Multi-stage thermal pathway with embedded hydrocarbon-coated rib geometry

Abstract

In one aspect, a payload-cooling system can comprise an aluminum payload chamber having an upper aluminum chamber plate and an aluminum internal rib assembly extending into an interior payload volume. The aluminum internal rib assembly can include rib segments arranged as a 2-by-4 conduction grid. A hydrocarbon thermal control material coating, such as tetradecane, can be disposed directly on the upper aluminum chamber plate and on the aluminum internal rib assembly. An outer polymer enclosure, such as ABS, can surround at least a portion of the aluminum payload chamber. A thermoelectric cooling assembly can be mounted above the upper aluminum chamber plate and can comprise a thermoelectric chip and a cooling block thermally coupling the chip to the chamber. A front access opening can be positioned at approximately forty-five degrees. A fluid circulation pathway and a forced-air heat-rejection assembly can remove heat and reject it to ambient through a multi-stage thermal pathway involving conduction, buffering, and forced-air transfer.

Description

BACKGROUNDField of the Invention

[0001] The present invention relates generally to portable temperature-controlled storage systems, and more particularly to a multi-stage thermal pathway with embedded hydrocarbon-coated rib geometry.Background

[0002] Temperature-sensitive materials, particularly in medical and biological applications, require precise temperature control during storage and transport. Traditional cooling systems rely on compressors, refrigerants, or ice packs that are bulky, inefficient, and unable to maintain consistent temperatures. Current portable cooling solutions face significant challenges in maintaining precise temperatures while operating on battery power.

[0003] The limitations of existing portable cooling systems are particularly evident in applications requiring extended autonomous temperature control. Traditional compressor-based systems consume significant power and are impractical for portable use, while passive cooling solutions using ice packs or phase change materials cannot maintain precise temperature control over long periods.

[0004] Additionally, existing systems often suffer from inefficient heat transfer between cooling elements and payload chambers, leading to temperature gradients and inconsistent cooling. This technical challenge is particularly acute in compact portable systems where space constraints limit traditional heat transfer approaches.SUMMARY OF THE INVENTION

[0005] In one aspect, a payload-cooling system can comprise an aluminum payload chamber having an upper aluminum chamber plate and an aluminum internal rib assembly. The aluminum internal rib assembly can extend into an interior payload volume and can include a plurality of aluminum rib segments arranged to define a 2-by-4 segmented conduction grid within the interior payload volume. A hydrocarbon thermal control material coating can be disposed directly on the upper aluminum chamber plate and directly on the aluminum internal rib assembly, where the hydrocarbon thermal control material coating can comprise tetradecane. An outer polymer enclosure can surround at least a portion of the aluminum payload chamber, and the outer polymer enclosure can comprise ABS.

[0006] A thermoelectric cooling assembly can be mounted above the upper aluminum chamber plate. The thermoelectric cooling assembly can comprise a thermoelectric chip having a cold side and a hot side, and a cooling block thermally coupled to the cold side of the thermoelectric chip and thermally coupled to the upper aluminum chamber plate. The cooling block can conduct cooling from the thermoelectric chip into the aluminum internal rib assembly and the hydrocarbon thermal control material coating. A front access opening can be positioned at an angle of approximately forty-five degrees relative to a vertical face of the aluminum payload chamber.

[0007] A fluid circulation pathway can be thermally coupled to the hot side of the thermoelectric chip and can be configured to remove heat from the thermoelectric chip. A forced-air heat-rejection assembly can be thermally coupled to the fluid circulation pathway and can be configured to reject heat to an ambient environment. The aluminum internal rib assembly, the hydrocarbon thermal control material coating, the thermoelectric cooling assembly, the fluid circulation pathway, and the forced-air heat-rejection assembly can cooperate to establish a multi-stage thermal pathway that can include conduction from the thermoelectric chip into the cooling block; conduction from the cooling block into the upper aluminum chamber plate; conduction from the upper aluminum chamber plate into the aluminum internal rib assembly; thermal buffering and distribution by the hydrocarbon thermal control material coating through the 2-by-4 segmented conduction grid; heat transfer from the hot side of the thermoelectric chip into the fluid circulation pathway; and forced-air heat rejection from the fluid circulation pathway to the ambient environment.BRIEF DESCRIPTION OF THE DRAWINGS

[0008] FIG. 1 is a top view of example embodiment of a portable temperature-controlled enclosure, according to some embodiments.

[0009] FIGS. 2 and 3 are isometric views of example embodiment of a portable temperature-controlled enclosure, according to some embodiments.

[0010] FIG. 4 is a front view of example embodiment of a portable temperature-controlled enclosure, according to some embodiments.

[0011] FIG. 5 is a side view of example embodiment of a portable temperature-controlled enclosure, according to some embodiments.

[0012] FIG. 6-9 illustrate various example views of an aluminum cooling chamber portable unit, according to some embodiments.

[0013] FIG. 6 illustrates a top-view of aluminum cooling chamber portable unit, according to some embodiments.

[0014] FIG. 7 illustrates a isometric-view of aluminum cooling chamber portable unit, according to some embodiments.

[0015] FIG. 8 illustrates a rear-view of aluminum cooling chamber portable unit, according to some embodiments.

[0016] FIG. 9 illustrates a side-view of aluminum cooling chamber portable unit, according to some embodiments.

[0017] FIG. 10 is a block diagram of a sample computing environment that can be utilized to implement various embodiments.

[0018] FIG. 11 illustrates a logical view of a portable temperature-controlled enclosure, according to some embodiments.

[0019] FIG. 12 illustrates an isometric view of the 12-liter aluminum cooling chamber, according to some embodiments.

[0020] FIG. 13 illustrates a top view of the 12-liter aluminum cooling chamber, according to some embodiments.

[0021] FIG. 14 illustrates a rear view of the 12-liter aluminum cooling chamber, according to some embodiments.

[0022] FIG. 15 illustrates a side view of the 12-liter aluminum cooling chamber revealing the internal thermal management architecture, according to some embodiments.

[0023] The Figures described above are a representative set and are not an exhaustive with respect to embodying the invention.DESCRIPTION

[0024] Disclosed are a system, method, and article of manufacture for an MULTI-STAGE THERMAL PATHWAY WITH EMBEDDED HYDROCARBON-COATED RIB GEOMETRY. The following description is presented to enable a person of ordinary skill in the art to make and use the various embodiments. Descriptions of specific devices, techniques, and applications are provided only as examples. Various modifications to the examples described herein can be readily apparent to those of ordinary skill in the art, and the general principles defined herein may be applied to other examples and applications without departing from the spirit and scope of the various embodiments.

[0025] Reference throughout this specification to ‘one embodiment,’‘an embodiment,’‘one example,’ or similar language means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment, according to some embodiments. Thus, appearances of the phrases ‘in one embodiment,’‘in an embodiment,’ and similar language throughout this specification may, but do not necessarily, all refer to the same embodiment.

[0026] Furthermore, the described features, structures, or characteristics of the invention may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided, such as examples of programming, software modules, user selections, network transactions, database queries, database structures, hardware modules, hardware circuits, hardware chips, etc., to provide a thorough understanding of embodiments of the invention. One skilled in the relevant art can recognize, however, that the invention may be practiced without one or more of the specific details, or with other methods, components, materials, and so forth. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring aspects of the invention.

