Electrolytic deposition system including hydrogels and methods of using same
The reactive electrochemical application system using hydrogels addresses the challenges of large equipment and chemical exposure in metal surface treatments by enabling localized, low-waste, and cost-effective processes that meet industry standards for corrosion resistance and adhesion.
US20260168129A1Pending Publication Date: 2026-06-18CHEMEON SURFACE TECHNOLOGY LLC
Patent Information
- Authority / Receiving Office
- US · United States
- Patent Type
- Applications(United States)
- Current Assignee / Owner
- CHEMEON SURFACE TECHNOLOGY LLC
- Filing Date
- 2024-12-16
- Publication Date
- 2026-06-18
AI Technical Summary
Technical Problem
Existing metal surface treatment processes, such as electroplating and anodizing, require large equipment, skilled operators, and result in chemical exposure and excessive waste, increasing costs and downtime.
Method used
A reactive electrochemical application system using hydrogels to contain reactive chemical solutions, which are applied to metal surfaces with a power supply to initiate chemical reactions, minimizing chemical exposure and waste.
Benefits of technology
The system allows for localized treatment of metal surfaces with reduced chemical exposure, minimized cleanup, and lower operational costs, while meeting industry specifications for corrosion resistance and adhesion.
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Figure US20260168129A1-D00000_ABST
Abstract
A reactive electrochemical application system is provided. The reactive electrochemical application system includes a power supply configured to be electrically coupled to a substrate and a hydrogel electrically coupled to the power supply. The hydrogel includes a reactive chemical solution. The hydrogel is configured to contact the substrate, the power supply is configured to pass a current through the hydrogel and the substrate, and the reactive chemical solution is configured to treat the substrate when the current is passed through the hydrogel and the substrate.
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