Polishing device

Abstract

A polishing device for polishing a substrate using a polishing pad is provided, and the polishing device includes a polishing table configured to be capable of spinning and defining a polishing pad holding surface for holding the polishing pad. The polishing pad holding surface is formed with a suction hole connected to a vacuum source, and the polishing table includes a movable member configured to be movable between a protruding state in which the movable member protrudes from the polishing pad holding surface and pushes the polishing pad held on the polishing table in a direction to separate the polishing pad from the polishing pad holding surface, and a retracted state in which the movable member does not protrude from the polishing pad holding surface.

Description

CROSS-REFERENCE TO RELATED APPLICATION

[0001] This application claims the priority benefits of Japanese application No. 2025-060434, filed on Apr. 1, 2025. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.BACKGROUNDTechnical Field

[0002] The disclosure relates to a polishing device.Description of Related Art

[0003] In semiconductor manufacturing processes, polishing (CMP: Chemical Mechanical Polishing) devices are used to polish substrates. An example of such a polishing device is disclosed in Patent Document 1 (Japanese Patent Application Laid-Open Publication No. 2002-86351). The polishing device disclosed in Patent Document 1 includes a polishing table, and this polishing table is provided with a suction holding portion for holding a polishing pad by vacuum suction on the upper surface. The suction holding portion is configured by connecting a vacuum source such as a vacuum pump to multiple vacuum suction holes that open on the upper surface of the polishing table. Accordingly, in this polishing device, the polishing pad may be held by suction on the upper surface of the polishing table. As a result, the polishing pad is prevented from shifting relative to the polishing table during polishing.

[0004] In the polishing table described above, when replacing the polishing pad, the vacuum suction of the polishing pad is stopped, and the polishing pad is peeled off and removed from the polishing table. However, for example, the polishing pad and the polishing table may stick together due to polishing liquid entering between the polishing pad and the polishing table, or due to the material of the polishing pad or the polishing table. Thus, even if the vacuum suction of the polishing pad is stopped, it may be difficult to smoothly remove the polishing pad from the polishing table.

[0005] The disclosure has been made to solve at least a part of the above-described problems, and one of the objects is to provide a polishing device capable of smoothly removing a polishing pad held on a polishing table from the polishing table.SUMMARY

[0006] According to one embodiment of the disclosure, there is proposed a polishing device for polishing a substrate using a polishing pad, and the polishing device includes a polishing table configured to be capable of spinning and defining a polishing pad holding surface for holding the polishing pad. The polishing pad holding surface is formed with a suction hole connected to a vacuum source, and the polishing table includes a movable member configured to be movable between a protruding state in which the movable member protrudes from the polishing pad holding surface and pushes the polishing pad held on the polishing table in a direction to separate the polishing pad from the polishing pad holding surface, and a retracted state in which the movable member does not protrude from the polishing pad holding surface.BRIEF DESCRIPTION OF THE DRAWINGS

[0007] FIG. 1 is a front view of a polishing device according to one embodiment of the present disclosure.

[0008] FIG. 2 is a plan view of a polishing table of the polishing device.

[0009] FIG. 3 is a cross-sectional view showing a schematic configuration of the polishing table of the present embodiment.

[0010] FIG. 4 is a diagram showing an example of the movable member and the drive mechanism in a retracted state.

[0011] FIG. 5 is a diagram showing an example of the movable member and the drive mechanism in a protruding state.

[0012] FIG. 6 is a plan view schematically showing the polishing table of the present embodiment.

[0013] FIG. 7A is a diagram for describing a feed operation of the polishing pad P1.

[0014] FIG. 7B is a diagram for describing a feed operation of the polishing pad P1.

[0015] FIG. 7C is a diagram for describing a feed operation of the polishing pad P1.

[0016] FIG. 8A is a diagram for describing a feed operation of the polishing table of the second embodiment.

[0017] FIG. 8B is a diagram for describing a feed operation of the polishing table of the second embodiment.

[0018] FIG. 8C is a diagram for describing a feed operation of the polishing table of the second embodiment.

[0019] FIG. 8D is a diagram for describing a feed operation of the polishing table of the second embodiment.

[0020] FIG. 9 is a diagram showing a schematic configuration of the polishing table of the third embodiment.DESCRIPTION OF THE EMBODIMENTS

[0021] Hereinafter, embodiments of the disclosure will be described with reference to the drawings. In the drawings described below, the same or corresponding components are denoted by the same reference numerals, and redundant description will be omitted.First Embodiment

[0022] FIG. 1 is a front view of a polishing device 1000 according to an embodiment of the disclosure. FIG. 2 is a plan view of a polishing table 30 of the polishing device 1000. The polishing device 1000 has a function of polishing a substrate WF using a polishing pad P1. Here, the “substrate” includes not only semiconductor substrates, glass substrates, liquid crystal substrates, and printed circuit boards, but also magnetic recording media, magnetic recording sensors, mirrors, optical elements, micromechanical elements, partially fabricated integrated circuits, and any other processing objects. The substrate WF may be any shape including polygonal and circular shapes. The polishing device 1000 of the present embodiment includes a polishing table 30, a top ring 40, and a controller 900.

