Electroplating apparatus

Abstract

An electroplating apparatus including a plating bath containing a plating solution, and a substrate holder holding a substrate so as to immerse the substrate in the plating solution. The substrate holder includes a rotor supporting the substrate, a moving plate supporting the rotor, a support plate under the moving plate, at least three cylinders coupled to the support plate, each cylinder having a piston connected to a lower surface of the moving plate to move the moving plate up and down, shafts between the cylinders, coupled to an upper surface of the support plate, and extending in a direction vertical to the upper surface of the support plate, linear bushings coupled to a lower surface of the moving plate and corresponding to the shafts, and a sealing ring fixing the substrate onto the rotor. The shafts are inserted into guide holes vertically penetrating the moving plate and the linear bushings.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This U.S. non-provisional patent application claims priority under 35 U.S.C. § 119 of Korean Patent Application No. 10-2025-0010339, filed on January 23, 2025, the entire contents of which are hereby incorporated by reference. BACKGROUND

[0002] The present disclosure herein relates to an electroplating apparatus, and particularly, to a substrate holder of an electroplating apparatus.

[0003] A metal layer composed of copper is formed on a semiconductor wafer by an electroplating apparatus. Specifically, when the wafer is immersed in a plating bath containing a plating solution including a metal ion, and current is supplied, the metal ion in the plating solution is precipitated on the wafer to form the metal layer. In this case, a substrate holder that holds the wafer may be used in order to immerse the wafer in the plating bath. An edge of the wafer may be covered by a sealing ring in order to prevent a part except for a plated surface of the wafer from being plated. The substrate holder may hold the wafer by sticking the wafer to the sealing ring, and may separate the wafer by pulling the wafer away from the sealing ring. For this, a rotor that supports the wafer is provided so as to move in the substrate holder.SUMMARY

[0004] The present disclosure provides an electroplating apparatus with improved driving stability.

[0005] The present disclosure also provides an electroplating apparatus capable of reducing wafer damage.

[0006] An embodiment of the inventive concept provides an electroplating apparatus including a plating bath in which a plating solution is contained, and a substrate holder configured to hold a substrate so as to immerse the substrate in the plating solution, wherein the substrate holder includes a rotor configured to support the substrate, a moving plate configured to support the rotor thereunder, a support plate disposed under the moving plate, at least three cylinders coupled to the support plate, each of the cylinders having a piston connected to a lower surface of the moving plate to move the moving plate up and down, shafts disposed between the cylinders, and coupled to an upper surface of the support plate so as to extend in a direction vertical to the upper surface of the support plate, linear bushings coupled to a lower surface of the moving plate so as to vertically correspond to the shafts, and a sealing ring configured to fix the substrate onto the rotor by pressing an upper surface of the substrate when the moving plate is raised by the cylinders, and the shafts are inserted into guide holes vertically penetrating the moving plate and the linear bushings.

[0007] In an embodiment of the inventive concept, an electroplating apparatus includes a support plate, a moving plate disposed on the support plate, a cylinder coupled to the support plate, and having a piston connected to a lower surface of the moving plate to move the moving plate up and down, a fixing block coupled to the support plate so as to be horizontally spaced apart from the cylinder, a shaft coupled to the fixing block, and extending from the support plate toward the moving plate, a vertical axis of the shaft being parallel to a moving direction of the piston, a linear bushing coupled to a lower surface of the moving plate, and a guide hole vertically penetrating the moving plate and the linear bushing, wherein the shaft is inserted into the guide hole, the fixing block has a recessed portion formed from an upper surface of the fixing block inward, and surrounding the shaft, and when the moving plate is lowered by the cylinder, the linear bushing is inserted into the recessed portion of the fixing block.

[0008] In an embodiment of the inventive concept, an electroplating apparatus includes a plating bath in which a plating solution is contained, and a substrate holder configured to hold a substrate so as to immerse the substrate in the plating solution, wherein the substrate holder includes a moving plate, a support plate disposed under the moving plate, a cylinder coupled to the support plate, and having a piston connected to a lower surface of the moving plate to move the moving plate up and down, fixing blocks coupled to the support plate so as to be horizontally spaced apart from the cylinder, at least three shafts coupled to the fixing blocks, and coupled to an upper surface of the support plate so as to extend in a direction vertical to the upper surface of the support plate, and linear bushings coupled to a lower surface of the moving plate so as to vertically correspond to the shafts, the shafts vertically penetrate the moving plate and the linear bushings, the moving plate has a planar shape of a circular ring, and the shafts are arranged along an edge of the moving plate.BRIEF DESCRIPTION OF THE FIGURES

[0009] The accompanying drawings are included to provide a further understanding of the inventive concept, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the inventive concept and, together with the description, serve to explain principles of the inventive concept. In the drawings:

[0010] FIG. 1 is a cross-sectional view for describing an electroplating apparatus according to example embodiments of the inventive concept;

[0011] FIG. 2 is a cross-sectional view for describing a substrate holder of an electroplating apparatus according to example embodiments of the inventive concept;

[0012] FIG. 3 is an exploded perspective view for describing a substrate holder of an electroplating apparatus according to example embodiments of the inventive concept;

[0013] FIG. 4 is a perspective view for describing a substrate holder of an electroplating apparatus according to example embodiments of the inventive concept;

[0014] FIG. 5 is a cross-sectional view for describing an operation of a substrate holder of an electroplating apparatus according to example embodiments of the inventive concept;

[0015] FIG. 6 is a cross-sectional view for describing operations of a shaft and a linear bushing;

[0016] FIG. 7 is a perspective view for describing an operation of a substrate holder of an electroplating apparatus according to example embodiments of the inventive concept;

[0017] FIG. 8 is a cross-sectional view for describing an operation of a substrate holder of an electroplating apparatus according to example embodiments of the inventive concept; and

[0018] FIG. 9 is a cross-sectional view for describing operations of a shaft and a linear bushing.DETAILED DESCRIPTION

[0019] An electroplating apparatus according to the inventive concept will be described with reference to the drawings. Like reference characters refer to like elements throughout.

[0020] FIG. 1 is a cross-sectional view for describing the electroplating apparatus according to example embodiments of the inventive concept.

[0021] Referring to FIG. 1, an electroplating apparatus 100 may include a plating bath 110, an anode electrode 120, a head portion 130, and a power supply 160.

[0022] The electroplating apparatus 100 may be an apparatus forming a metal layer by reducing and precipitating a metal ion on a wafer W by using a principle of electrolysis. The electroplating apparatus 100 may form an electroplated layer including metal such as copper (Cu), gold (Au), silver (Ag), or platinum (Pt) on a surface of the wafer W. For example, the wafer W may include a silicon (Si) wafer, a germanium (Ge) wafer, a ceramic wafer, or the like.

[0023] Although not shown, the electroplating apparatus 100 may receive the wafer W by an external loading / unloading unit. A cassette including a plurality of wafers may be located in the loading / unloading unit. In addition, a moving unit may move an individual wafer from the loading / unloading unit to the electroplating apparatus 100, and may move the individual wafer from the electroplating apparatus 100 to the loading / unloading unit. For example, the moving unit may include a robot, or the like capable of carrying the individual wafer while moving along a moving track.

[0024] The plating bath 110 may accommodate a plating solution SO thereinside. The plating bath 110 may include an electroplating chamber 112 having an internal space that accommodates the plating solution SO. The plating solution SO may be an electrolytic solution composed of an aqueous solution of a metal salt. For example, when a copper layer is electroplated on the wafer W, the plating solution SO may include an aqueous copper sulfate (CuSO4) solution.

[0025] A supply portion 114 that supplies the plating solution SO may be provided under the electroplating chamber 112. The supply portion 114 may be a conduit for supplying the plating solution SO to the electroplating chamber 112. The supply portion 114 may include, for example, a pipe, a hydraulic line, a tubing, a hose, etc. The plating solution SO supplied into the internal space of the electroplating chamber 112 from the supply portion 114 of the electroplating chamber 112 may move upward toward the wafer W.

