Packaging structure

Abstract

A packaging structure includes: a wafer unit including at least one wafer having an active side and a back side opposite in a first direction, and including a wafer pad located on the active side; a first encapsulation layer encapsulating the wafer unit; a conductive structure electrically connected to the wafer unit on the active side in the first direction, the conductive structure including a conductive pad; and a dielectric structure encapsulating the conductive structure and exposing the conductive pad; wherein the packaging structure has a packaging side surface, the conductive pad including a stepped pad, and the stepped side surface of the stepped pad being exposed by the dielectric structure and offset toward the wafer unit relative to the packaging side surface in a second direction parallel to the main surface of the wafer unit.

Claims

1. A packaging structure, comprising: A wafer cell includes at least one wafer having an active side and a back side opposite each other in a first direction, and including a wafer pad located on the active side; a first encapsulation layer encapsulating the wafer cell; a conductive structure electrically connected to the wafer cell on the active side in the first direction, the conductive structure including a conductive pad; and a dielectric structure encapsulating the conductive structure and exposing the conductive pad; wherein the encapsulation structure has an encapsulation side, the conductive pad including a stepped pad, and the stepped side of the stepped pad being exposed by the dielectric structure and offset toward the wafer cell relative to the encapsulation side in a second direction parallel to the main surface of the wafer cell.

2. The packaging structure of claim 1, wherein the stepped pad includes a body portion and a protrusion portion, the protrusion portion protruding from the body portion away from the wafer cell in the first direction, and the stepped side surface of the stepped pad is the side surface of the protrusion portion, wherein at least a portion of the first surface of the protrusion portion away from the wafer cell and the side surface of the protrusion portion are exposed by the dielectric structure.

3. The packaging structure as claimed in claim 2, wherein the second surface of the main body on the side away from the wafer cell is at a different horizontal height from the first surface of the protrusion in the first direction, the second surface of the main body is connected to the step side and is also exposed by the dielectric structure.

4. The packaging structure as claimed in claim 1, wherein the active side of the wafer cell includes a body region and a recessed region, the recessed region being recessed toward the wafer cell relative to the body region in a first direction and located at the periphery of the body region in a second direction, and the stepped pad being formed by a portion of the conductive pad located at the edge of the body region and a portion located in the recessed region.

5. The packaging structure as claimed in claim 4, wherein the dielectric structure includes a stepped dielectric portion, and the stepped dielectric portion is composed of a portion of the dielectric structure located at the edge of the body region and a portion located in the recessed region.

6. The encapsulation structure as described in claim 1, wherein, The first encapsulation layer has an encapsulation body portion and an encapsulation attachment portion; wherein the encapsulation body portion encapsulates the sidewall of the wafer cell in the second direction, and the encapsulation attachment portion encapsulates the active side of the wafer cell; and the redistribution layer closest to the wafer cell in the conductive structure includes a first conductive via and a conductive trace connected to each other, the first conductive via extending through the encapsulation attachment portion and electrically connected to a wafer pad located on the active side of the wafer cell.

7. The encapsulation structure as described in claim 6 further includes: A conductive connector is located on the side of the wafer cell in the second direction and is encapsulated by the first encapsulation layer. The redistribution layer further includes a second conductive via electrically connected to the conductive trace. The second conductive via extends through the encapsulation attachment and is electrically connected to the conductive connector.

8. The encapsulation structure as described in claim 6 further includes: A conductive connector is located on the side of the wafer cell in the second direction and is encapsulated by the first encapsulation layer, wherein the surface of the conductive connector near the conductive structure is flush with the surface of the first encapsulation layer near the conductive structure in the second direction and is connected to the conductive trace.

9. The encapsulation structure as claimed in claim 1, wherein the first encapsulation layer comprises a photosensitive molding film, the photosensitive molding film comprising an organic substrate and inorganic nanofillers dispersed in the organic substrate.

10. The packaging structure as claimed in claim 1, wherein the wafer unit comprises: A first protective layer is disposed on the active side of the wafer unit on the at least one wafer and exposes the wafer pads. The conductive structure extends through the first protective layer to be electrically connected to the wafer pads.

11. The packaging structure as claimed in claim 10, wherein the wafer unit further comprises: A second protective layer is disposed on the back side of the wafer unit on the at least one wafer; And a metal structure that extends through the second protective layer and is connected to the back side of the at least one wafer.

12. The packaging structure of claim 10, wherein the first encapsulation layer includes a molding compound, and the surface of the first protective layer near the conductive structure is flush with the surface of the molding compound near the conductive structure in the second direction.

13. The encapsulation structure as described in claim 12, wherein, The dielectric structure has a dielectric side that is offset toward the wafer cell relative to the package side in the second direction.

14. A packaging structure, comprising: A wafer unit includes at least one wafer and has opposing active and back sides; The first encapsulation layer encapsulates the wafer unit; A conductive structure is located on the active side of the at least one wafer and is electrically connected to the at least one wafer. The conductive structure includes conductive pads for connecting to an external device. The conductive structure is encapsulated by a dielectric structure, and the conductive pad is exposed. The conductive pad is configured to be connected to the external device via a solder layer, and the contact area between the solder layer and the conductive pad is greater than the orthogonal projection area of ​​the conductive pad on the external device.

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