Polishing device

Abstract

A polishing device is proposed. The polishing device includes: a polishing table, defining a polishing pad holding surface for holding a polishing pad; first and second polishing pad holding modules, configured such that the polishing pad slides along the polishing pad holding surface by the polishing pad supplied from the first polishing pad holding module being wound by the second polishing pad holding module; and a weight adjustment module, having a guide member extending in a direction in which the polishing pad slides along the polishing pad holding surface, and a weight member configured to be movable along the guide member.

Description

CROSS-REFERENCE TO RELATED APPLICATION

[0001] This application claims the priority benefit of Japan application serial no. 2025-060428, filed on Apr. 1, 2025. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.BACKGROUNDTechnical Field

[0002] The invention relates to a polishing device.Description of Related Art

[0003] In a semiconductor manufacturing process, a polishing (chemical mechanical polishing, CMP) device is used to polish a substrate. As an example, in a polishing device, a substrate is polished by pressing the substrate against a polishing pad held on a table. As such polishing device, a device including two holding modules that hold a polishing pad wound in a roll shape has been proposed (for example, see Patent Document 1). In the device, the polishing pad can be slid on the table by supplying the polishing pad from one holding module and winding the polishing pad with the other holding module. The polishing pad is a consumable item, and in the device, the polishing pad held on the table can be automatically renewed to an unused polishing pad portion.Prior Art Document(s)Patent Document(s)

[0004] [Patent Document 1] U.S. Patent Application Publication No. 2020 / 0086456

[0005] In the device described in Patent Document 1, during polishing of a substrate, the substrate is pressed against the polishing pad on the table while the table is spinning. As described above, since the two holding modules and the polishing pad are mounted on the table and rotate together with the rotation of the table, a large load is applied to the rotation axis and the bearing that rotate the table. Here, in order to reduce the load applied to the rotation axis and the bearing of the table, it is preferable that the weight of the table is not biased with respect to the rotation axis. Meanwhile, in the device described in Patent Document 1, the longer the entire length of the polishing pad wound in a roll shape, that is, the larger the roll-shaped polishing pad used, the more the polishing pad held on the table can be automatically renewed. However, the larger the roll-shaped polishing pad used, the more the weight of the table becomes biased, and the bias of the weight changes according to the use of the polishing pad. That is, when there is a large unused portion of the polishing pad, the polishing pad held by the holding module on the supply side is heavy, and when the unused portion of the polishing pad increases, the polishing pad held by the holding module on the winding side becomes heavy.

[0006] The invention provides a polishing device including a mechanism capable of renewing a polishing pad held on a polishing table, where the polishing device can reduce the load applied to the rotation axis and the bearing of the polishing table.SUMMARY

[0007] According to an embodiment of the invention, a polishing device that polishes a substrate using a polishing pad is proposed. The polishing device includes: a polishing table, configured to be spinnable and defining a polishing pad holding surface for holding the polishing pad; first and second polishing pad holding modules, configured to be rotatable integrally with the polishing table and configured to hold the polishing pad wound in a roll shape, the polishing pad supplied from the first polishing pad holding module being wound by the second polishing pad holding module, so that the polishing pad is configured to slide along the polishing pad holding surface; and a weight adjustment module, comprising: a guide member, extending in a direction in which the polishing pad slides along the polishing pad holding surface; and a weight member, configured to be movable along the guide member.BRIEF DESCRIPTION OF THE DRAWINGS

[0008] FIG. 1 is a front view of a polishing device according to an embodiment of the disclosure.

[0009] FIG. 2 is a plan view of a polishing table of the polishing device.

[0010] FIG. 3 is a plan view showing an example of an arrangement of components mounted on or attached to the polishing table.

[0011] FIG. 4 is a cross-sectional view showing a schematic configuration of the polishing table of the embodiment.

[0012] FIG. 5A is a diagram for describing a feed operation of a polishing pad P1.

[0013] FIG. 5B is a diagram for describing the feed operation of the polishing pad P1.

[0014] FIG. 5C is a diagram for describing the feed operation of the polishing pad P1.

[0015] FIG. 6A is a diagram for describing adjustment of a gravity central position of the polishing table by using a weight adjustment module of the embodiment.

[0016] FIG. 6B is a diagram for describing adjustment of the gravity central position of the polishing table by the weight adjustment module of the embodiment.DESCRIPTION OF THE EMBODIMENTS

[0017] Hereinafter, the embodiments of the invention are described with reference to the drawings. In the drawings described below, the same or corresponding components are denoted by the same reference numerals, and redundant description is omitted.

[0018] FIG. 1 is a front view of a polishing device 1000 according to an embodiment of the disclosure. FIG. 2 is a plan view of a polishing table 30 of the polishing device 1000. The polishing device 1000 has a function of polishing a substrate WF by using a polishing pad P1. Here, "substrate" includes not only semiconductor substrates, glass substrates, liquid crystal substrates, and printed circuit boards, but also magnetic recording media, magnetic recording sensors, mirrors, optical elements, micro mechanical elements, partially fabricated integrated circuits, and any other processing targets. The substrate WF can be any shape including polygonal and circular shapes. The polishing device 1000 of the embodiment includes the polishing table 30, a top ring 40, and a controller 900.

[0019] The polishing table 30 has, as an example, a substantially T-shape in side view (see FIG. 1) and a rectangular shape in plan view (see FIG. 2). The polishing table 30 includes a polishing table body 31 and a table top 32 that defines an upper surface on which a sub pad SP is disposed on the polishing table 30. In the embodiment, the polishing table 30 supports a polishing pad P1 for polishing the substrate WF via the sub pad SP.

[0020] The sub pad SP may be any sub pad that can perform polishing with desired accuracy, and various materials and dimensions can be adopted. The sub pad SP has, as an example, a substantially rectangular parallelepiped shape and is formed from resin or nonwoven fabric. The sub pad SP can be provided by being attached to the upper surface of the table top 32 with an adhesive or the like. The upper surface of the sub pad SP defines a polishing pad holding surface SP1 that holds the polishing pad P1. The sub pad SP can be a consumable item and can be replaced at a desired timing. However, the polishing table 30 does not have to be provided with the sub pad SP. In the case where the polishing table 30 does not include the sub pad SP, the upper surface of the table top 32 defines the polishing pad holding surface.

[0021] The polishing pad P1 is disposed on the polishing pad holding surface SP1, which is the upper surface of the sub pad SP, and is suctioned through sub pad suction holes SP8 (FIG. 4) described later that are open on the polishing pad holding surface SP1. The upper surface of the polishing pad P1 (the surface on the side opposite to the surface in contact with the polishing pad holding surface SP1) constitutes a polishing surface for polishing the substrate WF.

[0022] In the embodiment, a supply hole 37 for supplying a polishing liquid such as slurry is provided near the center of the polishing table 30 (see FIG. 2). A hole is formed in the sub pad SP and the polishing pad P1 at a position corresponding to the supply hole 37. Accordingly, during polishing of the substrate WF, the polishing liquid is supplied from the supply hole 37 to the polishing surface of the polishing pad P1. Such configuration can suitably supply the polishing liquid particularly even in the case where the substrate WF continues to cover the center of the polishing surface during polishing. In FIG. 2, four supply holes 37 are shown, but the number of supply holes 37 is not particularly limited and may be 1 to 3 or 5 or more. The polishing device 1000 may also be configured so that the polishing liquid is supplied to the polishing pad P1 from a polishing liquid supply port such as a nozzle provided above the polishing pad P1 instead of or in addition to the supply hole 37.

[0023] The polishing table 30 is configured to be capable of spinning (rotating) around a center axis (spin axis) C1 perpendicular to the polishing surface by the motor 38. As an example, the center axis C1 extends in a vertical direction passing through the center of the polishing pad holding surface SP1 of the sub pad SP.

[0024] The top ring 40 is disposed above the polishing table 30 so as to be movable up and down. The top ring 40 is configured to detachably hold the substrate WF, which is the polishing target, with the surface to be polished of the substrate WF facing downward (toward the polishing pad P1). The top ring 40 is configured to be capable of spinning (rotating) around a center axis C2. As an example, the center axis C2 extends in a vertical direction and extends parallel to the center axis C1. During polishing, in a state where the polishing liquid is supplied from the supply hole 37 to the polishing surface of the polishing pad P1, the substrate WF is pressed against the polishing surface of the polishing pad P1 by the top ring 40 and polished. In this manner, the polishing device 1000 is configured to polish the substrate WF by bringing the polishing pad P1 and the substrate WF into contact with each other in the presence of the polishing liquid and rotating the polishing pad P1 and the substrate WF relative to each other.

[0025] The polishing device 1000 includes, as an example, an atomizer (not shown). The atomizer has a function of removing the polishing liquid, polishing products, polishing pad residue due to dressing, and the like on the polishing surface by supplying at least one of a liquid (for example, pure water) and a gas (for example, nitrogen gas) to the polishing surface.

