Pump delivery tool and delivery method for vacuum pump using the same

Abstract

A method includes receiving a demand for delivering a vacuum pump in a wafer fabrication facility. The vacuum pump in a pump storage region of the wafer fabrication facility is assigned. A pump delivery tool is set up on a top surface of the assigned vacuum pump. The pump delivery tool includes length adjustment mechanisms, width adjustment mechanisms, and first fixing elements. The width adjustment mechanisms and the length adjustment mechanisms are over the top surface of the assigned vacuum pump. The width adjustment mechanisms are assembled to the length adjustment mechanisms. The width adjustment mechanisms are substantially perpendicular to the length adjustment mechanisms. The first fixing elements secure the length adjustment mechanisms to the width adjustment mechanisms. The assigned vacuum pump is delivered by using the pump delivery tool in the wafer fabrication facility.

Description

PRIORITY CLAIM AND CROSS-REFERENCE

[0001] The present application claims priority to China Application Serial Number 202520189797.8, filed Feb. 7, 2025, which is herein incorporated by reference.BACKGROUND

[0002] Integrated circuits including semiconductor devices are used in a variety of electronic applications, such as, for example, personal computers, cell phones, digital cameras, and other electronic equipment. Semiconductor devices are typically fabricated by sequentially depositing insulating or dielectric layers, conductive layers, and semiconductor layers of material over a semiconductor substrate, and patterning the various material layers using lithography to form circuit components and elements thereon. A series of chemical and physical processes may be performed during the fabrication process flow, using equipment with processing chambers that are often maintained at low pressure or partial vacuum.BRIEF DESCRIPTION OF THE DRAWINGS

[0003] Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying figures. It is noted that, in accordance with the standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.

[0004] FIG. 1 is an illustrative diagram of a wafer fabrication facility in accordance with some embodiments.

[0005] FIG. 2 is a flowchart illustrating a method for delivering and replacing vacuum pumps in the wafer fabrication facility in accordance with some embodiments.

[0006] FIG. 3 is a perspective view of the vacuum pump in FIG. 1 in accordance with some embodiments.

[0007] FIGS. 4-7 are different views of a pump delivery tool in accordance with some embodiments.

[0008] FIG. 8 is a schematic exploded view of the pump delivery tool in accordance with some embodiments.

[0009] FIG. 9 is a flowchart illustrating a method for setting up the pump delivery tool on the vacuum pump in accordance with some embodiments.

[0010] FIG. 10 is a perspective view of the pump delivery tool and the vacuum pump in accordance with some embodiments.

[0011] FIG. 11 is a flowchart illustrating a method for delivering the assigned vacuum pump by using the pump delivery tool in accordance with some embodiments.

[0012] FIG. 12 is a flowchart illustrating a method for detaching the pump delivery tool 100 from the vacuum pump in accordance with some embodiments.

[0013] FIG. 13 is a flowchart illustrating a method for delivering an old vacuum pumps out of an area in the wafer fabrication facility in accordance with some embodiments.DETAILED DESCRIPTION

[0014] The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. For example, the formation of a first feature over or on a second feature in the description that follows may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed between the first and second features, such that the first and second features may not be in direct contact. In addition, the present disclosure may repeat reference numerals and / or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and / or configurations discussed.

[0015] Further, spatially relative terms, such as “beneath”, “below”, “lower”, “above”, “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.

[0016] As used herein, “around”, “about”, “approximately”, or “substantially” shall generally mean within 20 percent, or within 10 percent, or within 5 percent of a given value or range. Numerical quantities given herein are approximate, meaning that the term “around”, “about”, “approximately”, or “substantially” can be inferred if not expressly stated. One of ordinary skill in the art will appreciate that the dimensions may be varied according to different technology nodes. One of ordinary skill in the art will recognize that the dimensions depend upon the specific device type, technology generation, minimum feature size, and the like. It is intended, therefore, that the term be interpreted in light of the technology being evaluated.

[0017] An integrated circuit fabrication facility generally utilizes vacuum systems wherein one or more vacuum pumps operate to maintain low pressure (e.g., from sub-atmospheric pressure (<760 Torr) to about a millitorr) in vacuum chambers of many of the processing equipment / tools used to manufacture semiconductor devices. In a semiconductor fabrication facility (FAB), wafers are frequently transported between various processing equipment / tools in corresponding bays, so as to carry out different semiconductor manufacturing processes. Since the processing equipment / tools are located in different areas of the FAB, vacuum pumps are delivered to these areas so as to be set up the vacuum systems for the processing equipment / tools that require the vacuum systems.

[0018] Some embodiments of the present disclosure are related to delivery of vacuum pumps in the FAB. More specifically, some embodiments of the present disclosure provide pump delivery tools for delivering the vacuum pumps and method for using the pump delivery tools. With the pump delivery tools, various heavy vacuum pumps can be easily and effectively delivered by operators. Also, the safety of the operators for delivering the vacuum pumps is improved.

