Conductive polishing head fixing device and conductive polishing head system

Abstract

The invention discloses a conductive polishing head fixing device, comprising: a loading component, having a first adsorption end surface matched and connection with a polishing head, at least one first channel being formed in the loading component, and an end of the first channel extending to the first adsorption end surface; a first conductive element, having an end connected to a power supply; and a conductive interface module, at least comprising a first acting terminal, at least part of the first acting terminal being arranged in the first channel, and the first acting terminal being electrically connected to the first conductive element. The invention further discloses a conductive polishing head system.

Description

TECHNICAL FIELD

[0001] The invention belongs to the technical field of fabrication of semiconductor integrated circuit chips, and particularly relates to a conductive polishing head fixing device and the conductive polishing head system thereof.RELATED ART

[0002] The manufacturing process of wafer substrates and semiconductor devices involves polishing, surface planarization and other processes. Mechanical polishing, chemical mechanical polishing or planarization and other techniques are often adopted. A wafer substrate carrier (a polishing head) applies a pressure to the back of a wafer to control the pressure, the rotation speed of the polishing head, the rotation speed of a polishing disc, the flow rate of polishing liquid and other parameters, and polishing or planarization is performed on the front surface of the wafer substrate or the surface of a film on a polishing pad. Compared with mechanical polishing, chemical mechanical polishing and planarization allow for a chemical reaction on the surface of the wafer substrate by adjusting the formula of polishing liquid, can realize higher polishing or planarization efficiency, and can also fulfill a better polishing or planarization effect, including better flatness and fewer defects.

[0003] Based on chemical mechanical polishing and planarization, electrochemical mechanical polishing and planarization allow for an electrochemical reaction on the surface of the wafer substrate or the film by a current path formed by means of the conductivity of the wafer substrate or the film on the surface of the wafer substrate, and the surface chemical reaction rate can be increased by accurate control of a circuit system so as to improve mechanical polishing and planarization efficiency.

[0004] Due to various difficulties, there is not yet, on the present market, an electrochemical mechanical polishing and planarization device suitable for mass production.

[0005] Polishing heads for chemical mechanical polishing and planarization devices need to be frequently disassembled for maintenance, consumable replacement and crystal removal. So, the polishing heads should be easy to assemble and disassemble, being stable and reliable. Similarly, polishing heads applied to electrochemical mechanical polishing and planarization devices should satisfy the same requirements. For electrical polishing heads that need to be connected to an external wire, switching on / off of the wire during assembly and disassembly would be an issue to be fixed.SUMMARY OF INVENTION

[0006] To overcome the defects in the prior art, the invention provides a conductive polishing head fixing device and a conductive polishing head system, which can realize electrical conduction and easy replacement of polishing heads and have high flexibility in use.

[0007] The technical solution adopted by the invention to solve the above technical problems is as follows: a conductive polishing head fixing device comprises:

[0008] a loading component, having a first adsorption end surface matched and connection with a polishing head, at least one first channel being formed in the loading component, and an end of the first channel extending to the first adsorption end surface;

[0009] a first conductive element, having an end connected to a power supply; and

[0010] a conductive interface module, at least comprising a first acting terminal, at least part of the first acting terminal being arranged in the first channel, and the first acting terminal being electrically connected to the first conductive element.

[0011] Further, the first acting terminal is made of a conductive material.

[0012] Further, the conductive interface module further comprises a fixing member made of an insulating material, the fixing member is connected to the loading component, and the first acting terminal is connected to the fixing member.

[0013] Further, the loading component is connected to a rotary joint, and the loading component is rotatable.

[0014] Further, the first channel extends in an axial direction of the loading component.

[0015] Further, the first conductive element penetrates through the first channel.

[0016] Further, the first channels comprise a first gas channel and a first mounting channel, and the first conductive element penetrates through the first mounting channel.

[0017] Further, the first channel is formed in the loading component; or, the first channel is formed in an outer area of the loading component; or, the first channel is formed in an outer wall of the loading component.