[0026] As shown inFIG. 1, the polishing device 1000 includes a first polishing pad holding module 310 and a second polishing pad holding module 320. The first polishing pad holding module 310 and the second polishing pad holding module 320 can be disposed below the overhang portions protruding on both sides of the T-shaped polishing table 30. In the example shown in FIG. 1, the first polishing pad holding module 310 and the second polishing pad holding module 320 are located on opposite sides with respect to the center axis C1 of the polishing table 30. The first polishing pad holding module 310 and the second polishing pad holding module 320 are configured to be rotatable around the center axis C1 integrally with the polishing table 30.

[0027] The first polishing pad holding module 310 is configured to hold the supply roll 100 in a state where the center of the supply roll 100 extends in the horizontal direction. The supply roll 100 is, for example, a roll-shaped pad in which an unused polishing pad P1 for supply is wound in a roll shape. The configuration of the first polishing pad holding module 310 is not particularly limited as long as it can rotatably hold the supply roll 100, and can be, for example, a support base that rotatably supports the rotating shaft of the supply roll 100. The second polishing pad holding module 320 is configured to hold the winding roll 200 in a state where the center of the winding roll 200 extends in the horizontal direction. The winding roll 200 is, for example, a roll-shaped pad in which a used polishing pad P1 that has passed above the polishing table 30 is wound in a roll shape. The configuration of the second polishing pad holding module 320 is not particularly limited as long as it can rotatably hold the winding roll 200, and can be, for example, a support base that rotatably supports the rotating shaft of the winding roll 200.

[0028] As shown in FIG. 1, the polishing device 1000 includes a first centering roller 110, a first tension roller 120, a second centering roller 210, and a second tension roller 220, which are configured to guide the polishing pad P1 by hanging the polishing pad P1. The first centering roller 110 and the first tension roller 120 are rollers that the polishing pad P1 fed out from the supply roll 100 contacts before reaching the polishing pad holding surface SP1 or above. In other words, the first centering roller 110 and the first tension roller 120 are configured to contact the polishing pad P1 from the supply roll 100 to above the polishing table 30. The second centering roller 210 and the second tension roller 220 are rollers that the polishing pad P1 that has passed above the polishing pad holding surface SP1 contacts before being wound onto the winding roll 200.

[0029] The first centering roller 110 is disposed diagonally downward from the supply roll 100 such that its rotation axis extends in a substantially horizontal direction. The second centering roller 210 is disposed diagonally downward from the winding roll 200 such that its rotation axis extends in a substantially horizontal direction. Since the first centering roller 110 and the second centering roller 210 are disposed below the supply roll 100 and the winding roll 200, respectively, it is possible to suppress the polishing liquid on the polishing surface from traveling along the polishing pad P1 to reach the supply roll 100 or the winding roll 200 and adversely affecting the supply roll 100 or the winding roll 200. At least one of the first centering roller 110 and the second centering roller 210 may have a shape in which the outer diameter increases toward the central portion in the long-axis direction (rotation axis direction). This makes it possible to make the polishing pad P1 less likely to shift in the long-axis direction of the first centering roller 110 or the second centering roller 210, and less likely to meander.

[0030] The first tension roller 120 is a roller disposed above the first centering roller 110. The second tension roller 220 is a roller disposed above the second centering roller 210. The first tension roller 120 and the second tension roller 220 are disposed along the upper surface of the polishing table 30 or the polishing pad holding surface SP1, at lateral sides of the upper surface of the polishing table 30 or the polishing pad holding surface SP1. In the embodiment, the first tension roller 120 is disposed along a first side (the right side in FIG. 2) of the polishing pad holding surface SP1, and the second tension roller 220 is disposed along a second side (the left side in FIG. 2) that is the opposite side of the first side of the polishing pad holding surface SP1. In the embodiment, the polishing pad P1 is configured to extend substantially parallel to the polishing pad holding surface SP1 between the first tension roller 120 and the second tension roller 220 when a predetermined tension is applied to the polishing pad P1. Here, as an example, the first tension roller 120 and the second tension roller 220 may support the polishing pad P1 at the same height as the polishing pad holding surface SP1. The first tension roller 120 and the second tension roller 220 are cylindrical as an example from the viewpoint of stretching the polishing pad P1 horizontally.

[0031] The polishing device 1000 further includes a first motor 130 that drives the rotation of the supply roll 100 and a second motor 230 that drives the rotation of the winding roll 200. The first motor 130 and the second motor 230 are controlled by the controller 900. The first motor 130 and the second motor 230 are connected to the rotating shafts of the supply roll 100 and the winding roll 200 via a transmission mechanism (not shown) that transmits a rotational force, such as a timing belt. The first motor 130 and the second motor 230 may be disposed below the overhang portions that protrude on both sides of the T-shaped polishing table 30. As an example, the first motor 130 and the second motor 230 are disposed on the inner sides (the side of the center axis C1) of the supply roll 100 and the winding roll 200.

[0032] In the polishing device 1000, the movement direction of the polishing pad P1 supplied from the supply roll 100 is changed by the first centering roller 110 and the first tension roller 120. The polishing pad P1 then slides in the horizontal direction along the polishing pad holding surface SP1. Thereafter, the movement direction of the polishing pad P1 is changed by the second tension roller 220 and the second centering roller 210. The polishing pad P1 is then wound onto the winding roll 200. In this manner, the polishing device 1000 is configured such that the polishing pad P1 can slide along the polishing pad holding surface SP1. Therefore, in the polishing device 1000, a used and worn portion of the polishing pad P1 can be slid and replaced with an unused portion for renewal.

[0033] The polishing table 30 includes a weight adjustment module 35 for adjusting the gravity central position of the polishing table 30. The weight adjustment module 35 may be disposed below the overhang portions that protrude on both sides of the T-shaped polishing table 30. The weight adjustment module 35 is configured to be rotatable integrally with the polishing table 30 about the center axis C1. The weight adjustment module 35 has a guide member 352 and a weight member 354 that is movable along the guide member 352. The guide member 352 extends in the direction in which the polishing pad P1 slides along the polishing pad holding surface SP1 (the left-right direction in FIG. 1). The guide member 352 may be configured with, for example, an elongated rod, a rail, or a ball screw. The weight member 354 moves along the guide member 352 and changes the gravity central position of the polishing table 30 in the direction along the guide member 352. As an example, for the weight member 354, metal such as lead or resin may be used. The dimensions and the material of the weight member 354 may be determined based on the weight of the supply roll 100 and the winding roll 200 held by the first polishing pad holding module 310 and the second polishing pad holding module 320.

[0034] Furthermore, the polishing table 30 includes a drive source 356 that moves the weight member 354 along the guide member 352. Various known mechanisms may be adopted as the drive source 356. As an example, the drive source 356 may be a motor that rotates the guide member 352 configured with a ball screw, or may be a fluid actuator. The drive source 356 is controlled by the controller 900. The polishing table 30 has a sensor (not shown) for detecting the position of the weight member 354, and the controller 900 may control the weight adjustment module (drive source 356) so as to control the position of the weight member 354 based on the detection signal from the sensor.

[0035] FIG. 3 is a plan view showing an example of arrangement of the components mounted on or attached to the polishing table 30. In FIG. 3, the polishing table body 31 and the table top 32 are not depicted. As illustrated, the first polishing pad holding module 310 and the second polishing pad holding module 320 (supply roll 100, winding roll 200) are positioned on opposite sides with respect to the center axis C1 of the polishing table 30. In other words, the supply roll 100 is disposed along a first side of the polishing pad holding surface SP1, and the winding roll 200 is disposed along a second side that is on the opposite side of the first side of the polishing pad holding surface SP1. Also, as shown in FIG. 3, the weight adjustment module 35 includes two guide members 352 and weight members 354 so as to be positioned on opposite sides with respect to the center axis C1 of the polishing table 30. In other words, the first guide member 352 and the weight member 354 are disposed along a third side that is perpendicular to the first side and the second side of the polishing pad holding surface SP1. Also, the second guide member 352 and weight member 354 are disposed along a fourth side that is on the opposite side of the third side of the polishing pad holding surface SP1. With such a weight adjustment module 35, shifting of the gravity central position of the polishing table 30 by the weight adjustment module 35 may be suppressed in a direction perpendicular to the axial direction of the supply roll 100 and the winding roll 200 (lateral direction in FIG. 3).

[0036] Also, the first motor 130 and the second motor 230 may be disposed at positions that are point-symmetric with respect to the center axis C1 of the polishing table 30 when viewed in a direction perpendicular to the polishing pad holding surface SP1. As an example, as shown in FIG. 3, the first motor 130 may be disposed on one end side in the axial direction of the supply roll 100 (lower side in FIG. 3), and the second motor 230 may be disposed on the other end side in the axial direction of the winding roll 200 (upper side in FIG. 3). With such an arrangement, the gravity central position of the polishing table 30 may be positioned near the center axis C1.

