Oscillating heat pipe with biphilic fluid channels

Abstract

An oscillating heat pipe includes an evaporator section, a condenser section, and a plurality of fluid channels extending between the evaporator section and the condenser section. The fluid channels are at least partially filled with a heat transfer fluid. An interior surface of a fluid channel of the fluid channels has a greater wettability at the condenser section than at the evaporator section. A thermal energy dissipation system includes a component and an oscillating heat pipe positioned at the component configured to remove thermal energy therefrom. The oscillating heat pipe includes an evaporator section, a condenser section and a plurality of fluid channels extending between the evaporator section and the condenser section. The fluid channels are at least partially filled with a heat transfer fluid. An interior surface of a fluid channel of the fluid channels has a greater wettability at the condenser section than at the evaporator section.

Description

BACKGROUND

[0001] Exemplary embodiments pertain to the art of thermal energy removal from, for example, electronics, and more particularly to oscillating heat pipe configurations for removal of such thermal energy.

[0002] Oscillating heat pipes typically include two main sections, a condenser section and an evaporator section that are interconnected by looping channels. The channels are filled with a two-phase mixture, which acts as the heat transfer medium for the system. Instabilities caused by the intermittent evaporation and condensation of working fluid transfers the vapor from the evaporator to condenser and return liquid from condenser back to the evaporator section.

[0003] Oscillating heat pipes can achieve 10× equivalent thermal conductivity of solid material through passive phase-change heat spreading. Surface wettability or fluid contact angle of the channel surfaces has a direct impact on condensation and evaporation characteristics of the oscillating heat pipe, as well as on the oscillating motion within the oscillating heat pipe channels.BRIEF DESCRIPTION

[0004] In one exemplary embodiment, an oscillating heat pipe includes an evaporator section, a condenser section, and a plurality of fluid channels extending between the evaporator section and the condenser section. The plurality of fluid channels are at least partially filled with a heat transfer fluid. An interior surface of a fluid channel of the plurality of fluid channels has a greater wettability at the condenser section than at the evaporator section.

[0005] Additionally or alternatively, in this or other embodiments, at the condenser section, a contact angle of a liquid phase of the heat transfer fluid to the interior surface that is less than 90 degrees.

[0006] Additionally or alternatively, in this or other embodiments, at the evaporator section, a contact angle of a liquid phase of the heat transfer fluid to the interior surface that is greater than 90 degrees.

[0007] Additionally or alternatively, in this or other embodiments the wettability of the interior surface increases continuously from the evaporator section to the condenser section.

[0008] Additionally or alternatively, in this or other embodiments the wettability increases continuously one of linearly or curvilinearly.

[0009] Additionally or alternatively, in this or other embodiments the wettability of the interior surface increases via one or more step-wise increases.

[0010] Additionally or alternatively, in this or other embodiments one or more treatments are applied to the interior surface to define the wettability of the interior surface.

[0011] Additionally or alternatively, in this or other embodiments the one or more treatments are one or more coatings.

[0012] Additionally or alternatively, in this or other embodiments the one or more coatings are one or more of a polymer material, a silica material, or a metal oxide material.

[0013] Additionally or alternatively, in this or other embodiments the interior surface is treated at the condenser section and at the evaporator section, and wherein the interior surface at an intermediate section connecting the evaporator section to the condenser section is untreated.

[0014] In another exemplary embodiment, a thermal energy dissipation system includes a component and an oscillating heat pipe positioned at the component configured to remove thermal energy from the component. The oscillating heat pipe includes an evaporator section, a condenser section and a plurality of fluid channels extending between the evaporator section and the condenser section. The plurality of fluid channels are at least partially filled with a heat transfer fluid. An interior surface of a fluid channel of the plurality of fluid channels has a greater wettability at the condenser section than at the evaporator section.

[0015] Additionally or alternatively, in this or other embodiments, at the condenser section, a contact angle of a liquid phase of the heat transfer fluid to the interior surface that is less than 90 degrees.

[0016] Additionally or alternatively, in this or other embodiments, at the evaporator section, a contact angle of a liquid phase of the heat transfer fluid to the interior surface that is greater than 90 degrees.

[0017] Additionally or alternatively, in this or other embodiments the wettability of the interior surface increases continuously from the evaporator section to the condenser section.

[0018] Additionally or alternatively, in this or other embodiments the wettability increases continuously one of linearly or curvilinearly.