[0018] The invention further discloses a conductive polishing head system, comprising:

[0019] a loading component, having a first adsorption end surface, at least one first channel being formed in the loading component, an end of the first channel extending to the first adsorption end surface;

[0020] a polishing head, having a second adsorption end surface, at least one second channel being formed in the polishing head, an end of the second channel extending to the second adsorption end surface;

[0021] a conductive element, at least comprising a first conductive element with an end connected to a power supply; and

[0022] a conductive interface module, at least comprising a first acting terminal connected to the first conductive element, and a second acting terminal, at least part of the first acting terminal and at least part of the second acting terminal being arranged in the first channel and / or the second channel;

[0023] wherein, when the first adsorption end surface clings to the second adsorption end surface, the first acting terminal and the second acting terminal come in contact and conduction to realize electrical connection of the polishing head.

[0024] Further, the first acting terminal is made of a conductive material, and the second acting terminal is made of a conductive material.

[0025] Further, the conductive element further comprises a second conductive element connected to the second acting terminal.

[0026] Further, the conductive interface module further comprises a fixing member made of an insulating material, the fixing member is connected to the loading component or the polishing head, and the first acting terminal or the second acting terminal is connected to the fixing member.

[0027] Further, the conductive interface module further comprises a mounting frame made of an insulating material, the mounting frame is connected to the polishing head or the loading component, and the second acting terminal or the first acting terminal is connected to the mounting frame.

[0028] Further, an elastic element is arranged in the mounting frame, a flange abutting against the elastic element is formed in an outer wall of the second acting terminal or the first acting terminal, and when the elastic element is in a relaxed state, the flange abuts against an inner wall of the mounting frame, and two ends of the second acting terminal or the first acting terminal extend out from openings in two sides of the mounting frame respectively.

[0029] Further, the first acting terminal and the second acting terminal are magnetically attracted.

[0030] Further, the mounting frame is formed by an upper portion and a lower portion.

[0031] Further, the loading component is connected to a rotary joint, and the polishing head rotates synchronously with the loading component.

[0032] Further, the first channel extends in an axial direction of the loading component.

[0033] Further, the first channels comprise a first gas channel and a first mounting channel, and the first conductive element penetrates through the first channel; the second channels comprise a second gas channel and a second mounting channel, and a second conductive element penetrates through the second mounting channel.

[0034] Further, the first gas channel and the second gas channel are vertically connected.

[0035] Further, a mounting hole is formed in the first acting terminal or / and the second acting terminal, the first conductive element or / and the second conductive element are connected to a conductive adapter, and the conductive adapter is threadedly connected to the mounting hole.

[0036] Further, a limiting groove allowing the second acting terminal to be partially inserted therein is formed in an end surface of the first acting terminal; and / or, a limiting groove allowing the first acting terminal to be partially inserted therein is formed in a surface of the second acting terminal.

[0037] Further, a sealing element is arranged on an outer side of the conductive interface module, and when the first adsorption end surface clings to the second adsorption end surface, the sealing element is squeezed to realize sealing.

[0038] Further, the polishing head comprises an adsorption film used for adsorbing a wafer, at least part of the adsorption film is made of a conductive material, and the adsorption film is electrically connected to the second acting terminal or the second conductive element.

[0039] Further, the adsorption film is a flexible film, or a metal film, or a metal and non-metal composite film.

[0040] Further, the polishing head comprises a retaining ring used for fixing a wafer in the polishing head, at least part of the retaining ring is made of a conductive material, and the retaining ring is electrically connected to the second acting terminal or the second conductive element.

[0041] Further, the first channel is formed in the loading component; or, the first channel is formed in an outer area of the loading component; or, the first channel is formed in an outer wall of the loading component.

[0042] The invention provides novel mechanical structures of electrochemical mechanical polishing and planarization devices suitable for mass production and has the advantages that original chemical mechanical polishing and planarization devices can be easily transformed into electrochemical mechanical polishing and planarization devices without affecting the basic structures of the chemical mechanical polishing and planarization devices and original functions can be maintained, that is, the electrochemical mechanical polishing and planarization devices are suitable for both electrical polishing heads and common polishing heads.