[0037] The polishing device 1000 includes a first displacement meter 140 for measuring a radius R100 of the supply roll 100, and a second displacement meter 240 for measuring a radius R200 of the winding roll 200. The detection signals from the first displacement meter 140 and the second displacement meter 240 are input to the controller 900. As an example, the first displacement meter 140 and the second displacement meter 240 are configured to measure the radii R100, R200 by measuring the radial displacement of the outer peripheral surface of the polishing pad P1 on the supply roll 100 and the winding roll 200 from the center of the winding of the polishing pad P1. The first displacement meter 140 and the second displacement meter 240 may be configured with laser displacement meters, contact-type displacement meters, imaging elements, or the like. Without limitation thereto, the first displacement meter 140 detects a first position A1 located in the end region on one end side of the supply roll 100 in the axial direction (upper side in FIG. 3). Also, the second displacement meter 240 detects a second position A2 located in the end region on the other end side of the winding roll 200 in the axial direction (lower side in FIG. 3). This is based on the fact that the central regions of the supply roll 100 and the winding roll 200 in the axial direction are affected by the centrifugal force accompanying the rotation of the polishing table 30, and a deviation may occur in the detection by the displacement meters. Furthermore, the first displacement meter 140 and the second displacement meter 240 may be disposed at positions that are point-symmetric with respect to the center axis C1 when viewed in a direction perpendicular to the polishing pad holding surface SP1. With such arrangement, the gravity central position of the polishing table 30 may be positioned near the center axis C1. The polishing device 1000 may include only one of the first displacement meter 140 and the second displacement meter 240, and may measure only one of the radii R100, R200.

[0038] FIG. 4 is a cross-sectional view showing a schematic configuration of the polishing table 30 of the embodiment. As illustrated, the polishing table 30 of the embodiment includes multiple suction holes 328 opening on the upper surface of the polishing table 30, and a flow path 90 in fluid communication with the suction holes 328. The suction holes 328 are through holes penetrating the table top 32 of the polishing table 30 in the thickness direction. The polishing device 1000 further includes a vacuum source 91, a fluid supply source 92, and a pressure gauge 93 for measuring the pressure of the flow path 90. The flow path 90 may include a valve (not shown) and may be configured to selectively establish fluid connection between the suction holes 328 and either the vacuum source 91 or the fluid supply source 92. Alternatively, the suction holes 328 may be in fluid connection with the vacuum source 91, and fluid supply holes provided separately from the suction holes 328 may be in fluid connection with the fluid supply source 92. It may also be that the polishing device 1000 does not include the fluid supply source 92. In the sub pad SP, multiple sub pad suction holes SP8 are formed at positions corresponding to the suction holes 328. The sub pad suction holes SP8 penetrate the plate-shaped sub pad SP in the thickness direction. The sub pad SP is disposed on the upper surface of the polishing table 30 such that the sub pad suction holes SP8 communicate with the suction holes 328 formed on the upper surface of the polishing table 30.

[0039] When holding the polishing pad P1 on the polishing pad holding surface SP1, the controller 900 controls the vacuum source 91 to apply a negative pressure to the flow path 90. As a result, the polishing pad P1 located above the sub pad SP is held on the polishing pad holding surface SP1 by vacuum suction. When peeling the polishing pad P1 from the polishing pad holding surfaceSP1, the controller 900 controls the fluid supply source 92 to supply fluid to the flow path 90. As a result, the fluid is ejected from the sub pad suction holes SP8, and separation of the polishing pad P1 from the polishing pad holding surface SP1 can be promoted. The ejection of the fluid is referred to as blow. As an example, the fluid for the blow that is supplied from the fluid supply source 92 can be a gas such as nitrogen or air, or a liquid such as water.

[0040] Next, the feed operation of the polishing pad P1 by the polishing device 1000 of the embodiment will be described. FIGS. 5A-5C are diagrams for describing the feed operation of the polishing pad P1. As described above, when the substrate WF is polished, with the polishing pad P1 held by suction on the polishing pad holding surface SP1 (see FIG. 5A), the substrate WF held by the top ring 40 is pressed against the polishing pad P1. Then, as an example, the feed operation of the polishing pad P1 is performed by polishing a predetermined number (such as one or several) of substrates WF, or by external input from a user. The controller 900 may rotate the polishing table 30 to remove the liquid on the polishing pad P1 prior to the feed operation of the polishing pad P1.

[0041] In the feed operation of the polishing pad P1, first, the controller 900 stops the supply of the negative pressure from the vacuum source 91 (see FIG. 5B). At this time, the controller 900 may control the fluid supply source 92 to blow (eject fluid) between the polishing pad holding surface SP1 and the polishing pad P1. In this way, the separation of the polishing pad P1 from the polishing pad holding surface SP1 can be promoted.

[0042] Subsequently, the controller 900 controls the first motor 130 and the second motor 230 to supply the polishing pad P1 from the supply roll 100 and to wind the polishing pad P1 by using the winding roll 200 (see FIG. 5C). As a specific example, although not limited thereto, the controller 900 drives the first motor 130 so that the feed rate of the polishing pad P1 becomes constant to supply the polishing pad P1 from the supply roll 100, and drives the second motor 230 at a predetermined torque limit value to wind the polishing pad P1 by using the winding roll 200. At this time, under the torque limit, by setting the target winding speed of the winding roll 200 to be greater than a feed rate V1 of the supply roll 100, the winding roll 200 stretches the polishing pad P1 with a torque corresponding to the torque limit value while rotating at a winding speed equal to the feed rate V1. As a result, the polishing pad P1 is fed from the supply roll 100 to the winding roll 200 in a stretched state. That is, the feed rate V1 of the supply roll 100 becomes the same as the effective winding speed of the winding roll 200. Blowing may be continued when the polishing pad P1 is fed.

[0043] Next, when the polishing pad P1 is fed by a desired amount, the controller 900 stops the first motor 130 and the second motor 230, and supplies the negative pressure from the vacuum source 91. As a result, the renewed polishing pad P1 is held by suction on the polishing pad holding surface SP1 (see FIG. 5A). The polishing device 1000 can feed the polishing pad P1 through such operation.

[0044] The controller 900 may refer to the feed rate of the polishing pad P1 by the first motor 130 and the second motor 230, and when the speed difference between the winding speed of the winding roll 200 and the supply speed of the supply roll 100 is equal to or greater than a threshold value, the controller 900 may stop the feed operation or issue an error notification.

[0045] FIGS. 6A and 6B are diagrams for describing the adjustment to the gravity central position of the polishing table 30 by using the weight adjustment module 35 of the embodiment. FIG. 6A shows a state where the amount of the polishing pad P1 wound on the supply roll 100 is large and the amount of the polishing pad P1 wound on the winding roll 200 is small. In the state shown in FIG. 6A, because the weight of the supply roll 100 is greater than that of the winding roll 200, a relatively large weight acts on the polishing table 30 on the side of the supply roll 100, and a weight imbalance occurs with respect to the center axis C1. To eliminate such weight imbalance, the controller 900 positions the weight member 354 toward the side of the winding roll 200 as the weight of the supply roll 100 increases relative to the winding roll 200. Then, as described above, along with the polishing of the substrate WF, the polishing pad P1 is supplied from the supply roll 100 and the polishing pad P1 is wound by the winding roll 200, and the polishing pad P1 is fed. As a result, the weight of the supply roll 100 decreases and the weight of the winding roll 200 increases. FIG. 6B shows a state where the amount of the polishing pad P1 wound on the supply roll 100 is small and the amount of the polishing pad P1 wound on the winding roll 200 is large. In the state shown in FIG. 6B, the weight of the supply roll 100 is smaller than the winding roll 200, and the weight acting on the polishing table 30 has changed from the state shown in FIG. 6A. To eliminate the change in the gravity central position due to such weight change, the controller 900 moves the weight member 354 toward the side of the supply roll 100 as the weight of the supply roll 100 decreases relative to the winding roll 200.

[0046] As an example, the weight of the supply roll 100 and the winding roll 200 at the time when the use starts may be input to the controller 900 by external input or the like. Then, the position of the weight member 354 when the use starts may be set to the controller 900 based on the weight of the supply roll 100 and the winding roll 200 when the use starts. Instead of such an example, the position of the weight member 354 when the use starts may be set in the controller 900 by external input. Then, as an example, the controller 900 can control the weight adjustment module 35 based on the detection by the first displacement meter 140 and the second displacement meter 240. As a specific example, the controller 900 calculates the amount of the polishing pad P1 wound on the supply roll 100 and the winding roll 200 based on the radii R100, R200 detected by the first displacement meter 140 and the second displacement meter 240. Then, the controller 900 controls the weight adjustment module 35 to position the weight member 354 toward the side of the winding roll 200 as the weight of the supply roll 100 increases relative to the winding roll 200, based on the calculated amount of the polishing pad P1. Also, the controller 900 controls the weight adjustment module 35 to position the weight member 354 toward the side of the supply roll 100 as the weight of the supply roll 100 decreases relative to the winding roll 200, based on the calculated amount of the polishing pad P1. As an example, the controller 900 positions the weight member 354 at the center of the third side and the fourth side of the polishing table 30 when the weight of the winding roll 200 and the weight of the supply roll 100 are equal. Also, as an example, the controller 900 controls the weight adjustment module 35 so that the weight member 354 moves to a position on the opposite side from the initial position along the third side and the fourth side of the polishing table 30 when the polishing pad P1 wound on the supply roll 100 runs out. In this manner, in the polishing table 30 of the embodiment, the gravity central position of the polishing table 30 can be adjusted by the weight adjustment module 35, and the load on the rotation axis and the bearing of the polishing table 30 can be reduced.Modified Examples

[0047] In the embodiment described above, the controller 900 controls the weight adjustment module 35 based on the detection by the first displacement meter 140 and the second displacement meter 240. However, the controller 900 may control the weight adjustment module 35 based on other information instead of or in addition to the detection by the first displacement meter 140 and the second displacement meter 240. As one example, the controller 900 may control the weight adjustment module 35 based on the operation history of the first motor 130 and the second motor 230. Also, as one example, the polishing device 1000 may have a sensor for detecting the weight of the supply roll 100 or the winding roll 200 held by the first polishing pad holding module 310 or the second polishing pad holding module 320. Then, the controller 900 may move the weight member 354 toward the side of the winding roll 200 as the weight of the supply roll 100 increases relative to the winding roll 200, based on the detected weight. Also, the controller 900 may move the weight member 354 toward the side of the supply roll 100 as the weight of the supply roll 100 decreases relative to the winding roll 200, based on the detected weight.

