Diamond conditioner manufacturing equipment and diamond conditioner manufacturing method

Abstract

A diamond conditioner manufacturing equipment includes a working chamber and a supporting base. The supporting base is disposed in the working chamber and the supporting base includes an oscillator and a heater. The supporting base is configured to fix a diamond disc, and a protective layer is coated on the diamond disc under a predetermined temperature and a predetermined oscillation frequency, and below a predetermined pressure. In addition, a diamond conditioner manufacturing method is also disclosed herein.

Description

RELATED APPLICATIONS

[0001] This application claims priority to Taiwan Application Serial Number 114102965 filed January 23, 2025, the disclosure of which is incorporated herein by reference in its entirety.BACKGROUNDTechnical Field

[0002] The present invention relates to a conditioner manufacturing equipment and a conditioner manufacturing method. More particularly, the present invention relates to a diamond conditioner manufacturing equipment and a diamond conditioner manufacturing method. Description of Related Art

[0003] In recent years, the domestic and international semiconductor markets have flourished due to the demand for computers and peripheral materials, and the semiconductor industry has continuously expanded so as to generate substantial foreign exchange revenue.

[0004] The manufacturing process of semiconductor devices is highly complex and involves technologies that encompass the most important and critical scientific and technological advancements of modern human development.

[0005] Therefore, semiconductor manufacturing is not only a high-tech industry but also one industry that requires significant capital to sustain development.

[0006] Chemical mechanical polishing (CMP) is an indispensable key technology in semiconductor processing. To maintain the stability and continuity of the CMP process and to ensure wafer quality, a polishing pad must be conditioned using a conditioner to restore the surface morphology and properties thereof.

[0007] However, the use of conditioners still presents challenges, such as potential metallic contamination of the semiconductor process caused by the polishing pad, uneven flatness of the conditioner, and the conditioner’s cutting rate changes, all of which adversely affect process stability.

[0008] Accordingly, there is a need to effectively improve the stability of the conditioner’s cutting rate and reduce contamination for enhancing the reliability, performance, and yield of semiconductor manufacturing.SUMMARY

[0009] One object of the present disclosure is to provide a diamond conditioner manufacturing equipment and a diamond conditioner manufacturing method capable of improving the quality and performance of diamond conditioners, thereby enhancing the quality and stability of semiconductor production.

[0010] To achieve these and other advantages and in accordance with the objective of the embodiments of the present invention, as the embodiment broadly describes herein, the embodiments of the present invention provides a diamond conditioner manufacturing equipment including a working chamber and a supporting base. The supporting base is disposed in the working chamber and includes an oscillator and a heater.

[0011] The supporting base is configured to fix a diamond disc, and under a predetermined temperature, a predetermined oscillation frequency, and below a predetermined pressure, a protective layer is coated on the diamond disc.

[0012] In another aspect, the present disclosure is to provide a diamond conditioner manufacturing method comprising: providing a diamond disc; providing a protective layer material; fixing the diamond disc on a supporting base disposed in a working chamber; reducing a pressure of the working chamber to a predetermined pressure; adjusting a temperature of the diamond disc to a predetermined temperature; oscillating the diamond disc at a predetermined frequency; and coating a protective layer onto a surface of the diamond disc using the protective layer material.

[0013] In some embodiments, the predetermined temperature is approximately 20°C to 60°C.

[0014] In some embodiments, the predetermined oscillation frequency is approximately 30 Hz to 500 Hz.

[0015] In some embodiments, the predetermined pressure is less than 0.05 atm.

[0016] In some embodiments, the protective layer is an acrylic protective layer, an epoxy resin protective layer, a polyurethane (PU) protective layer, or a silicon-based protective layer.

