Apparatus for screening potential failure seeds induced by residual stress in pspi / pbo of advanced semiconductor packaging

TWM688812UActive Publication Date: 2026-10-21HIROMI SYST
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Patent Information

Application Number
TW115205476
Authority / Receiving Office
TW · TW
Patent Type
Utility models
Current Assignee / Owner
Filing Date
2026-06-15
Publication Date
2026-10-21
Estimated Expiration
2036-06-14

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Abstract

This invention relates to a screening and inspection device for potential failure precursors of residual stress in advanced semiconductor packaging PSPI / PBO. It utilizes a high-contrast parallel optical module, a reflective Schlieren imaging module, a high-resolution imaging module, and an analysis and computing module to perform non-contact inspection of PSPI or PBO dielectric layers after coating, exposure, development, or curing. This invention can detect local residual stress, micro-scratches, micro-bubbles, abnormal refractive textures, and localized stress concentration areas, and create a potential failure seed map for subsequent process improvement and reliability analysis.
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Claims

1. A screening and inspection device for potential failure precursors of residual stress in advanced semiconductor packaging PSPI / PBO, comprising: a parallel light source module; a telecentric projection module disposed in the optical path of the parallel light source module to form a parallel light beam illuminating the PSPI / PBO dielectric material; a reflective Schlieren module disposed corresponding to the PSPI / PBO dielectric material to receive light reflected by the PSPI / PBO dielectric material; an imaging module disposed in the imaging optical path of the reflective Schlieren module to capture the image formed by the reflective Schlieren module; and an analysis and processing module connected to the imaging module to analyze the image to obtain the residual stress abnormal area of ​​the PSPI / PBO dielectric material.

2. The apparatus as claimed in claim 1, comprising a Knife-edge adjustment module for adjusting the contrast of the Schlieren optical system.

3. The device as claimed in claim 1, wherein the potential precursor to failure includes micro-scratches.

4. The apparatus as claimed in claim 1, wherein the potential failure precursor comprises microbubbles.

5. The apparatus as claimed in claim 1, wherein the potential failure precursor includes refractive texture anomalies or localized stress concentration areas.