[0026] Although not shown, an outlet portion that discharges an overflowed plating solution SO may be provided on a sidewall of the electroplating chamber 112. An overflow storage 113 that collects the overflowed plating solution SO from the electroplating chamber 112 may be formed between the electroplating chamber 112 and an inside of the plating bath 110. The overflow storage 113 of the plating bath 110 may supply the overflowed plating solution SO into the electroplating chamber 112 through a circulation line. The plating solution SO overflowed through the outlet portion of the sidewall of the electroplating chamber 112 may be filtered, and then may be recirculated by a pump. A heating member may be disposed on the circulation line, and may constantly maintain a temperature of the plating solution SO.

[0027] The anode electrode 120 may be disposed in the internal space of the electroplating chamber 112. For example, the anode electrode 120 may be disposed adjacent to a bottom portion of the electroplating chamber 112 in the internal space of the electroplating chamber 112. The anode electrode 120 may be a plate including metal that is electrodeposited in an electroplating process. For example, the anode electrode 120 may include a copper (Cu) plate.

[0028] The head portion 130 may be disposed on the sidewall of the electroplating chamber 112, and may hold the wafer W so as to immerse the wafer W in the plating solution SO. For example, the head portion 130 may be disposed over the electroplating chamber 112 and above the plating solution SO. That is, the head portion 130 may be a substrate holder for holding the wafer W. When a plating process is performed, the head portion 130 may move up and down so as to immerse the wafer W in the plating solution SO.

[0029] The head portion 130 may further include a support plate 132, a moving plate 136, a rotor 138, and a fixing member 150. Hereinafter, specific configuration of the head portion 130 will be described with reference to FIGS. 2 to 4 in more detail.

[0030] FIG. 2 is a cross-sectional view for describing the substrate holder of the electroplating apparatus according to example embodiments of the inventive concept. FIG. 3 is an exploded perspective view for describing the substrate holder of the electroplating apparatus according to example embodiments of the inventive concept. FIG. 4 is a perspective view for describing the substrate holder of the electroplating apparatus according to example embodiments of the inventive concept. For convenience of description, it is illustrated in FIGS. 2 to 4 that the head portion 130 of FIG. 1 is turned upside down.

[0031] Referring to FIGS. 2 to 4, the head portion 130 may include a support plate 132, a cylinder 134, a moving plate 136, a rotor 138, a guide member 140 and a fixing member 150.

[0032] The support plate 132 may be fixed to a main body of the head portion 130. The support plate 132 may be raised in order to fix and support other components disposed on the support plate 132, for example, the cylinder 134, the moving plate 136, the rotor 138, the guide member 140 and the fixing member 150. The support plate 132 may have a circular plate form. However, the inventive concept is not limited thereto, and the support plate 132 may be provided in a form of a plate having various planar shape as needed.

[0033] The moving plate 136 may be provided on the support plate 132. The moving plate 136 may be a coupling portion provided in order to be coupled to the rotor 138, and may be coupled to the rotor 138 to move the rotor 138 up and down. The moving plate 136 may have a planar shape of a circular ring.

[0034] The cylinder 134 may be coupled to the support plate 132. The cylinder 134 may be a driving device for moving the moving plate 136 up and down. For example, the cylinder 134 may have a piston 135 extending onto the cylinder 134 to be coupled to a lower surface of the moving plate 136. The piston 135 may be coupled to the moving plate 136 by using a coupling portion 137. For example, the coupling portion 137 may include a screw, etc. The cylinder 134 may move the piston 135 up and down, and thus the moving plate 136 may be moved up and down. More specifically, the cylinder 134 may lower the piston 135 to lower the moving plate 136, too. The cylinder 134 may raise the piston 135 to raise the moving plate 136, too. The cylinder 134 may not be exposed onto an upper surface of the support plate 132. For example, the cylinder 134 may be coupled to the lower surface of the support plate 132, and the piston 135 may protrude above the support plate 132 through a penetration hole formed in the support plate 132. Alternatively, the cylinder 134 may be coupled to an inside of the support plate 132, but an upper surface of the cylinder 134 may be located on the same plane as the upper surface of the support plate 132. The piston 135 may have a shape of a column extending in a vertical direction VD of the upper surface of the support plate 132. Hereinafter, for convenience of description, a vertical direction of the upper surface of the support plate 132 is defined as the vertical direction VD in the present specification. That is, a vertical axis of the piston 135 may be the vertical direction VD. The piston 135 may be lowered or raised in the vertical direction VD.

[0035] The cylinder 134 may be provided in plurality as needed. For example, as illustrated in FIG. 3, the cylinder 134 may be provided as at least three cylinders 134. On a plan view, the cylinders 134 may be arranged along an edge of the moving plate 136. Differently describing, the cylinders 134 may be connected to the lower surface of the moving plate 136 having a circular ring form. Preferentially, the cylinders 134 may be arranged so as to have the same interval as each other.

[0036] The guide member 140 may be provided to the support plate 132 and the moving plate 136. When the moving plate 136 moves up and down, the guide member 140 may be a linear motion device provided in order to maintain leveling of the moving plate 136 or to prevent the moving plate 136 from being inclined. The guide member 140 may include a linear bushing 142, a shaft 144, and a fixing block 146.

[0037] The linear bushing 142 may be coupled to the lower surface of the moving plate 136. The linear bushing 142 may be disposed so as to be spaced apart from the piston 135 of the cylinder 134. That is, a coupling portion of the piston 135 and a coupling portion of the linear bushing 142 may be spaced apart from each other on the lower surface of the moving plate 136. The linear bushing 142 may force the moving plate 136 to perform a linear motion. Here, the linear motion of the moving plate 136 may be a linear motion in the vertical direction VD. The linear bushing 142 may have a flange for coupling the linear bushing 142 to the lower surface of the moving plate 136, and a cylindrical body portion extending from the flange toward the support plate 132. The shaft 144 to be described later may be inserted into an inside of the body portion of the linear bushing 142, and may have a mechanical component such as a bearing in order to easily move the shaft 144. For example, the bearing may include a ball bearing. However, a form of the linear bushing 142 is an example, and the inventive concept is not limited thereto. The linear bushing 142 may be provided in various forms and structures as needed. A vertical height of the linear bushing 142 may be greater than a vertical thickness of the moving plate 136. Here, the vertical height of the linear bushing 142 and the vertical thickness of the moving plate 136 respectively mean a height and a thickness measured in the vertical direction VD. The linear bushing 142 may be coupled to the moving plate 136 by using a coupling portion. For example, the coupling portion may include a screw, etc.

[0038] A guide hole 143 may be provided to the linear bushing142. The guide hole 143 may vertically penetrate the moving plate 136 and the linear bushing 142. More specifically, the guide hole 143 may extend from an upper surface of the moving plate 136 to a lower surface of the body portion of the linear bushing 142. The guide hole 143 may be a moving path into which the shaft 144 is inserted and through which the shaft 144 moves. An extension direction of the guide hole 143 may be parallel to the vertical axis and the up-and-down moving direction of the piston 135 of the cylinder 134. The extension direction of the guide hole 143 may be the vertical direction VD. A width of the guide hole 143 measured in the moving plate 136 may be greater than a width of the guide hole 143 measured in the linear bushing 142. The width of the guide hole 143 may be an inner diameter of the guide hole 143 measured in a direction vertical to the vertical direction VD.

[0039] The shaft 144 may be coupled to the support plate 132. The shaft 144 may be disposed so as to be spaced apart from the cylinder 134. The shaft 144 may be disposed so as to vertically correspond to the linear bushing 142. The shaft 144 may have a shape of a column extending in the vertical direction VD of the upper surface of the support plate 132. That is, a vertical axis of the shaft 144 may be the vertical direction VD. For example, the vertical axis of the shaft 144 may be parallel to the up-and-down moving direction and the vertical axis of the piston 135. The shaft 144 may provide a path through which the linear bushing 142 moves up and down. For example, the shaft 144 may be inserted into the guide hole 143. The width of the guide hole 143 may be greater than a width of the shaft 144. The shaft 144 may protrude onto the support plate 132. The linear bushing 142 and the moving plate 136 to which the linear bushing 142 is coupled may move up and down along the shaft 144. More preferentially, the moving plate 136 may vertically move up and down along the shaft 144 through the guide hole 143. This will be described later in more detail. When the moving plate 136 is lowered, the shaft 144 may protrude onto the moving plate 136.