[0019] FIG. 1 is an illustrative diagram of a wafer fabrication facility 1 in accordance with some embodiments. In the wafer fabrication facility 1, equipment 10 with similar functions may be clustered in areas 15, which are called process bays or bays. An inter-bay aisle 30 is located between the areas 15. A pump storage region 20 is located in the wafer fabrication facility 1 and is a temporary area for storing vacuum pumps 45 that are intended to be used for vacuum systems in the equipment 10. It is noted that the distribution of the areas 15 and the pump storage region 20 in FIG. 1 is for illustrative purposes only and not intended to be limiting beyond what is specifically recited in the claims. It can be appreciated that any distribution for the areas 15 and the pump storage region 20 can be designed depending on various fabrication requirements.

[0020] During manufacturing semiconductor devices, vacuum systems are used in the equipment 10. However, as the vacuum pumps 40 used in the vacuum systems are not functioning, the old vacuum pumps 40 would be replaced with new vacuum pumps 45, which are stored in the pump storage region 20. Operators Op are responsible to deliver the vacuum pumps 45 to the area 15 in demand by using a pump delivery tool 100 (not shown in FIG. 1, please see FIGS. 4-8 and 10) to move the vacuum pumps 45. Also, after the old vacuum pump 40 is replaced with the new vacuum pump 45, the operators Op are responsible to deliver the vacuum pumps 40 out of the area 15 in demand.

[0021] FIG. 2 is a flowchart illustrating a method M1 for delivering and replacing vacuum pumps in the wafer fabrication facility 1 in accordance with some embodiments. Various operations of the method M1 are discussed in association with at least FIGS. 1-12. It is noted that each of the methods presented below is merely an example, and not intended to limit the present disclosure beyond what is explicitly recited in the claims. Additional operations may be provided before, during, and after each of the methods. Some operations described may be replaced, eliminated, or moved around for additional embodiments of the transport methods. Additionally, for clarity and ease of explanation, some elements of the figures have been simplified.

[0022] The operation S12 of the method M1 includes receiving a demand for delivering a vacuum pump in a wafer fabrication facility. For example, in FIG. 1, when the vacuum pump 40 in one of the areas 15 is not functioning, a demand for replacing the vacuum pump 40 with a new vacuum pump 45 can be sent (by the operator Op and / or the corresponding equipment 10) to a control unit 50 of the wafer fabrication facility 1. In some other embodiments, when a new process bay is established in the wafer fabrication facility 1, new equipment 10 and vacuum systems are scheduled to move to the new process bay. Therefore, a demand for delivering the new vacuum pump(s) 45 can be sent (by the operator Op and / or the corresponding equipment 10) to the control unit 50 of the wafer fabrication facility 1.

[0023] The operation S14 of the method M1 includes assigning a vacuum pump in a pump storage region of the wafer fabrication facility. Specifically, the vacuum pumps 45 in the pump storage region 20 includes one or more dry pumps, such as a turbo molecular pump (TMP), a sorption pump, a sputter ion pump, a mechanical booster pump or a cryo pump. Each type of the vacuum pumps 45 may have various models. Therefore, the operator Op and / or the control unit 50 assigns a specific type and model of the vacuum pump 45 in the pump storage region 20 that is qualified to be used in the corresponding process bay and the corresponding equipment 10.

[0024] FIG. 3 is a perspective view of the vacuum pump 45 in FIG. 1 in accordance with some embodiments. In addition to the vacuum pump 45, FIG. 3 depicts X-axis, Y-axis, and Z-axis directions. In some embodiments, the vacuum pump 45 has a main body 46 and a plurality of wheels 48 secured to the main body 46. The main body 46 has a size including a length L, a width W, and a height H. A pumping unit of the vacuum pump 45 is located in the main body 46. It is noted that some components (such as tubes, valves, pipes, etc.) of the vacuum pump 45 are not shown in FIG. 3. Generally, the main body 46 has a weight more than about 100 kg and has the height H about a half an adult. Therefore, the delivery of the vacuum pump 45 is a challenge for the operators Op because of its weight and size.

[0025] The operation S16 of the method M1 includes setting up a pump delivery tool on the assigned vacuum pump. FIGS. 4-7 are different views of a pump delivery tool 100 in accordance with some embodiments, and FIG. 8 is a schematic exploded view of the pump delivery tool 100 in accordance with some embodiments. In addition to the pump delivery tool 100, FIGS. 4-8 depict X-axis, Y-axis, and Z-axis directions. The pump delivery tool 100 includes a plurality of length adjustment elements 112 and 116. Each of the length adjustment elements 112 has a plurality of holes 114 separated from each other and arranged along an extension direction (i.e., Y direction in this case) of the length adjustment elements 112. Each of the length adjustment elements 116 has a slit 118 therein and extending along an extension direction (i.e., Y direction in this case) of the length adjustment elements 116.