[0027] The schematic flow chart diagrams included herein are generally set forth as logical flow chart diagrams. As such, the depicted order and labeled steps are indicative of one embodiment of the presented method. Other steps and methods may be conceived that are equivalent in function, logic, or effect to one or more steps, or portions thereof, of the illustrated method. Additionally, the format and symbols employed are provided to explain the logical steps of the method and are understood not to limit the scope of the method. Although various arrow types and line types may be employed in the flow chart diagrams, and they are understood not to limit the scope of the corresponding method. Indeed, some arrows or other connectors may be used to indicate only the logical flow of the method. For instance, an arrow may indicate a waiting or monitoring period of unspecified duration between enumerated steps of the depicted method. Additionally, the order in which a particular method occurs may or may not strictly adhere to the order of the corresponding steps shown. Appendix A includes additional information for implementing various embodiments.Definitions

[0028] Example definitions for some embodiments are now provided.

[0029] Acrylonitrile butadiene styrene (ABS) is a common plastic polymer.

[0030] High-density polyethylene (HDPE) or polyethylene high-density (PEHD) is a polyethylene thermoplastic made from petroleum.

[0031] The thermo-electric effect is the presence of heating or cooling at an electrified junction of two different conductors. When a current is made to flow through a junction between two conductors, A and B, heat may be generated or removed at the junction. Thermoelectric cooling uses the Peltier effect to create a heat flux between the junction of two different types of materials. A thermoelectric cooler, heater, or thermoelectric heat pump is a solid-state active heat pump which transfers heat from one side of the device to the other, with consumption of electrical energy, depending on the direction of the current.

[0032] Thermal control material (TCM) is a substance with a high heat of fusion which, melting and solidifying at a certain temperature, is capable of storing and releasing large amounts of energy. Heat is absorbed or released when the material changes from solid to liquid and vice versa. Example TCM materials can include, inter alia: organic (paraffin and nonparaffin), inorganic (salt hydrates and metallic alloys), and eutectic (mixture of two or more TCM components: organic, inorganic, and both).

[0033] Polypropylene (PP) is a thermoplastic polymer used in a wide variety of applications. It is produced via chain-growth polymerization from the monomer propylene.

[0034] Press fit or friction fit is a fastening between two parts which is achieved by friction after the parts are pushed together, rather than by any other means of fastening.

[0035] Temperature sensors can include mechanical temperature sensors, electrical temperature sensors, integrated circuit sensors, medometers, etc.

[0036] Thermoelectric effect is the direct conversion of temperature differences to electric voltage and vice versa via a thermocouple. A thermoelectric device creates voltage when there is a different temperature on each side. Conversely, when a voltage is applied to it, heat is transferred from one side to the other, creating a temperature difference. At the atomic scale, an applied temperature gradient causes charge carriers in the material to diffuse from the hot side to the cold side.

[0037] 6061-T6 aluminum is a precipitation-hardened aluminum alloy containing magnesium and silicon, heat-treated to the T6 temper to provide increased strength, machinability, and corrosion resistance.

[0038] 3003-H14 aluminum is a work-hardened aluminum alloy containing manganese, cold-worked to the H14 temper to increase strength while retaining high thermal conductivity and corrosion resistance.

[0039] Controlled dip-coating can be a deposition process in which a part is immersed in a liquid coating bath and withdrawn at a controlled rate such that a uniform wet film forms on the surface.

[0040] Spray-deposition can be a surface-coating process that atomizes a liquid precursor and directs droplets toward a target surface to form a continuous coating layer.

[0041] A nanostructured adhesion primer layer can be a thin film comprising nanoscale features configured to promote mechanical or chemical bonding between a substrate and an overlying coating.

[0042] A hydrocarbon material layer having a thermal diffusivity can be a coating comprising organic molecules configured to exhibit a rate of internal heat transport characterized by its thermal diffusivity.

[0043] Thermal diffusivity can be a material property defined as the ratio of thermal conductivity to volumetric heat capacity (α=k / (ρ·Cp)), indicating the rate at which heat spreads through a substance.

[0044] Hydrocarbon coating mass can be a quantity of applied hydrocarbon coating material measured as the total mass present on a coated surface.Example Smart Refrigerator Exterior Views

[0045] FIGS. 1-5 provide series of views of an example embodiment of a portable temperature-controlled enclosure 100, according to some embodiments. The series of views includes a set of orthographic views (e.g. top, front, side, and isometric) of the portable temperature-controlled enclosure according to one embodiment. The example embodiment of a portable temperature-controlled enclosure 100 can be a top loaded system. Portable temperature-controlled enclosure 100 can include an optimized solid-state cooling system (e.g. see infra). Portable temperature-controlled enclosure 100 provides a portable temperature-controlled enclosure utilizing an innovative solid-state cooling system with optimized thermal management. Portable temperature-controlled enclosure 100 combines advanced thermoelectric cooling technology with sophisticated control systems to achieve superior temperature stability and extended battery operation.

[0046] Portable temperature-controlled enclosure 100 comprises several key components working in concert: a precision-engineered payload chamber for storing temperature-sensitive materials, an optimized thermoelectric cooling system with angular mounting configuration, an integrated thermal control material (TCM) chamber for thermal buffering, and a sophisticated heat dissipation system including honeycomb ventilation. These components are managed by advanced monitoring and control systems, all supported by extended battery-powered operation capability.

[0047] The top-loading portable temperature-controlled enclosure 100 represents a breakthrough in portable refrigeration technology, utilizing solid-state cooling principles to maintain precise temperature control. The top-loading portable temperature-controlled enclosure 100 distinguishes itself through the complete elimination of traditional cooling infrastructure components such as compressors, refrigerant gases, cooling coils, ice packs, or gel packs.

[0048] Example physical specifications of the top-loading portable temperature-controlled enclosure 100 are now discussed. The top-loading portable temperature-controlled enclosure 100 payload capacity, by way of example, can be a one (1) liter. The top-loading portable temperature-controlled enclosure 100 can include a top-loading design with example dimensions of 107.78 mm×119.92 mm×166.84 mm.

[0049] Access to the top-loading portable temperature-controlled enclosure 100 can be via a top-mounted lid providing full access to internal chamber. Construction of The top-loading portable temperature-controlled enclosure 100 can include precision-engineered aluminum chamber with integrated cooling system.

[0050] An example Core Cooling Technology of the top-loading portable temperature-controlled enclosure 100 is now discussed. The top-loading portable temperature-controlled enclosure 100 employs an advanced solid-state cooling mechanism based on semiconductor physics. As a cooling principle, the top-loading portable temperature-controlled enclosure 100 utilizes an electron mobility differential between semiconductor materials. By way of operation, the top-loading portable temperature-controlled enclosure 100 uses an electric current passage through dual-semiconductor junction.

[0051] The thermal control during electron transition between materials is implemented to optimize cooling efficiency. The top-loading portable temperature-controlled enclosure 100 can achieve target temperature (2° C.) within 2-hour initialization period. The top-loading portable temperature-controlled enclosure 100 implements temperature maintenance to maintain 2-8° C. range for 72 hours without external power.

[0052] An example Thermal Management System of the internal payload chamber incorporates a sophisticated thermal management design. As seen below, the top-loading portable temperature-controlled enclosure 100 includes a chamber construction that includes payload 104. Here, the material composition can include a specialized heat-absorbing material combined with aluminum. The top-loading portable temperature-controlled enclosure 100 utilizes thermal spreading via an engineered aluminum structure for optimal temperature distribution. The top-loading portable temperature-controlled enclosure 100 performs heat absorption via a material matrix for thermal energy management.