[0040] The shaft 144 may be coupled to the support plate 132 by using the fixing block 146. The fixing block 146 may be coupled to the support plate 132. The fixing block 146 may not be exposed onto the upper surface of the support plate 132. For example, the fixing block 146 may be coupled to an inside of the support plate 132, but an upper surface of the fixing block 146 may be located on the same plane as the upper surface of the support plate 132. Alternatively, the fixing block 146 may be coupled to the lower surface of the support plate 132. That is, the upper surface of the fixing block 146 may be located at a lower level than the upper surface of the support plate 132.

[0041] The fixing block 146 may have a recessed portion 145. The recessed portion 145 may be formed so as to face from the upper surface of the fixing block 146 to an inside thereof. The recessed portion 145 may surround the shaft 144. The fixing block 146 may be spaced apart from an outer circumferential surface of the shaft 144 by the recessed portion 145. Differently describing, the shaft 144 may be coupled to a bottom surface of the recessed portion 145 formed in the fixing block 146. A size and a shape of the recessed portion 145 may be the same as or greater than a size and a shape of the linear bushing 142. For example, when the linear bushing 142 is lowered along the shaft 144, the linear bushing 142 may be inserted into the recessed portion 145 of the fixing block 146. Differently describing, when the moving plate 136 is lowered, the moving plate 136 and the support plate 132 may not be spaced apart from each other by the linear bushing 142, and the lower surface of the moving plate 136 and the upper surface of the support plate 132 may be in contact with each other.

[0042] The guide member 140 may be provided in plurality as needed. For example, as illustrated in FIG. 3, the guide member 140 may be at least three guide members 140. On a plan view, the guide members 140 may be arranged along the edge of the moving plate 136. Differently describing, the guide members 140 may be disposed along the lower surface of the moving plate 136 having a circular ring form. The shafts 144 may be provided in plurality equal to or more than three, and the shafts 144 may be arranged along the edge of the moving plate 136. The shafts 144 coupled to the moving plate 136 may be connected to the lower surface of the moving plate 136 having the circular ring form. Preferentially, the guide members 140 may be arranged so as to have the same interval. On a plan view, each of the guide members 140 may be located between two adjacent cylinders 134. Preferentially, on a plan view, the shafts 144 of the guide members 140 and pistons of the cylinders 134 may be alternately disposed along the edge of the moving plate 136.

[0043] According to embodiments of the inventive concept, since the guide members 140 coupled to the moving plate 136 are provided, a vertical moving direction of the moving plate 136 may be corrected. This will be described later in more detail.

[0044] The rotor 138 may be disposed on the moving plate 136. The rotor 138 may be a component for supporting the wafer W. The rotor 138 may include an upper plate on which the wafer W is installed, a lower plate which is spaced apart from the upper plate to be coupled to the moving plate 136, and a connection portion which connects the upper plate and the lower plate. The rotor 138 may support a rear surface of the wafer W, and may move up and down depending on moving of the moving plate 136 such that an edge part of a front surface of the wafer W is in contact with the fixing member 150 to be described later. A distance between the upper plate and the lower plate of the rotor 138 may be greater than a height of the shafts 144 of the guide members 140. Accordingly, when the moving plate 136 is lowered by the cylinder 134, uppermost ends of the shafts 144 may be located at a lower position than the upper plate of the rotor 138, more preferentially, the wafer W. However, configuration of the described rotor 138 is an example, and the rotor 138 may be provided in various forms as needed.

[0045] The fixing member 150 may have a shape of a circle in contact with the edge part of the wafer W. The fixing member 150 may be disposed so as to hold the edge part of the wafer W. For example, when the moving plate 136 is raised by the cylinders 134, the fixing member 150 may include a sealing ring pressing the front surface of the wafer W to fix the wafer W onto the rotor 138. When the moving plate 136 is lowered by the cylinders 134, the fixing member 150 may be spaced apart from the wafer W in order to separate the wafer W. When the plating process is performed, a cathode electric potential may be applied to the fixing member 150, and thus a seed layer (not shown) on the wafer W may be functioned as a cathode electrode by applying electric potential to the wafer W electrically connected to the fixing member 150.

[0046] The fixing member 150 may further include a support portion 152. The support portion 152 may fix the fixing member 150, more preferentially, the sealing ring, and may define a space in which the wafer W moves up and down. For example, the support portion 152 may surround an edge of the rotor 138. The lower plate of the rotor 138 may be located on a lower surface of the support portion 152, and the support portion 152 may limit a position of the lower plate of the rotor 138 to prevent the rotor 138 from rising higher than necessary.

[0047] An elastic member 151 may be provided inside the support portion 152 as needed. The elastic member 151 may connect the rotor 138 and the support portion 152, and may press the rotor 138 upward. The elastic member 151 may be provided in order to press and clamp the wafer W on the rotor 138. The elastic member 151 may easily enable raising and lowering the rotor 138. The elastic member 151 may be installed on the support portion 152 and may press the rotor 138 such that the rotor 138 is stuck to the wafer W, and such that the wafer W is in contact with the fixing member 150. The elastic member 151 may enable raising and lowering the rotor 138. For example, the elastic member 151 may include a spring, etc.

[0048] The power supply 160 may be configured so as to provide an electrical signal to the anode electrode 120 and the fixing member 150. For example, the power supply 160 may include power applying the electrical signal to the anode electrode 120 and the fixing member 150, and a power control portion that controls a signal of a voltage applied to the anode electrode 120 and the fixing member 150.

[0049] FIG. 4 is a perspective view for describing the substrate holder of the electroplating apparatus according to example embodiments of the inventive concept. FIG. 5 is a cross-sectional view for describing an operation of the substrate holder of the electroplating apparatus according to example embodiments of the inventive concept. FIG. 6 is a cross-sectional view for describing operations of the shaft and the linear bushing. FIGS. 4 to 6 correspond to the drawing of a time at which the moving plate 136 of the head portion 130 is raised. FIG. 7 is a perspective view for describing an operation of the substrate holder of the electroplating apparatus according to example embodiments of the inventive concept. FIG. 8 is a cross-sectional view for describing an operation of the substrate holder of the electroplating apparatus according to example embodiments of the inventive concept. FIG. 9 is a cross-sectional view for describing operations of the shaft and the linear bushing. FIGS. 7 to 9 correspond to the drawing of a time at which the moving plate 136 of the head portion 130 is lowered.

[0050] Referring to FIGS. 4 to 6, the moving plate 136 may be raised by operating the cylinders 134. The pistons 135 of the cylinders 134 may push the moving plate 136 upward. In this case, the shafts 144 may be inserted in the guide holes 143, penetrating the moving plate 136 and the linear bushings 142. Accordingly, the moving plate 136 may move along the shafts 144, and a moving direction of the moving plate 136 may be the vertical direction VD, which is an extension direction of the shafts 144. That is, the guide holes 143 and the shafts 144 may define and force the moving direction of the moving plate 136. Even after raising the moving plate 136 is completed, the shafts 144 may be inserted in the guide holes 143. That is, the shafts 144 may be provided with a sufficient height so as to be located within a rising range of the moving plate 136.

[0051] Since the moving plate 136 is raised, the rotor 138 may be raised. The rotor 138 may be raised so that the wafer W on the rotor 138 may be in contact with the fixing member 150, and a front surface of the wafer W may be fixed and sealed by the fixing member 150. Thereafter, the head portion 130 (see FIG. 1) may move onto the electroplating chamber 112 (see FIG. 1) so that the wafer W may be immersed in the plating solution SO (see FIG. 1). and thus, the electroplating process may be performed.

