Heat dissipation base of electronic device

TWM688701UActive Publication Date: 2026-10-21AURAS TECH
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Patent Information

Application Number
TW115200897
Authority / Receiving Office
TW · TW
Patent Type
Utility models
Current Assignee / Owner
Priority Date
2025-09-26
Filing Date
2026-01-27
Publication Date
2026-10-21
Estimated Expiration
2036-01-26

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Abstract

An electronic device heat sink includes a body, an inlet connector, an outlet connector, a water tank unit, a water pump unit, a liquid cooling radiator module, and a cooling fan. The water tank unit, water pump unit, liquid cooling radiator module, and cooling fan are all housed within the body, with the water pump unit connected to both the water tank unit and the outlet connector. The liquid cooling radiator module includes a heat dissipation fin assembly and a piping assembly. The piping assembly is located within the heat dissipation fin assembly, thermally connected to the heat dissipation fin assembly, and connected to both the inlet connector and the water tank unit. The cooling fan faces the heat dissipation fin assembly.
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Claims

1. A heat sink for an electronic device, comprising: One inlet connector; One outlet connector; One body; A water tank unit is located within the base; a water pump unit is located within the base and is connected to the water tank unit and the outlet connector respectively; a liquid cooling radiator module includes a first heat dissipation fin assembly and a first piping assembly, the first heat dissipation fin assembly being located within the base and the first piping assembly being located within the first heat dissipation fin assembly, thermally connected to the first heat dissipation fin assembly, and connected to the inlet connector and the water tank unit respectively; and a first cooling fan is located within the base and faces the first heat dissipation fin assembly.

2. The heat sink for an electronic device as claimed in claim 1, wherein the liquid cooling module further comprises a first container and a second container, and the first heat dissipation fin assembly is respectively connected to the second container and the first container; the first container comprises a lower chamber and an upper chamber stacked on top of each other, the lower chamber is respectively connected to the inlet connector and the first piping assembly, and the upper chamber is respectively connected to the water tank unit and the first piping assembly; and the first piping assembly comprises a first upper fin tube and a first lower fin tube stacked on top of each other, the first lower fin tube is respectively connected to the second container and the lower chamber, and the first upper fin tube is respectively connected to the second container and the upper chamber.

3. The heat sink for an electronic device as claimed in claim 2, wherein the first heat sink fin group comprises a plurality of first fins, the first fins being stacked on top of each other, and the first upper fin tube and the first lower fin tube being respectively stacked within the first fins.

4. The heat sink for an electronic device as claimed in claim 2, wherein the liquid cooling module further comprises: a second heat dissipation fin assembly located within the sink body; and a second pipeline assembly located within the second heat dissipation fin assembly, thermally connected to the second heat dissipation fin assembly, and respectively connected to the inlet connector and the water tank unit, wherein the first container is sandwiched between the first heat dissipation fin assembly and the second heat dissipation fin assembly, and respectively connected to the inlet connector, the first pipeline assembly, and the second pipeline assembly.

5. The heat sink for an electronic device as described in claim 4 further includes: a second cooling fan located within the sink and facing the second heat sink fin assembly.

6. The heat sink for an electronic device as claimed in claim 4, wherein the liquid cooling module further includes a third container, and the second heat dissipation fin assembly is respectively connected to the first container and the third container; and the second pipeline assembly includes a second upper fin and a second lower fin stacked on top of each other, the second lower fin being respectively connected to the lower chamber and the third container, and the second upper fin being respectively connected to the upper chamber and the third container.

7. The heat sink for an electronic device as claimed in claim 6, wherein the second heat sink assembly comprises a plurality of second fins stacked on top of each other, and the second upper fin tube and the second lower fin tube respectively overlap within the second fins.

8. The heat sink for an electronic device as claimed in claim 2, wherein the outlet connector is disposed on the first container and is isolated from the first conduit assembly.

9. The heat sink for an electronic device as claimed in claim 1, wherein the water tank unit has a water inlet that is exposed on the base body.

10. The heat sink for the electronic device as claimed in claim 1 further includes: a control circuit electrically connected to the water pump and the first cooling fan respectively, for controlling the operation of the water pump and the first cooling fan respectively.