[0023] The polishing table 30 has, as an example, a substantially T-shaped configuration in side view (see FIG. 1) and a rectangular shape in plan view (see FIG. 2). The polishing table 30 includes a polishing table body 31 and a tabletop 32 that defines an upper surface on which a sub pad SP is disposed on the polishing table 30. In the present embodiment, the polishing table 30 supports a polishing pad P1 for polishing the substrate WF via the sub pad SP.

[0024] The sub pad SP may be any sub pad that may perform polishing with desired accuracy and various materials and dimensions may be adopted. The sub pad SP has, as an example, a substantially rectangular parallelepiped shape and is formed from resin or nonwoven fabric. The sub pad SP may be provided by being attached to the upper surface of the tabletop 32 with an adhesive or the like. The upper surface of the sub pad SP defines a polishing pad holding surface SP1 that holds the polishing pad P1. The sub pad SP may be a consumable item and may be replaced at a desired timing. However, the polishing table 30 does not need to be provided with the sub pad SP. In the case where the polishing table 30 does not include the sub pad SP, the upper surface of the tabletop 32 defines the polishing pad holding surface.

[0025] The polishing pad P1 is disposed on the polishing pad holding surface SP1, which is the upper surface of the sub pad SP, and is suctioned through sub pad suction holes SP8 (FIG. 3) described later that open to the polishing pad holding surface SP1. The upper surface of the polishing pad P1 (the surface on the opposite side from the surface in contact with the polishing pad holding surface SP1) constitutes a polishing surface for polishing the substrate WF.

[0026] In the present embodiment, supply holes 37 for supplying a polishing liquid such as slurry are provided near the center of the polishing table 30 (see FIG. 2). Holes are formed in the sub pad SP and the polishing pad P1 at positions corresponding to the supply holes 37. Accordingly, during polishing of the substrate WF, the polishing liquid is supplied from the supply holes 37 to the polishing surface of the polishing pad P1. Such a configuration may suitably supply the polishing liquid particularly even in the case where the substrate WF continues to cover the center of the polishing surface during polishing. In FIG. 2, four supply holes 37 are shown, but the number of supply holes 37 is not particularly limited and may be 1 to 3 or 5 or more. Further, the polishing device 1000 may be configured such that the polishing liquid is supplied to the polishing pad P1 from a polishing liquid supply port such as a nozzle provided above the polishing pad P1 instead of or in addition to the supply hole 37.

[0027] Further, the polishing table 30 is configured to be capable of spinning (rotating) around a center shaft (spin axis) C1 perpendicular to the polishing surface by a motor 38. As an example, the center shaft C1 extends in a vertical direction passing through the center of the polishing pad holding surface SP1 of the sub pad SP.

[0028] The top ring 40 is disposed above the polishing table 30 so as to be movable up and down. The top ring 40 is configured to detachably hold the substrate WF, which is the processing object, with the surface to be polished of the substrate WF facing downward (toward the polishing pad P1). The top ring 40 is configured to be capable of spinning (rotating) around the center shaft C2. As an example, the center shaft C2 extends in a vertical direction and extends parallel to the center shaft C1. During polishing, in a state where the polishing liquid is supplied from the supply holes 37 to the polishing surface of the polishing pad P1, the substrate WF is pressed against the polishing surface of the polishing pad P1 by the top ring 40 and polished. In this manner, the polishing device 1000 is configured to polish the substrate WF by bringing the polishing pad P1 and the substrate WF into contact with each other in the presence of the polishing liquid and rotating the same relative to each other.

[0029] Further, the polishing device 1000 includes, as an example, an atomizer (not shown). The atomizer has a function of removing the polishing liquid, polishing products, polishing pad residue due to dressing, and the like on the polishing surface by supplying at least one of a liquid (for example, pure water) and a gas (for example, nitrogen gas) to the polishing surface.

[0030] Further, as shown in FIG. 1, the polishing device 1000 includes a first polishing pad holding module 310 and a second polishing pad holding module 320. The first and second polishing pad holding modules 310 and 320 may be disposed below protruding parts that protrude on two sides of the T-shaped polishing table 30. In the example shown in FIG. 1, the first and second polishing pad holding modules 310 and 320 are located on opposite sides with respect to the center shaft C1 of the polishing table 30. The first and second polishing pad holding modules 310 and 320 are configured to be rotatable around the center shaft C1 integrally with the polishing table 30.