[0052] According to embodiments of the inventive concept, since the guide members 140 coupled to the moving plate 136 are provided, the vertical moving direction of the moving plate 136 may be corrected. When some of the cylinders 134 are in a poor control state, a process error occurs in operating the cylinders 134, or failure occurs in some of the cylinders 134, rising heights between the pistons 135 of the cylinders 134 may be different from each other. A difference of the rising heights between the pistons 135 may cause inclining of the moving plate 136, and in this case, the wafer W installed on the rotor 138 may be partially strongly pressed by the fixing member 150, and may be damaged. However, according to embodiments of the inventive concept, since the guide members 140 are provided, even in the cases of poor control, process error, or failure of the cylinders 134, the moving plate 136 may be raised along the shafts 144 maintaining leveling without inclining. That is, the electroplating apparatus having improved driving stability and being capable of reducing damage of the wafer W during driving may be provided.

[0053] Referring to FIGS. 7 to 9, after the electroplating process is terminated, the head portion 130 (see FIG. 1) may be separated from the electroplating chamber 112 (see FIG. 1).

[0054] The moving plate 136 may be lowered by operating the cylinders 134. The pistons 135 of the cylinders 134 may pull the moving plate 136 downward. In this case, the shafts 144 may be inserted in the guide holes 143 penetrating the moving plate 136 and the linear bushings 142. Accordingly, the moving plate 136 may move along the shafts 144, and the moving direction of the moving plate 136 may be the vertical direction VD, which is the extension direction of the shafts 144. That is, the shafts 144 and the guide holes 143 may define and force the moving direction of the moving plate 136.

[0055] Since the moving plate 136 is lowered, the linear bushing 142 may become adjacent to the support plate 132 and the fixing block 146. The moving plate 136 may be continuously lowered, and the linear bushing 142 may be inserted into the recessed portion 145 of the fixing block 146. A size and a shape of the recessed portion 145 may be greater than a size and a shape of the linear bushing 142, and the linear bushing 142 may be completely inserted into the recessed portion 145 of the fixing block 146. Accordingly, the lower surface of the moving plate 136 may be in contact with the upper surface of the support plate 132. When the moving plate 136 is lowered, the support plate 132 and the moving plate 136 may not be spaced apart from each other by the linear bushing 142. The upper surface of the support plate 132 may become a reference surface with respect to the moving direction of the pistons 135 of the cylinders 134. Accordingly, since the moving plate 136 is in contact with the upper surface of the support plate 132, a position of the moving plate 136 may be horizontally aligned. Since the moving plate 136 is lowered along the shafts 144, the shafts 144 may penetrate the guide holes 143, and may protrude onto the moving plate 136.

[0056] Since the moving plate 136 is lowered, the rotor 138 may be lowered. The rotor 138 may be lowered so that the wafer W on the rotor 138 may be spaced apart from the fixing member 150. In this case, uppermost ends of the shafts 144 may be located at a lower position than the wafer W. That is, the shafts 144 may be provided with a height at which the wafer W may not be prevented from moving (or at which an upper plate of the rotor 138 may not be prevented from moving).

[0057] Thereafter, the wafer W may be separated from the head portion 130 (see FIG. 1).

[0058] When some of the cylinders 134 are in a poor control state, a process error occurs in operating the cylinders 134, or failure occurs in some of the cylinders 134, and lowering heights between the pistons 135 of the cylinders 134 may be different from each other. A difference of the lowering heights between the pistons 135 may cause inclining of the moving plate 136, and when the moving plate 136 is inclined, there may be increased friction between the moving plate 136 and other components (for example, the fixing member 150, etc.) in the head portion 130.

[0059] According to embodiments of the inventive concept, since the guide members 140 are provided, despite the poor control, the process error or the failure of the cylinders 134, the moving plate 136 may be lowered along the shaft 144 maintaining leveling without inclining. That is, the electroplating apparatus having improved driving stability, and being capable of reducing damage of components in the head portion 130 during driving may be provided.

[0060] Since guide members coupled to a moving plate are provided in an electroplating apparatus according to embodiments of the inventive concept, a vertical moving direction of the moving plate may be corrected. Since the guide members are provided, despite poor control, process error or failure of cylinders, the moving plate may be raised or lowered along shafts maintaining leveling without inclining. That is, the electroplating apparatus having improved driving stability, and being capable of reducing damage of a wafer during driving may be provided.

[0061] Although the embodiments of the present disclosure have been described, it is understood that the present disclosure should not be limited to these embodiments but various changes and modifications can be made by one ordinary skilled in the art within the spirit and scope of the present disclosure as hereinafter claimed. Therefore, it should be understood that the embodiments described above are exemplary in all respects and are not intended to be limiting.

Examples

Embodiment Construction

[0019] An electroplating apparatus according to the inventive concept will be described with reference to the drawings. Like reference characters refer to like elements throughout.

[0020]FIG. 1 is a cross-sectional view for describing the electroplating apparatus according to example embodiments of the inventive concept.

[0021] Referring to FIG. 1, an electroplating apparatus 100 may include a plating bath 110, an anode electrode 120, a head portion 130, and a power supply 160.

[0022] The electroplating apparatus 100 may be an apparatus forming a metal layer by reducing and precipitating a metal ion on a wafer W by using a principle of electrolysis. The electroplating apparatus 100 may form an electroplated layer including metal such as copper (Cu), gold (Au), silver (Ag), or platinum (Pt) on a surface of the wafer W. For example, the wafer W may include a silicon (Si) wafer, a germanium (Ge) wafer, a ceramic wafer, or the like.

[0023]Although not ...

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This U.S. non-provisional patent application claims priority under 35 U.S.C. § 119 of Korean Patent Application No. 10-2025-0010339, filed on January 23, 2025, the entire contents of which are hereby incorporated by reference. BACKGROUND

[0002] The present disclosure herein relates to an electroplating apparatus, and particularly, to a substrate holder of an electroplating apparatus.

[0003] A metal layer composed of copper is formed on a semiconductor wafer by an electroplating apparatus. Specifically, when the wafer is immersed in a plating bath containing a plating solution including a metal ion, and current is supplied, the metal ion in the plating solution is precipitated on the wafer to form the metal layer. In this case, a substrate holder that holds the wafer may be used in order to immerse the wafer in the plating bath. An edge of the wafer may be covered by a sealing ring in order to prevent a part except for a plated surface of the wafer from being plated. The substrate holder may hold the wafer by sticking the wafer to the sealing ring, and may separate the wafer by pulling the wafer away from the sealing ring. For this, a rotor that supports the wafer is provided so as to move in the substrate holder.SUMMARY

[0004] The present disclosure provides an electroplating apparatus with improved driving stability.

[0005] The present disclosure also provides an electroplating apparatus capable of reducing wafer damage.

[0006] An embodiment of the inventive concept provides an electroplating apparatus including a plating bath in which a plating solution is contained, and a substrate holder configured to hold a substrate so as to immerse the substrate in the plating solution, wherein the substrate holder includes a rotor configured to support the substrate, a moving plate configured to support the rotor thereunder, a support plate disposed under the moving plate, at least three cylinders coupled to the support plate, each of the cylinders having a piston connected to a lower surface of the moving plate to move the moving plate up and down, shafts disposed between the cylinders, and coupled to an upper surface of the support plate so as to extend in a direction vertical to the upper surface of the support plate, linear bushings coupled to a lower surface of the moving plate so as to vertically correspond to the shafts, and a sealing ring configured to fix the substrate onto the rotor by pressing an upper surface of the substrate when the moving plate is raised by the cylinders, and the shafts are inserted into guide holes vertically penetrating the moving plate and the linear bushings.