[0053] The top-loading portable temperature-controlled enclosure 100 provides dynamic temperature control. Primary cooling is performed via a solid-state semiconductor chip (e.g. discussed infra). Supplementary cooling can be performed via a thermal mass buffer system. Hybrid operation between thermal mass and active cooling Response system can be used for temperature maintenance. Automated cooling bursts for temperature deviation compensation can be performed.

[0054] The top-loading portable temperature-controlled enclosure 100 can include a power and environmental adaptation power system 1102. The top-loading portable temperature-controlled enclosure 100 includes an input compatibility, by way of example of a Universal AC power (110V / 220V) and an integrated charging system. Battery operation can be for 72-hour autonomous operation capability.

[0055] Optimized power consumption during steady-state operation can be obtained using bi-directional temperature control capability. For example, in a winter mode operation, the top-loading portable temperature-controlled enclosure 100 functions in extreme cold environments (−20° C. to −30° C.). Thermal management systems 1104 of the top-loading portable temperature-controlled enclosure 100 can maintains 2-8° C. in both hot and cold ambient conditions. An example environmental range enables The top-loading portable temperature-controlled enclosure 100 to be functional across extreme temperature variations.

[0056] The top-loading portable temperature-controlled enclosure 100 includes a monitoring and communication system 1106 for temperature monitoring. Real-time temperature tracking is implemented across continuous internal temperature measurement. The top-loading portable temperature-controlled enclosure 100 includes a digital display for current temperature indication. The top-loading portable temperature-controlled enclosure 100 includes an alert system for temperature deviations. The top-loading portable temperature-controlled enclosure 100 includes a communication infrastructure 1108 that can include an integrated LTE module with SIM card and / or GPS location tracking capability. The top-loading portable temperature-controlled enclosure 100 can perform data transmission intervals (e.g. at 4-5 minutes. The top-loading portable temperature-controlled enclosure 100 also includes cloud connectivity for remote monitoring. A backup SD card storage system can be included for offline data logging. The top-loading portable temperature-controlled enclosure 100 includes a Data Management module 1110 for continuous temperature logging and location tracking and recording. The top-loading portable temperature-controlled enclosure 100 can also perform automated cloud data synchronization.

[0057] The top-loading portable temperature-controlled enclosure 100 includes an Operation and Performance Temperature Performance module that manages an initial cooldown (e.g. 2 hours to reach target temperature with a temperature range: 2-8° C. maintenance and operation duration of 72 hours on battery power).

[0058] A thermal interface material utilizes a high thermal conductivity compound with controlled thickness application and full surface coverage verification. Mounting pressure can be maintained at 30-40 PSI through a spring-loaded mechanism, ensuring even pressure distribution across the chip surface and compensation for thermal expansion and contraction in some example embodiments.

[0059] The top-loading configuration represents a significant advancement in portable temperature-controlled storage, combining innovative solid-state cooling technology with sophisticated thermal management and monitoring systems. The design achieves exceptional efficiency and reliability while maintaining precise temperature control across varied environmental conditions.

[0060] More specifically, FIG. 1 is a top view of example embodiment of a portable temperature-controlled enclosure 100, according to some embodiments. FIGS. 2 and 3 are isometric views of example embodiment of a portable temperature-controlled enclosure 100, according to some embodiments. FIG. 4 is a front view of example embodiment of a portable temperature-controlled enclosure 100, according to some embodiments. FIG. 5 is a side view of example embodiment of a portable temperature-controlled enclosure 100, according to some embodiments.

[0061] In one embodiments, portable temperature-controlled enclosure 100 can have a top-loading configuration with example payload dimensions: 3.2″×4.1″×5.5″. An example top opening capacity can be one (1) liter. Overall dimensions, by way of example, can be 107.78 mm×119.92 mm×166.84 mm. Portable temperature-controlled enclosure 100 provides a top access lid for payload (e.g. medications, etc.) insertion.

[0062] FIG. 6-9 illustrate various example views of an aluminum cooling chamber portable unit 200, according to some embodiments. Aluminum cooling chamber portable unit 200 can be the internal cooling / heating system of portable temperature-controlled enclosure 100.

[0063] Aluminum cooling chamber portable unit 200 of portable temperature-controlled enclosure 100 comprises a sophisticated thermoelectric cooling mechanism wherein electrical power is transmitted through a strategically positioned semiconductor chip 202 mounted at a calculated angular orientation relative to the aluminum payload chamber 204. The semiconductor chip 202 incorporates a material combination wherein electrons traverse between different semiconductor elements, creating an thermal control effect at the material junction interfaces. This thermal control phenomenon, occurring at the precise locations where the material composition transitions, facilitates the cooling process through electron mobility differentials between the semiconductor materials.

[0064] The thermal management system utilizes direct thermal coupling between the semiconductor chip 202 and an aluminum payload chamber 204, whereby the thermal control at the material junctions actively extracts heat from the payload area through the aluminum wall interface. The extracted thermal energy is subsequently transferred to a closed-loop cooling system 206 comprising fluid-carrying pipes 208 directly coupled to the posterior surface of the semiconductor chip (e.g. can include a heat sink system). The cooling loop 206 employs either water or antifreeze as the working fluid, circulating through an engineered pipe network via an integrated pump mechanism.

[0065] The system's thermal circuit can be completed through a fan-assisted heat exchanger configuration 214, wherein the heated working fluid from the cooling loop 206 is actively cooled before being recirculated through the system. The angular mounting of the semiconductor chip, deliberately oriented at a calculated angle rather than perpendicular to the payload chamber, achieves enhanced cooling distribution by optimizing the radius of coolness spread and increasing the effective surface area coverage. This angular configuration demonstrably improves the speed and uniformity of temperature distribution compared to traditional perpendicular mounting arrangements.

[0066] The thermal control system can operate in a dual-power configuration, initially utilizing wall power for the cooldown phase until the target temperature (typically 2° C.) is achieved, at which point the system transitions to battery power through a lithium polymer battery assembly capable of maintaining temperature control for 72 hours of autonomous operation. The internal configuration includes various top-loading variants (e.g. via top opening 212, etc.) while maintaining identical operational principles, with the semiconductor chip positioning optimized for each configuration to maximize cooling efficiency through enhanced radial distribution patterns.

[0067] The angular orientation of the semiconductor chip 202 relative to the payload chamber wall facilitates superior thermal spreading characteristics. The cooling effect disperses in a radial pattern rather than traditional linear distribution, resulting in more efficient coverage of the payload surface area and accelerated temperature equalization throughout the chamber. This geometric optimization of the semiconductor chip 202 placement enables the system to achieve more comprehensive thermal coverage compared to conventional perpendicular mounting configurations, as the angular positioning creates an expanded radius of cooling influence that enhances the overall heat absorption efficiency of the system.

[0068] More specifically, FIG. 6 illustrates a top-view of aluminum cooling chamber portable unit 200, according to some embodiments. FIG. 7 illustrates a isometric-view of aluminum cooling chamber portable unit 200, according to some embodiments. FIG. 8 illustrates a rear-view of aluminum cooling chamber portable unit 200, according to some embodiments. FIG. 9 illustrates a side-view of aluminum cooling chamber portable unit 200, according to some embodiments.Example Computer Architecture and Systems

[0069] FIG. 10 depicts an exemplary computing system 1000 that can be configured to perform any one of the processes provided herein. In this context, computing system 1000 may include, for example, a processor, memory, storage, and I / O devices (e.g., monitor, keyboard, disk drive, Internet connection, etc.). However, computing system 1000 may include circuitry or other specialized hardware for carrying out some or all aspects of the processes. In some operational settings, computing system 1000 may be configured as a system that includes one or more units, each of which is configured to carry out some aspects of the processes either in software, hardware, or some combination thereof.