[0048] In the embodiment described above, the controller 900 that handles the control of the entire polishing device 1000 controls the weight adjustment module 35 based on the detection by the first displacement meter 140 and the second displacement meter 240. However, the polishing device 1000 may include another controller (hereinafter referred to as "separate controller") for controlling the weight adjustment module 35, separately from the controller 900. In this case, the detection (detection signal) by the first displacement meter 140 and the second displacement meter 240 is input to a separate controller, and the separate controller may control the weight adjustment module 35 based on the detection signal in the same manner as the control by the controller 900 described above. The separate controller may be provided on the polishing table 30 and configured to be rotatable about the center axis C1 integrally with the polishing table 30. In this way, the first displacement meter 140 and the second displacement meter 240 can be connected to the separate controller, and the weight adjustment module 35 (drive source 356) can be connected to the separate controller without using a rotary switch or the like, and the polishing device 1000 can have a simple configuration.

[0049] In the embodiment described above, the polishing device 1000 includes the first centering roller 110, the first tension roller 120, the second centering roller 210, and the second tension roller 220. However, the polishing device 1000 may not include at least a part of the first centering roller 110, the first tension roller 120, the second centering roller 210, and the second tension roller 220. Also, in the embodiment described above, the polishing table 30 holds the polishing pad P1 on the polishing pad holding surface SP1 by vacuum suction, without including a vacuum suction mechanism.

[0050] The embodiment described above can also be described as the following configurations [Configuration 1] According to Configuration 1, a polishing device that polishing a substrate by using a polishing pad is provided. The polishing device includes: a polishing table, configured to be spinnable and defining a polishing pad holding surface for holding the polishing pad; first and second polishing pad holding modules, configured to be rotatable integrally with the polishing table and configured to hold the polishing pad wound in a roll shape, wherein the polishing pad supplied from the first polishing pad holding module is wound by the second polishing pad holding module, so that the polishing pad is configured to slide along the polishing pad holding surface; and a weight adjustment module, comprising: a guide member, extending in a direction in which the polishing pad slides along the polishing pad holding surface; and a weight member, configured to be movable along the guide member. According to Configuration 1, in the polishing device including a mechanism capable of renewing the polishing pad, a load applied to the rotation axis and the bearing of the polishing table can be reduced.

[0051] [Configuration 2] According to Configuration 2, in Configuration 1, a drive source is further provided. The drive source moves the weight member along the guide member. According to Configuration 2, the weight member can be moved by driving the drive source.

[0052] [Configuration 3] According to Configuration 3, in Configuration 2, a controller is further provided. The controller controls the drive source, so that the weight member is positioned toward a side of the second polishing pad holding module as an amount of the polishing pad held by the second polishing pad holding module decreases relative to an amount of the polishing pad held by the first polishing pad holding module, and the weight member is positioned toward a side of the second polishing pad holding module as the amount of the polishing pad held by the second polishing pad holding module increases relative to the amount of the polishing pad held by the first polishing pad holding module. According to Configuration 3, the load applied to the rotation axis and the bearing of the polishing table can be reduced by the control of the controller.

[0053] [Configuration 4] According to Configuration 4, in Configuration 3, a displacement meter is provided for detecting a roll diameter of the polishing pad held by at least one of the first polishing pad holding module and the second polishing pad holding module. The controller obtains the amount of the polishing pad held by at least one of the first polishing pad holding module and the second polishing pad holding module based on the roll diameter of the polishing pad detected by the displacement meter. According to Configuration 4, the controller can perform control based on the detection by the displacement meter.

[0054] [Configuration 5] According to Configuration 5, in Configuration 4, the displacement meter includes: a first displacement meter for detecting the roll diameter of the polishing pad held by the first polishing pad holding module; and a second displacement meter for detecting the roll diameter of the polishing pad held by the second polishing pad holding module. The first displacement meter detects a first position located in an end region on an end side in the polishing pad wound in the roll shape. The second displacement meter detects a second position located in an end region on an other end side in the polishing pad wound in the roll shape. According to Configuration 5, the controller can perform control based on the detection by the first and second displacement meters.

[0055] [Configuration 6] According to Configuration 6, in Configurations 1 to 5, the first polishing pad holding module includes a first motor as a drive source for supplying the polishing pad wound in the roll shape, the second polishing pad holding module includes a second motor as a drive source for winding the polishing pad wound in the roll shape, and the first motor and the second motor are configured to be rotatable integrally with the table, and are disposed at positions that are point-symmetric with respect to a spin axis of the polishing table when viewed in a direction perpendicular to the polishing pad holding surface. According to Configuration 6, the load acting on the rotation axis or the bearing of the polishing table due to the weight of the first motor and the second motor can be reduced.

[0056] [Configuration 7] According to Configuration 6, in Configurations 1 to 5, a first roller and a second roller are provided. The first tension roller is configured to be rotatable integrally with the table, the first tension roller has a rotation axis disposed along a first side of the polishing pad holding surface, and the polishing pad is hung on the first tension roller, the second tension roller, configured to be rotatable integrally with the polishing table, and the second tension roller has a rotation axis disposed along a second side of the polishing pad holding surface on an opposite side of the first side, and the polishing pad is hung on the second tension roller.

[0057] [Configuration 8] According to Configuration 8, in Configurations 1 to 7, a suction hole connected to a vacuum source is formed in the polishing pad holding surface. According to Configuration 8, the polishing pad can be vacuum-suctioned to the polishing pad holding surface.

[0058] Although the embodiments of the invention and the modification examples related thereto have been described above, it goes without saying that each of the above-described examples is for facilitating the understanding to the invention and does not limit the invention. The invention can be appropriately changed and improved without departing from the spirit thereof, and equivalents thereof are included in the invention. In addition, any combination or omission of each component described in the claims and the specification is possible within a range in which at least a part of the above-described problems can be solved or within a range in which at least a part of the effects can be achieved. As an example, the drive control of the first motor 130 and the second motor 230 described in the second embodiment can be applied to other embodiments.

Examples

modified examples

[0047]In the embodiment described above, the controller 900 controls the weight adjustment module 35 based on the detection by the first displacement meter 140 and the second displacement meter 240. However, the controller 900 may control the weight adjustment module 35 based on other information instead of or in addition to the detection by the first displacement meter 140 and the second displacement meter 240. As one example, the controller 900 may control the weight adjustment module 35 based on the operation history of the first motor 130 and the second motor 230. Also, as one example, the polishing device 1000 may have a sensor for detecting the weight of the supply roll 100 or the winding roll 200 held by the first polishing pad holding module 310 or the second polishing pad holding module 320. Then, the controller 900 may move the weight member 354 toward the side of the winding roll 200 as the weight of the supply roll 100 increases relative to the winding roll 200, based on...

CROSS-REFERENCE TO RELATED APPLICATION

[0001] This application claims the priority benefit of Japan application serial no. 2025-060428, filed on Apr. 1, 2025. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.BACKGROUNDTechnical Field

[0002] The invention relates to a polishing device.Description of Related Art

[0003] In a semiconductor manufacturing process, a polishing (chemical mechanical polishing, CMP) device is used to polish a substrate. As an example, in a polishing device, a substrate is polished by pressing the substrate against a polishing pad held on a table. As such polishing device, a device including two holding modules that hold a polishing pad wound in a roll shape has been proposed (for example, see Patent Document 1). In the device, the polishing pad can be slid on the table by supplying the polishing pad from one holding module and winding the polishing pad with the other holding module. The polishing pad is a consumable item, and in the device, the polishing pad held on the table can be automatically renewed to an unused polishing pad portion.Prior Art Document(s)Patent Document(s)

[0004] [Patent Document 1] U.S. Patent Application Publication No. 2020 / 0086456

[0005] In the device described in Patent Document 1, during polishing of a substrate, the substrate is pressed against the polishing pad on the table while the table is spinning. As described above, since the two holding modules and the polishing pad are mounted on the table and rotate together with the rotation of the table, a large load is applied to the rotation axis and the bearing that rotate the table. Here, in order to reduce the load applied to the rotation axis and the bearing of the table, it is preferable that the weight of the table is not biased with respect to the rotation axis. Meanwhile, in the device described in Patent Document 1, the longer the entire length of the polishing pad wound in a roll shape, that is, the larger the roll-shaped polishing pad used, the more the polishing pad held on the table can be automatically renewed. However, the larger the roll-shaped polishing pad used, the more the weight of the table becomes biased, and the bias of the weight changes according to the use of the polishing pad. That is, when there is a large unused portion of the polishing pad, the polishing pad held by the holding module on the supply side is heavy, and when the unused portion of the polishing pad increases, the polishing pad held by the holding module on the winding side becomes heavy.