[0043] The invention has the following beneficial effects: (1) a simple and reliable solution is provided to electrify the polishing head; (2) the first channel and the second channel are formed in the loading component and the polishing head, such that electrical conduction of the polishing head is realized without affecting existing structures; (3) the conductive interface module is arranged to satisfy the requirements for easy and quick assembly and disassembly of the electrified polishing head; (4) the number of the channels in the loading component and the polishing heads may be set as needed, multiple wires may be arranged in one channel or / and connection may be realized by multiple wires may, such that the requirement for connection by multiple wires is satisfied; (5) the conductive interface module is divided into two portions which are respectively arranged on the loading component and the polishing head, such that daily disassembly and maintenance are facilitated; (6) the two portions of the conductive interface module have different functions and work together to fulfill different functions.BRIEF DESCRIPTION OF DRAWINGS

[0044] FIG. 1 is a sectional view of a mating structure of a conductive polishing head fixing device and a polishing head according to Embodiment 1 of the invention.

[0045] FIG. 2 is a sectional view of a mating structure of the conductive polishing head fixing device, the polishing head and a rotary joint according to Embodiment 1 of the invention.

[0046] FIG. 3 is a top view of a conductive polishing head system according to Embodiment 3 of the invention.

[0047] FIG. 4 is a sectional view along C-C in FIG. 3.

[0048] FIG. 5 is an enlarged view of part A in FIG. 4.

[0049] FIG. 6 is a sectional view along B-B in FIG. 3.

[0050] FIG. 7 is a top view of a conductive interface module according to Embodiment 3 of the invention.

[0051] FIG. 8 is a sectional view along D-D in FIG. 7 in a case where a first acting terminal and a second acting terminal are not connected for conduction.

[0052] FIG. 9 is a sectional view along D-D in FIG. 7 in a case where the first acting terminal and the second acting terminal are connected for conduction.

[0053] FIG. 10 is a top view of the conductive polishing head system in a case where the first acting terminal extends along a whole first channel according to Embodiment 3 of the invention.

[0054] FIG. 11 is an enlarged view of a part where the conductive interface module is located in a case where no sealing element is arranged between a first adsorption end surface and a second adsorption end surface according to Embodiment 3 of the invention.

[0055] FIG. 12 is a sectional view of a conductive interface module according to Embodiment 5 of the invention.

[0056] FIG. 13 is a sectional view of a conductive polishing head system according to Embodiment 6 of the invention.

[0057] FIG. 14 is an enlarged view of part E in FIG. 13.

[0058] FIG. 15 is a sectional view of a conductive interface module according to Embodiment 7 of the invention.

[0059] FIG. 16 is a sectional view of a conductive polishing head system according to Embodiment 8 of the invention.

[0060] FIG. 17 is a sectional view of a conductive polishing head system according to Embodiment 9 of the invention.

[0061] FIG. 18 is a front view of a conductive polishing head system according to Embodiment 10 of the invention.

[0062] FIG. 19 is a sectional view along F-F in FIG. 18.DESCRIPTION OF EMBODIMENTS

[0063] To allow those skilled in the art to have a better understanding of the technical solutions of the invention, the technical solutions in the embodiments of the invention will be clearly and completely described below in conjunction with accompanying drawings of these embodiments. Obviously, the embodiments described below are merely illustrative ones, and are not all possible ones of the invention. All other embodiments obtained by ordinarily skilled in the art based on the following ones without creative labor should also fall within the protection scope of the invention.Embodiment 1

[0064] As shown in FIG. 1, a conductive polishing head fixing device comprises a loading component 1, a first conductive element 31 and a conductive interface module 4.

[0065] The loading component 1 has a first adsorption end surface 11 matched and connected with a polishing head 2, at least one first channel 12 is formed in the loading component 1, and one end of the first channel 12 extends to the first adsorption end surface 11. With directions shown in FIG. 1 as an example, the first adsorption end surface 11 is a horizontal surface, a lower end of the first channel 12 extends to the first adsorption end surface 11, and the first channel 12 extends in an axial direction of the loading component 1 and penetrates through the loading component 1.

[0066] As shown in FIG. 2, the top of the loading component 1 is connected to a rotary joint 5, and the loading component 1 is rotatable.

[0067] One, two or more first channels 12 may be configured. As shown in FIG. 2, the first channels 12 comprise a first gas channel 121 and a first mounting channel 122, and the first conductive element 31 penetrates through the first mounting channel 122. The number of the first gas channels 121 and the number of the first mounting channels 122 are not limited, and the effects of the first gas channels 121 and the first mounting channels 122 are not limited, either. For example, current may pass through the first gas channel 121, an ultrasonic device, a microwave device, an electromagnetic device, a magnetic device or a light guide device may be arranged in the first gas channel 121, or liquid may pass through the first gas channel 121.