[0026] One of the length adjustment elements 112 can be assembled to one of the length adjustment elements 116 with fixing elements (e.g., screws or turn buttons) 119 to form a length adjustment mechanism 110. For example, the fixing elements 119 are inserted into the slit 118 of the length adjustment element 116 and individual holes 114 of the length adjustment element 112, such that the length adjustment element 116 is movable relative to the length adjustment element 112 in the Y direction. After the relative position between the length adjustment elements 112 and 116 is determined, the fixing elements 119 are rotated to secure the length adjustment elements 112 and 116. The two pairs of the length adjustment mechanisms 110 are separated from each other by an adjustable distance D1 (which is adjusted by using width adjustment mechanisms 120 described as below). In some embodiments, the distance D1 is determined by the width W of the vacuum pump 45 (see FIG. 3).

[0027] The pump delivery tool 100 further includes a plurality of width adjustment elements 122 and 126. Each of the width adjustment elements 122 has a plurality of holes 124 separated from each other and arranged along an extension direction (i.e., X direction in this case) of the width adjustment elements 122. Each of the width adjustment elements 126 has a slit 128 therein and extending along an extension direction (i.e., X direction in this case) of the width adjustment elements 126.

[0028] One of the width adjustment elements 122 can be assembled to one of the width adjustment elements 126 with fixing elements (e.g., screws or turn buttons) 129 to form a width adjustment mechanism 120. For example, the fixing elements 129 insert into the slit 128 of the width adjustment element 126 and individual holes 124 of the width adjustment element 122, such that the width adjustment element 126 is movable relative to the width adjustment element 122 in the X direction. After the relative position of the width adjustment elements 122 and 126 is determined, the fixing elements 129 are rotated to secure the width adjustment elements 122 and 126. The two pairs of the width adjustment mechanisms 120 are separated from each other by an adjustable distance D2 (which is adjusted by using the length adjustment mechanisms 110). In some embodiments, the distance D2 is determined by the length L of the vacuum pump 45 (see FIG. 3).

[0029] The length adjustment mechanisms 110 and the width adjustment mechanisms 120 can be assembled together by using the fixing elements (e.g., screws or turn buttons) 130a and 130b, such that the length adjustment mechanisms 110 are across and substantially perpendicular to the width adjustment mechanisms 120. Specifically, the fixing elements 130a and 130b secures the length adjustment mechanisms 110 to the width adjustment mechanisms 120 so that the width adjustment mechanisms 120 are coupled to the length adjustment mechanisms 110. For example, each of the fixing elements 130a is inserted into one of the holes 114 of the length adjustment element 112 and one of the holes 124 of the width adjustment element 122; each of the fixing elements 130b is inserted into one of the slit 118 of the length adjustment element 116 and one of the slits 128 of the width adjustment element 126. In some other embodiments, however, one of the fixing elements 130a and 130b may be inserted into one of the holes 114 and one of the slits 128, or may be inserted into one of the slits 118 and one of the holes 124.

[0030] The pump delivery tool 100 further includes a plurality of fixing assemblies 140 connected to the width adjustment mechanisms 120. Specifically, each of the fixing assemblies 140 includes a body 142, a knob 144, a screw 146, and a swivel pad 148. The body 142 is connected to the width adjustment element 122 or 126 and extends downwardly from the width adjustment mechanisms 120 in the Z direction. That is, the body 142 is substantially perpendicular to the width adjustment element 122 or 126. Each of the grips 150 is between the body 142 and the corresponding fixing element 130a / 130b. The screw 146 passes through the body 142 and interconnects the knob 144 and the swivel pad 148. Through rotating the knob 144, a position of the swivel pad 148 is adjusted.

[0031] The pump delivery tool 100 further includes a plurality of grips 150 secured to the width adjustment mechanisms 120. Specifically, the grips 150 are located adjacent to the fixing elements 130a / 130b, respectively. That is, the grips 150 are located at four corners of the pump delivery tool 100. Furthermore, the grips 150 protrude from the width adjustment mechanisms 120 and extend upwards in the Z direction. Therefore, at least one of the operators Op is able to hold one of the grips 150 to pull the pump delivery tool 100 in the X and Y directions when delivering the vacuum pump 45 by using the pump delivery tool 100. Also, the operator Op is able to guide the pump delivery tool 100 and the vacuum pump 45 by pulling the grip 150 towards different directions.