[0006] The invention provides a polishing device including a mechanism capable of renewing a polishing pad held on a polishing table, where the polishing device can reduce the load applied to the rotation axis and the bearing of the polishing table.SUMMARY

[0007] According to an embodiment of the invention, a polishing device that polishes a substrate using a polishing pad is proposed. The polishing device includes: a polishing table, configured to be spinnable and defining a polishing pad holding surface for holding the polishing pad; first and second polishing pad holding modules, configured to be rotatable integrally with the polishing table and configured to hold the polishing pad wound in a roll shape, the polishing pad supplied from the first polishing pad holding module being wound by the second polishing pad holding module, so that the polishing pad is configured to slide along the polishing pad holding surface; and a weight adjustment module, comprising: a guide member, extending in a direction in which the polishing pad slides along the polishing pad holding surface; and a weight member, configured to be movable along the guide member.BRIEF DESCRIPTION OF THE DRAWINGS

[0008] FIG. 1 is a front view of a polishing device according to an embodiment of the disclosure.

[0009] FIG. 2 is a plan view of a polishing table of the polishing device.

[0010] FIG. 3 is a plan view showing an example of an arrangement of components mounted on or attached to the polishing table.

[0011] FIG. 4 is a cross-sectional view showing a schematic configuration of the polishing table of the embodiment.

[0012] FIG. 5A is a diagram for describing a feed operation of a polishing pad P1.

[0013] FIG. 5B is a diagram for describing the feed operation of the polishing pad P1.

[0014] FIG. 5C is a diagram for describing the feed operation of the polishing pad P1.

[0015] FIG. 6A is a diagram for describing adjustment of a gravity central position of the polishing table by using a weight adjustment module of the embodiment.

[0016] FIG. 6B is a diagram for describing adjustment of the gravity central position of the polishing table by the weight adjustment module of the embodiment.DESCRIPTION OF THE EMBODIMENTS

[0017] Hereinafter, the embodiments of the invention are described with reference to the drawings. In the drawings described below, the same or corresponding components are denoted by the same reference numerals, and redundant description is omitted.

[0018] FIG. 1 is a front view of a polishing device 1000 according to an embodiment of the disclosure. FIG. 2 is a plan view of a polishing table 30 of the polishing device 1000. The polishing device 1000 has a function of polishing a substrate WF by using a polishing pad P1. Here, "substrate" includes not only semiconductor substrates, glass substrates, liquid crystal substrates, and printed circuit boards, but also magnetic recording media, magnetic recording sensors, mirrors, optical elements, micro mechanical elements, partially fabricated integrated circuits, and any other processing targets. The substrate WF can be any shape including polygonal and circular shapes. The polishing device 1000 of the embodiment includes the polishing table 30, a top ring 40, and a controller 900.

[0019] The polishing table 30 has, as an example, a substantially T-shape in side view (see FIG. 1) and a rectangular shape in plan view (see FIG. 2). The polishing table 30 includes a polishing table body 31 and a table top 32 that defines an upper surface on which a sub pad SP is disposed on the polishing table 30. In the embodiment, the polishing table 30 supports a polishing pad P1 for polishing the substrate WF via the sub pad SP.

[0020] The sub pad SP may be any sub pad that can perform polishing with desired accuracy, and various materials and dimensions can be adopted. The sub pad SP has, as an example, a substantially rectangular parallelepiped shape and is formed from resin or nonwoven fabric. The sub pad SP can be provided by being attached to the upper surface of the table top 32 with an adhesive or the like. The upper surface of the sub pad SP defines a polishing pad holding surface SP1 that holds the polishing pad P1. The sub pad SP can be a consumable item and can be replaced at a desired timing. However, the polishing table 30 does not have to be provided with the sub pad SP. In the case where the polishing table 30 does not include the sub pad SP, the upper surface of the table top 32 defines the polishing pad holding surface.

[0021] The polishing pad P1 is disposed on the polishing pad holding surface SP1, which is the upper surface of the sub pad SP, and is suctioned through sub pad suction holes SP8 (FIG. 4) described later that are open on the polishing pad holding surface SP1. The upper surface of the polishing pad P1 (the surface on the side opposite to the surface in contact with the polishing pad holding surface SP1) constitutes a polishing surface for polishing the substrate WF.

[0022] In the embodiment, a supply hole 37 for supplying a polishing liquid such as slurry is provided near the center of the polishing table 30 (see FIG. 2). A hole is formed in the sub pad SP and the polishing pad P1 at a position corresponding to the supply hole 37. Accordingly, during polishing of the substrate WF, the polishing liquid is supplied from the supply hole 37 to the polishing surface of the polishing pad P1. Such configuration can suitably supply the polishing liquid particularly even in the case where the substrate WF continues to cover the center of the polishing surface during polishing. In FIG. 2, four supply holes 37 are shown, but the number of supply holes 37 is not particularly limited and may be 1 to 3 or 5 or more. The polishing device 1000 may also be configured so that the polishing liquid is supplied to the polishing pad P1 from a polishing liquid supply port such as a nozzle provided above the polishing pad P1 instead of or in addition to the supply hole 37.

[0023] The polishing table 30 is configured to be capable of spinning (rotating) around a center axis (spin axis) C1 perpendicular to the polishing surface by the motor 38. As an example, the center axis C1 extends in a vertical direction passing through the center of the polishing pad holding surface SP1 of the sub pad SP.

[0024] The top ring 40 is disposed above the polishing table 30 so as to be movable up and down. The top ring 40 is configured to detachably hold the substrate WF, which is the polishing target, with the surface to be polished of the substrate WF facing downward (toward the polishing pad P1). The top ring 40 is configured to be capable of spinning (rotating) around a center axis C2. As an example, the center axis C2 extends in a vertical direction and extends parallel to the center axis C1. During polishing, in a state where the polishing liquid is supplied from the supply hole 37 to the polishing surface of the polishing pad P1, the substrate WF is pressed against the polishing surface of the polishing pad P1 by the top ring 40 and polished. In this manner, the polishing device 1000 is configured to polish the substrate WF by bringing the polishing pad P1 and the substrate WF into contact with each other in the presence of the polishing liquid and rotating the polishing pad P1 and the substrate WF relative to each other.

[0025] The polishing device 1000 includes, as an example, an atomizer (not shown). The atomizer has a function of removing the polishing liquid, polishing products, polishing pad residue due to dressing, and the like on the polishing surface by supplying at least one of a liquid (for example, pure water) and a gas (for example, nitrogen gas) to the polishing surface.

[0026] As shown inFIG. 1, the polishing device 1000 includes a first polishing pad holding module 310 and a second polishing pad holding module 320. The first polishing pad holding module 310 and the second polishing pad holding module 320 can be disposed below the overhang portions protruding on both sides of the T-shaped polishing table 30. In the example shown in FIG. 1, the first polishing pad holding module 310 and the second polishing pad holding module 320 are located on opposite sides with respect to the center axis C1 of the polishing table 30. The first polishing pad holding module 310 and the second polishing pad holding module 320 are configured to be rotatable around the center axis C1 integrally with the polishing table 30.

[0027] The first polishing pad holding module 310 is configured to hold the supply roll 100 in a state where the center of the supply roll 100 extends in the horizontal direction. The supply roll 100 is, for example, a roll-shaped pad in which an unused polishing pad P1 for supply is wound in a roll shape. The configuration of the first polishing pad holding module 310 is not particularly limited as long as it can rotatably hold the supply roll 100, and can be, for example, a support base that rotatably supports the rotating shaft of the supply roll 100. The second polishing pad holding module 320 is configured to hold the winding roll 200 in a state where the center of the winding roll 200 extends in the horizontal direction. The winding roll 200 is, for example, a roll-shaped pad in which a used polishing pad P1 that has passed above the polishing table 30 is wound in a roll shape. The configuration of the second polishing pad holding module 320 is not particularly limited as long as it can rotatably hold the winding roll 200, and can be, for example, a support base that rotatably supports the rotating shaft of the winding roll 200.

[0028] As shown in FIG. 1, the polishing device 1000 includes a first centering roller 110, a first tension roller 120, a second centering roller 210, and a second tension roller 220, which are configured to guide the polishing pad P1 by hanging the polishing pad P1. The first centering roller 110 and the first tension roller 120 are rollers that the polishing pad P1 fed out from the supply roll 100 contacts before reaching the polishing pad holding surface SP1 or above. In other words, the first centering roller 110 and the first tension roller 120 are configured to contact the polishing pad P1 from the supply roll 100 to above the polishing table 30. The second centering roller 210 and the second tension roller 220 are rollers that the polishing pad P1 that has passed above the polishing pad holding surface SP1 contacts before being wound onto the winding roll 200.