[0068] One end of the first conductive element 31 is connected to a power supply (not shown), and the first conductive element 31 penetrates through the first channel 12. Here, a large portion of an axial length of the first channel 12 is occupied by the first conductive element 31, or a small portion of the axial length of the first channel 12 is occupied by the first conductive element 31. Or, the whole axial length of the first channel 12 is occupied by a first acting terminal 41 of the conductive interface module 4, and the first conductive element 31 is connected to the first acting terminal 41 and located outside the first channel 12. In this embodiment, the first conductive element 31 is a wire.

[0069] The conductive interface module 4 at least comprises the first acting terminal 41, at least part of the first acting terminal 41 is arranged in the first channel 12, and the first acting terminal 41 is electrically connected to the first conductive element 31. In this embodiment, the first acting terminal 41 is made of a conductive material. Of course, in other embodiments, the first acting terminal 41 may be partially made of a conductive material and partially made of a non-conductive material, and the specific material of the first acting terminal 41 is not limited as long as an electrical conduction function can be fulfilled.

[0070] To facilitate assembly and connection between the first acting terminal 41 and the loading component 1, the conductive interface module 4 further comprises a fixing member 43 made of an insulating material, the fixing member 43 is connected to the loading component 1, and the first acting terminal 41 is connected to the fixing member 43. The fixing member 43 and the loading component 1 may be connected with bolts or the like, and the first acting terminal 41 and the fixing member 43 may be connected by interference fit. The invention has no specific limitation in this aspect.

[0071] Of course, as shown in FIG. 2, the first acting terminal 41 may be a cylindrical conductor inlaid in the loading component 1, and in this case, the fixing member 43 is not needed anymore.Embodiment 2

[0072] A polishing head system comprises a conductive polishing head fixing device and a polishing head 2. A loading component 1, a first conductive element 31 and a conductive interface module 4 in the conductive polishing head fixing device are identical in structure with the loading component 1, the first conductive element 31 and the conductive interface module 4 in Embodiment 1 and will not be repeated here.

[0073] The polishing head 2 is a polishing head in the prior art and is non-conductive, a top surface of the polishing head 2 is a second adsorption end surface 21 that can cling to the first adsorption end surface 11. A plurality of airbags are arranged in the polishing head 2, and the air pressure in the airbags is controlled to generate pressures in different areas of the back of a wafer to control the polishing effect.

[0074] When the first adsorption end surface 11 clings to the second adsorption end surface 21, a negative pressure is formed in the first gas channel 121, such that the loading component 1 adsorbs the polishing head 2 and rotates, and the polishing head 2 rotates synchronously with the loading component 1 to polish a wafer.Embodiment 3

[0075] As shown in FIGS. 3-10, a conductive polishing head system comprises a loading component 1, a polishing head 2, a conductive element and a conductive interface module 4.

[0076] The loading component 1 has a first adsorption end surface 11, at least one first channel 12 is formed in the loading component 1, and one end of the first channel 12 extends to the first adsorption end surface 11. With directions shown in FIG. 4 as an example, the first adsorption end surface 11 is a horizontal surface, a lower end of the first channel 12 extends to the first adsorption end surface 11, and the first channel 12 extends in an axial direction of the loading component 1 and penetrates through the loading component 1.

[0077] The top of the loading component 1 is connected to a rotary joint 5, and the loading component 1 is rotatable around its central line.

[0078] One, two or more first channels 12 may be configured. The first channels 12 comprise a first gas channel 121 and a first mounting channel 122, and a first conductive element 31 penetrates through the first mounting channel 122. The number of the first gas channels 121 and the number of the first mounting channels 122 are not limited, and the effects of the first gas channels 121 and the first mounting channels 122 are not limited, either.

[0079] The polishing head 2 has a second adsorption end surface 21, at least one second channel 22 is formed in the polishing head 2, and one end of the second channel 22 extends to the second adsorption end surface 21. With the directions shown in FIG. 4 as an example, the second adsorption end surface 21 is a horizontal surface, an upper end of the second channel 22 extends to the second adsorption end surface 21, and the second channel 22 extends in an axial direction of the polishing head 2.