[0032] The pump delivery tool 100 further includes a plurality of handle assemblies 160 connected to the width adjustment mechanisms 120. Specifically, each of the handle assemblies includes a handle 162 and a connection piece 164. The connection piece 164 interconnects the handle 162 and the width adjustment element 122 or 126. As shown in FIG. 8, each of the connection pieces 164 extends beneath the width adjustment element 122 or 126 and is secured to the width adjustment element 122 or 126. The handle 162 extends in the Y direction and is higher than the top surface 45t of the vacuum pump 45, such that the operator Op is able to hold the handle 162 and pushes the pump delivery tool 100 forwards or pulls the pump delivery tool 100 backwards. In some embodiments, each of the handle assemblies 160 further includes an end plate 166 connected to the connection piece 164. The end plate 166 extends downwards from the connection piece 164 in the Z direction and is configured to lean against the sidewalls of the vacuum pump 45 to fix the pump delivery tool 100 to the vacuum pump 45.

[0033] FIG. 9 is a flowchart illustrating a method M2 for setting up the pump delivery tool 100 on the vacuum pump 45 (i.e., the operation S16 of the method M1) in accordance with some embodiments. Various operations of the method M2 are discussed in association with at least FIGS. 3-8 and 10. It is noted that each of the methods presented below is merely an example, and not intended to limit the present disclosure beyond what is explicitly recited in the claims. Additional operations may be provided before, during, and after each of the methods. Some operations described may be replaced, eliminated, or moved around for additional embodiments of the transport methods. Additionally, for clarity and ease of explanation, some elements of the figures have been simplified.

[0034] The operation S102 of the method M2 includes providing a pump delivery tool in a loose state. For example, the pump delivery tool 100 in FIG. 8 is assembled to be the state as shown in FIG. 4. Specifically, in FIG. 8, the length adjustment elements 112 and 116 each has a recess R1 at their ends. After the length adjustment elements 112 and 116 are assembled to the width adjustment elements 122 and 126, the recesses R1 of the length adjustment elements 112 and 116 are coupled to the connection pieces 164 of the handle assemblies 160, respectively. Therefore, the relative positions between the crossed length adjustment elements 112 / 116 and width adjustment elements 122 / 126 can be fixed. The fixing elements 130a and 130b are then inserted into the holes 114 and 124 or the slits 118 and 128 of the crossed length adjustment elements 112 / 116 and width adjustment elements 122 / 126 and then be screwed in a tight state.

[0035] Thereafter, the fixing elements 119 are inserted into the slit 118 of the length adjustment element 116 and individual holes 114 of the length adjustment element 112 in a loose state. That is, the fixing elements 119 are not screwed tightly and the length adjustment element 116 is still movable relative to the length adjustment element 112 in the extension direction of the length adjustment elements 112 and 116. Also, the fixing elements 129 are inserted into the slit 128 of the width adjustment element 126 and individual holes 124 of the width adjustment element 122 in a loose state. That is, the fixing elements 129 are not screwed tightly and the width adjustment element 126 is still movable relative to the width adjustment element 122 in the extension direction of the width adjustment elements 122 and 126.

[0036] The operation S104 of the method M2 includes placing the loose pump delivery tool on an assigned vacuum pump. FIG. 10 is a perspective view of the pump delivery tool 100 and the vacuum pump 45 in accordance with some embodiments. Reference is made to FIGS. 2, 4, and 10. As mentioned in the operation S16 of the method M1, the pump delivery tool 100 will be set up on the assigned vacuum pump 45. Initially, the pump delivery tool 100 in a loose state as mentioned in the operation S102 is placed on the top surface 45t of the vacuum pump 45 which has been assigned. As shown in FIGS. 1 and 10, the length adjustment mechanisms 110 and the width adjustment mechanisms 120 of the pump delivery tool 100 are over the top surface 45t of the vacuum pump 45, and the pump delivery tool 100 is spaced apart from a floor 5 of the wafer fabrication facility 1. After the pump delivery tool 100 is placed on the vacuum pump 45, at least one of the end plates 166 and at least one of the swivel pads 148 are not in contact with the main body 46 of the vacuum pump 45.

[0037] The operation S106 of the method M2 includes adjusting relative positions of length adjustment elements until end plates of the pump delivery tool are in contact with the assigned vacuum pump. As shown in FIGS. 4 and 10, in some embodiments, the length adjustment elements 116 are moved relative to the length adjustment elements 112 until the end plates 166 on opposite sides of the pump delivery tool 100 touch the opposite sidewalls 47a of the main body 46 of the vacuum pump 45. Until then, the relative positions between the length adjustment elements 112 and 116 are determined. The fixing elements 119 are then screwed into the holes 114 in a tight state. As such, the length adjustment mechanisms 110 are secured / fixed on the vacuum pump 45.