[0070] FIG. 10 depicts computing system 1000 with a number of components that may be used to perform any of the processes described herein. The main system 1002 includes a motherboard 1004 having an I / O section 1006, one or more central processing units (CPU) 1008, and a memory section 1010, which may have a flash memory card 1012 related to it. The I / O section 1006 can be connected to a display 1014, a keyboard and / or other user input (not shown), a disk storage unit 1016, and a media drive unit 1018. The media drive unit 1018 can read / write a computer-readable medium 1020, which can contain programs 1022 and / or data. Computing system 1000 can include a web browser. Moreover, it is noted that computing system 1000 can be configured to include additional systems in order to fulfill various functionalities. Computing system 1000 can communicate with other computing devices based on various computer communication protocols such a Wi-Fi, Bluetooth® (and / or other standards for exchanging data over short distances includes those using short-wavelength radio transmissions), USB, Ethernet, cellular, an ultrasonic local area communication protocol, etc.

[0071] Thermo-electric cooler pump can be managed by a computing system in the portable smart refrigerator. The computing system can be coupled with an exterior display. Exterior display can display various parameters (e.g. temperature, battery power, etc.) of the portable smart refrigerator. Computing system can also be coupled with various other systems such as, inter alia: temperature sensors, digital clocks, Wi-Fi systems, etc.

[0072] FIG. 11 illustrates a logical view 1100 of a portable temperature-controlled enclosure, according to some embodiments. Power and environmental adaptation power system 1102. The top-loading portable temperature-controlled enclosure 100 includes an input compatibility, by way of example of a Universal AC power (110V / 220V) and an integrated charging system. Thermal management systems 1104 manage the temperature of top-loading portable temperature-controlled enclosure 100. Thermal management systems 110 of the top-loading portable temperature-controlled enclosure 100 can maintain 2-8° C. in both hot and cold ambient conditions. Monitoring and communication system 1106 for temperature monitoring. Real-time temperature tracking is implemented across continuous internal temperature measurement. The top-loading portable temperature-controlled enclosure 100 includes a digital display for current temperature indication. The top-loading portable temperature-controlled enclosure 100 includes an alert system for temperature deviations. The top-loading portable temperature-controlled enclosure 100 includes a communication infrastructure 1108 that can include an integrated LTE module with SIM card and / or GPS location tracking capability. The top-loading portable temperature-controlled enclosure 100 can perform data transmission intervals (e.g. at 4-5 minutes. The top-loading portable temperature-controlled enclosure 100 also includes cloud connectivity for remote monitoring. A backup SD card storage system can be included for offline data logging. The top-loading portable temperature-controlled enclosure 100 includes a Data Management module 1110 for continuous temperature logging and location tracking and recording.

[0073] Additional information on chip positioning is now discussed. The innovative cooling system centers around a precisely engineered 40 mm×40 mm semiconductor chip that represents a significant advancement in portable refrigeration technology. This chip, comprising multiple semiconductor junctions arranged in an optimized pattern, is mounted at a carefully calculated 20-degree angle relative to the payload chamber wall, deviating from traditional perpendicular mounting approaches. This specific angular orientation was chosen to maximize the cooling efficiency through enhanced radial distribution patterns.

[0074] The mounting configuration creates a sophisticated thermal management system where the chip interfaces directly with the aluminum chamber wall for maximum thermal conductivity. This direct coupling is maintained by a spring-loaded mechanism that ensures a consistent 30-40 PSI mounting pressure, crucial for optimal heat transfer. The interface between the chip and wall utilizes a high thermal conductivity compound with carefully controlled thickness and verified full surface coverage.

[0075] The 20-degree mounting angle serves a critical purpose in the system's operation. Unlike conventional perpendicular mounting, which typically results in linear cooling distribution, this angular orientation creates an expanded radius of cooling influence. This radial distribution pattern enables more comprehensive coverage of the payload surface area and facilitates faster temperature equalization throughout the chamber. The result is a more efficient and effective cooling system that achieves superior thermal coverage compared to traditional mounting configurations.

[0076] In the top-loaded configuration, the chip is positioned lower, near the midsection of the wall, with the temperature sensor strategically placed inside the payload wall towards the bottom side. This positioning was specifically chosen to optimize the cooling effect in relation to the temperature sensor location. The entire setup demonstrates a carefully engineered approach to thermal management, where each component's position has been optimized for maximum efficiency.

[0077] The semiconductor chip's design and mounting create a cooling effect that disperses in a radial pattern rather than a traditional linear distribution. This radial dispersion is particularly effective because it provides more uniform coverage across the payload area. The angular mounting effectively increases the total area over which the cooling effect spreads, resulting in more efficient temperature control throughout the chamber. This innovative approach to chip mounting and cooling distribution represents a significant advancement in portable refrigeration technology, offering improved performance over conventional perpendicular mounting systems.

[0078] The system's overall design reflects a deep understanding of thermal dynamics and practical engineering considerations. By combining the precise 40 mm×40 mm chip dimensions with the 20-degree mounting angle and strategic positioning relative to temperature sensors, the system achieves optimal cooling performance while maintaining efficient use of space within the portable unit. The careful attention to mounting pressure, thermal compound application, and interface design ensures reliable and consistent performance, making this cooling system particularly well-suited for portable applications requiring precise temperature control.Multi-Stage Thermal Pathway with Embedded Hydrocarbon-Coated Rib Geometry

[0079] 12-liter cooling system incorporates both an external enclosure and an internal cooling chamber. The system's dimensions include 14.65 inches (372.19 mm) width, 20.33 inches (516.41 mm) height, and 18.27 inches (464.18 mm) depth for the external enclosure.

[0080] The internal aluminum cooling chamber accommodates a payload space of 8″×8″×11.6″, providing a 12-liter capacity. The chamber design includes distinctive ribbed sections positioned at 45-degree angles along the sides. These ribs, larger than those in the 1-liter version, serve a dual purpose-reducing the overall weight while maintaining thermal conductivity properties. Each rib segment can be oriented at an angle between 40° and 50°, preferably 45°±2°, relative to the longitudinal axis of the chamber side wall. Each rib may exhibit a width between 8 mm and 12 mm, a height between 6 mm and 10 mm, and a pitch spacing of 10 mm to 18 mm between adjacent ribs. This configuration maximizes lateral conduction paths while maintaining mechanical stiffness and minimizing material mass.

[0081] The external enclosure integrates several key components, including a top-loading lid design, an integrated display panel, and strategically placed air-flow vents. The asymmetrical shape of certain components relates to calculations for thermal conduction stability. The design includes pocketed sides with a series of square sections that contribute to weight reduction while maintaining thermal performance.

[0082] The cooling system incorporates a hydrocarbon-coated chamber design, with the internal structure featuring cooling loops and fan integration. The rear view reveals the positioning of these thermal management components, while the side view displays the arrangement of the cooling system elements. The dimensions of the cooling chamber include 10.65 inches (270.5 mm) width, 10.20 inches (270.5 mm) length, and 12.71 inches (322.94 mm) height. The internal aluminum wall thickness may range from 2.5 mm to 3.5 mm, while the external ABS housing thickness ranges from 3 mm to 4.5 mm, selected to balance conduction efficiency and insulation. The hydrocarbon coating, composed of n-tetradecane (C14H30), can be applied to a uniform thickness between 0.05 mm and 0.25 mm with a tolerance of ±0.01 mm, verified by X-ray fluorescence (XRF) or eddy-current measurement. The coating exhibits a latent heat of fusion of approximately 240 KJ / kg and thermal conductivity of 0.26 W / m·K at 25° C., ensuring rapid absorption and controlled release of heat during operation.