[0017] Hence, the diamond conditioner manufacturing equipment and the diamond conditioner manufacturing method of the present disclosure may provide a diamond conditioner having a uniform protective layer completely covering a surface of the diamond disc, preventing metallic contamination in semiconductor processing, ensuring stable cutting rates of the diamond conditioner, reducing process variability, eliminating micro-bubbles in the protective layer, and minimizing semiconductor process contamination.BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The disclosure may be more fully understood by reading the following detailed description of the embodiment, with reference made to the accompanying drawings as follows:

[0019] FIG. 1 is a schematic diagram of diamond conditioner manufacturing equipment according to an embodiment of the present invention; and

[0020] FIG. 2 is a schematic flow diagram of a diamond conditioner manufacturing method according to another aspect of the present invention.DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

[0021] The following is a detailed description of the embodiments in conjunction with the accompanying drawings, but the provided embodiments are not intended to limit the scope of the disclosure, and the description of the structure and operation is not utilized to limit the execution sequence thereof. The structure of the recombination of components and the resulting devices with equal functions are all within the scope of this disclosure. In addition, the drawings are for illustration purposes only, and are not drawn according to the original scale. For ease of understanding, the same reference numbers are utilized in the drawings and the description to refer to the same or like parts.

[0022] In addition, the terms utilized in the entire description and the scope of the patent application, unless otherwise specified, usually have the usual meaning of each term utilized in this field, in the content disclosed here and in the special content. Some terms utilized to describe the disclosure are discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art in the disclosure.

[0023] In the implementation mode and the scope of the present application, unless the article is specifically limited in the context, "a" and "the" may generally refer to a single or pluralities. In the steps, the numbering is only utilized to conveniently describe the steps, rather than to limit the sequence and implementation.

[0024] Secondly, the words "comprising", "including", "having", "containing" and the like utilized in the present application are all open language, meaning including but not limited thereto.

[0025] FIG. 1 illustrates a diamond conditioner manufacturing equipment 100 according to an embodiment of the invention. FIG. 2 illustrates a diamond conditioner manufacturing method 200 according to another aspect of the invention.

[0026] Referring to FIG. 1, the diamond conditioner manufacturing equipment 100 includes a working chamber 120 and a supporting base 110 disposed in the working chamber 120. The supporting base 110 may control and adjust the temperature and oscillation frequency of a diamond disc 130 fixed thereon. The working chamber 120 may be a low-pressure chamber or a vacuum chamber, without departing from the scope of the invention.

[0027] In some embodiments, the supporting base 110 includes an oscillator 112 and a heater 114, and the supporting base 110 is configured to fix the diamond disc 130. Under a predetermined temperature, a predetermined oscillation frequency, and below a predetermined pressure, a protective layer material is applied onto the surface of the diamond disc 130 to form a protective layer 140.

[0028] In some embodiments, the predetermined temperature is approximately 20°C to 60°C.

[0029] In some embodiments, the predetermined oscillation frequency is approximately 30 Hz to 500 Hz.

[0030] In some embodiments, the predetermined pressure is less than 0.05 atm.

[0031] In some embodiments, the protective layer 140 is an acrylic protective layer, an epoxy resin protective layer, a polyurethane (PU) protective layer, or a silicon-based protective layer.

[0032] In some embodiments, the diamond conditioner 102 is further formed with a protective layer 140 on the diamond disc 130 to enhance the conditioning performance thereof. The diamond disc 130 includes a substrate 132, a bonding layer 134, and a plurality of diamond particles 136. The diamond particles 136 are bonded to the substrate 132 via the bonding layer 134, and the bonding layer 134 may be formed by electroplating or brazing to bond the diamond particles 136 on the substrate 132. The protective layer 140 effectively covers the surface of the substrate 132 and encapsulates the bonding layer 134 to prevent metallic contamination caused by the metal material of the substrate 132 and the bonding layer 134 during semiconductor processing.

[0033] According to another aspect of the present invention, a diamond conditioner manufacturing method 200 is provided. As shown in FIG. 2, a diamond conditioner manufacturing method 200 is illustrated. The diamond conditioner manufacturing method 200 includes the following steps. In step 210, a diamond disc 130 is first provided. In step 220, a protective layer material is provided. In some embodiments, the protective layer material is acrylic, epoxy resin, polyurethane (PU), or silicon-based material, but the present invention is not limited thereto.

[0034] In step 230, the diamond disc 130 is fixed on the supporting base 110 in the working chamber 120. In step 240, a pressure of the working chamber 120 is then reduced to a predetermined pressure, such as below 0.05 atm. Accordingly, the working chamber 120 may be a low-pressure or vacuum chamber, without departing from the spirit and scope of the disclosure.

