Polishing surface dressing method and method of manufacturing substrate

The method simultaneously dresses and measures the polishing surface of a polishing pad to achieve a desired shape, addressing inefficiencies in traditional methods by real-time adjustment, ensuring efficient and accurate wafer polishing.

US20260084263A1Pending Publication Date: 2026-03-26DISCO CORP
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
Filing Date
2025-08-12
Publication Date
2026-03-26

AI Technical Summary

Technical Problem

Existing polishing methods require time-consuming and inefficient dressing of polishing surfaces based on measuring the shape of the polishing pad before dressing, which can lead to excessive or insufficient adjustment of the polishing surface, and do not account for the desired shape of the wafer during polishing.

Method used

A method that simultaneously dresses and measures the polishing surface of a polishing pad using a dressing mechanism with displacement measurement, allowing for real-time adjustment of contact conditions to achieve a desired shape, thereby improving efficiency and accuracy.

Benefits of technology

The method enables rapid determination of the polishing surface's appropriateness, allowing for efficient production of wafers with the desired shape by adjusting the dressing process in real-time, reducing time and resources required.

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Abstract

A polishing surface dressing method includes: a dressing step of dressing a polishing surface; a polishing surface shape measuring step of measuring the shape of the polishing surface based on a displacement amount in a first direction orthogonal to the polishing surface and a movement position in the second direction of the dressing section that is in contact with the polishing surface; a determination step of determining appropriateness of the shape of the polishing surface measured in the polishing surface shape measuring step; and a condition change step of changing a contact condition in which the dressing section makes contact with the polishing surface in the dressing step, when the shape of the polishing surface is determined to be “No Good”, and the dressing step is performed again based on the contact condition changed in the condition change step.
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