[0080] The conductive element at least comprises the first conductive element 31 with one end connected to a power supply, and the first conductive element 31 penetrates through the first channel 12. Here, a large portion of an axial length of the first channel 12 is occupied by the first conductive element 31, or a small portion of the axial length of the first channel 12 is occupied by the first conductive element 31. Or, the whole axial length of the first channel 12 is occupied by a first acting terminal 41 of the conductive interface module 4, and the first conductive element 31 is connected to the first acting terminal 41 and located outside the first channel 12, as shown in FIG. 10. In this embodiment, the first conductive element 31 is a wire.

[0081] The conductive interface module 4 at least comprises the first acting terminal 41 and a second acting terminal 42, wherein at least part of the first acting terminal 41 is arranged in the first channel 12, and the first acting terminal 41 is electrically connected to the first conductive element 31. At least part of the second acting terminal 42 is arranged in the second channel 22. In this embodiment, the first acting terminal 41 and the second acting terminal 42 are made of a conductive material. Of course, in other embodiments, the first acting terminal 41 and the second acting terminal 42 may be partially made of a conductive material and partially made of a non-conductive material. The specific material of the first acting terminal 41 and the second acting terminal 42 is not limited as long as an electrical conduction function can be fulfilled.

[0082] To facilitate assembly and connection between the second acting terminal 42 and the polishing head 2, the conductive interface module 4 further comprises a mounting frame 44 made of an insulating material, the mounting frame 44 is connected to the polishing head 2, and the specific connection method of the mounting frame 44 and the polishing head 2 is not limited. The mounting frame 44 is non-conductive and can isolate the second acting terminal 42 from the polishing head 2 to prevent electric leakage. The second acting terminal 42 is connected to the mounting frame 44. Specifically, the mounting frame 44 is formed by an upper portion 443 and a lower portion 444, an elastic element 441 is arranged in the mounting frame 44, a flange 442 is formed in an outer wall of the second acting terminal 42, one end of the elastic element 441 abuts against the flange 442, and the other end of the elastic element 441 abut against the lower portion 444 of the mounting frame 44; when the elastic element 441 is in a relaxed state, the flange 442 abuts against the upper portion 443 of the mounting frame 44, and two ends of the second acting terminal 42 extend out from openings in upper and lower sides of the mounting frame 44 respectively, such that effective contact and conduction between the second acting terminal 42 and the first acting terminal 41 are guaranteed.

[0083] When the first absorption end surface 11 clings to the second adsorption end surface 21, the first acting terminal 41 and the second acting terminal 42 come in contact for conduction, such that electrical connection of the polishing head 2 is realized. In other words, the power supply is connected to the polishing head 2 by means of the first conductive element 31, the first acting terminal 41 and the second acting terminal 42 to electrify the polishing head 2.

[0084] To guarantee effective connection between the first acting terminal 41 and the second acting terminal 42 to form a conductive path, a limiting groove 411 is formed in an end surface of the first acting terminal 41, and the second acting terminal 42 is partially inserted into the limiting groove 411.

[0085] To further guarantee effective connection between the first acting terminal 41 and the second acting terminal 42, the first acting terminal 41 and the second acting terminal 42 may be magnetically attracted, that is to say, the first acting terminal 41 and the second acting terminal 42 are not only conductive, but also magnetic.

[0086] Because the working area of the polishing head 2 is humid, liquid may infiltrate into the space between the polishing head 2 and the loading component 1, leading to two risks: first, the second acting terminal 42 and the first acting terminal 41 may be electrically connected to the polishing head 2 or the loading component 1 by means of the liquid, leading to electric leakage; second, the second acting terminal 42 and the first acting terminal 41 may be corroded by the liquid.

[0087] As shown in FIG. 11, a sealing element 47 is arranged on an outer side of the conductive interface module 4; after the first adsorption end surface 11 clings to the second adsorption end surface 21, the sealing element 47 will be squeezed to fulfill a sealing effect. The sealing element 47 may be inlaid in a mounting groove of the second adsorption end surface 21 or inlaid in a mounting groove of the first adsorption end surface 11, and the invention has no specific limitation in this aspect as long as sealing between the first adsorption end surface 11 and the second adsorption end surface 21 can be realized to prevent the water from entering the conductive interface module 4 to prevent the risks of water leakage and corrosion.Embodiment 4

[0088] In this embodiment, the conductive element further comprises a second conductive element 32 connected to the second acting terminal 42.

