Test mounting jig for combining different materials

Abstract

A heterogeneous bonding test stage fixture for testing semiconductor devices includes: a fixture, an electroformed layer, and a noble metal. The fixture is made of a common metal material and has a bonding surface. The electroformed layer is disposed on the bonding surface. The noble metal is disposed on one side of the electroformed layer. A semiconductor device is placed on the noble metal side. When the fixture is powered, the power is conducted through the electroformed layer to the noble metal for testing the semiconductor device.

Claims

1. A test stage fixture with heterogeneous bonding for testing semiconductor devices, comprising: A fixture, made of general metal material, has a mating surface; an electroformed layer is disposed on the mating surface; A precious metal is disposed on one side of the electroformed layer; wherein, a semiconductor element is placed on one side of the precious metal, and the semiconductor element is tested after the fixture is powered on.

2. The test platform fixture with heterogeneous bonding as described in claim 1, wherein, The fixture has a base, and a protrusion is provided on one side of the base. The top of the protrusion has the mating surface.

3. The test platform fixture with heterogeneous bonding as described in claim 2, wherein, The mating surface can be rectangular, trapezoidal, concave, or convex.

4. The test platform fixture with heterogeneous bonding as described in claim 1, wherein, The electroformed layer forms a groove according to the surface shape of the joint surface.

5. The test platform fixture with heterogeneous bonding as described in claim 1, wherein, The electroplated layer material can be pure nickel, electroless nickel, nickel-iron, nickel-cobalt alloy, germanium, copper, gold, or silver.

6. The test platform fixture with heterogeneous bonding as described in claim 4, wherein, The precious metal is placed in the groove.

7. The test platform fixture with heterogeneous bonding as described in claim 1, wherein, The thickness of this precious metal is between 0.3mm and 0.8mm.

8. The test platform fixture with heterogeneous bonding as described in claim 7, wherein, The thickness of this precious metal is 0.5 mm.

9. The test platform fixture with heterogeneous bonding as described in claim 1, wherein, The precious metal is ruthenium, rhodium, palladium, osmium, iridium, or platinum.

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