[0029] The first centering roller 110 is disposed diagonally downward from the supply roll 100 such that its rotation axis extends in a substantially horizontal direction. The second centering roller 210 is disposed diagonally downward from the winding roll 200 such that its rotation axis extends in a substantially horizontal direction. Since the first centering roller 110 and the second centering roller 210 are disposed below the supply roll 100 and the winding roll 200, respectively, it is possible to suppress the polishing liquid on the polishing surface from traveling along the polishing pad P1 to reach the supply roll 100 or the winding roll 200 and adversely affecting the supply roll 100 or the winding roll 200. At least one of the first centering roller 110 and the second centering roller 210 may have a shape in which the outer diameter increases toward the central portion in the long-axis direction (rotation axis direction). This makes it possible to make the polishing pad P1 less likely to shift in the long-axis direction of the first centering roller 110 or the second centering roller 210, and less likely to meander.

[0030] The first tension roller 120 is a roller disposed above the first centering roller 110. The second tension roller 220 is a roller disposed above the second centering roller 210. The first tension roller 120 and the second tension roller 220 are disposed along the upper surface of the polishing table 30 or the polishing pad holding surface SP1, at lateral sides of the upper surface of the polishing table 30 or the polishing pad holding surface SP1. In the embodiment, the first tension roller 120 is disposed along a first side (the right side in FIG. 2) of the polishing pad holding surface SP1, and the second tension roller 220 is disposed along a second side (the left side in FIG. 2) that is the opposite side of the first side of the polishing pad holding surface SP1. In the embodiment, the polishing pad P1 is configured to extend substantially parallel to the polishing pad holding surface SP1 between the first tension roller 120 and the second tension roller 220 when a predetermined tension is applied to the polishing pad P1. Here, as an example, the first tension roller 120 and the second tension roller 220 may support the polishing pad P1 at the same height as the polishing pad holding surface SP1. The first tension roller 120 and the second tension roller 220 are cylindrical as an example from the viewpoint of stretching the polishing pad P1 horizontally.

[0031] The polishing device 1000 further includes a first motor 130 that drives the rotation of the supply roll 100 and a second motor 230 that drives the rotation of the winding roll 200. The first motor 130 and the second motor 230 are controlled by the controller 900. The first motor 130 and the second motor 230 are connected to the rotating shafts of the supply roll 100 and the winding roll 200 via a transmission mechanism (not shown) that transmits a rotational force, such as a timing belt. The first motor 130 and the second motor 230 may be disposed below the overhang portions that protrude on both sides of the T-shaped polishing table 30. As an example, the first motor 130 and the second motor 230 are disposed on the inner sides (the side of the center axis C1) of the supply roll 100 and the winding roll 200.

[0032] In the polishing device 1000, the movement direction of the polishing pad P1 supplied from the supply roll 100 is changed by the first centering roller 110 and the first tension roller 120. The polishing pad P1 then slides in the horizontal direction along the polishing pad holding surface SP1. Thereafter, the movement direction of the polishing pad P1 is changed by the second tension roller 220 and the second centering roller 210. The polishing pad P1 is then wound onto the winding roll 200. In this manner, the polishing device 1000 is configured such that the polishing pad P1 can slide along the polishing pad holding surface SP1. Therefore, in the polishing device 1000, a used and worn portion of the polishing pad P1 can be slid and replaced with an unused portion for renewal.

[0033] The polishing table 30 includes a weight adjustment module 35 for adjusting the gravity central position of the polishing table 30. The weight adjustment module 35 may be disposed below the overhang portions that protrude on both sides of the T-shaped polishing table 30. The weight adjustment module 35 is configured to be rotatable integrally with the polishing table 30 about the center axis C1. The weight adjustment module 35 has a guide member 352 and a weight member 354 that is movable along the guide member 352. The guide member 352 extends in the direction in which the polishing pad P1 slides along the polishing pad holding surface SP1 (the left-right direction in FIG. 1). The guide member 352 may be configured with, for example, an elongated rod, a rail, or a ball screw. The weight member 354 moves along the guide member 352 and changes the gravity central position of the polishing table 30 in the direction along the guide member 352. As an example, for the weight member 354, metal such as lead or resin may be used. The dimensions and the material of the weight member 354 may be determined based on the weight of the supply roll 100 and the winding roll 200 held by the first polishing pad holding module 310 and the second polishing pad holding module 320.

[0034] Furthermore, the polishing table 30 includes a drive source 356 that moves the weight member 354 along the guide member 352. Various known mechanisms may be adopted as the drive source 356. As an example, the drive source 356 may be a motor that rotates the guide member 352 configured with a ball screw, or may be a fluid actuator. The drive source 356 is controlled by the controller 900. The polishing table 30 has a sensor (not shown) for detecting the position of the weight member 354, and the controller 900 may control the weight adjustment module (drive source 356) so as to control the position of the weight member 354 based on the detection signal from the sensor.

[0035] FIG. 3 is a plan view showing an example of arrangement of the components mounted on or attached to the polishing table 30. In FIG. 3, the polishing table body 31 and the table top 32 are not depicted. As illustrated, the first polishing pad holding module 310 and the second polishing pad holding module 320 (supply roll 100, winding roll 200) are positioned on opposite sides with respect to the center axis C1 of the polishing table 30. In other words, the supply roll 100 is disposed along a first side of the polishing pad holding surface SP1, and the winding roll 200 is disposed along a second side that is on the opposite side of the first side of the polishing pad holding surface SP1. Also, as shown in FIG. 3, the weight adjustment module 35 includes two guide members 352 and weight members 354 so as to be positioned on opposite sides with respect to the center axis C1 of the polishing table 30. In other words, the first guide member 352 and the weight member 354 are disposed along a third side that is perpendicular to the first side and the second side of the polishing pad holding surface SP1. Also, the second guide member 352 and weight member 354 are disposed along a fourth side that is on the opposite side of the third side of the polishing pad holding surface SP1. With such a weight adjustment module 35, shifting of the gravity central position of the polishing table 30 by the weight adjustment module 35 may be suppressed in a direction perpendicular to the axial direction of the supply roll 100 and the winding roll 200 (lateral direction in FIG. 3).

[0036] Also, the first motor 130 and the second motor 230 may be disposed at positions that are point-symmetric with respect to the center axis C1 of the polishing table 30 when viewed in a direction perpendicular to the polishing pad holding surface SP1. As an example, as shown in FIG. 3, the first motor 130 may be disposed on one end side in the axial direction of the supply roll 100 (lower side in FIG. 3), and the second motor 230 may be disposed on the other end side in the axial direction of the winding roll 200 (upper side in FIG. 3). With such an arrangement, the gravity central position of the polishing table 30 may be positioned near the center axis C1.

[0037] The polishing device 1000 includes a first displacement meter 140 for measuring a radius R100 of the supply roll 100, and a second displacement meter 240 for measuring a radius R200 of the winding roll 200. The detection signals from the first displacement meter 140 and the second displacement meter 240 are input to the controller 900. As an example, the first displacement meter 140 and the second displacement meter 240 are configured to measure the radii R100, R200 by measuring the radial displacement of the outer peripheral surface of the polishing pad P1 on the supply roll 100 and the winding roll 200 from the center of the winding of the polishing pad P1. The first displacement meter 140 and the second displacement meter 240 may be configured with laser displacement meters, contact-type displacement meters, imaging elements, or the like. Without limitation thereto, the first displacement meter 140 detects a first position A1 located in the end region on one end side of the supply roll 100 in the axial direction (upper side in FIG. 3). Also, the second displacement meter 240 detects a second position A2 located in the end region on the other end side of the winding roll 200 in the axial direction (lower side in FIG. 3). This is based on the fact that the central regions of the supply roll 100 and the winding roll 200 in the axial direction are affected by the centrifugal force accompanying the rotation of the polishing table 30, and a deviation may occur in the detection by the displacement meters. Furthermore, the first displacement meter 140 and the second displacement meter 240 may be disposed at positions that are point-symmetric with respect to the center axis C1 when viewed in a direction perpendicular to the polishing pad holding surface SP1. With such arrangement, the gravity central position of the polishing table 30 may be positioned near the center axis C1. The polishing device 1000 may include only one of the first displacement meter 140 and the second displacement meter 240, and may measure only one of the radii R100, R200.