[0089] In other words, in Embodiment 3, the second acting terminal 42 may be electrically connected to the polishing head 2 directly. In this embodiment, the second conductive element 32 is electrically connected to the polishing head 2, and the power supply is connected to the polishing head 2 by means of the first conductive element 31, the first acting terminal 41, the second acting terminal 42 and the second conductive element 32 to electrify the polishing head 2.

[0090] One, two or more second channels 22 may be configured. As shown in FIG. 6, the second channels 12 comprise a second gas channel 221 and a second mounting channel 222, and the second conductive element 32 penetrates through the second mounting channel 222. The number of the second gas channels 221 and the number of the second mounting channels 222 are not limited, and the effects of the second gas channels 221 and the second mounting channels 222 are not limited, either.

[0091] To guarantee effective adsorption between the loading component 1 and the polishing head 2, the first gas channel 121 and the second gas channel 221 are vertically connected. After being vertically aligned, the first gas channel 121 and the second gas channel 221 are connected by means of the rotary joint 5 and a stationary gas port.Embodiment 5

[0092] In Embodiment 3, at least part of the first acting terminal 41 is located in the first channel 12, and at least part of the second acting terminal 42 is located in the second channel 22.

[0093] As shown in FIG. 12, in this embodiment, a structure identical with the first acting terminal 41 may be located in the second channel 22, and a structure identical with the second acting terminal 42 may be located in the first channel 12, that is to say, the structures in Embodiment 3 are vertically exchanged.

[0094] In this case, a limiting groove allowing the first acting terminal to be partially inserted therein is formed in a surface of the second acting terminal.

[0095] Of course, in other embodiments, the first acting terminal 41 may protrude out of the first adsorption end surface 11. When the first adsorption end surface 11 clings to the second adsorption end surface 21, the first acting terminal 41 extends into the second channel 22 to come in contact with the second acting terminal 42 to realize conduction.

[0096] Or, the second acting terminal 42 protrudes out of the second adsorption end surface 21 by a large length, the first acting terminal 41 is located deep inside the first channel 12, and when the first adsorption end surface 11 clings to the second adsorption end surface 21, the second acting terminal 42 extends into the first channel 12 to come in contact with the first acting terminal 41 to realize conduction.Embodiment 6

[0097] As shown in FIG. 5, when the loading component 1 and the fixing member 43 are assembled together, an end surface of the fixing member 43 is flush with the first adsorption end surface 11. When the mounting frame 44 and the polishing head 2 are assembled together, an end surface of the mounting frame 44 is flush with the second adsorption end surface 21.

[0098] As shown in FIGS. 13 and 14, in this embodiment, a groove 13, for mounting the fixing member 43 and the first acting terminal 41, in the loading component 1 has a large depth, such that a large portion of the second acting terminal 42 and the mounting frame 44 may be received in the groove 13. When the polishing head 2 does not need to be electrified, the mounting frame 33 may be detached.

[0099] Of course, in other embodiments, a groove with a large depth may be formed in the polishing head 2 to receive the first acting terminal 41.Embodiment 7

[0100] Based on Embodiment 4, to realize assembly and connection between the first conductive element 31 and the first acting terminal 41, a mounting hole 45 is formed in the first acting terminal 41, an internal thread is formed in the mounting hole 45, and the first conductive element 31 is connected to a conductive adapter 46. Specifically, the first conductive element 31 may be wound around the periphery of the conductive adapter 46, and the conductive adapter 46 is provided with an external thread and threadedly connected to the mounting hole 45 to realize detachable connection between the first conductive element 31 and the first acting terminal 42.

[0101] Similarly, to realize assembly and connection between the second conductive element 32 and the second acting terminal 42, a second mounting hole 48 is formed in the second acting terminal 42, an internal thread is formed in the second mounting hole 48, and the second conductive element 32 is connected to a second conductive adapter 49. Specifically, the second conductive element 32 may be wound around the periphery of the second conductive adapter 49, and the second conductive adapter 49 is provided with an external thread and threadedly connected to the second mounting hole 38 to realize detachable connection between the second conductive adapter 49 and the second acting terminal 42 is realized.