[0083] The enclosure design focuses on practical functionality with features such as reinforced corners and robust construction. The component arrangement balances thermal efficiency with user accessibility.

[0084] The integration of the cooling loop and fan assembly works to maintain consistent temperature control throughout the payload space. The side view shows a depth of 10.32 inches (262.11 mm) for key components, with the top side opening measuring 10.16 inches (258.03 mm). These dimensional relationships optimize the balance between internal capacity and overall size.

[0085] This 12-liter system expands upon thermal management principles demonstrated in the smaller version, with adaptations for larger-scale cooling requirements. The design applies similar thermal management approaches while accommodating the increased capacity needs.

[0086] FIG. 12 illustrates an isometric view of the 12-liter aluminum cooling chamber 1200, according to some embodiments. This larger-capacity internal chamber builds upon the thermal management principles of the 1-liter design while accommodating increased payload volume. The chamber 1200 features a top opening 1202 configuration providing access to the 12-liter capacity payload space with internal dimensions of 8″×8″×11.6″ (203×203×295 mm). A distinctive angled access port 1204 is visible on the front face, positioned at approximately 45 degrees to facilitate payload loading while maintaining thermal seal integrity when closed. The side wall structure 1206 reveals a segmented grid pattern comprising eight rectangular sections arranged in a 2×4 array. This compartmentalized structure integrates the fin plate elements described in the specification, wherein aluminum fins coated with hydrocarbon thermal control material (tetradecane) extend into the payload volume to increase thermal exchange surface area. The isometric perspective demonstrates the overall cubic geometry of the chamber and the relationship between the top opening, angled access port, and segmented side walls. The chamber 1200 represents the internal aluminum structure that interfaces with the top-mounted cooling block and thermoelectric chip assembly, providing the thermally conductive pathway between the active cooling elements and the hydrocarbon-coated surfaces that maintain payload temperature.

[0087] FIG. 13 illustrates a top view of the 12-liter aluminum cooling chamber 1200, according to some embodiments. This orthographic projection shows the rectangular payload opening 1402 with dimensions of 10.65 inches (270.5 mm)×10.20 inches (270.5 mm). The payload opening 1402 represents the top access interface through which temperature-sensitive materials are loaded into the 12-liter capacity chamber. The trapezoidal taper visible around the perimeter indicates the wall structure that transitions from the outer chamber dimensions to the internal payload volume. This top surface serves as the mounting interface for the cooling block element described in the specification, wherein the thermoelectric cooling chip couples thermally to a cooling block that in turn interfaces directly with the top surface of the aluminum chamber. Multiple mounting features are visible around the perimeter, indicated by circular patterns that represent fastener locations for securing the cooling block assembly and maintaining consistent thermal interface pressure across the junction. The top view clearly demonstrates the accessible opening area and the structural features that support the top-mounted cooling architecture unique to the 12-liter embodiment.

[0088] FIG. 14 illustrates a rear view of the 12-liter aluminum cooling chamber 1200. This view prominently features the angled cooling element mounting area 1104 positioned diagonally across the rear face. Unlike the 1-liter system where the semiconductor chip mounts at 20 degrees on the side wall, the 12-liter system employs a top-mounted configuration as described in the specification. However, this rear surface shows auxiliary cooling distribution elements or mounting features for the heat rejection system components. The angled element 1104 may represent cooling loop attachment points, structural reinforcement ribs positioned at 45-degree angles as described in the specification, or interface features for the fluid circulation system. The chamber height dimension shows 12.71 inches (322.94 mm), corresponding to the internal height specification. The rear view demonstrates the thermal management infrastructure that works in conjunction with the top-mounted cooling block to distribute cooling effect throughout the larger 12-liter payload volume.

[0089] FIG. 15 illustrates a side view of the 12-liter aluminum cooling chamber 1200 revealing the internal thermal management architecture, according to some embodiments. The top side opening is shown with dimensions of 10.32 inches (262.11 mm) width and 10.16 inches (258.03 mm) depth, matching the specifications from the engineering drawings. The cooling loop is visible as vertical tubing or channels that transport heat transfer fluid from the thermoelectric chip hot side to the heat rejection system. The fan provides forced convection cooling for the fluid-to-air heat exchanger. Most notably, this view clearly shows the ribbed structure 1502 comprising the segmented side wall panels. These ribs 1502 are positioned at 45-degree angles as described in the specification, serving dual purposes of reducing overall chamber weight while maintaining thermal conductivity properties. The ribs 1502 represent the aluminum fin plate elements that extend into the payload space, each coated with hydrocarbon thermal control material (tetradecane) as detailed in the enhanced Appendix A. The 2×4 grid arrangement of rectangular sections is clearly visible, with each compartment representing a finned chamber that increases surface area for thermal exchange between the hydrocarbon TCM coating and the payload contents. The cooling loop positioning relative to these ribbed sections demonstrates how the heat rejection system couples to the chamber structure. The fan mounting at the bottom enables the closed-loop cooling system wherein: (1) the thermoelectric chip extracts heat through the cooling block to the chamber top surface, (2) aluminum thermal conduction distributes cooling throughout the chamber walls and fin plates, (3) hydrocarbon TCM coating absorbs thermal energy from payload while distributing cooling effect, (4) waste heat from chip hot side transfers to circulating fluid, and (5) fan-assisted heat exchanger dissipates thermal energy to ambient environment through the external enclosure ventilation system. This side view effectively illustrates the complete thermal pathway from payload chamber through the various heat transfer stages to final ambient rejection. The aluminum alloy used for the chamber can be 3003-H14, selected for corrosion resistance, machinability, and high thermal conductivity (>150 W / m·K). The ribs and fin-plate grid may be produced by CNC milling or die casting to maintain dimensional precision within ±0.1 mm. The internal surfaces can undergo a micro-etch surface treatment (Ra≈0.8 μm) prior to hydrocarbon application to promote adhesion and uniform wetting.

[0090] In some embodiments, the payload-cooling architecture described with respect to FIGS. 1-11 can be implemented using a 12-liter aluminum cooling chamber 1200 having structural and thermal features illustrated in FIGS. 12-15. As shown, chamber 1200 includes a top-side loading interface 1202 configured to receive temperature-sensitive payloads and to mechanically and thermally couple to the cooling block and thermoelectric module described previously with respect to FIGS. 1-3. The chamber further includes an angled access geometry 1204 and a segmented wall structure 1206 that supports the aluminum fin-plate assemblies and hydrocarbon thermal control coatings discussed above. These internal fin-plate structures can distribute cooling from the active module into the payload region, thereby extending the thermal pathways previously described for the 1-liter implementations of FIGS. 4-7. In this manner, the chamber 1200 functions as a dimensional and capacity extension of the core thermal-management principles described earlier, while maintaining compatibility with the same top-mounted active cooling components, insulation strategy, and payload-handling workflow introduced in FIGS. 1-11.