[0019] Additionally or alternatively, in this or other embodiments the wettability of the interior surface increases via one or more step-wise increases.

[0020] Additionally or alternatively, in this or other embodiments one or more treatments are applied to the interior surface to define the wettability of the interior surface.

[0021] Additionally or alternatively, in this or other embodiments the one or more treatments are one or more coatings.

[0022] Additionally or alternatively, in this or other embodiments the one or more coatings are one or more of a polymer material, a silica material, or a metal oxide material.

[0023] Additionally or alternatively, in this or other embodiments the interior surface is treated at the condenser section and at the evaporator section, and wherein the interior surface at an intermediate section connecting the evaporator section to the condenser section is untreated.BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The following descriptions should not be considered limiting in any way. With reference to the accompanying drawings, like elements are numbered alike:

[0025] FIG. 1 is a schematic illustration of an embodiment of a thermal energy dissipation system;

[0026] FIG. 2 is a schematic illustration of an exemplary embodiment of an oscillating heat pipe of a thermal energy dissipation system;

[0027] FIG. 3 is a schematic illustration of another exemplary embodiment of an oscillating heat pipe of a thermal energy dissipation system;

[0028] FIG. 4 is a schematic illustration of an exemplary embodiment of a wettability profile along a fluid channel of an oscillating heat pipe;

[0029] FIG. 5 is a schematic illustration of another exemplary embodiment of a wettability profile along a fluid channel of an oscillating heat pipe; and

[0030] FIG. 6 is a schematic illustration of yet another exemplary embodiment of a wettability profile along a fluid channel of an oscillating heat pipe.DETAILED DESCRIPTION

[0031] A detailed description of one or more embodiments of the disclosed apparatus and method are presented herein by way of exemplification and not limitation with reference to the Figures.

[0032] Illustrated in FIG. 1 is an exemplary embodiment of an assembly 10. The assembly 10 includes a component 12, for example, an airfoil or control surface or other component of an aerospace system. A heat exchanger 16 is operably connected to the component 12 to remove thermal energy generated by, for example, a high speed flow 13 across the component 12 and / or the heat exchanger to thereby cool the component 12. In some embodiments, the heat exchanger 16 is embedded in the component 12, at least partially defining an outer surface 14 of the component 12.

[0033] Referring now to FIG. 2, the heat exchanger is configured as an oscillating heat pipe (OHP) 16. The OHP 16 includes an evaporator section 18 at which thermal energy is absorbed from the component 12, and a condenser section 20 at which the thermal energy is rejected from the OHP 16 to, for example, one or more heat sinks 21. In the embodiment of FIG. 2, the OHP 16 is configured as a linear OHP 16, in which the condenser section 20 is located at a first end 22 of the OHP 16, and the evaporator section 18 is located at a second end 24 of the OHP 16, opposite the first end 22. In other embodiments, such as shown in FIG. 3 for example, the OHP 16 is configured as a radial OHP 16, where in the condenser section 20 surrounds the evaporator section 18.

[0034] A plurality of fluid channels 26 extend substantially radially outwardly from the evaporator section 18 to the condenser section 20. In some embodiments, the plurality of fluid channels 26 are arranged into one or more closed fluid loops 28 that are arranged between the evaporator section 18 and the condenser section 20.

[0035] In the presently disclosed configurations, a wettability of an interior surface of the fluid channels 26 is varied between the evaporator section 18 and the condenser section 20. More specifically, the interior surfaces of the fluid channels are made more hydrophobic at the evaporator section 18 than at the condenser section 20, meaning that liquid fluid flow in the fluid channels 26 has a greater contact angle with the interior surface at the evaporator section 18 than at the condenser section 20. In some embodiments, the interior surface at the evaporator section 18 is hydrophobic, with a contact angle of the liquid to the interior surface that is greater than 90 degrees, and the interior surface at the condenser section 20 is hydrophilic, with a contact angle of the liquid to the interior surface that is less than 90 degrees. In one embodiment, the contact angle at the evaporator section 18 is 95 degrees, and the contact angle at the condenser section is 25 degrees. Overall, the contact angle at the evaporator section 18 is greater than the contact angle at the condenser section 20, meaning that the evaporator section 18 is more hydrophobic that the condenser section 20.

