wafer edge finder

Abstract

This invention relates to a wafer edge finder, suitable for rotating a substrate with an identification code. The wafer edge finder includes a machine base, a carrier module, and a reading device. The machine base has a table surface, a side surface connected to the table surface, and a reading recess. The reading recess is formed by the table surface and the side surface, and has a reading inlet on the side surface and an identification opening on the table surface. The identification opening has a projection range in the longitudinal direction of the table surface. The carrier module is disposed on the machine base to carry and rotate the substrate, so that the identification code is located within the projection range of the identification opening. The reading device is used to read the identification code located within the projection range through the reading recess. This improves the compatibility of the wafer edge finder with substrates of different sizes, allowing even small-sized substrates to directly read the identification code located on the back side without requiring additional changes to the mechanism or additional handling procedures.

Claims

1. A wafer edge finder, suitable for rotating a substrate having an identification code, the wafer edge finder comprising: a machine having a platform, a side surface connected to the platform, and a reading recess formed by the platform and the side surface, the reading recess having a reading inlet on the side surface and an identification opening on the platform, the identification opening having a projection range in the longitudinal direction of the platform; a carrier module disposed on the machine for carrying and rotating the substrate, such that the identification code is located within the projection range of the identification opening; and a reading device for reading the identification code located within the projection range through the reading recess.

2. The wafer edge finder as described in claim 1, wherein, The reading device includes a displacement unit and a reader. The displacement unit has a displacement body fixed on the side and a displacement member that can move back toward the reading recess. The reader has a reading body fixed on the displacement member and a reading head disposed on the reading body and capable of entering the reading recess through the reading inlet to read the identification code.

3. The wafer edge finder as described in claim 1, wherein, The reading device includes a reading body disposed within the reading recess and a reading head located within the reading recess for reading the identification code.

4. The wafer edge finder as described in claim 1, wherein, The machine tool has an identification opening with an edge, and the bearing module has a rotation center. The distance between the edge and the rotation center is between 20 mm and 75 mm.

5. The wafer edge finder as described in claim 1, wherein, The carrier module has a rotation center, and the distance from the rotation center to the side is L1. The substrate has a center, and the distance from the center to the identification code is L2, and the following relationship is satisfied: L1≧L2.

6. The wafer edge finder as described in claim 5, wherein, The identification opening of the machine has an edge, and the distance from the rotation center to the edge is L3, satisfying the following relationship: L1≧L2≧L3.

7. The wafer edge finder as described in claim 1, wherein, The substrate is a wafer or photomask, and its size is less than or equal to 6 inches.

8. The wafer edge finder as described in claim 1, wherein, The bottom surface of the reading recess is inclined.

9. The wafer edge finder as described in claim 1, wherein, The cross-section of the reading recess is rectangular.

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