[0007] In an embodiment of the inventive concept, an electroplating apparatus includes a support plate, a moving plate disposed on the support plate, a cylinder coupled to the support plate, and having a piston connected to a lower surface of the moving plate to move the moving plate up and down, a fixing block coupled to the support plate so as to be horizontally spaced apart from the cylinder, a shaft coupled to the fixing block, and extending from the support plate toward the moving plate, a vertical axis of the shaft being parallel to a moving direction of the piston, a linear bushing coupled to a lower surface of the moving plate, and a guide hole vertically penetrating the moving plate and the linear bushing, wherein the shaft is inserted into the guide hole, the fixing block has a recessed portion formed from an upper surface of the fixing block inward, and surrounding the shaft, and when the moving plate is lowered by the cylinder, the linear bushing is inserted into the recessed portion of the fixing block.

[0008] In an embodiment of the inventive concept, an electroplating apparatus includes a plating bath in which a plating solution is contained, and a substrate holder configured to hold a substrate so as to immerse the substrate in the plating solution, wherein the substrate holder includes a moving plate, a support plate disposed under the moving plate, a cylinder coupled to the support plate, and having a piston connected to a lower surface of the moving plate to move the moving plate up and down, fixing blocks coupled to the support plate so as to be horizontally spaced apart from the cylinder, at least three shafts coupled to the fixing blocks, and coupled to an upper surface of the support plate so as to extend in a direction vertical to the upper surface of the support plate, and linear bushings coupled to a lower surface of the moving plate so as to vertically correspond to the shafts, the shafts vertically penetrate the moving plate and the linear bushings, the moving plate has a planar shape of a circular ring, and the shafts are arranged along an edge of the moving plate.BRIEF DESCRIPTION OF THE FIGURES

[0009] The accompanying drawings are included to provide a further understanding of the inventive concept, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the inventive concept and, together with the description, serve to explain principles of the inventive concept. In the drawings:

[0010] FIG. 1 is a cross-sectional view for describing an electroplating apparatus according to example embodiments of the inventive concept;

[0011] FIG. 2 is a cross-sectional view for describing a substrate holder of an electroplating apparatus according to example embodiments of the inventive concept;

[0012] FIG. 3 is an exploded perspective view for describing a substrate holder of an electroplating apparatus according to example embodiments of the inventive concept;

[0013] FIG. 4 is a perspective view for describing a substrate holder of an electroplating apparatus according to example embodiments of the inventive concept;

[0014] FIG. 5 is a cross-sectional view for describing an operation of a substrate holder of an electroplating apparatus according to example embodiments of the inventive concept;

[0015] FIG. 6 is a cross-sectional view for describing operations of a shaft and a linear bushing;

[0016] FIG. 7 is a perspective view for describing an operation of a substrate holder of an electroplating apparatus according to example embodiments of the inventive concept;

[0017] FIG. 8 is a cross-sectional view for describing an operation of a substrate holder of an electroplating apparatus according to example embodiments of the inventive concept; and

[0018] FIG. 9 is a cross-sectional view for describing operations of a shaft and a linear bushing.DETAILED DESCRIPTION

[0019] An electroplating apparatus according to the inventive concept will be described with reference to the drawings. Like reference characters refer to like elements throughout.

[0020] FIG. 1 is a cross-sectional view for describing the electroplating apparatus according to example embodiments of the inventive concept.

[0021] Referring to FIG. 1, an electroplating apparatus 100 may include a plating bath 110, an anode electrode 120, a head portion 130, and a power supply 160.

[0022] The electroplating apparatus 100 may be an apparatus forming a metal layer by reducing and precipitating a metal ion on a wafer W by using a principle of electrolysis. The electroplating apparatus 100 may form an electroplated layer including metal such as copper (Cu), gold (Au), silver (Ag), or platinum (Pt) on a surface of the wafer W. For example, the wafer W may include a silicon (Si) wafer, a germanium (Ge) wafer, a ceramic wafer, or the like.

[0023] Although not shown, the electroplating apparatus 100 may receive the wafer W by an external loading / unloading unit. A cassette including a plurality of wafers may be located in the loading / unloading unit. In addition, a moving unit may move an individual wafer from the loading / unloading unit to the electroplating apparatus 100, and may move the individual wafer from the electroplating apparatus 100 to the loading / unloading unit. For example, the moving unit may include a robot, or the like capable of carrying the individual wafer while moving along a moving track.

[0024] The plating bath 110 may accommodate a plating solution SO thereinside. The plating bath 110 may include an electroplating chamber 112 having an internal space that accommodates the plating solution SO. The plating solution SO may be an electrolytic solution composed of an aqueous solution of a metal salt. For example, when a copper layer is electroplated on the wafer W, the plating solution SO may include an aqueous copper sulfate (CuSO4) solution.

[0025] A supply portion 114 that supplies the plating solution SO may be provided under the electroplating chamber 112. The supply portion 114 may be a conduit for supplying the plating solution SO to the electroplating chamber 112. The supply portion 114 may include, for example, a pipe, a hydraulic line, a tubing, a hose, etc. The plating solution SO supplied into the internal space of the electroplating chamber 112 from the supply portion 114 of the electroplating chamber 112 may move upward toward the wafer W.

[0026] Although not shown, an outlet portion that discharges an overflowed plating solution SO may be provided on a sidewall of the electroplating chamber 112. An overflow storage 113 that collects the overflowed plating solution SO from the electroplating chamber 112 may be formed between the electroplating chamber 112 and an inside of the plating bath 110. The overflow storage 113 of the plating bath 110 may supply the overflowed plating solution SO into the electroplating chamber 112 through a circulation line. The plating solution SO overflowed through the outlet portion of the sidewall of the electroplating chamber 112 may be filtered, and then may be recirculated by a pump. A heating member may be disposed on the circulation line, and may constantly maintain a temperature of the plating solution SO.

[0027] The anode electrode 120 may be disposed in the internal space of the electroplating chamber 112. For example, the anode electrode 120 may be disposed adjacent to a bottom portion of the electroplating chamber 112 in the internal space of the electroplating chamber 112. The anode electrode 120 may be a plate including metal that is electrodeposited in an electroplating process. For example, the anode electrode 120 may include a copper (Cu) plate.

[0028] The head portion 130 may be disposed on the sidewall of the electroplating chamber 112, and may hold the wafer W so as to immerse the wafer W in the plating solution SO. For example, the head portion 130 may be disposed over the electroplating chamber 112 and above the plating solution SO. That is, the head portion 130 may be a substrate holder for holding the wafer W. When a plating process is performed, the head portion 130 may move up and down so as to immerse the wafer W in the plating solution SO.

[0029] The head portion 130 may further include a support plate 132, a moving plate 136, a rotor 138, and a fixing member 150. Hereinafter, specific configuration of the head portion 130 will be described with reference to FIGS. 2 to 4 in more detail.

[0030] FIG. 2 is a cross-sectional view for describing the substrate holder of the electroplating apparatus according to example embodiments of the inventive concept. FIG. 3 is an exploded perspective view for describing the substrate holder of the electroplating apparatus according to example embodiments of the inventive concept. FIG. 4 is a perspective view for describing the substrate holder of the electroplating apparatus according to example embodiments of the inventive concept. For convenience of description, it is illustrated in FIGS. 2 to 4 that the head portion 130 of FIG. 1 is turned upside down.

[0031] Referring to FIGS. 2 to 4, the head portion 130 may include a support plate 132, a cylinder 134, a moving plate 136, a rotor 138, a guide member 140 and a fixing member 150.

[0032] The support plate 132 may be fixed to a main body of the head portion 130. The support plate 132 may be raised in order to fix and support other components disposed on the support plate 132, for example, the cylinder 134, the moving plate 136, the rotor 138, the guide member 140 and the fixing member 150. The support plate 132 may have a circular plate form. However, the inventive concept is not limited thereto, and the support plate 132 may be provided in a form of a plate having various planar shape as needed.

[0033] The moving plate 136 may be provided on the support plate 132. The moving plate 136 may be a coupling portion provided in order to be coupled to the rotor 138, and may be coupled to the rotor 138 to move the rotor 138 up and down. The moving plate 136 may have a planar shape of a circular ring.