[0036] In some embodiments, the difference in wettability between the evaporator section 18 and the condenser section 20 is accomplished through surface coatings applied to the interior surfaces of the fluid channels 26. In some embodiments, these coatings may include polymer materials, silica materials, or metal oxides. In some embodiments, such as illustrated in FIG. 4, the contact angle may continuously decrease from the evaporator section 18 to the condenser section 20, resulting in a continuous increase in wettability from the evaporator section 18 to the condenser section 20. This continuous increase may be linear as illustrated in FIG. 4, or curvilinear on other embodiments. In other embodiments, such as illustrated in FIG. 5, the contact angle may decrease in a plurality of discrete steps from the evaporator section 18 to the condenser section 20, resulting in a stepwise increase in wettability from the evaporator section 18 to the condenser section 20. In another embodiment, illustrated schematically in FIG. 6, each of the evaporator section 18 and the condenser section 20 are treated or coated to provide their respective wettability, while an intermediate section 30 positioned between the evaporator section 18 and the condenser section 20 is left untreated or uncoated. This allows for the selective relative wettability of the fluid channels 26 at the evaporator section 18 and the condenser section 20 to be achieved, while not having to apply a treatment at the intermediate section 30.

[0037] The relative wettability of the evaporator section 18 and the condenser section 20 of the embodiments of the OHP 16 disclosed herein, with the evaporator section 18 being more hydrophobic than the condenser section 20 improves condensation and evaporation characteristics of the OHP 16, in some cases by up to a 40 percent performance increase compared to an OHP having a uniform wettability of the fluid channels 26.

[0038] In some embodiments, the relative wettability and / or wettability profile of all of the fluid channels 26 of the OHP 16 is equal, while in other embodiments, a first fluid channel 26 may have a first wettability profile, and a second fluid channel 26 may have a second wettability profile different from the first wettability profile. The difference in wettability profiles may be utilized to provide desired performance characteristics of the OHP 16.

[0039] The term “about” is intended to include the degree of error associated with measurement of the particular quantity based upon the equipment available at the time of filing the application.

[0040] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present disclosure. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and / or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, element components, and / or groups thereof.

[0041] While the present disclosure has been described with reference to an exemplary embodiment or embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the present disclosure. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the present disclosure without departing from the essential scope thereof. Therefore, it is intended that the present disclosure not be limited to the particular embodiment disclosed as the best mode contemplated for carrying out this present disclosure, but that the present disclosure will include all embodiments falling within the scope of the claims.

Examples

Embodiment Construction

[0031]A detailed description of one or more embodiments of the disclosed apparatus and method are presented herein by way of exemplification and not limitation with reference to the Figures.

[0032]Illustrated in FIG. 1 is an exemplary embodiment of an assembly 10. The assembly 10 includes a component 12, for example, an airfoil or control surface or other component of an aerospace system. A heat exchanger 16 is operably connected to the component 12 to remove thermal energy generated by, for example, a high speed flow 13 across the component 12 and / or the heat exchanger to thereby cool the component 12. In some embodiments, the heat exchanger 16 is embedded in the component 12, at least partially defining an outer surface 14 of the component 12.

[0033]Referring now to FIG. 2, the heat exchanger is configured as an oscillating heat pipe (OHP) 16. The OHP 16 includes an evaporator section 18 at which thermal energy is absorbed from the component 12, and a condenser section 20 at which t...

BACKGROUND

[0001] Exemplary embodiments pertain to the art of thermal energy removal from, for example, electronics, and more particularly to oscillating heat pipe configurations for removal of such thermal energy.

[0002] Oscillating heat pipes typically include two main sections, a condenser section and an evaporator section that are interconnected by looping channels. The channels are filled with a two-phase mixture, which acts as the heat transfer medium for the system. Instabilities caused by the intermittent evaporation and condensation of working fluid transfers the vapor from the evaporator to condenser and return liquid from condenser back to the evaporator section.

[0003] Oscillating heat pipes can achieve 10× equivalent thermal conductivity of solid material through passive phase-change heat spreading. Surface wettability or fluid contact angle of the channel surfaces has a direct impact on condensation and evaporation characteristics of the oscillating heat pipe, as well as on the oscillating motion within the oscillating heat pipe channels.BRIEF DESCRIPTION

[0004] In one exemplary embodiment, an oscillating heat pipe includes an evaporator section, a condenser section, and a plurality of fluid channels extending between the evaporator section and the condenser section. The plurality of fluid channels are at least partially filled with a heat transfer fluid. An interior surface of a fluid channel of the plurality of fluid channels has a greater wettability at the condenser section than at the evaporator section.