[0091] As illustrated in the top, rear, and side views of FIGS. 13-15, the cooling block and thermoelectric chip stack previously described in FIGS. 1-3 can be mounted directly above chamber 1200 to deliver thermal flux into the ribbed fin-plate volume 1502. Each fin or rib segment can be coated with hydrocarbon thermal control material to buffer thermal transitions and enhance conductive coupling between the cooling surface and the payload, analogous to the fin-plate embodiments described earlier in FIGS. 8-11. A cooling loop and fan assembly can be coupled to the hot side of the thermoelectric device to expel heat to ambient using the heat-rejection architectures previously shown for the 1-liter systems, thereby enabling the same closed-loop thermal cycle across multiple payload formats. Thus, FIGS. 12-15 represent capacity-scaled embodiments of the same integrated cooling system described in FIGS. 1-11, wherein the payload chamber, fin-plate structure, hydrocarbon coating, thermoelectric block, and ambient-side heat-rejection system operate cooperatively to maintain controlled payload temperature.

[0092] FIG. 12-FIG. 15 collectively illustrate an embodiment in which all of the structural, thermal, and material innovations described above are instantiated within a 12-liter aluminum payload-cooling chamber 1200. As shown in FIG. 12, the chamber 1200 includes a top-side loading interface 1202 and an internal capacity of approximately 8″×8″×11.6″, forming a geometry that supports payload loading and direct conduction from the top-mounted active cooling subsystem. The active subsystem comprises a thermoelectric cooling (TEC) element mounted at the top of the chamber, thermally coupled through a cooling block that directly contacts the upper aluminum surface of the chamber. This arrangement establishes a primary downward thermal-flux pathway into the internal aluminum conduction body. The cooling block is mechanically fastened in place by distributed perimeter mounting points (shown in FIG. 13) that ensure consistent thermal interface pressure and stable alignment of the block and TEC stack. This top-origin conduction architecture is maintained across multiple capacity embodiments, including both 1-liter and 12-liter designs, and enables a consistent modular upper-assembly interface.

[0093] The internal chamber architecture includes a grid of eight rectangular aluminum fin-plate segments arranged in a 2×4 thermal partitioning array 1206 / 1502, as shown in FIG. 12, FIG. 14, and FIG. 15. Each fin-plate segment is an aluminum rib structure arranged at approximately 45 degrees to adjacent chamber boundaries. These rib structures extend directly into the payload volume, not merely along chamber walls, thus significantly increasing thermal surface area accessible for conduction to the payload. This geometry reduces weight while preserving high-efficiency conduction pathways. Each of these aluminum ribs, as well as the chamber's interior aluminum surfaces, is coated with a hydrocarbon thermal control material (TCM), specifically tetradecane, applied directly as a coating rather than encapsulated. The tetradecane coating provides distributed thermal buffering, absorbing heat at the payload interface while simultaneously distributing cooling from the TEC-origin conduction interface into the payload volume. The ribs and fin-plate segments, in conjunction with the TCM layer, create a highly uniform thermal environment that mitigates localized temperature gradients and provides consistent cold storage throughout the interior volume. Each fin-plate segment can project 8-12 mm into the payload volume, forming micro-channels that promote even temperature distribution. The total effective thermal surface area of the rib network may be increased by 1.8-2.3× relative to a smooth-wall chamber of identical volume. Computational thermal analysis (finite-element simulation) confirms that this structure reduces internal temperature gradient to less than 0.4° C. across the 12-liter payload under steady-state operation.

[0094] The integration of aluminum conduction structures and tetradecane TCM with an outer ABS enclosure forms a hybrid chamber in which the aluminum internal chassis provides the primary cold-side thermal pathway, while the external ABS structure functions as an insulating barrier that reduces heat ingress from the surrounding ambient environment. Thus, unlike conventional TCM cartridge-based systems, the TCM here is applied directly to the aluminum conduction elements, ensuring rapid heat absorption and uniform cooling through both fast conduction and latent heat absorption. The hydrocarbon coating can be deposited by dip-coating, spin-coating, or precision spray application, followed by controlled vacuum curing at 40-50° C. to ensure complete bonding to the aluminum substrate without oxidation. Coating uniformity may be maintained by automatic flow-rate control during application to prevent pooling in rib recesses.

[0095] As illustrated in FIG. 13, FIG. 14, and FIG. 15, the top-mounted TEC and cooling-block assembly feeds cooling downward into the ribbed, TCM-coated aluminum grid. The angled access port 1204, positioned at approximately 45 degrees on the chamber's front face (shown in FIG. 12), permits ergonomic loading and unloading while maintaining thermal-seal integrity and without interrupting the conduction-dominant cooling path from the top surface. The angled geometry minimizes seal length relative to a full side opening and allows retention of the top-down conductive / TCM-distributed temperature profile. The internal grill-type rib / fin structure may be fabricated as an integrated internal insert or as a removable modular assembly, enabling interchangeable thermal configurations across differing chamber geometries or payload demands.

[0096] On the hot side of the TEC, FIG. 14 and FIG. 15 show a circulating fluid loop and a fan-assisted heat-exchanger, which dissipate extracted heat into ambient. Thus, the complete thermal pathway includes:

[0097] (1) TEC cold-side to cooling block;

[0098] (2) cooling block to upper aluminum chamber plate;

[0099] (3) conduction from plate into ribs and fins;

[0100] (4) TCM coating distributing cooling and buffering thermal spikes within the payload region;

[0101] (5) hot-side transfer from TEC into circulating fluid pathway;

[0102] (6) convective heat exchange via an air-cooled heat-exchanger; and

[0103] (7) rejection to ambient via a bottom-mounted fan assembly.

[0104] Accordingly, FIG. 12-FIG. 15 implement and demonstrate all of the novel structural and thermal innovations disclosed herein, including:

[0105] aluminum fin-plate structures coated with tetradecane TCM extending into the payload region;

[0106] 2×4 rib segmentation improving conduction and uniformity while reducing weight;

[0107] direct TCM coating on both chamber walls and fins rather than encapsulated TCM;

[0108] a top-mounted TEC+cooling-block stack contacting the aluminum chamber body through a fastened perimeter interface;

[0109] a hybrid aluminum+ABS composite chamber body for conduction+insulation;

[0110] rib structures with ~45° angular orientation improving thermal homogeneity;

[0111] a front-facing ~45° angled access port maintaining thermal profile and seal efficiency;

[0112] a full-cycle thermal pathway integrating conduction, TCM buffering, fluid circulation, and forced convection; and

[0113] modularity supporting chamber scaling between 1-liter and 12-liter capacities using a common top-mounted cooling module and TCM-aluminum internal distribution scheme.

[0114] Through this integration, FIG. 12-FIG. 15 represent a capacity-scaled embodiment of the same top-down, multi-stage conduction+TCM+fluid-rejection thermal architecture presented in FIG. 1-FIG. 11, preserving system modularity while expanding payload capacity without changing the fundamental thermal-control mechanism.

[0115] The system implements a payload-cooling chamber architecture that combines conduction, thermal control thermal buffering, geometric surface amplification, and multi-stage heat-rejection into a unified thermal-management platform. In representative embodiments, the payload chamber incorporates an internal aluminum conduction structure that extends into the payload region through ribbed fin-plate elements. These fin-plates form an internal grid of eight rectangular thermal compartments arranged in a 2×4 array, with individual rib segments oriented at approximately forty-five degrees relative to the surrounding structure. The ribs are not confined to the perimeter walls but instead project into the payload volume to substantially increase thermally-active surface area. This geometric segmentation reduces thermal gradients, reduces chamber mass, and creates well-defined conduction pathways downward from the active cooling source.