[0035] In step 250, a temperature of the diamond disc 130 is adjusted to a predetermined temperature, such as by heating with the heater 114 of the supporting base 110 or any other heating means, so that the surface temperature of the diamond disc 130 is approximately 20°C to 60°C. At the same time, in step 260, the diamond disc 130 is oscillated at a predetermined frequency, such as 30 Hz to 500 Hz, but the invention is not limited thereto.

[0036] In step 270, the protective layer material is applied to the surface of the diamond disc 130 to form the protective layer 140.

[0037] According to the diamond conditioner manufacturing method 200 of the present invention, during the coating of the protective layer 140, the diamond conditioner manufacturing equipment 100 may adjust the pressure within the working chamber 120, and utilize the supporting base 110 to adjust the temperature and oscillation frequency of the diamond disc 130, such that the protective layer material

[0038] may form the protective layer 140 more uniformly on the surface of the diamond disc 130, and completely covers the bonding layer 134 on the surface of the diamond disc 130 to effectively prevent metal contamination in semiconductor processes and uniform the protective layer 140. In addition, the protective layer 140 may allow partial exposure of the diamond particles 136 as required, thereby providing the diamond conditioner 102 with a more stable cutting rate without being affected by uneven thickness of the protective layer 140. Moreover, the diamond conditioner manufacturing equipment 100 and the diamond conditioner manufacturing method 200 of the present invention may eliminate the micro-bubbles in the protective layer 140, thereby enhancing the protective function of the protective layer 140 and further reducing unexpected risks in semiconductor processes.

[0039] In addition, the diamond conditioner manufacturing equipment 100 and the diamond conditioner manufacturing method 200 may reduce contamination concerns caused by the diamond conditioner 102 and subsequent semiconductor processes using the diamond conditioner 102 so as to enhance overall quality and stability of the diamond conditioner 102 and subsequent semiconductor processes.

[0040] Accordingly, the diamond conditioner manufacturing equipment and method of the present invention may provide a uniform protective layer that fully covers the surface of the diamond disc so as to prevent metallic contamination, stabilize the cutting rate, reduce variability, eliminate micro-bubbles, and reduce contamination in semiconductor processing.

[0041] Although the present disclosure has been disclosed above in terms of implementation, it is not intended to limit the present disclosure. Any person with ordinary knowledge in the field may make various variations and modifications without departing from the spirit and scope of the disclosure. Therefore, the spirit and scope of the appended claims should not be limited to the description of the embodiments contained herein.

Claims

1. A diamond conditioner manufacturing equipment, comprising: a working chamber; anda supporting base disposed in the working chamber, wherein the supporting base comprises an oscillator and a heater, the supporting base is configured to fix a diamond disc, and a protective layer is coated on the diamond disc under a predetermined temperature, a predetermined oscillation frequency, and below a predetermined pressure, wherein the predetermined oscillation frequency is approximately 30 Hz to 500 Hz.

2. The diamond conditioner manufacturing equipment according to claim 1, wherein the predetermined temperature is approximately 20°C to 60°C.

3. The diamond conditioner manufacturing equipment according to claim 2, wherein the predetermined pressure is less than 0.05 atm.

4. The diamond conditioner manufacturing equipment according to claim 1, wherein the protective layer is an acrylic protective layer, an epoxy resin protective layer, a polyurethane protective layer, or a silicon-based protective layer.

5. A diamond conditioner manufacturing method, comprising: providing a diamond disc;providing a protective layer material;fixing the diamond disc on a supporting base in a working chamber;reducing a pressure of the working chamber to a predetermined pressure;adjusting a temperature of the diamond disc to a predetermined temperature;oscillating the diamond disc at a predetermined oscillation frequency; andcoating a protective layer onto a surface of the diamond disc with the protective layer material, wherein the predetermined oscillation frequency is approximately 30 Hz to 500 Hz.

6. The diamond conditioner manufacturing method according to claim 5, wherein the predetermined temperature is approximately 20°C to 60°C.

7. The diamond conditioner manufacturing method according to claim 6, wherein the predetermined pressure is less than 0.05 atm.

8. The diamond conditioner manufacturing method according to claim 5, wherein the protective layer is an acrylic protective layer, an epoxy resin protective layer, a polyurethane protective layer, or a silicon-based protective layer.

Images