[0005] Additionally or alternatively, in this or other embodiments, at the condenser section, a contact angle of a liquid phase of the heat transfer fluid to the interior surface that is less than 90 degrees.

[0006] Additionally or alternatively, in this or other embodiments, at the evaporator section, a contact angle of a liquid phase of the heat transfer fluid to the interior surface that is greater than 90 degrees.

[0007] Additionally or alternatively, in this or other embodiments the wettability of the interior surface increases continuously from the evaporator section to the condenser section.

[0008] Additionally or alternatively, in this or other embodiments the wettability increases continuously one of linearly or curvilinearly.

[0009] Additionally or alternatively, in this or other embodiments the wettability of the interior surface increases via one or more step-wise increases.

[0010] Additionally or alternatively, in this or other embodiments one or more treatments are applied to the interior surface to define the wettability of the interior surface.

[0011] Additionally or alternatively, in this or other embodiments the one or more treatments are one or more coatings.

[0012] Additionally or alternatively, in this or other embodiments the one or more coatings are one or more of a polymer material, a silica material, or a metal oxide material.

[0013] Additionally or alternatively, in this or other embodiments the interior surface is treated at the condenser section and at the evaporator section, and wherein the interior surface at an intermediate section connecting the evaporator section to the condenser section is untreated.

[0014] In another exemplary embodiment, a thermal energy dissipation system includes a component and an oscillating heat pipe positioned at the component configured to remove thermal energy from the component. The oscillating heat pipe includes an evaporator section, a condenser section and a plurality of fluid channels extending between the evaporator section and the condenser section. The plurality of fluid channels are at least partially filled with a heat transfer fluid. An interior surface of a fluid channel of the plurality of fluid channels has a greater wettability at the condenser section than at the evaporator section.

[0015] Additionally or alternatively, in this or other embodiments, at the condenser section, a contact angle of a liquid phase of the heat transfer fluid to the interior surface that is less than 90 degrees.

[0016] Additionally or alternatively, in this or other embodiments, at the evaporator section, a contact angle of a liquid phase of the heat transfer fluid to the interior surface that is greater than 90 degrees.

[0017] Additionally or alternatively, in this or other embodiments the wettability of the interior surface increases continuously from the evaporator section to the condenser section.

[0018] Additionally or alternatively, in this or other embodiments the wettability increases continuously one of linearly or curvilinearly.

[0019] Additionally or alternatively, in this or other embodiments the wettability of the interior surface increases via one or more step-wise increases.

[0020] Additionally or alternatively, in this or other embodiments one or more treatments are applied to the interior surface to define the wettability of the interior surface.

[0021] Additionally or alternatively, in this or other embodiments the one or more treatments are one or more coatings.

[0022] Additionally or alternatively, in this or other embodiments the one or more coatings are one or more of a polymer material, a silica material, or a metal oxide material.

[0023] Additionally or alternatively, in this or other embodiments the interior surface is treated at the condenser section and at the evaporator section, and wherein the interior surface at an intermediate section connecting the evaporator section to the condenser section is untreated.BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The following descriptions should not be considered limiting in any way. With reference to the accompanying drawings, like elements are numbered alike:

[0025] FIG. 1 is a schematic illustration of an embodiment of a thermal energy dissipation system;

[0026] FIG. 2 is a schematic illustration of an exemplary embodiment of an oscillating heat pipe of a thermal energy dissipation system;

[0027] FIG. 3 is a schematic illustration of another exemplary embodiment of an oscillating heat pipe of a thermal energy dissipation system;

[0028] FIG. 4 is a schematic illustration of an exemplary embodiment of a wettability profile along a fluid channel of an oscillating heat pipe;

[0029] FIG. 5 is a schematic illustration of another exemplary embodiment of a wettability profile along a fluid channel of an oscillating heat pipe; and

[0030] FIG. 6 is a schematic illustration of yet another exemplary embodiment of a wettability profile along a fluid channel of an oscillating heat pipe.DETAILED DESCRIPTION

[0031] A detailed description of one or more embodiments of the disclosed apparatus and method are presented herein by way of exemplification and not limitation with reference to the Figures.

[0032] Illustrated in FIG. 1 is an exemplary embodiment of an assembly 10. The assembly 10 includes a component 12, for example, an airfoil or control surface or other component of an aerospace system. A heat exchanger 16 is operably connected to the component 12 to remove thermal energy generated by, for example, a high speed flow 13 across the component 12 and / or the heat exchanger to thereby cool the component 12. In some embodiments, the heat exchanger 16 is embedded in the component 12, at least partially defining an outer surface 14 of the component 12.