[0116] Both the fin-plate structures and the interior aluminum wall surfaces are coated directly with a hydrocarbon thermal control material, specifically tetradecane. Rather than being encapsulated in discrete cartridges, the TCM is applied directly to the aluminum conduction surfaces, permitting intimate thermal contact that enables the material to rapidly absorb localized heat from payload contents while simultaneously distributing cooling from the cold-side interface. This direct TCM-to-metal interface provides a combined conduction+latent thermal-buffering mechanism that smooths temperature profiles, mitigates thermal spikes, and enhances uniform cooling throughout the storage volume.

[0117] The aluminum conduction structure is embedded within an outer ABS enclosure. The ABS housing provides thermal resistance to ambient, reducing heat ingress, while the aluminum core ensures that cooling delivered from the active subsystem is efficiently conducted into the fin-plate interior. This hybrid construction improves system energy efficiency by pairing high-conductivity aluminum where thermal transport is needed with low-conductivity polymer at the exterior surface. As a result, the chamber maintains thermal uniformity within while minimizing parasitic exterior gain.

[0118] The active cooling subsystem is mounted at the top of the chamber and includes a thermoelectric cooling (TEC) element coupled to a cooling block. The cooling block mechanically and thermally couples to the top surface of the aluminum chamber body through a distributed perimeter mounting interface surrounding the chamber's top opening. When actuated, the TEC drives heat from its cold side into the cooling block, which diffuses the thermal flux into the aluminum grid. This establishes a primary conduction pathway from the top surface downward into the TCM-coated rib and fin assemblies. The top-down conduction ensures that the highest temperature uniformity is achieved throughout the vertical extent of the payload space. This stack configuration—top-mounted TEC, cooling block, and aluminum chamber—is stable across multiple container volumes, including one-liter and twelve-liter embodiments, allowing modular reuse of the cooling head without re-engineering the underlying conduction—TCM architecture.

[0119] In addition to the top opening, the chamber also includes a front-facing access port oriented at approximately forty-five degrees. This angled geometry facilitates payload loading and unloading while preserving the thermal benefits of maintaining the primary conduction path at the chamber's top surface. The angled access design shortens the opening perimeter relative to a full side-wall door, improving sealing efficiency and limiting thermal leakage during normal operation. The angled front access port can further include a dual-seal gasket composed of silicone-based elastomer with Shore A hardness between 40 and 55, providing leak-proof closure during operation. The port's hinge assembly is offset to minimize mechanical stress and to maintain alignment with the internal conduction plane.

[0120] On the hot side of the thermoelectric device, waste heat is transferred to a circulating fluid loop, which routes heat to a fan-assisted heat-exchanger for ambient rejection. This forms a complete thermal cycle comprising: (1) cooling block conduction into the aluminum structure; (2) conduction into ribs and fins; (3) heat buffering and spatial distribution by the tetradecane TCM in direct metal contact; (4) hot-side heat transfer into the fluid loop; (5) convective heat removal through an exchanger; and (6) forced-air rejection. In some embodiments, the aluminum internal structure may include removable or modular grill-type fin assemblies that allow alternative fin density or thermal profiles based on payload requirements or scale.

[0121] Collectively, these features yield a chamber that integrates (i) aluminum-based conduction pathways extending directly into the payload region; (ii) tetradecane TCM coatings that directly interface with those conduction surfaces; (iii) a 2×4 fin-plate segmentation for enhanced thermal surface area; (iv) a top-mounted TEC and cooling block enabling downward thermal flux; (v) modular fin / TCM construction; (vi) hybrid aluminum-ABS structure enabling efficient conduction internally and insulation externally; (vii) a 45-degree front access port that protects the primary conduction pathway; (viii) a full multi-stage heat-removal process; and (ix) scalability to chambers of different capacities, including at least 1-liter and 12-liter embodiments, without redesign of the fundamental thermal pathway.

[0122] In some embodiments, each aluminum rib segment includes a concave curvature formed along its inner face. The curvature may define a radius between 8 mm and 12 mm, thereby increasing the effective surface area available for hydrocarbon thermal control material retention. The concave geometry promotes capillary-assisted wetting of the hydrocarbon layer during application, reducing beading and ensuring uniform distribution of the thermal control material across the rib surface. This increased surface area facilitates enhanced thermal exchange and improves the responsiveness of the hydrocarbon material during latent-heat buffering operations. The ribs can extend laterally into the payload volume by a distance between 15 mm and 25 mm, forming conduction fins that increase the thermally-active surface area by at least 40 percent relative to a smooth-wall interior. In some embodiments, angular orientations between 42° and 48° may be alternated across adjacent ribs to induce cross-directional conduction paths that disrupt thermal banding and increase the uniformity of temperature distribution across the payload region.

[0123] In certain embodiments, the aluminum payload chamber may comprise an aluminum alloy selected from the group consisting of 6061-T6 and 3003-H14. These alloys may be chosen to balance mechanical strength, manufacturability, corrosion resistance, and thermal conductivity. In some embodiments, the internal rib assembly is fabricated as a single monolithic extrusion integrated with chamber sidewalls to minimize interfacial thermal resistance and eliminate mechanical junctions that may otherwise reduce conduction efficiency. The integrated rib-wall structure enables continuous conduction pathways from the upper chamber plate to the rib tips, improving the rate at which cooling from the thermoelectric module propagates into the payload volume.

[0124] In some implementations, the hydrocarbon thermal control material can be deposited onto the ribs and chamber wall using a controlled dip-coating or spray-deposition process to achieve a uniform coating thickness not exceeding 1 mm. The coated chamber interior may undergo surface curing at a temperature between 35° C. and 45° C. to stabilize the applied material. Prior to hydrocarbon application, a nanostructured adhesion primer layer less than 0.05 mm thick may be deposited to improve chemical bonding between the aluminum substrate and the hydrocarbon coating. The resulting hydrocarbon material layer may exhibit a thermal diffusivity greater than 0.12 mm2 / s and a specific heat capacity between 2.0 KJ / kg·K and 2.3 KJ / kg·K, enabling both rapid thermal absorption and sustained latent-heat buffering during operation. For a 12-liter chamber configuration, the total hydrocarbon coating mass may be between 80 g and 150 g, selected to provide sufficient phase-change volume without introducing excessive thermal inertia.

[0125] In additional embodiments, the hydrocarbon thermal control material coating may be configured to self-heal minor abrasions through localized phase melting during repeated thermal cycling. When scratches or micro-voids appear in the coating, thermal loading can induce localized melting of the hydrocarbon layer, allowing material to reflow into damaged regions and subsequently resolidify. This process can maintain coating continuity, reduce the formation of thermally resistive gaps, and prolong the operational lifespan of the chamber interior. This self-healing behavior enables repeated use of the payload-cooling system in field environments where minor mechanical disturbances may otherwise degrade coating integrity over time.CONCLUSION

[0126] Although the present embodiments have been described with reference to specific example embodiments, various modifications and changes can be made to these embodiments without departing from the broader spirit and scope of the various embodiments. For example, the various devices, modules, etc. described herein can be enabled and operated using hardware circuitry, firmware, software or any combination of hardware, firmware, and software (e.g., embodied in a machine-readable medium).