[0038] The operation S108 of the method M2 includes adjusting relative positions of width adjustment elements until swivel pads of the pump delivery tool are in contact with the vacuum pump. As shown in FIGS. 4 and 10, in some embodiments, the width adjustment elements 126 are moved relative to the width adjustment elements 122 until the swivel pads 148 on opposite sides of the pump delivery tool 100 touch the other opposite sidewalls 47b of the main body 46 of the vacuum pump 45. Until then, the relative positions between the width adjustment elements 122 and 126 are determined. The fixing elements 129 are then screwed into the holes 124 in a tight state. As such, the width adjustment mechanisms 120 are secured / fixed on the vacuum pump 45.

[0039] The operation S110 of the method M2 includes screwing the swivel pads towards the vacuum pump. As shown in FIGS. 4 and 10, in some embodiments, after the length adjustment mechanisms 110 and the width adjustment mechanisms 120 are secured to / fixed on the vacuum pump 45, the knobs 144 of the fixing assemblies 140 are further screwed to push the swivel pads 148 against the sidewalls 47b of the main body 46 of the vacuum pump 45, increasing the friction between the swivel pads 148 and the sidewalls 47b of the main body 46. This configuration prevents the pump delivery tool 100 from being detached from the vacuum pump 45 during the delivering.

[0040] Reference is made back to FIG. 2. The operation S18 of the method M1 includes delivering the assigned vacuum pump by using the pump delivery tool. As shown in FIGS. 1 and 10, after the pump delivery tool 100 is set up on the vacuum pump 45, the operators Op can deliver the vacuum pump 45 from the pump storage region 20 to the area 15 in demand.

[0041] FIG. 11 is a flowchart illustrating a method M3 for delivering the assigned vacuum pump 45 by using the pump delivery tool 100 (i.e., the operation S18 of the method M1) in accordance with some embodiments. Various operations of the method M3 are discussed in association with at least FIGS. 1 and 10. It is noted that each of the methods presented below is merely an example, and not intended to limit the present disclosure beyond what is explicitly recited in the claims. Additional operations may be provided before, during, and after each of the methods. Some operations described may be replaced, eliminated, or moved around for additional embodiments of the transport methods. Additionally, for clarity and ease of explanation, some elements of the figures have been simplified.

[0042] The operation S202 of the method M3 includes pushing a pump delivery tool with an assigned vacuum pump. The operation S204 of the method M3 includes pulling the pump delivery tool with the assigned vacuum pump. In some embodiments, one of the operators Op stands on a backside of the vacuum pump 45. The operator Op may hold the handles 162 with his / her two hands and push the vacuum pump 45 forwards from the backside of the vacuum pump 45. Alternatively, the operator Op may pull the vacuum pump 45 backwards from the front-side of the vacuum pump 45. On the other hand, another operator Op may stand beside the vacuum pump 45 and grasp one of the grips 150 to pull the vacuum pump 45 forwards. Therefore, with the cooperation of the two operators Op, the vacuum pump 45 with a heavy weight can be easily moved and delivered to the predetermined position (e.g., the area 15 in demand).

[0043] The operation S206 of the method M3 includes pulling a grip of the pump delivery tool towards different directions to turn a direction of the delivering the vacuum pump. As shown in FIG. 1, the vacuum pump 45 may pass through the inter-bay aisle 30 to the specific area 15. Therefore, the delivery route may have some turns. During the delivery of the vacuum pump 45, the operator Op grasping the grip 150 may pull the grip 150 towards different directions when they meet the turns of the delivery route, and the vacuum pump 45 can be easily turned to the specific direction.

[0044] Further, in some embodiments, the areas 15 may be occupied by many tools and / or apparatuses. Therefore, the delivery route in the areas 15 may be narrower than in the inter-bay aisle 30 and the vacuum pump 45 with the pump delivery tool 100 may hit the walls or objects in the areas 15. As shown in FIG. 10, the fixing assemblies 140 protrude from the sidewalls 47b of the vacuum pump 45, such that the fixing assemblies 140 can be a buffer to bear the hit power, preventing the vacuum pump 45 from being damaged even the pump delivery tool 100 hits the walls or objects. Also, the grips 150 are indented from the fixing assemblies 140. The hand of the operator Op grasping the grip 150 is not injured even when the pump delivery tool 100 hits the walls or the objects.

[0045] Reference is made back to FIG. 2. The operation S20 of the method M1 includes detaching the pump delivery tool from the assigned vacuum pump. Reference is then made to FIGS. 1 and 10. After the vacuum pump 45 with the pump delivery tool 100 are delivered to a predetermined position of the specific area 15, the pump delivery tool 100 is detached from the vacuum pump 45, and the vacuum pump 45 is going to be set up with the equipment 10 in the specific area 15.