[0033] Referring now to FIG. 2, the heat exchanger is configured as an oscillating heat pipe (OHP) 16. The OHP 16 includes an evaporator section 18 at which thermal energy is absorbed from the component 12, and a condenser section 20 at which the thermal energy is rejected from the OHP 16 to, for example, one or more heat sinks 21. In the embodiment of FIG. 2, the OHP 16 is configured as a linear OHP 16, in which the condenser section 20 is located at a first end 22 of the OHP 16, and the evaporator section 18 is located at a second end 24 of the OHP 16, opposite the first end 22. In other embodiments, such as shown in FIG. 3 for example, the OHP 16 is configured as a radial OHP 16, where in the condenser section 20 surrounds the evaporator section 18.

[0034] A plurality of fluid channels 26 extend substantially radially outwardly from the evaporator section 18 to the condenser section 20. In some embodiments, the plurality of fluid channels 26 are arranged into one or more closed fluid loops 28 that are arranged between the evaporator section 18 and the condenser section 20.

[0035] In the presently disclosed configurations, a wettability of an interior surface of the fluid channels 26 is varied between the evaporator section 18 and the condenser section 20. More specifically, the interior surfaces of the fluid channels are made more hydrophobic at the evaporator section 18 than at the condenser section 20, meaning that liquid fluid flow in the fluid channels 26 has a greater contact angle with the interior surface at the evaporator section 18 than at the condenser section 20. In some embodiments, the interior surface at the evaporator section 18 is hydrophobic, with a contact angle of the liquid to the interior surface that is greater than 90 degrees, and the interior surface at the condenser section 20 is hydrophilic, with a contact angle of the liquid to the interior surface that is less than 90 degrees. In one embodiment, the contact angle at the evaporator section 18 is 95 degrees, and the contact angle at the condenser section is 25 degrees. Overall, the contact angle at the evaporator section 18 is greater than the contact angle at the condenser section 20, meaning that the evaporator section 18 is more hydrophobic that the condenser section 20.

[0036] In some embodiments, the difference in wettability between the evaporator section 18 and the condenser section 20 is accomplished through surface coatings applied to the interior surfaces of the fluid channels 26. In some embodiments, these coatings may include polymer materials, silica materials, or metal oxides. In some embodiments, such as illustrated in FIG. 4, the contact angle may continuously decrease from the evaporator section 18 to the condenser section 20, resulting in a continuous increase in wettability from the evaporator section 18 to the condenser section 20. This continuous increase may be linear as illustrated in FIG. 4, or curvilinear on other embodiments. In other embodiments, such as illustrated in FIG. 5, the contact angle may decrease in a plurality of discrete steps from the evaporator section 18 to the condenser section 20, resulting in a stepwise increase in wettability from the evaporator section 18 to the condenser section 20. In another embodiment, illustrated schematically in FIG. 6, each of the evaporator section 18 and the condenser section 20 are treated or coated to provide their respective wettability, while an intermediate section 30 positioned between the evaporator section 18 and the condenser section 20 is left untreated or uncoated. This allows for the selective relative wettability of the fluid channels 26 at the evaporator section 18 and the condenser section 20 to be achieved, while not having to apply a treatment at the intermediate section 30.

[0037] The relative wettability of the evaporator section 18 and the condenser section 20 of the embodiments of the OHP 16 disclosed herein, with the evaporator section 18 being more hydrophobic than the condenser section 20 improves condensation and evaporation characteristics of the OHP 16, in some cases by up to a 40 percent performance increase compared to an OHP having a uniform wettability of the fluid channels 26.

[0038] In some embodiments, the relative wettability and / or wettability profile of all of the fluid channels 26 of the OHP 16 is equal, while in other embodiments, a first fluid channel 26 may have a first wettability profile, and a second fluid channel 26 may have a second wettability profile different from the first wettability profile. The difference in wettability profiles may be utilized to provide desired performance characteristics of the OHP 16.

[0039] The term “about” is intended to include the degree of error associated with measurement of the particular quantity based upon the equipment available at the time of filing the application.

[0040] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present disclosure. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and / or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, element components, and / or groups thereof.