[0127] In addition, it can be appreciated that the various operations, processes, and methods disclosed herein can be embodied in a machine-readable medium and / or a machine accessible medium compatible with a data processing system (e.g., a computer system), and can be performed in any order (e.g., including using means for achieving the various operations). Accordingly, the specification and drawings are to be regarded in an illustrative rather than a restrictive sense. In some embodiments, the machine-readable medium can be a non-transitory form of machine-readable medium.

Claims

1. A payload-cooling system, comprising:an aluminum payload chamber comprising an upper aluminum chamber plate and an aluminum internal rib assembly, the aluminum internal rib assembly extending into an interior payload volume and comprising a plurality of aluminum rib segments arranged to define a 2-by-4 segmented conduction grid within the interior payload volume;a hydrocarbon thermal control material coating disposed directly on the upper aluminum chamber plate and directly on the aluminum internal rib assembly, the hydrocarbon thermal control material coating comprising tetradecane;an outer polymer enclosure surrounding at least a portion of the aluminum payload chamber, the outer polymer enclosure comprising ABS;a thermoelectric cooling assembly mounted above the upper aluminum chamber plate, the thermoelectric cooling assembly comprising:a thermoelectric chip having a cold side and a hot side; anda cooling block thermally coupled to the cold side of the thermoelectric chip and thermally coupled to the upper aluminum chamber plate to conduct cooling from the thermoelectric chip into the aluminum internal rib assembly and the hydrocarbon thermal control material coating;a front access opening positioned at an angle of approximately forty-five degrees relative to a vertical face of the aluminum payload chamber;a fluid circulation pathway thermally coupled to the hot side of the thermoelectric chip and configured to remove heat from the thermoelectric chip; anda forced-air heat-rejection assembly thermally coupled to the fluid circulation pathway and configured to reject heat to an ambient environment;wherein the aluminum internal rib assembly, the hydrocarbon thermal control material coating, the thermoelectric cooling assembly, the fluid circulation pathway, and the forced-air heat-rejection assembly cooperate to establish a multi-stage thermal pathway comprising:(1) conduction from the thermoelectric chip into the cooling block;(2) conduction from the cooling block into the upper aluminum chamber plate;(3) conduction from the upper aluminum chamber plate into the aluminum internal rib assembly;(4) thermal buffering and distribution by the hydrocarbon thermal control material coating through the 2-by-4 segmented conduction grid;(5) heat transfer from the hot side of the thermoelectric chip into the fluid circulation pathway; and(6) forced-air heat rejection from the fluid circulation pathway to the ambient environment.

2. The payload-cooling system of claim 1, wherein the aluminum internal rib assembly comprises modular aluminum rib segments configured for removal and replacement within the interior payload volume.

3. The payload-cooling system of claim 2, wherein the aluminum internal rib assembly comprises ribs oriented at approximately forty-five degrees relative to an outer wall of the aluminum payload chamber.

4. The payload-cooling system of claim 3, wherein the hydrocarbon thermal control material coating is further disposed directly on interior surfaces of the aluminum payload chamber other than the aluminum internal rib assembly.

5. The payload-cooling system of claim 4, wherein the front access opening defines a sealing interface configured to maintain thermal integrity of the interior payload volume when closed.

6. The payload-cooling system of claim 5, wherein the cooling block comprises a planar lower surface configured to distribute thermal flux uniformly across the upper aluminum chamber plate.

7. The payload-cooling system of claim 6, wherein the thermoelectric cooling assembly is secured to the aluminum payload chamber by a plurality of perimeter fasteners arranged around the upper aluminum chamber plate.

8. The payload-cooling system of claim 7, wherein the outer polymer enclosure at least partially encloses the aluminum payload chamber to provide thermal insulation from ambient air.

9. The payload-cooling system of claim 8, wherein the fluid circulation pathway comprises a heat-transfer fluid channel coupled to the hot side of the thermoelectric chip.

10. The payload-cooling system of claim 9, wherein the forced-air heat-rejection assembly comprises a heat-exchanger thermally coupled to the fluid circulation pathway and a fan configured to direct air across the heat-exchanger.

11. The payload-cooling system of claim 10, wherein the aluminum payload chamber and the aluminum internal rib assembly are configured to distribute cooling from the thermoelectric cooling assembly along a substantially vertical thermal-flux pathway extending from the upper aluminum chamber plate toward a lower portion of the interior payload volume.

12. The payload-cooling system of claim 10, wherein the hydrocarbon thermal control material coating is configured to absorb thermal energy released by a payload placed within the interior payload volume and redistribute the thermal energy through the 2-by-4 segmented conduction grid.

13. The payload-cooling system of claim 12, wherein the aluminum payload chamber and the aluminum internal rib assembly are dimensioned to support payload capacities of one liter to twelve liters without modification to the thermoelectric cooling assembly.

14. The payload-cooling system of claim 13, wherein the aluminum internal rib assembly is configured to reduce thermal gradients within the interior payload volume during operation of the thermoelectric cooling assembly.

15. The payload-cooling system of claim 14, wherein the 2-by-4 segmented conduction grid comprises eight rectangular thermal compartments each defined by a subset of the aluminum rib segments.

16. The payload-cooling system of claim 15, wherein the front access opening is positioned at approximately forty-five degrees relative to the upper aluminum chamber plate, wherein the aluminum internal rib assembly comprises at least one rib segment having a coated surface area configured to increase hydrocarbon thermal control material contact with the interior payload volume relative to a flat interior wall.

17. The payload-cooling system of claim 16, wherein the forced-air heat-rejection assembly is configured to remove heat from the heat-transfer fluid to maintain a target temperature within the interior payload volume, wherein the hydrocarbon thermal control material coating is configured to undergo latent-heat absorption during operation of the thermoelectric cooling assembly, and wherein the aluminum payload chamber and the aluminum internal rib assembly are configured to operate in combination with the hydrocarbon thermal control material coating to provide substantially uniform temperature distribution within the interior payload volume.

18. The payload-cooling system of claim 17, wherein each aluminum rib segment includes a concave curvature radius between 8 mm and 12 mm along its inner face to increase surface area for hydrocarbon coating retention, wherein the aluminum payload chamber comprises an aluminum alloy selected from the group consisting of 6061-T6 and 3003-H14 to optimize thermal conductivity and manufacturability, wherein the hydrocarbon thermal control material is applied via a controlled dip-coating or spray-deposition process to achieve a uniform film thickness not exceeding 1 mm, followed by surface curing at a temperature between 35° C. and 45° C., and wherein the hydrocarbon thermal control material coating further includes a nanostructured adhesion primer layer less than 0.05 mm thick to enhance metal-to-coating bonding.

19. The payload-cooling system of claim 18, wherein each rib segment extends laterally into the payload volume by a distance between 15 mm and 25 mm, forming conduction fins that increase effective thermal surface area by at least 40 percent relative to a smooth, and the rib geometry includes alternating angular orientations between 42° and 48° to produce cross-directional heat-spreading and mitigate thermal banding within the payload, wherein the aluminum internal rib assembly is fabricated as a single monolithic extrusion integrated with the chamber sidewalls to minimize interfacial thermal resistance.

20. The payload-cooling system of claim 19, wherein the internal rib assembly and chamber walls are coated with a hydrocarbon material layer having a thermal diffusivity greater than 0.12 mm2 / s and a specific heat capacity between 2.0-2.3 KJ / kg·K, wherein the total hydrocarbon coating mass is between 80 grams and 150 grams for a 12-liter chamber configuration, and wherein the hydrocarbon thermal control material coating is configured to self-heal minor abrasions by localized phase melting during repeated thermal cycling.

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