[0046] FIG. 12 is a flowchart illustrating a method M4 for detaching the pump delivery tool 100 from the vacuum pump 45 (i.e., the operation S20 of the method M1) in accordance with some embodiments. Various operations of the method M4 are discussed in association with at least FIGS. 4 and 10. It is noted that each of the methods presented below is merely an example, and not intended to limit the present disclosure beyond what is explicitly recited in the claims. Additional operations may be provided before, during, and after each of the methods. Some operations described may be replaced, eliminated, or moved around for additional embodiments of the transport methods. Additionally, for clarity and ease of explanation, some elements of the figures have been simplified.

[0047] The operation S302 of the method M4 includes loosening swivel pads of a pump delivery tool from a vacuum pump. Reference is made to FIGS. 4 and 10. As mentioned above, the fixing assemblies 140 are in a tight state during the delivery. Therefore, the operator(s) Op may screw the knobs 144 to loosen the fixing assemblies 140. In some embodiments, after the fixing assemblies 140 are loosened, the swivel pads 148 may be in a loose state but still in contact with the sidewalls 47b of the vacuum pump 45. Or, the swivel pads 148 are detached from the sidewalls 47b of the vacuum pump 45.

[0048] The operation S304 of the method M4 includes loosening fixing elements to loosen width adjustment mechanisms of the pump delivery tool. Reference is made to FIGS. 4 and 10. After the fixing assemblies 140 are loosened, the operator(s) Op may screw the fixing elements 129 until the width adjustment element 126 can move relative to the width adjustment element 122. In some embodiments, the fixing elements 129 are still coupled to the width adjustment elements 122 and 126 when the width adjustment mechanisms 120 are in a loose state. It is convenience for the operators to set up the pump delivery tool 100 to another vacuum pump 40 or 45.

[0049] The operation S306 of the method M4 includes loosening fixing elements to loosen length adjustment mechanisms of the pump delivery tool. Reference is made to FIGS. 4 and 10. After the fixing assemblies 140 are loosened, the operator(s) Op may screw the fixing elements 119 until the length adjustment element 116 can move relative to the length adjustment element 112. In some embodiments, the fixing elements 119 are still coupled to the length adjustment elements 112 and 116 when the length adjustment mechanisms 110 are in a loose state. It is convenience for the operators to set up the pump delivery tool 100 to another vacuum pump 40 or 45. It is noted that, in some embodiments, the operation S306 can be performed prior to the operation S304, or the operations S304 and S306 can be performed simultaneously.

[0050] The operation S308 of the method M4 includes taking the pump delivery tool away from the vacuum pump. As shown in FIG. 10, after the length adjustment mechanisms 110 and the width adjustment mechanisms 120 are in a loose state, the operators Op may take the pump delivery tool 100 away from the vacuum pump 45 to finish the delivery.

[0051] Reference is back to FIG. 1. In some embodiments, when the new vacuum pump 45 is delivered to the specific area 15, a corresponding old vacuum pump 40 may be replaced with the new vacuum pump 45. As such, the old vacuum pump 40 may need to be taken away from the specific area 15 (to the pump storage region 20 or other temporary area for storing the old vacuum pump(s) 40).

[0052] FIG. 13 is a flowchart illustrating a method M5 for delivering an old vacuum pumps 40 out of an area 15 in the wafer fabrication facility 1 in accordance with some embodiments. Various operations of the method M5 are discussed in association with at least FIGS. 1 and 10. It is noted that each of the methods presented below is merely an example, and not intended to limit the present disclosure beyond what is explicitly recited in the claims. Additional operations may be provided before, during, and after each of the methods. Some operations described may be replaced, eliminated, or moved around for additional embodiments of the transport methods. Additionally, for clarity and ease of explanation, some elements of the figures have been simplified.

[0053] The operation S32 of the method M5 includes providing a demand for delivering a vacuum pump out of a process bay of a wafer fabrication facility. In some embodiments, the vacuum pump 40 in the process bay is operated for a long time. The components (e.g., motors, pipes, tubes, etc.) of the vacuum pump 40 may be corroded by corrosive gases. The vacuum pump 40 may also suck dust, which may block the pipes and / or tubes of the vacuum pump 40. Therefore, the vacuum pump 40 may eventually be not functioning and need to be replaced. The operator Op or the equipment 10 may provide a demand for delivering the vacuum pump 40 out of the corresponding area 15 and replace the vacuum pump 40 with a new vacuum pump 45.

[0054] The operation S34 of the method M5 includes detaching the vacuum pump from an equipment of the process bay. As shown in FIG. 1. The vacuum pump 40 is initially connected or coupled to the vacuum system used in the equipment 10. As the vacuum pump 40 is not functioning, the vacuum pump 40 is detached from the vacuum system used in the equipment 10 and waits for the delivery.

[0055] The operation S36 of the method M5 includes setting up a pump delivery tool on the vacuum pump. In some embodiments, the method M2 in FIG. 9 may be used to set up the pump delivery tool 100 to the old vacuum pump 40. Therefore, a description in this regard will not be provided hereinafter.

