Improved heat dissipation structure of heat dissipation device

Abstract

An improved heat dissipation and airflow guiding structure for a heat dissipation device includes: a heat dissipation fin assembly comprising a plurality of heat dissipation fins arranged in a group, the heat dissipation fins having several through holes inside, and at least one protruding airflow guide on one fin surface, the airflow guide being correspondingly disposed on the inner side of the portion below the through hole, the airflow guide being strip-shaped and having an outwardly extending airflow channel; and a heat pipe assembly comprising a plurality of heat pipes, the heat pipes passing through the through holes of the heat dissipation fins, with the airflow guide located on the inner side of the portion below the heat pipes; thereby, through the airflow guiding structure design of the heat dissipation fins, the hot airflow heated by the heat pipes is guided outward, so that the cooling airflow is not affected by the heat of the heat pipes, maintaining a low temperature and blowing towards the bottom heat source, thus actively improving the overall heat dissipation efficiency.

Claims

1. An improved heat dissipation and airflow guiding structure for a heat dissipation device, comprising: a heat dissipation fin assembly including a plurality of heat dissipation fins arranged in a group, the heat dissipation fins having a plurality of through holes inside, the heat dissipation fins having at least one protruding airflow guiding member on one fin surface, the airflow guiding member being correspondingly disposed on the inner side of the portion below the through hole, the airflow guiding member being strip-shaped and having an airflow guiding channel extending in an outward direction; a heat pipe assembly including a plurality of heat pipes, the heat pipes passing through the through holes of the heat dissipation fins, and the airflow guiding member being located on the inner side of the portion below the heat pipes.

2. The improved heat dissipation and airflow guiding structure of the heat dissipation device as described in claim 1, wherein the through hole has a ring abutment protruding from a fin surface, and the ring abutment is located on the outer ring of the through hole.

3. The improved heat dissipation flow guiding structure of the heat dissipation device as described in claim 1, wherein the strip-shaped body of the flow guiding member is arranged in an arc shape.

4. The improved heat dissipation and airflow guiding structure of the heat dissipation device as described in claim 3, wherein the heat dissipation fin has a corresponding groove on the other fin surface of the airflow guiding member.

5. The improved heat dissipation structure of the heat dissipation device as described in claim 4, wherein a receiving groove is provided below / at the bottom of the heat dissipation fins for accommodating the plurality of heat pipes.

6. The improved heat dissipation and flow guiding structure of the heat dissipation device as described in claim 1, wherein the heat pipe is a heat transfer element with extremely high thermal conductivity, which transfers heat through the evaporation and condensation of liquid in a fully enclosed vacuum tube, and achieves the effect of circulating heat dissipation and cooling by utilizing fluid principles such as capillary action.

7. The improved heat dissipation structure of the heat dissipation device as described in claim 1, wherein a fan device is provided above / on the top surface of the heat dissipation fin device.

8. The improved heat dissipation structure of the heat dissipation device as described in claim 7, wherein the plurality of heat pipes below / bottom of the heat dissipation fin device are used to dissipate heat and cool a heat-generating element, the heat-generating element is disposed on a circuit board, a heat-conducting plate is disposed above the heat-generating element, and the heat-conducting plate contacts the plurality of heat pipes.

9. The improved heat dissipation flow guiding structure of the heat dissipation device as described in claim 7, wherein when the fan device provides cooling airflow to the heat dissipation fin device, the cooling airflow is heated by the heat pipe and guided by the flow guiding channel of the flow guide member, and then discharged from the outside of the heat dissipation fin device.

10. The improved heat dissipation flow guiding structure of the heat dissipation device as described in claim 3, wherein the flow guiding member includes two protruding flow guiding fin walls, and a through slot is provided between the two flow guiding fin walls.

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