[0034] The cylinder 134 may be coupled to the support plate 132. The cylinder 134 may be a driving device for moving the moving plate 136 up and down. For example, the cylinder 134 may have a piston 135 extending onto the cylinder 134 to be coupled to a lower surface of the moving plate 136. The piston 135 may be coupled to the moving plate 136 by using a coupling portion 137. For example, the coupling portion 137 may include a screw, etc. The cylinder 134 may move the piston 135 up and down, and thus the moving plate 136 may be moved up and down. More specifically, the cylinder 134 may lower the piston 135 to lower the moving plate 136, too. The cylinder 134 may raise the piston 135 to raise the moving plate 136, too. The cylinder 134 may not be exposed onto an upper surface of the support plate 132. For example, the cylinder 134 may be coupled to the lower surface of the support plate 132, and the piston 135 may protrude above the support plate 132 through a penetration hole formed in the support plate 132. Alternatively, the cylinder 134 may be coupled to an inside of the support plate 132, but an upper surface of the cylinder 134 may be located on the same plane as the upper surface of the support plate 132. The piston 135 may have a shape of a column extending in a vertical direction VD of the upper surface of the support plate 132. Hereinafter, for convenience of description, a vertical direction of the upper surface of the support plate 132 is defined as the vertical direction VD in the present specification. That is, a vertical axis of the piston 135 may be the vertical direction VD. The piston 135 may be lowered or raised in the vertical direction VD.

[0035] The cylinder 134 may be provided in plurality as needed. For example, as illustrated in FIG. 3, the cylinder 134 may be provided as at least three cylinders 134. On a plan view, the cylinders 134 may be arranged along an edge of the moving plate 136. Differently describing, the cylinders 134 may be connected to the lower surface of the moving plate 136 having a circular ring form. Preferentially, the cylinders 134 may be arranged so as to have the same interval as each other.

[0036] The guide member 140 may be provided to the support plate 132 and the moving plate 136. When the moving plate 136 moves up and down, the guide member 140 may be a linear motion device provided in order to maintain leveling of the moving plate 136 or to prevent the moving plate 136 from being inclined. The guide member 140 may include a linear bushing 142, a shaft 144, and a fixing block 146.

[0037] The linear bushing 142 may be coupled to the lower surface of the moving plate 136. The linear bushing 142 may be disposed so as to be spaced apart from the piston 135 of the cylinder 134. That is, a coupling portion of the piston 135 and a coupling portion of the linear bushing 142 may be spaced apart from each other on the lower surface of the moving plate 136. The linear bushing 142 may force the moving plate 136 to perform a linear motion. Here, the linear motion of the moving plate 136 may be a linear motion in the vertical direction VD. The linear bushing 142 may have a flange for coupling the linear bushing 142 to the lower surface of the moving plate 136, and a cylindrical body portion extending from the flange toward the support plate 132. The shaft 144 to be described later may be inserted into an inside of the body portion of the linear bushing 142, and may have a mechanical component such as a bearing in order to easily move the shaft 144. For example, the bearing may include a ball bearing. However, a form of the linear bushing 142 is an example, and the inventive concept is not limited thereto. The linear bushing 142 may be provided in various forms and structures as needed. A vertical height of the linear bushing 142 may be greater than a vertical thickness of the moving plate 136. Here, the vertical height of the linear bushing 142 and the vertical thickness of the moving plate 136 respectively mean a height and a thickness measured in the vertical direction VD. The linear bushing 142 may be coupled to the moving plate 136 by using a coupling portion. For example, the coupling portion may include a screw, etc.

[0038] A guide hole 143 may be provided to the linear bushing142. The guide hole 143 may vertically penetrate the moving plate 136 and the linear bushing 142. More specifically, the guide hole 143 may extend from an upper surface of the moving plate 136 to a lower surface of the body portion of the linear bushing 142. The guide hole 143 may be a moving path into which the shaft 144 is inserted and through which the shaft 144 moves. An extension direction of the guide hole 143 may be parallel to the vertical axis and the up-and-down moving direction of the piston 135 of the cylinder 134. The extension direction of the guide hole 143 may be the vertical direction VD. A width of the guide hole 143 measured in the moving plate 136 may be greater than a width of the guide hole 143 measured in the linear bushing 142. The width of the guide hole 143 may be an inner diameter of the guide hole 143 measured in a direction vertical to the vertical direction VD.

[0039] The shaft 144 may be coupled to the support plate 132. The shaft 144 may be disposed so as to be spaced apart from the cylinder 134. The shaft 144 may be disposed so as to vertically correspond to the linear bushing 142. The shaft 144 may have a shape of a column extending in the vertical direction VD of the upper surface of the support plate 132. That is, a vertical axis of the shaft 144 may be the vertical direction VD. For example, the vertical axis of the shaft 144 may be parallel to the up-and-down moving direction and the vertical axis of the piston 135. The shaft 144 may provide a path through which the linear bushing 142 moves up and down. For example, the shaft 144 may be inserted into the guide hole 143. The width of the guide hole 143 may be greater than a width of the shaft 144. The shaft 144 may protrude onto the support plate 132. The linear bushing 142 and the moving plate 136 to which the linear bushing 142 is coupled may move up and down along the shaft 144. More preferentially, the moving plate 136 may vertically move up and down along the shaft 144 through the guide hole 143. This will be described later in more detail. When the moving plate 136 is lowered, the shaft 144 may protrude onto the moving plate 136.

[0040] The shaft 144 may be coupled to the support plate 132 by using the fixing block 146. The fixing block 146 may be coupled to the support plate 132. The fixing block 146 may not be exposed onto the upper surface of the support plate 132. For example, the fixing block 146 may be coupled to an inside of the support plate 132, but an upper surface of the fixing block 146 may be located on the same plane as the upper surface of the support plate 132. Alternatively, the fixing block 146 may be coupled to the lower surface of the support plate 132. That is, the upper surface of the fixing block 146 may be located at a lower level than the upper surface of the support plate 132.

[0041] The fixing block 146 may have a recessed portion 145. The recessed portion 145 may be formed so as to face from the upper surface of the fixing block 146 to an inside thereof. The recessed portion 145 may surround the shaft 144. The fixing block 146 may be spaced apart from an outer circumferential surface of the shaft 144 by the recessed portion 145. Differently describing, the shaft 144 may be coupled to a bottom surface of the recessed portion 145 formed in the fixing block 146. A size and a shape of the recessed portion 145 may be the same as or greater than a size and a shape of the linear bushing 142. For example, when the linear bushing 142 is lowered along the shaft 144, the linear bushing 142 may be inserted into the recessed portion 145 of the fixing block 146. Differently describing, when the moving plate 136 is lowered, the moving plate 136 and the support plate 132 may not be spaced apart from each other by the linear bushing 142, and the lower surface of the moving plate 136 and the upper surface of the support plate 132 may be in contact with each other.

[0042] The guide member 140 may be provided in plurality as needed. For example, as illustrated in FIG. 3, the guide member 140 may be at least three guide members 140. On a plan view, the guide members 140 may be arranged along the edge of the moving plate 136. Differently describing, the guide members 140 may be disposed along the lower surface of the moving plate 136 having a circular ring form. The shafts 144 may be provided in plurality equal to or more than three, and the shafts 144 may be arranged along the edge of the moving plate 136. The shafts 144 coupled to the moving plate 136 may be connected to the lower surface of the moving plate 136 having the circular ring form. Preferentially, the guide members 140 may be arranged so as to have the same interval. On a plan view, each of the guide members 140 may be located between two adjacent cylinders 134. Preferentially, on a plan view, the shafts 144 of the guide members 140 and pistons of the cylinders 134 may be alternately disposed along the edge of the moving plate 136.

[0043] According to embodiments of the inventive concept, since the guide members 140 coupled to the moving plate 136 are provided, a vertical moving direction of the moving plate 136 may be corrected. This will be described later in more detail.