[0056] The operation S38 of the method M5 includes delivering the vacuum pump by using the pump delivery tool. In some embodiments, the method M3 in FIG. 11 may be used for delivering the vacuum pump 40 by using the pump delivery tool 100. Therefore, a description in this regard will not be provided hereinafter. In some embodiments, the wheels of the old vacuum pump 40 may be aging and hard to be rotated on the floor 5. By using the pump delivery tool 100, the operators Op can effectively pull and push the vacuum pump 40 even the wheels thereof are aging.

[0057] The operation S40 of the method M5 includes detaching the pump delivery tool from the vacuum pump. In some embodiments, the method M4 in FIG. 12 may be used for detaching the pump delivery tool 100 from the vacuum pump 40. Therefore, a description in this regard will not be provided hereinafter. The old vacuum pump 40 may be delivered to the pump storage region 20 or other temporary area in the wafer fabrication facility 1.

[0058] Based on the above discussions, it can be seen that the present disclosure offers advantages. It is understood, however, that other embodiments may offer additional advantages, and not all advantages are necessarily disclosed herein, and that no particular advantage is required for all embodiments. One advantage is that the pump delivery tools can be set up on different types and models of the vacuum pumps. The setup and detaching processes of the pump delivery tools are simple and quick, simplifying the delivery process of the vacuum pumps. In addition, the configuration of the grips and the handles of the pump delivery tools is friendly to the operators and makes sure the safety of the operators. Furthermore, the pump delivery tools save effort for the operators, such that the operators can deliver old vacuum pumps with aging wheels in an easy way.

[0059] According to some embodiments, a method includes receiving a demand for delivering a vacuum pump in a wafer fabrication facility. The vacuum pump in a pump storage region of the wafer fabrication facility is assigned. A pump delivery tool is set up on a top surface of the assigned vacuum pump. The pump delivery tool includes length adjustment mechanisms, width adjustment mechanisms, and first fixing elements. The width adjustment mechanisms and the length adjustment mechanisms are over the top surface of the assigned vacuum pump. The width adjustment mechanisms are assembled to the length adjustment mechanisms. The width adjustment mechanisms are substantially perpendicular to the length adjustment mechanisms. The first fixing elements secure the length adjustment mechanisms to the width adjustment mechanisms. The assigned vacuum pump is delivered by using the pump delivery tool in the wafer fabrication facility.

[0060] According to some embodiments, a method includes providing a demand for delivering a first vacuum pump out of a process bay of a wafer fabrication facility. The first vacuum pump is detached from an equipment of the process bay. A pump delivery tool is set up on the first vacuum pump. The pump delivery tool is placed on the first vacuum pump and spaced apart from a floor of the wafer fabrication facility. The first vacuum pump is delivered by using the pump delivery tool, including holding handles of the pump delivery tool that higher than a top surface of the first vacuum pump to push the pump delivery tool with the first vacuum pump; and grasping a grip of the pump delivery tool to pull the first vacuum pump.

[0061] According to some embodiments, a pump delivery tool includes length adjustment mechanisms, width adjustment mechanisms, first fixing elements, handle assemblies, and grips. The width adjustment mechanisms are across the length adjustment mechanisms. The first fixing elements secure the width adjustment mechanisms to the length adjustment mechanisms, such that the width adjustment mechanisms are substantially perpendicular to the length adjustment mechanisms. The handle assemblies are connected to the width adjustment mechanisms and each of the handle assemblies includes a handle and a connection piece interconnects the handle and one of the width adjustment mechanisms. The grips are secured to the width adjustment mechanisms and adjacent to the first fixing elements, respectively. The grips extend upwards from the width adjustment mechanisms.

[0062] The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and / or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure.

Claims

1. A method comprising:receiving a demand for delivering a vacuum pump in a wafer fabrication facility;assigning the vacuum pump in a pump storage region of the wafer fabrication facility;setting up a pump delivery tool on a top surface of the assigned vacuum pump, wherein the pump delivery tool comprises:length adjustment mechanisms over the top surface of the assigned vacuum pump;width adjustment mechanisms over the top surface of the assigned vacuum pump and assembled to the length adjustment mechanisms, wherein the width adjustment mechanisms are substantially perpendicular to the length adjustment mechanisms; andfirst fixing elements securing the length adjustment mechanisms to the width adjustment mechanisms; anddelivering the assigned vacuum pump by using the pump delivery tool in the wafer fabrication facility.

2. The method of claim 1, wherein setting up the pump delivery tool comprises:placing the pump delivery tool on the assigned vacuum pump;adjusting a relative position between length adjustment elements of the length adjustment mechanisms until end plates of the pump delivery tool touch first sidewalls of the assigned vacuum pump; andadjusting a relative position between width adjustment elements of the width adjustment mechanisms until swivel pads of the pump delivery tool touch second sidewalls of the assigned vacuum pump.