[0041] While the present disclosure has been described with reference to an exemplary embodiment or embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the present disclosure. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the present disclosure without departing from the essential scope thereof. Therefore, it is intended that the present disclosure not be limited to the particular embodiment disclosed as the best mode contemplated for carrying out this present disclosure, but that the present disclosure will include all embodiments falling within the scope of the claims.

Examples

Embodiment Construction

[0031]A detailed description of one or more embodiments of the disclosed apparatus and method are presented herein by way of exemplification and not limitation with reference to the Figures.

[0032]Illustrated in FIG. 1 is an exemplary embodiment of an assembly 10. The assembly 10 includes a component 12, for example, an airfoil or control surface or other component of an aerospace system. A heat exchanger 16 is operably connected to the component 12 to remove thermal energy generated by, for example, a high speed flow 13 across the component 12 and / or the heat exchanger to thereby cool the component 12. In some embodiments, the heat exchanger 16 is embedded in the component 12, at least partially defining an outer surface 14 of the component 12.

[0033]Referring now to FIG. 2, the heat exchanger is configured as an oscillating heat pipe (OHP) 16. The OHP 16 includes an evaporator section 18 at which thermal energy is absorbed from the component 12, and a condenser section 20 at which t...

Claims

1. An oscillating heat pipe, comprising:an evaporator section;a condenser section; anda plurality of fluid channels extending between the evaporator section and the condenser section, the plurality of fluid channels at least partially filled with a heat transfer fluid;wherein an interior surface of a fluid channel of the plurality of fluid channels has a greater wettability at the condenser section than at the evaporator section.

2. The oscillating heat pipe of claim 1, wherein at the condenser section, a contact angle of a liquid phase of the heat transfer fluid to the interior surface that is less than 90 degrees.

3. The oscillating heat pipe of claim 1, wherein at the evaporator section, a contact angle of a liquid phase of the heat transfer fluid to the interior surface that is greater than 90 degrees.

4. The oscillating heat pipe of claim 1, wherein the wettability of the interior surface increases continuously from the evaporator section to the condenser section.

5. The oscillating heat pipe of claim 4, wherein the wettability increases continuously one of linearly or curvilinearly.

6. The oscillating heat pipe of claim 1, wherein the wettability of the interior surface increases via one or more step-wise increases.

7. The oscillating heat pipe of claim 1, further comprising one or more treatments applied to the interior surface to define the wettability of the interior surface.

8. The oscillating heat pipe of claim 7, wherein the one or more treatments are one or more coatings.

9. The oscillating heat pipe of claim 8, wherein the one or more coatings are one or more of a polymer material, a silica material, or a metal oxide material.

10. The oscillating heat pipe of claim 7, wherein the interior surface is treated at the condenser section and at the evaporator section, and wherein the interior surface at an intermediate section connecting the evaporator section to the condenser section is untreated.

11. A thermal energy dissipation system, comprising:a component; andan oscillating heat pipe disposed at the component configured to remove thermal energy from the component, the oscillating heat pipe including:an evaporator section;a condenser section; anda plurality of fluid channels extending between the evaporator section and the condenser section, the plurality of fluid channels at least partially filled with a heat transfer fluid;wherein an interior surface of a fluid channel of the plurality of fluid channels has a greater wettability at the condenser section than at the evaporator section.

12. The thermal energy dissipation system of claim 11, wherein at the condenser section, a contact angle of a liquid phase of the heat transfer fluid to the interior surface that is less than 90 degrees.

13. The thermal energy dissipation system of claim 11, wherein at the evaporator section, a contact angle of a liquid phase of the heat transfer fluid to the interior surface that is greater than 90 degrees.

14. The thermal energy dissipation system of claim 11, wherein the wettability of the interior surface increases continuously from the evaporator section to the condenser section.

15. The thermal energy dissipation system of claim 14, wherein the wettability increases continuously one of linearly or curvilinearly.

16. The thermal energy dissipation system of claim 11, wherein the wettability of the interior surface increases via one or more step-wise increases.

17. The thermal energy dissipation system of claim 11, further comprising one or more treatments applied to the interior surface to define the wettability of the interior surface.

18. The thermal energy dissipation system of claim 17, wherein the one or more treatments are one or more coatings.

19. The thermal energy dissipation system of claim 18, wherein the one or more coatings are one or more of a polymer material, a silica material, or a metal oxide material.

20. The thermal energy dissipation system of claim 17, wherein the interior surface is treated at the condenser section and at the evaporator section, and wherein the interior surface at an intermediate section connecting the evaporator section to the condenser section is untreated.

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