[0044] The rotor 138 may be disposed on the moving plate 136. The rotor 138 may be a component for supporting the wafer W. The rotor 138 may include an upper plate on which the wafer W is installed, a lower plate which is spaced apart from the upper plate to be coupled to the moving plate 136, and a connection portion which connects the upper plate and the lower plate. The rotor 138 may support a rear surface of the wafer W, and may move up and down depending on moving of the moving plate 136 such that an edge part of a front surface of the wafer W is in contact with the fixing member 150 to be described later. A distance between the upper plate and the lower plate of the rotor 138 may be greater than a height of the shafts 144 of the guide members 140. Accordingly, when the moving plate 136 is lowered by the cylinder 134, uppermost ends of the shafts 144 may be located at a lower position than the upper plate of the rotor 138, more preferentially, the wafer W. However, configuration of the described rotor 138 is an example, and the rotor 138 may be provided in various forms as needed.

[0045] The fixing member 150 may have a shape of a circle in contact with the edge part of the wafer W. The fixing member 150 may be disposed so as to hold the edge part of the wafer W. For example, when the moving plate 136 is raised by the cylinders 134, the fixing member 150 may include a sealing ring pressing the front surface of the wafer W to fix the wafer W onto the rotor 138. When the moving plate 136 is lowered by the cylinders 134, the fixing member 150 may be spaced apart from the wafer W in order to separate the wafer W. When the plating process is performed, a cathode electric potential may be applied to the fixing member 150, and thus a seed layer (not shown) on the wafer W may be functioned as a cathode electrode by applying electric potential to the wafer W electrically connected to the fixing member 150.

[0046] The fixing member 150 may further include a support portion 152. The support portion 152 may fix the fixing member 150, more preferentially, the sealing ring, and may define a space in which the wafer W moves up and down. For example, the support portion 152 may surround an edge of the rotor 138. The lower plate of the rotor 138 may be located on a lower surface of the support portion 152, and the support portion 152 may limit a position of the lower plate of the rotor 138 to prevent the rotor 138 from rising higher than necessary.

[0047] An elastic member 151 may be provided inside the support portion 152 as needed. The elastic member 151 may connect the rotor 138 and the support portion 152, and may press the rotor 138 upward. The elastic member 151 may be provided in order to press and clamp the wafer W on the rotor 138. The elastic member 151 may easily enable raising and lowering the rotor 138. The elastic member 151 may be installed on the support portion 152 and may press the rotor 138 such that the rotor 138 is stuck to the wafer W, and such that the wafer W is in contact with the fixing member 150. The elastic member 151 may enable raising and lowering the rotor 138. For example, the elastic member 151 may include a spring, etc.

[0048] The power supply 160 may be configured so as to provide an electrical signal to the anode electrode 120 and the fixing member 150. For example, the power supply 160 may include power applying the electrical signal to the anode electrode 120 and the fixing member 150, and a power control portion that controls a signal of a voltage applied to the anode electrode 120 and the fixing member 150.

[0049] FIG. 4 is a perspective view for describing the substrate holder of the electroplating apparatus according to example embodiments of the inventive concept. FIG. 5 is a cross-sectional view for describing an operation of the substrate holder of the electroplating apparatus according to example embodiments of the inventive concept. FIG. 6 is a cross-sectional view for describing operations of the shaft and the linear bushing. FIGS. 4 to 6 correspond to the drawing of a time at which the moving plate 136 of the head portion 130 is raised. FIG. 7 is a perspective view for describing an operation of the substrate holder of the electroplating apparatus according to example embodiments of the inventive concept. FIG. 8 is a cross-sectional view for describing an operation of the substrate holder of the electroplating apparatus according to example embodiments of the inventive concept. FIG. 9 is a cross-sectional view for describing operations of the shaft and the linear bushing. FIGS. 7 to 9 correspond to the drawing of a time at which the moving plate 136 of the head portion 130 is lowered.

[0050] Referring to FIGS. 4 to 6, the moving plate 136 may be raised by operating the cylinders 134. The pistons 135 of the cylinders 134 may push the moving plate 136 upward. In this case, the shafts 144 may be inserted in the guide holes 143, penetrating the moving plate 136 and the linear bushings 142. Accordingly, the moving plate 136 may move along the shafts 144, and a moving direction of the moving plate 136 may be the vertical direction VD, which is an extension direction of the shafts 144. That is, the guide holes 143 and the shafts 144 may define and force the moving direction of the moving plate 136. Even after raising the moving plate 136 is completed, the shafts 144 may be inserted in the guide holes 143. That is, the shafts 144 may be provided with a sufficient height so as to be located within a rising range of the moving plate 136.

[0051] Since the moving plate 136 is raised, the rotor 138 may be raised. The rotor 138 may be raised so that the wafer W on the rotor 138 may be in contact with the fixing member 150, and a front surface of the wafer W may be fixed and sealed by the fixing member 150. Thereafter, the head portion 130 (see FIG. 1) may move onto the electroplating chamber 112 (see FIG. 1) so that the wafer W may be immersed in the plating solution SO (see FIG. 1). and thus, the electroplating process may be performed.

[0052] According to embodiments of the inventive concept, since the guide members 140 coupled to the moving plate 136 are provided, the vertical moving direction of the moving plate 136 may be corrected. When some of the cylinders 134 are in a poor control state, a process error occurs in operating the cylinders 134, or failure occurs in some of the cylinders 134, rising heights between the pistons 135 of the cylinders 134 may be different from each other. A difference of the rising heights between the pistons 135 may cause inclining of the moving plate 136, and in this case, the wafer W installed on the rotor 138 may be partially strongly pressed by the fixing member 150, and may be damaged. However, according to embodiments of the inventive concept, since the guide members 140 are provided, even in the cases of poor control, process error, or failure of the cylinders 134, the moving plate 136 may be raised along the shafts 144 maintaining leveling without inclining. That is, the electroplating apparatus having improved driving stability and being capable of reducing damage of the wafer W during driving may be provided.

[0053] Referring to FIGS. 7 to 9, after the electroplating process is terminated, the head portion 130 (see FIG. 1) may be separated from the electroplating chamber 112 (see FIG. 1).

[0054] The moving plate 136 may be lowered by operating the cylinders 134. The pistons 135 of the cylinders 134 may pull the moving plate 136 downward. In this case, the shafts 144 may be inserted in the guide holes 143 penetrating the moving plate 136 and the linear bushings 142. Accordingly, the moving plate 136 may move along the shafts 144, and the moving direction of the moving plate 136 may be the vertical direction VD, which is the extension direction of the shafts 144. That is, the shafts 144 and the guide holes 143 may define and force the moving direction of the moving plate 136.

[0055] Since the moving plate 136 is lowered, the linear bushing 142 may become adjacent to the support plate 132 and the fixing block 146. The moving plate 136 may be continuously lowered, and the linear bushing 142 may be inserted into the recessed portion 145 of the fixing block 146. A size and a shape of the recessed portion 145 may be greater than a size and a shape of the linear bushing 142, and the linear bushing 142 may be completely inserted into the recessed portion 145 of the fixing block 146. Accordingly, the lower surface of the moving plate 136 may be in contact with the upper surface of the support plate 132. When the moving plate 136 is lowered, the support plate 132 and the moving plate 136 may not be spaced apart from each other by the linear bushing 142. The upper surface of the support plate 132 may become a reference surface with respect to the moving direction of the pistons 135 of the cylinders 134. Accordingly, since the moving plate 136 is in contact with the upper surface of the support plate 132, a position of the moving plate 136 may be horizontally aligned. Since the moving plate 136 is lowered along the shafts 144, the shafts 144 may penetrate the guide holes 143, and may protrude onto the moving plate 136.

[0056] Since the moving plate 136 is lowered, the rotor 138 may be lowered. The rotor 138 may be lowered so that the wafer W on the rotor 138 may be spaced apart from the fixing member 150. In this case, uppermost ends of the shafts 144 may be located at a lower position than the wafer W. That is, the shafts 144 may be provided with a height at which the wafer W may not be prevented from moving (or at which an upper plate of the rotor 138 may not be prevented from moving).