[0102] Of course, in other embodiments, the first conductive element 31 and the first acting terminal 42 may be directly welded together, or the first acting terminal 42 is one part of the first conductive element 31. The invention has no specific limitation in this aspect.Embodiment 8

[0103] In the above embodiments, the first channel 12 extends in the axial direction of the loading component 1. As shown in FIG. 16, the first channel 123 may not extend linearly in the axial direction of the loading component 1 and may extend sinuously, a lower end of the first channel 12 is located on the first adsorption end surface 11, and an upper end of the first channel 12 may be located on an upper end surface opposite to the first adsorption end surface 11 or a side wall of the loading component 1. The invention has no specific limitation in this aspect.

[0104] Similarly, the second channel 12 may not extend linearly and may extend sinuously.Embodiment 9

[0105] In the above embodiments, the first channel 12 is located in the loading component 1. As shown in FIG. 17, the first channel 12 may be in an outer area of the loading component 1, and the outer area is an outer wall or a peripheral area of the loading component 1.Embodiment 10

[0106] As shown in FIGS. 18 and 19, the conductive interface module 4 may not be configured as the complex structure in Embodiment 3 and may be configured as a simple structure. The first acting terminal 41 directly extends along the whole second channel 12, the second acting terminal 42 directly extends along the whole second channel 22, and the upper end of the second acting terminal 42 is flush with the second adsorption end surface 21.Embodiment 11

[0107] Based on the above embodiments, the polishing head 1 comprises an adsorption film 23 used for adsorbing a wafer, at least part of the adsorption film 23 is made of a conductive material, and the adsorption film 23 is electrically connected to the second acting terminal 42 or the second conductive element 32. Specifically, in Embodiment 10, the lower end of the second acting terminal 42 extends to the adsorption film 23.

[0108] The adsorption film 23 is a flexible film, or a metal film, or a metal and non-metal composite film.Embodiment 12

[0109] Based on the above embodiments, the polishing head 1 comprises a retaining ring 24 for fixing a wafer in the polishing head, at least part of the retaining ring 24 is made of a conductive material, and the retaining ring 24 is electrically connected to the second acting terminal 42 or the second conductive element 32.

[0110] The retaining ring 24 and the adsorption film 23 in Embodiment 11 may be both or separately configured. The invention has no limitation in this aspect.

[0111] The structures in the above embodiments may be combined in different ways. The invention has no specific limitation in this aspect.

[0112] The above specific embodiments are used for explaining the invention rather than limiting the invention. Any modifications and transformations made to the invention based on the spirit of the invention and the protection scope of the claims should also fall within the protection scope of the invention.

Claims

1. A conductive polishing head fixing device, comprising:a loading component, having a first adsorption end surface matched and connection with a polishing head; and at least one first channel being formed in the loading component, and an end of the first channel extending to the first adsorption end surface;a first conductive element, having an end connected to a power supply; anda conductive interface module, at least comprising a first acting terminal, at least part of the first acting terminal being arranged in the first channel, and the first acting terminal being electrically connected to the first conductive element.

2. The conductive polishing head fixing device according to claim 1, wherein the first acting terminal is made of a conductive material.

3. The conductive polishing head fixing device according to claim 1, wherein the conductive interface module further comprises a fixing member made of an insulating material, the fixing member is connected to the loading component, and the first acting terminal is connected to the fixing member.

4. The conductive polishing head fixing device according to claim 1, wherein the loading component is connected to a rotary joint, and the loading component is rotatable.

5. The conductive polishing head fixing device according to claim 1, wherein the first channel extends in an axial direction of the loading component.

6. The conductive polishing head fixing device according to claim 1, wherein the first conductive element penetrates through the first channel.

7. The conductive polishing head fixing device according to claim 1, wherein the first channels comprise a first gas channel and a first mounting channel, and the first conductive element penetrates through the first mounting channel.

8. The conductive polishing head fixing device according to claim 1, wherein the first channel is formed in the loading component; or, the first channel is formed in an outer area of the loading component; or, the first channel is formed in an outer wall of the loading component.