3. The method of claim 2, wherein setting up the pump delivery tool further comprises:after adjusting the relative position between the width adjustment elements of the width adjustment mechanisms, screwing the swivel pads towards the second sidewalls of the assigned vacuum pump.

4. The method of claim 1, wherein delivering the assigned vacuum pump by using the pump delivery tool in the wafer fabrication facility comprises:pushing the pump delivery tool from a backside of the assigned vacuum pump.

5. The method of claim 1, wherein delivering the assigned vacuum pump by using the pump delivery tool in the wafer fabrication facility comprises:pulling the pump delivery tool beside the assigned vacuum pump.

6. The method of claim 1, further comprising:holding a grip located on one of the width adjustment mechanisms; andpulling the grip towards different directions to change a direction of the delivering of the assigned vacuum pump.

7. The method of claim 1, further comprising:detaching the pump delivery tool from the assigned vacuum pump after the assigned vacuum pump is delivered to a predetermined position.

8. A method comprising:providing a demand for delivering a first vacuum pump out of a process bay of a wafer fabrication facility;detaching the first vacuum pump from an equipment of the process bay;setting up a pump delivery tool on the first vacuum pump, wherein the pump delivery tool is placed on the first vacuum pump and spaced apart from a floor of the wafer fabrication facility; anddelivering the first vacuum pump by using the pump delivery tool, comprising:holding handles of the pump delivery tool that higher than a top surface of the first vacuum pump to push the pump delivery tool with the first vacuum pump; andgrasping a grip of the pump delivery tool to pull the first vacuum pump.

9. The method of claim 8, wherein the pump delivery tool comprises:length adjustment mechanisms;width adjustment mechanisms coupled to the length adjustment mechanisms, wherein the length adjustment mechanisms are substantially perpendicular to the width adjustment mechanisms;handle assemblies connected to the width adjustment mechanisms and comprising the handles; andthe grip protruding from one of the width adjustment mechanisms.

10. The method of claim 8, wherein the first vacuum pump is a turbo molecular pump (TMP), a sorption pump, a sputter ion pump, a mechanical booster pump or a cryo pump.

11. The method of claim 8, wherein delivering the first vacuum pump with the pump delivery tool further comprises:pulling the grip towards different directions to turn a direction of the delivering the first vacuum pump.

12. The method of claim 8, further comprising:after delivering the first vacuum pump, detaching the pump delivery tool from the first vacuum pump.

13. The method of claim 8, further comprising:delivering the first vacuum pump to a pump storage region of the wafer fabrication facility, wherein a plurality of vacuum pumps are stored in the pump storage region.

14. The method of claim 8, further comprising:delivering a second vacuum pump from a pump storage region of the wafer fabrication facility to the process bay prior to delivering the first vacuum pump out of the process bay, wherein a plurality of vacuum pumps are stored in the pump storage region; andreplacing the first vacuum pump with the second vacuum pump.

15. A pump delivery tool, comprising:length adjustment mechanisms;width adjustment mechanisms across the length adjustment mechanisms;first fixing elements securing the width adjustment mechanisms to the length adjustment mechanisms, such that the width adjustment mechanisms are substantially perpendicular to the length adjustment mechanisms;handle assemblies connected to the width adjustment mechanisms and each of the handle assemblies comprising:a handle; anda connection piece interconnects the handle and one of the width adjustment mechanisms; andgrips secured to the width adjustment mechanisms and adjacent to the first fixing elements, respectively, wherein the grips extend upwards from the width adjustment mechanisms.

16. The pump delivery tool of claim 15, wherein each of the length adjustment mechanisms comprises:a first length adjustment element having a plurality of holes arranged along an extension direction of the first length adjustment element;a second length adjustment element having a slit extending along an extension direction of the second length adjustment element; andsecond fixing elements passing through the slit of the second length adjustment element and the holes of the first length adjustment element.

17. The pump delivery tool of claim 15, wherein each of the width adjustment mechanisms comprises:a first width adjustment element having a plurality of holes arranged along an extension direction of the first width adjustment element;a second width adjustment element having a slit extending along an extension direction of the second width adjustment element; andthird fixing elements passing through the slit of the second width adjustment element and the holes of the first width adjustment element.

18. The pump delivery tool of claim 15, further comprising:fixing assemblies connected to the width adjustment mechanisms and each of the fixing assemblies comprising:a body extending downward from one of the width adjustment mechanisms;a knob;a screw; anda swivel pad, wherein the screw passes through the body and interconnects the knob and the swivel pad.

19. The pump delivery tool of claim 18, wherein one of the grips is between the body of one of the fixing assemblies and one of the first fixing elements.

20. The pump delivery tool of claim 18, wherein each of the handle assemblies further comprises:an end plate extending downwards from the connection piece.

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