Circuit board structure

Abstract

A circuit board structure includes a dielectric layer, a first embedded component, a second embedded component, and a first wiring layer. The dielectric layer has a first surface, a second surface, a first cavity, and a second cavity. The first surface and the second surface face away from each other. The first cavity and the second cavity are located on the first surface and the second surface, respectively, and are connected to each other. The width of the first cavity is greater than the width of the second cavity. The first embedded component is disposed in the first cavity and abuts against the bottom surface of a groove in the first cavity. The second embedded component is disposed in the second cavity. The first wiring layer is embedded in the dielectric layer and exposed on the first surface. The first embedded component is electrically connected to the first wiring layer.

Claims

1. A circuit board structure comprising: a dielectric layer having a first surface, a second surface, a first cavity, and a second cavity, the first surface and the second surface facing away from each other, the first cavity and the second cavity being located on the first surface and the second surface respectively and communicating with each other, the width of the first cavity being greater than the width of the second cavity; a first embedded element disposed in the first cavity and abutting against a groove bottom surface of the first cavity; a second embedded element disposed in the second cavity; and a first circuit layer embedded in the dielectric layer and exposed on the first surface, the first embedded element being electrically connected to the first circuit layer.

2. The circuit board structure as described in claim 1 further includes a second circuit layer disposed on the second surface and electrically connected to the second embedded component.

3. The circuit board structure as described in claim 2 further includes a package that covers the dielectric layer, the first embedded component, the second embedded component, the first circuit layer, and the second circuit layer.

4. The circuit board structure as described in claim 2 further includes two first conductive elements, the first embedded element being electrically connected to the first circuit layer through the two first conductive elements.

5. The circuit board structure as described in claim 4 further includes two second conductive elements, the second embedded element being electrically connected to the second circuit layer through the two second conductive elements.

6. The circuit board structure as described in claim 5, wherein the two first conductive elements and the two second conductive elements are conductive paste or solder balls.

7. The circuit board structure as described in claim 1, wherein the first embedded component has a top surface, a bottom surface, two side surfaces and two pads, the top surface and the bottom surface are opposite to each other, the two side surfaces are opposite to each other and connected to the top surface and the bottom surface, and the two pads are respectively disposed on the two side surfaces and electrically connected to the first circuit layer.

8. The circuit board structure as described in claim 7, wherein each of the two pads includes a first pad portion and two second pad portions, in each of the two pads, the two second pad portions are respectively connected to opposite sides of the first pad portion, the two second pad portions are respectively flush with the top surface and the bottom surface of the first embedded component, and the two first pad portions of the two pads are respectively disposed on the two side surfaces.

9. The circuit board structure as described in claim 1, wherein the dielectric layer comprises a first dielectric layer and a second dielectric layer, the first dielectric layer is disposed on the second dielectric layer, the first surface and the first cavity are located on the first dielectric layer, and the second surface and the second cavity are located on the second dielectric layer.

10. The circuit board structure as described in claim 1, wherein the first embedded element and the second embedded element are multi-layer ceramic capacitors.

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