[0038] FIG. 4 is a cross-sectional view showing a schematic configuration of the polishing table 30 of the embodiment. As illustrated, the polishing table 30 of the embodiment includes multiple suction holes 328 opening on the upper surface of the polishing table 30, and a flow path 90 in fluid communication with the suction holes 328. The suction holes 328 are through holes penetrating the table top 32 of the polishing table 30 in the thickness direction. The polishing device 1000 further includes a vacuum source 91, a fluid supply source 92, and a pressure gauge 93 for measuring the pressure of the flow path 90. The flow path 90 may include a valve (not shown) and may be configured to selectively establish fluid connection between the suction holes 328 and either the vacuum source 91 or the fluid supply source 92. Alternatively, the suction holes 328 may be in fluid connection with the vacuum source 91, and fluid supply holes provided separately from the suction holes 328 may be in fluid connection with the fluid supply source 92. It may also be that the polishing device 1000 does not include the fluid supply source 92. In the sub pad SP, multiple sub pad suction holes SP8 are formed at positions corresponding to the suction holes 328. The sub pad suction holes SP8 penetrate the plate-shaped sub pad SP in the thickness direction. The sub pad SP is disposed on the upper surface of the polishing table 30 such that the sub pad suction holes SP8 communicate with the suction holes 328 formed on the upper surface of the polishing table 30.

[0039] When holding the polishing pad P1 on the polishing pad holding surface SP1, the controller 900 controls the vacuum source 91 to apply a negative pressure to the flow path 90. As a result, the polishing pad P1 located above the sub pad SP is held on the polishing pad holding surface SP1 by vacuum suction. When peeling the polishing pad P1 from the polishing pad holding surfaceSP1, the controller 900 controls the fluid supply source 92 to supply fluid to the flow path 90. As a result, the fluid is ejected from the sub pad suction holes SP8, and separation of the polishing pad P1 from the polishing pad holding surface SP1 can be promoted. The ejection of the fluid is referred to as blow. As an example, the fluid for the blow that is supplied from the fluid supply source 92 can be a gas such as nitrogen or air, or a liquid such as water.

[0040] Next, the feed operation of the polishing pad P1 by the polishing device 1000 of the embodiment will be described. FIGS. 5A-5C are diagrams for describing the feed operation of the polishing pad P1. As described above, when the substrate WF is polished, with the polishing pad P1 held by suction on the polishing pad holding surface SP1 (see FIG. 5A), the substrate WF held by the top ring 40 is pressed against the polishing pad P1. Then, as an example, the feed operation of the polishing pad P1 is performed by polishing a predetermined number (such as one or several) of substrates WF, or by external input from a user. The controller 900 may rotate the polishing table 30 to remove the liquid on the polishing pad P1 prior to the feed operation of the polishing pad P1.

[0041] In the feed operation of the polishing pad P1, first, the controller 900 stops the supply of the negative pressure from the vacuum source 91 (see FIG. 5B). At this time, the controller 900 may control the fluid supply source 92 to blow (eject fluid) between the polishing pad holding surface SP1 and the polishing pad P1. In this way, the separation of the polishing pad P1 from the polishing pad holding surface SP1 can be promoted.

[0042] Subsequently, the controller 900 controls the first motor 130 and the second motor 230 to supply the polishing pad P1 from the supply roll 100 and to wind the polishing pad P1 by using the winding roll 200 (see FIG. 5C). As a specific example, although not limited thereto, the controller 900 drives the first motor 130 so that the feed rate of the polishing pad P1 becomes constant to supply the polishing pad P1 from the supply roll 100, and drives the second motor 230 at a predetermined torque limit value to wind the polishing pad P1 by using the winding roll 200. At this time, under the torque limit, by setting the target winding speed of the winding roll 200 to be greater than a feed rate V1 of the supply roll 100, the winding roll 200 stretches the polishing pad P1 with a torque corresponding to the torque limit value while rotating at a winding speed equal to the feed rate V1. As a result, the polishing pad P1 is fed from the supply roll 100 to the winding roll 200 in a stretched state. That is, the feed rate V1 of the supply roll 100 becomes the same as the effective winding speed of the winding roll 200. Blowing may be continued when the polishing pad P1 is fed.

[0043] Next, when the polishing pad P1 is fed by a desired amount, the controller 900 stops the first motor 130 and the second motor 230, and supplies the negative pressure from the vacuum source 91. As a result, the renewed polishing pad P1 is held by suction on the polishing pad holding surface SP1 (see FIG. 5A). The polishing device 1000 can feed the polishing pad P1 through such operation.

[0044] The controller 900 may refer to the feed rate of the polishing pad P1 by the first motor 130 and the second motor 230, and when the speed difference between the winding speed of the winding roll 200 and the supply speed of the supply roll 100 is equal to or greater than a threshold value, the controller 900 may stop the feed operation or issue an error notification.

[0045] FIGS. 6A and 6B are diagrams for describing the adjustment to the gravity central position of the polishing table 30 by using the weight adjustment module 35 of the embodiment. FIG. 6A shows a state where the amount of the polishing pad P1 wound on the supply roll 100 is large and the amount of the polishing pad P1 wound on the winding roll 200 is small. In the state shown in FIG. 6A, because the weight of the supply roll 100 is greater than that of the winding roll 200, a relatively large weight acts on the polishing table 30 on the side of the supply roll 100, and a weight imbalance occurs with respect to the center axis C1. To eliminate such weight imbalance, the controller 900 positions the weight member 354 toward the side of the winding roll 200 as the weight of the supply roll 100 increases relative to the winding roll 200. Then, as described above, along with the polishing of the substrate WF, the polishing pad P1 is supplied from the supply roll 100 and the polishing pad P1 is wound by the winding roll 200, and the polishing pad P1 is fed. As a result, the weight of the supply roll 100 decreases and the weight of the winding roll 200 increases. FIG. 6B shows a state where the amount of the polishing pad P1 wound on the supply roll 100 is small and the amount of the polishing pad P1 wound on the winding roll 200 is large. In the state shown in FIG. 6B, the weight of the supply roll 100 is smaller than the winding roll 200, and the weight acting on the polishing table 30 has changed from the state shown in FIG. 6A. To eliminate the change in the gravity central position due to such weight change, the controller 900 moves the weight member 354 toward the side of the supply roll 100 as the weight of the supply roll 100 decreases relative to the winding roll 200.

[0046] As an example, the weight of the supply roll 100 and the winding roll 200 at the time when the use starts may be input to the controller 900 by external input or the like. Then, the position of the weight member 354 when the use starts may be set to the controller 900 based on the weight of the supply roll 100 and the winding roll 200 when the use starts. Instead of such an example, the position of the weight member 354 when the use starts may be set in the controller 900 by external input. Then, as an example, the controller 900 can control the weight adjustment module 35 based on the detection by the first displacement meter 140 and the second displacement meter 240. As a specific example, the controller 900 calculates the amount of the polishing pad P1 wound on the supply roll 100 and the winding roll 200 based on the radii R100, R200 detected by the first displacement meter 140 and the second displacement meter 240. Then, the controller 900 controls the weight adjustment module 35 to position the weight member 354 toward the side of the winding roll 200 as the weight of the supply roll 100 increases relative to the winding roll 200, based on the calculated amount of the polishing pad P1. Also, the controller 900 controls the weight adjustment module 35 to position the weight member 354 toward the side of the supply roll 100 as the weight of the supply roll 100 decreases relative to the winding roll 200, based on the calculated amount of the polishing pad P1. As an example, the controller 900 positions the weight member 354 at the center of the third side and the fourth side of the polishing table 30 when the weight of the winding roll 200 and the weight of the supply roll 100 are equal. Also, as an example, the controller 900 controls the weight adjustment module 35 so that the weight member 354 moves to a position on the opposite side from the initial position along the third side and the fourth side of the polishing table 30 when the polishing pad P1 wound on the supply roll 100 runs out. In this manner, in the polishing table 30 of the embodiment, the gravity central position of the polishing table 30 can be adjusted by the weight adjustment module 35, and the load on the rotation axis and the bearing of the polishing table 30 can be reduced.Modified Examples

[0047] In the embodiment described above, the controller 900 controls the weight adjustment module 35 based on the detection by the first displacement meter 140 and the second displacement meter 240. However, the controller 900 may control the weight adjustment module 35 based on other information instead of or in addition to the detection by the first displacement meter 140 and the second displacement meter 240. As one example, the controller 900 may control the weight adjustment module 35 based on the operation history of the first motor 130 and the second motor 230. Also, as one example, the polishing device 1000 may have a sensor for detecting the weight of the supply roll 100 or the winding roll 200 held by the first polishing pad holding module 310 or the second polishing pad holding module 320. Then, the controller 900 may move the weight member 354 toward the side of the winding roll 200 as the weight of the supply roll 100 increases relative to the winding roll 200, based on the detected weight. Also, the controller 900 may move the weight member 354 toward the side of the supply roll 100 as the weight of the supply roll 100 decreases relative to the winding roll 200, based on the detected weight.

[0048] In the embodiment described above, the controller 900 that handles the control of the entire polishing device 1000 controls the weight adjustment module 35 based on the detection by the first displacement meter 140 and the second displacement meter 240. However, the polishing device 1000 may include another controller (hereinafter referred to as "separate controller") for controlling the weight adjustment module 35, separately from the controller 900. In this case, the detection (detection signal) by the first displacement meter 140 and the second displacement meter 240 is input to a separate controller, and the separate controller may control the weight adjustment module 35 based on the detection signal in the same manner as the control by the controller 900 described above. The separate controller may be provided on the polishing table 30 and configured to be rotatable about the center axis C1 integrally with the polishing table 30. In this way, the first displacement meter 140 and the second displacement meter 240 can be connected to the separate controller, and the weight adjustment module 35 (drive source 356) can be connected to the separate controller without using a rotary switch or the like, and the polishing device 1000 can have a simple configuration.