9. A conductive polishing head system, comprising:a loading component, having a first adsorption end surface; and at least one first channel being formed in the loading component, an end of the first channel extending to the first adsorption end surface;a polishing head, having a second adsorption end surface, at least one second channel being formed in the polishing head, an end of the second channel extending to the second adsorption end surface;a conductive element, at least comprising a first conductive element with an end connected to a power supply; anda conductive interface module, at least comprising a first acting terminal connected to the first conductive element, and a second acting terminal, at least part of the first acting terminal and at least part of the second acting terminal being arranged in the first channel and / or the second channel;wherein, when the first adsorption end surface clings to the second adsorption end surface, the first acting terminal and the second acting terminal come in contact and conduction to realize electrical connection of the polishing head.

10. The conductive polishing head system according to claim 9, wherein the first acting terminal is made of a conductive material, and the second acting terminal is made of a conductive material.

11. The conductive polishing head system according to claim 9, wherein the conductive element further comprises a second conductive element connected to the second acting terminal.

12. The conductive polishing head system according to claim 9, wherein the conductive interface module further comprises a fixing member made of an insulating material, the fixing member is connected to the loading component or the polishing head, and the first acting terminal or the second acting terminal is connected to the fixing member.

13. The conductive polishing head system according to claim 9, wherein the conductive interface module further comprises a mounting frame made of an insulating material, the mounting frame is connected to the polishing head or the loading component, and the second acting terminal or the first acting terminal is connected to the mounting frame.

14. The conductive polishing head system according to claim 13, wherein an elastic element is arranged in the mounting frame, a flange abutting against the elastic element is formed in an outer wall of the second acting terminal or the first acting terminal, and when the elastic element is in a relaxed state, the flange abuts against an inner wall of the mounting frame, and two ends of the second acting terminal or the first acting terminal extend out from openings in two sides of the mounting frame respectively.

15. The conductive polishing head system according to claim 9, wherein the first acting terminal and the second acting terminal are magnetically attracted.

16. The conductive polishing head system according to claim 13, wherein the mounting frame is formed by an upper portion and a lower portion.

17. The conductive polishing head system according to claim 9, wherein the loading component is connected to a rotary joint, and the polishing head rotates synchronously with the loading component.

18. The conductive polishing head system according to claim 9, wherein the first channel extends in an axial direction of the loading component.

19. The conductive polishing head system according to claim 9, wherein the first channels comprise a first gas channel and a first mounting channel, and the first conductive element penetrates through the first mounting channel; the second channels comprise a second gas channel and a second mounting channel, and a second conductive element penetrates through the second mounting channel.

20. The conductive polishing head system according to claim 19, wherein the first gas channel and the second gas channel are vertically connected.

21. The conductive polishing head system according to claim 89, wherein a mounting hole is formed in the first acting terminal or / and the second acting terminal, the first conductive element or / and the second conductive element are connected to a conductive adapter, and the conductive adapter is threadedly connected to the mounting hole.

22. The conductive polishing head system according to claim 9, wherein a limiting groove allowing the second acting terminal to be partially inserted therein is formed in an end surface of the first acting terminal; and / or, a limiting groove allowing the first acting terminal to be partially inserted therein is formed in a surface of the second acting terminal.

23. The conductive polishing head system according to claim 9, wherein a sealing element is arranged on an outer side of the conductive interface module, and when the first adsorption end surface clings to the second adsorption end surface, the sealing element is squeezed to realize sealing.

24. The conductive polishing head system according to claim 11, wherein the polishing head comprises an adsorption film used for adsorbing a wafer, at least part of the adsorption film is made of a conductive material, and the adsorption film is electrically connected to the second acting terminal or the second conductive element.

25. The conductive polishing head system according to claim 24, wherein the adsorption film is a flexible film, or a metal film, or a metal and non-metal composite film.

26. The conductive polishing head system according to claim 11, wherein the polishing head comprises a retaining ring used for fixing a wafer in the polishing head, at least part of the retaining ring is made of a conductive material, and the retaining ring is electrically connected to the second acting terminal or the second conductive element.

27. The conductive polishing head system according to claim 9, wherein the first channel is formed in the loading component; or, the first channel is formed in an outer area of the loading component; or, the first channel is formed in an outer wall of the loading component.

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