[0057] Thereafter, the wafer W may be separated from the head portion 130 (see FIG. 1).

[0058] When some of the cylinders 134 are in a poor control state, a process error occurs in operating the cylinders 134, or failure occurs in some of the cylinders 134, and lowering heights between the pistons 135 of the cylinders 134 may be different from each other. A difference of the lowering heights between the pistons 135 may cause inclining of the moving plate 136, and when the moving plate 136 is inclined, there may be increased friction between the moving plate 136 and other components (for example, the fixing member 150, etc.) in the head portion 130.

[0059] According to embodiments of the inventive concept, since the guide members 140 are provided, despite the poor control, the process error or the failure of the cylinders 134, the moving plate 136 may be lowered along the shaft 144 maintaining leveling without inclining. That is, the electroplating apparatus having improved driving stability, and being capable of reducing damage of components in the head portion 130 during driving may be provided.

[0060] Since guide members coupled to a moving plate are provided in an electroplating apparatus according to embodiments of the inventive concept, a vertical moving direction of the moving plate may be corrected. Since the guide members are provided, despite poor control, process error or failure of cylinders, the moving plate may be raised or lowered along shafts maintaining leveling without inclining. That is, the electroplating apparatus having improved driving stability, and being capable of reducing damage of a wafer during driving may be provided.

[0061] Although the embodiments of the present disclosure have been described, it is understood that the present disclosure should not be limited to these embodiments but various changes and modifications can be made by one ordinary skilled in the art within the spirit and scope of the present disclosure as hereinafter claimed. Therefore, it should be understood that the embodiments described above are exemplary in all respects and are not intended to be limiting.

Examples

Embodiment Construction

[0019] An electroplating apparatus according to the inventive concept will be described with reference to the drawings. Like reference characters refer to like elements throughout.

[0020]FIG. 1 is a cross-sectional view for describing the electroplating apparatus according to example embodiments of the inventive concept.

[0021] Referring to FIG. 1, an electroplating apparatus 100 may include a plating bath 110, an anode electrode 120, a head portion 130, and a power supply 160.

[0022] The electroplating apparatus 100 may be an apparatus forming a metal layer by reducing and precipitating a metal ion on a wafer W by using a principle of electrolysis. The electroplating apparatus 100 may form an electroplated layer including metal such as copper (Cu), gold (Au), silver (Ag), or platinum (Pt) on a surface of the wafer W. For example, the wafer W may include a silicon (Si) wafer, a germanium (Ge) wafer, a ceramic wafer, or the like.

[0023]Although not ...

Claims

1. An electroplating apparatus comprising:a plating bath in which a plating solution is contained; anda substrate holder configured to hold a substrate so as to immerse the substrate in the plating solution,wherein the substrate holder includes:a rotor configured to support the substrate;a moving plate configured to support the rotor thereunder;a support plate disposed under the moving plate;at least three cylinders coupled to the support plate, each of the cylinders having a piston connected to a lower surface of the moving plate to move the moving plate up and down;shafts disposed between the cylinders, and coupled to an upper surface of the support plate so as to extend in a direction vertical to the upper surface of the support plate;linear bushings coupled to a lower surface of the moving plate so as to vertically correspond to the shafts; and a sealing ring configured to fix the substrate onto the rotor by pressing an upper surface of the substrate when the moving plate is raised by the cylinders, andwherein the shafts are inserted into guide holes vertically penetrating the moving plate and the linear bushings.

2. The electroplating apparatus of claim 1, wherein the moving plate has a planar shape of a circular ring, wherein the pistons are arranged along an edge of the moving plate, and wherein the shafts are arranged along the edge of the moving plate.

3. The electroplating apparatus of claim 2, wherein the pistons and the shafts are alternately disposed along the edge of the moving plate.

4. The electroplating apparatus of claim 1, wherein when the moving plate is lowered by the cylinders, the shafts protrude onto the moving plate.

5. The electroplating apparatus of claim 1, further comprising: fixing blocks configured to fix the shafts to the support plate, wherein the fixing blocks have a recessed portion formed from upper surfaces of the fixing blocks inward, and surrounding the shafts, and wherein, when the moving plate is lowered by the cylinders, the linear bushings are inserted into the recessed portion of the fixing blocks.

6. The electroplating apparatus of claim 5, wherein upper surfaces of the fixing blocks are located at the same level as or at a lower level than the upper surface of the support plate.

7. The electroplating apparatus of claim 5, wherein when the moving plate is lowered by the cylinders, the lower surface of the moving plate is in contact with the upper surface of the support plate.

8. The electroplating apparatus of claim 1, wherein vertical axes of the shafts are parallel to a moving direction of the pistons.

9. The electroplating apparatus of claim 1, wherein a width of the guide holes is greater than a width of the shafts.

10. The electroplating apparatus of claim 1, wherein when the moving plate is lowered by the cylinders, an uppermost end of the shafts is located at a lower vertical level than the substrate.

11. The electroplating apparatus of claim 1, wherein a width of the guide holes measured in the moving plate is greater than a width of the guide holes measured in the linear bushings.

12. The electroplating apparatus of claim 1, wherein a height of the linear bushings is greater than a vertical thickness of the moving plate.

13. The electroplating apparatus of claim 1, wherein when the moving plate is raised and lowered by the cylinders, the moving plate moves to upper portions or lower portions of the shafts along the guide holes.

14. An electroplating apparatus comprising:a support plate;a moving plate disposed on the support plate;a cylinder coupled to the support plate, and having a piston connected to a lower surface of the moving plate to move the moving plate up and down;a fixing block coupled to the support plate so as to be horizontally spaced apart from the cylinder;a shaft coupled to the fixing block, and extending from the support plate toward the moving plate, a vertical axis of the shaft being parallel to a moving direction of the piston;a linear bushing coupled to a lower surface of the moving plate; and a guide hole vertically penetrating the moving plate and the linear bushing, wherein the shaft is inserted into the guide hole, wherein the fixing block has a recessed portion formed from an upper surface of the fixing block inward, and surrounding the shaft, and wherein, when the moving plate is lowered by the cylinder, the linear bushing is inserted into the recessed portion of the fixing block.

15. The electroplating apparatus of claim 14, wherein the moving plate has a planar shape of a circular ring, wherein each of the cylinder and the piston is provided in a plurality equal to or more than three, and the cylinders and the pistons are arranged along an edge of the moving plate, and wherein the shaft is provided in a plurality equal to or more than three, and the shafts are arranged along the edge of the moving plate.

16. The electroplating apparatus of claim 15, wherein the pistons and the shafts are alternately disposed along the edge of the moving plate.

17. The electroplating apparatus of claim 14, wherein when the moving plate is lowered by the cylinder, the shaft protrudes onto the moving plate.

18. The electroplating apparatus of claim 14, wherein when the moving plate is raised and lowered by the cylinder, the moving plate moves to an upper portion or a lower portion of the shaft along the guide hole.

19. The electroplating apparatus of claim 14, wherein when the moving plate is lowered by the cylinder, the lower surface of the moving plate is in contact with the upper surface of the support plate.

20. An electroplating apparatus comprising:a plating bath in which a plating solution is contained; anda substrate holder configured to hold a substrate so as to immerse the substrate in the plating solution,wherein the substrate holder includes:a moving plate;a support plate disposed under the moving plate;a cylinder coupled to the support plate, and having a piston connected to a lower surface of the moving plate to move the moving plate up and down;fixing blocks coupled to the support plate so as to be horizontally spaced apart from the cylinder; at least three shafts coupled to the fixing blocks, and coupled to an upper surface of the support plate so as to extend in a direction vertical to the upper surface of the support plate; and linear bushings coupled to a lower surface of the moving plate so as to vertically correspond to the shafts, wherein the shafts vertically penetrate the moving plate and the linear bushings, wherein the moving plate has a planar shape of a circular ring, and wherein the shafts are arranged along an edge of the moving plate.

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