodating space and spray the transport component onto the microstructure patch.

15. The integrated microstructure patch manufacturing equipment as described in claim 1, wherein, The coating apparatus includes a base and a pick-and-place unit. The base has a receiving groove for receiving the transport component. The pick-and-place unit is used to pick up the microstructure patch and immerse the microstructure layer of the microstructure patch in the transport component in the receiving groove.

16. The integrated microstructure patch manufacturing apparatus as described in claim 1 further includes a liquid reservoir detachably mounted to the coating apparatus and filled with the transport component.

17. The integrated microstructure patch manufacturing apparatus as claimed in claim 1 further includes a liquid reservoir connected to the coating apparatus, the liquid reservoir being filled with the transport component and a cleaning liquid, the coating apparatus also being able to perform a cleaning procedure to output the cleaning liquid to clean the transport component remaining in the coating apparatus.

18. The integrated microstructure patch manufacturing equipment as described in claim 1, wherein, The first processing procedure involves irradiating the microstructure patch with ultraviolet light to sterilize it or drying the transport component on the microstructure patch.

19. The integrated microstructure patch manufacturing apparatus as claimed in claim 1 further includes a packaging device disposed in the receiving space, the packaging device being used to perform a packaging process, gripping a package and covering the package onto the microstructure patch.