[0049] In the embodiment described above, the polishing device 1000 includes the first centering roller 110, the first tension roller 120, the second centering roller 210, and the second tension roller 220. However, the polishing device 1000 may not include at least a part of the first centering roller 110, the first tension roller 120, the second centering roller 210, and the second tension roller 220. Also, in the embodiment described above, the polishing table 30 holds the polishing pad P1 on the polishing pad holding surface SP1 by vacuum suction, without including a vacuum suction mechanism.

[0050] The embodiment described above can also be described as the following configurations [Configuration 1] According to Configuration 1, a polishing device that polishing a substrate by using a polishing pad is provided. The polishing device includes: a polishing table, configured to be spinnable and defining a polishing pad holding surface for holding the polishing pad; first and second polishing pad holding modules, configured to be rotatable integrally with the polishing table and configured to hold the polishing pad wound in a roll shape, wherein the polishing pad supplied from the first polishing pad holding module is wound by the second polishing pad holding module, so that the polishing pad is configured to slide along the polishing pad holding surface; and a weight adjustment module, comprising: a guide member, extending in a direction in which the polishing pad slides along the polishing pad holding surface; and a weight member, configured to be movable along the guide member. According to Configuration 1, in the polishing device including a mechanism capable of renewing the polishing pad, a load applied to the rotation axis and the bearing of the polishing table can be reduced.

[0051] [Configuration 2] According to Configuration 2, in Configuration 1, a drive source is further provided. The drive source moves the weight member along the guide member. According to Configuration 2, the weight member can be moved by driving the drive source.

[0052] [Configuration 3] According to Configuration 3, in Configuration 2, a controller is further provided. The controller controls the drive source, so that the weight member is positioned toward a side of the second polishing pad holding module as an amount of the polishing pad held by the second polishing pad holding module decreases relative to an amount of the polishing pad held by the first polishing pad holding module, and the weight member is positioned toward a side of the second polishing pad holding module as the amount of the polishing pad held by the second polishing pad holding module increases relative to the amount of the polishing pad held by the first polishing pad holding module. According to Configuration 3, the load applied to the rotation axis and the bearing of the polishing table can be reduced by the control of the controller.

[0053] [Configuration 4] According to Configuration 4, in Configuration 3, a displacement meter is provided for detecting a roll diameter of the polishing pad held by at least one of the first polishing pad holding module and the second polishing pad holding module. The controller obtains the amount of the polishing pad held by at least one of the first polishing pad holding module and the second polishing pad holding module based on the roll diameter of the polishing pad detected by the displacement meter. According to Configuration 4, the controller can perform control based on the detection by the displacement meter.

[0054] [Configuration 5] According to Configuration 5, in Configuration 4, the displacement meter includes: a first displacement meter for detecting the roll diameter of the polishing pad held by the first polishing pad holding module; and a second displacement meter for detecting the roll diameter of the polishing pad held by the second polishing pad holding module. The first displacement meter detects a first position located in an end region on an end side in the polishing pad wound in the roll shape. The second displacement meter detects a second position located in an end region on an other end side in the polishing pad wound in the roll shape. According to Configuration 5, the controller can perform control based on the detection by the first and second displacement meters.

[0055] [Configuration 6] According to Configuration 6, in Configurations 1 to 5, the first polishing pad holding module includes a first motor as a drive source for supplying the polishing pad wound in the roll shape, the second polishing pad holding module includes a second motor as a drive source for winding the polishing pad wound in the roll shape, and the first motor and the second motor are configured to be rotatable integrally with the table, and are disposed at positions that are point-symmetric with respect to a spin axis of the polishing table when viewed in a direction perpendicular to the polishing pad holding surface. According to Configuration 6, the load acting on the rotation axis or the bearing of the polishing table due to the weight of the first motor and the second motor can be reduced.

[0056] [Configuration 7] According to Configuration 6, in Configurations 1 to 5, a first roller and a second roller are provided. The first tension roller is configured to be rotatable integrally with the table, the first tension roller has a rotation axis disposed along a first side of the polishing pad holding surface, and the polishing pad is hung on the first tension roller, the second tension roller, configured to be rotatable integrally with the polishing table, and the second tension roller has a rotation axis disposed along a second side of the polishing pad holding surface on an opposite side of the first side, and the polishing pad is hung on the second tension roller.

[0057] [Configuration 8] According to Configuration 8, in Configurations 1 to 7, a suction hole connected to a vacuum source is formed in the polishing pad holding surface. According to Configuration 8, the polishing pad can be vacuum-suctioned to the polishing pad holding surface.

[0058] Although the embodiments of the invention and the modification examples related thereto have been described above, it goes without saying that each of the above-described examples is for facilitating the understanding to the invention and does not limit the invention. The invention can be appropriately changed and improved without departing from the spirit thereof, and equivalents thereof are included in the invention. In addition, any combination or omission of each component described in the claims and the specification is possible within a range in which at least a part of the above-described problems can be solved or within a range in which at least a part of the effects can be achieved. As an example, the drive control of the first motor 130 and the second motor 230 described in the second embodiment can be applied to other embodiments.

Examples

modified examples

[0047]In the embodiment described above, the controller 900 controls the weight adjustment module 35 based on the detection by the first displacement meter 140 and the second displacement meter 240. However, the controller 900 may control the weight adjustment module 35 based on other information instead of or in addition to the detection by the first displacement meter 140 and the second displacement meter 240. As one example, the controller 900 may control the weight adjustment module 35 based on the operation history of the first motor 130 and the second motor 230. Also, as one example, the polishing device 1000 may have a sensor for detecting the weight of the supply roll 100 or the winding roll 200 held by the first polishing pad holding module 310 or the second polishing pad holding module 320. Then, the controller 900 may move the weight member 354 toward the side of the winding roll 200 as the weight of the supply roll 100 increases relative to the winding roll 200, based on...

Claims

1. A polishing device, polishing a substrate using a polishing pad, the polishing device comprising:a polishing table, configured to be spinnable and defining a polishing pad holding surface for holding the polishing pad;first and second polishing pad holding modules, configured to be rotatable integrally with the polishing table and configured to hold the polishing pad wound in a roll shape, wherein the polishing pad supplied from the first polishing pad holding module is wound by the second polishing pad holding module, so that the polishing pad is configured to slide along the polishing pad holding surface; anda weight adjustment module, comprising: a guide member, extending in a direction in which the polishing pad slides along the polishing pad holding surface; and a weight member, configured to be movable along the guide member.

2. The polishing device according to claim 1, further comprising: a drive source, moving the weight member along the guide member.

3. The polishing device according to claim 2, further comprising: a controller, controlling the drive source, so that the weight member is positioned toward a side of the second polishing pad holding module as an amount of the polishing pad held by the second polishing pad holding module decreases relative to an amount of the polishing pad held by the first polishing pad holding module, and the weight member is positioned toward a side of the second polishing pad holding module as the amount of the polishing pad held by the second polishing pad holding module increases relative to the amount of the polishing pad held by the first polishing pad holding module.

4. The polishing device according to claim 3, comprising:a displacement meter for detecting a roll diameter of the polishing pad held by at least one of the first polishing pad holding module and the second polishing pad holding module,wherein the controller obtains the amount of the polishing pad held by at least one of the first polishing pad holding module and the second polishing pad holding module based on the roll diameter of the polishing pad detected by the displacement meter.

5. The polishing device according to claim 4, wherein the displacement meter comprises: a first displacement meter for detecting the roll diameter of the polishing pad held by the first polishing pad holding module; and a second displacement meter for detecting the roll diameter of the polishing pad held by the second polishing pad holding module,the first displacement meter detects a first position located in an end region on an end side in the polishing pad wound in the roll shape, andthe second displacement meter detects a second position located in an end region on an other end side in the polishing pad wound in the roll shape.

6. The polishing device according to claim 1, wherein the first polishing pad holding module comprises a first motor as a drive source for supplying the polishing pad wound in the roll shape,the second polishing pad holding module comprises a second motor as a drive source for winding the polishing pad wound in the roll shape, andthe first motor and the second motor are configured to be rotatable integrally with the polishing table, and are disposed at positions that are point-symmetric with respect to a spin axis of the polishing table when viewed in a direction perpendicular to the polishing pad holding surface.

7. The polishing device according to claim 1, comprising:a first tension roller, configured to be rotatable integrally with the polishing table, wherein the first tension roller has a rotation axis disposed along a first side of the polishing pad holding surface, and the polishing pad is hung on the first tension roller; anda second tension roller, configured to be rotatable integrally with the polishing table, wherein the second tension roller has a rotation axis disposed along a second side of the polishing pad holding surface on an opposite side of the first side, and the polishing pad is hung on the second tension roller.

8. The polishing device according to claim 1, wherein a suction hole connected to a vacuum source is formed in the polishing pad holding surface.

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