Three-dimensional heat transfer device

Abstract

A three-dimensional heat transfer device includes a first heat-conducting shell and a second heat-conducting shell. The second heat-conducting shell is attached to the first heat-conducting shell to form a liquid-tight chamber. The three-dimensional heat transfer device further includes a plurality of heat-conducting protrusions, a first capillary structure disposed on the first heat-conducting shell, a plurality of second capillary structures disposed on the heat-conducting protrusions and thermally coupled to the first capillary structure, and a plurality of first heat pipes passing through a first perforation and contacting the second capillary structures. In at least one first heat pipe, a fourth capillary structure is disposed on the inner wall of the first heat pipe and contacts the second capillary structure.

Claims

1. A three-dimensional heat transfer device, comprising: a first heat-conducting shell having an outer surface in thermal contact with a heat source; a second heat-conducting shell having at least one first perforation, and the second heat-conducting shell being attached to the first heat-conducting shell to form a liquid-tight chamber; at least one heat-conducting protrusion formed above an inner surface of the first heat-conducting shell and extending toward an inner surface of the second heat-conducting shell; a first capillary structure disposed on the inner surface of the first heat-conducting shell; a second capillary structure disposed on a first surface of the at least one heat-conducting protrusion; a first heat pipe passing through the at least one first perforation and contacting the second capillary structure; and a fourth capillary structure disposed on an inner wall of the first heat pipe and contacting the second capillary structure; wherein, The first capillary structure is disposed on the inner surface of the first heat-conducting shell opposite the outer surface, and the second capillary structure is closer to the second heat-conducting shell than the first capillary structure.

2. The three-dimensional heat transfer device as claimed in claim 1, wherein the first heat-conducting shell includes a base plate, an annular side plate, a first convex structure and a second convex structure, the annular side plate is connected to the base plate, the first convex structure protrudes from the base plate in a direction away from the second heat-conducting shell, the second convex structure protrudes from the first convex structure in a direction away from the second heat-conducting shell, the at least one heat-conducting protrusion protrudes from one inner surface of the second convex structure, and the first capillary structure is stacked on the inner surface of the second convex structure.

3. The three-dimensional heat transfer device as described in claim 2 further includes a third capillary structure, wherein the at least one heat-conducting protrusion has a second surface, the first surface faces away from an outer surface of the second convex structure, the second surface is located between the first surface and the inner surface of the second convex structure, and is connected to the first surface and the inner surface of the second convex structure, and the third capillary structure is disposed on the second surface of the at least one heat-conducting protrusion and is connected to the first capillary structure and the second capillary structure.

4. The three-dimensional heat transfer device as claimed in claim 2, wherein the second capillary structure has a top surface facing away from the inner surface of the second convex structure, the top surface being separated from the inner surface of the second convex structure by a first distance, a vapor channel being formed between the inner surface of the second convex structure and the second heat-conducting shell, and the inner surface of the second convex structure being separated from the second heat-conducting shell by a second distance.

5. The three-dimensional heat transfer device as described in claim 2 further includes at least one support structure, the at least one support structure including a first end, a second end and a columnar body, the first end being connected to the first heat-conducting shell and the second end being connected to the second heat-conducting shell.

6. The three-dimensional heat transfer device as claimed in claim 5, wherein the at least one heat-conducting protrusion is connected to the at least one support structure.

7. The three-dimensional heat transfer device as claimed in claim 2, wherein the number of the at least one heat-conducting protrusion is plurality of, and the heat-conducting protrusions are parallel.

8. The three-dimensional heat transfer device as claimed in claim 2, wherein the at least one heat-conducting protrusion is spaced apart from the second heat-conducting shell.

9. The three-dimensional heat transfer device as claimed in claim 3, wherein the at least one heat-conducting protrusion is made of a non-solid metal.

10. The three-dimensional heat transfer device as claimed in claim 9, wherein the at least one heat-conducting protrusion, the second capillary structure, and the third capillary structure are integrally formed to form an integral capillary structure.

11. The three-dimensional heat transfer device as claimed in claim 2, wherein the at least one heat-conducting protrusion is formed by spaced sections.

12. The three-dimensional heat transfer device as claimed in claim 1 further includes a second heat pipe, the second heat-conducting shell having at least one second perforation, the second heat pipe passing through the at least one second perforation, and the second heat pipe being spaced apart from the first heat-conducting shell.

13. The three-dimensional heat transfer device as claimed in claim 12, wherein the first heat pipe has a first chamber in fluid communication with the liquid-tight chamber.

14. The three-dimensional heat transfer device as claimed in claim 13, wherein the second heat pipe has a second chamber that is not in fluid communication with the liquid-tight chamber.

15. The three-dimensional heat transfer device as claimed in claim 1, wherein the first capillary structure and the second capillary structure are selected from the group consisting of metal mesh, sintered powder and sintered ceramic.

16. The three-dimensional heat transfer device as claimed in claim 1, wherein the fourth capillary structure of the first heat pipe is connected to the second capillary structure via a metallic bond.

17. The three-dimensional heat transfer device as claimed in claim 7, wherein the heat-conducting protrusions are square and spaced apart and arranged in a cross pattern.

18. The three-dimensional heat transfer device as claimed in claim 7, wherein the heat-conducting protrusions are rectangular, spaced apart, and arranged in a parallel, staggered pattern.

19. The three-dimensional heat transfer device as claimed in claim 7, wherein the heat-conducting protrusions are triangular and extend radially outward from the center of one of the first heat-conducting shells.

20. The three-dimensional heat transfer device as claimed in claim 7, wherein the heat-conducting protrusions are rectangular and spaced apart and arranged in a cross pattern.

21. A three-dimensional heat transfer device, comprising: a first heat-conducting shell; a second heat-conducting shell having at least one first perforation, the second heat-conducting shell being attached to the first heat-conducting shell to form a liquid-tight chamber; a heat-conducting protrusion formed above an inner surface of the first heat-conducting shell and extending toward an inner surface of the second heat-conducting shell; a first capillary structure disposed on the inner surface of the first heat-conducting shell; a second capillary structure disposed on a first surface of the heat-conducting protrusion and thermally coupled to the first capillary structure through a third capillary structure; a first heat pipe passing through the at least one first perforation and contacting the second capillary structure; and a fourth capillary structure disposed on an inner wall of the first heat pipe and contacting the second capillary structure.

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