[0031] The first polishing pad holding module 310 is configured to hold a supply roll 100 in a state where the center of the supply roll 100 extends in the horizontal direction. The supply roll 100 is, for example, a roll-shaped pad in which an unused polishing pad P1 for supply is wound in a roll shape. The configuration of the first polishing pad holding module 310 is not particularly limited as long as it may rotatably hold the supply roll 100, and may be, for example, a support stand that rotatably supports the rotating shaft of the supply roll 100. Further, the second polishing pad holding module 320 is configured to hold a winding roll 200 in a state where the center of the winding roll 200 extends in the horizontal direction. The winding roll 200 is, for example, a roll-shaped pad in which a used polishing pad P1 that has passed above the polishing table 30 is wound in a roll shape. The configuration of the second polishing pad holding module 320 is not particularly limited as long as it may rotatably hold the winding roll 200, and may be, for example, a support stand that rotatably supports the rotating shaft of the winding roll 200.

[0032] As shown in FIG. 1, the polishing device 1000 includes a first supply side roller 110, a second supply side roller (first tension roller) 120, a first winding side roller 210, and a second winding side roller (second tension roller) 220, which are configured to have the polishing pad P1 hung thereon and to guide the polishing pad P1. The first supply side roller 110 and the second supply side roller 120 are rollers that the polishing pad P1 fed from the supply roll 100 contacts before reaching the polishing pad holding surface SP1 or above it. In other words, the first supply side roller 110 and the second supply side roller 120 are configured to contact the polishing pad P1 from the supply roll 100 to above the polishing table 30. The first winding side roller 210 and the second winding side roller 220 are rollers that the polishing pad P1 that has passed above the polishing pad holding surface SP1 contacts before being wound onto the winding roll 200.

[0033] The first supply side roller 110 is disposed diagonally downward from the supply roll 100 such that its rotation axis extends in a substantially horizontal direction. Further, the first winding side roller 210 is disposed diagonally downward from the winding roll 200 such that its rotation axis extends in a substantially horizontal direction. Since the first supply side roller 110 and the first winding side roller 210 are disposed below the supply roll 100 and the winding roll 200, respectively, it is possible to suppress the polishing liquid on the polishing surface from traveling along the polishing pad P1 to reach the supply roll 100 or the winding roll 200 and adversely affecting the supply roll 100 or the winding roll 200. At least one of the first supply side roller 110 and the first winding side roller 210 may have a shape in which the outer diameter increases toward the central portion in the longitudinal direction (rotation axis direction). This makes it possible to prevent the polishing pad P1 from shifting in the longitudinal direction of the first supply side roller 110 or the first winding side roller 210 and to prevent meandering.

[0034] The second supply side roller 120 is a roller disposed above the first supply side roller 110. Further, the second winding side roller 220 is a roller disposed above the first winding side roller 210. The second supply side roller 120 and the second winding side roller 220 are disposed along the upper surface of the polishing table 30 or the polishing pad holding surface SP1, at the side of the upper surface of the polishing table 30 or the polishing pad holding surface SP1. In the present embodiment, the second supply side roller 120 is disposed along a first side (the right side in FIG. 2) of the polishing pad holding surface SP1, and the second winding side roller 220 is disposed along a second side (the left side in FIG. 2) which is the opposite side of the first side of the polishing pad holding surface SP1. In the present embodiment, when a predetermined tension is applied to the polishing pad P1, the polishing pad P1 is configured to extend substantially parallel to the polishing pad holding surface SP1 between the second supply side roller 120 and the second winding side roller 220. Here, as an example, the second supply side roller 120 and the second winding side roller 220 may support the polishing pad P1 at the same height as the polishing pad holding surface SP1. The second supply side roller 120 and the second winding side roller 220 are cylindrical as an example, from the viewpoint of stretching the polishing pad P1 horizontally.

[0035] Further, the polishing device 1000 further includes a first motor 130 that drives the rotation of the supply roll 100 and a second motor 230 that drives the rotation of the winding roll 200. The first motor 130 and the second motor 230 are controlled by the controller 900. The first motor 130 and the second motor 230 are connected to the rotating shafts of the supply roll 100 and the winding roll 200 via a transmission mechanism (not shown) that transmits rotational force, such as a timing belt. The first motor 130 and the second motor 230 may be disposed below the protruding parts that protrude on two sides of the T-shaped polishing table 30. Further, as an example, the first motor 130 and the second motor 230 are disposed on the inner side (center shaft C1 side) of the supply roll 100 and the winding roll 200.

[0036] In the polishing device 1000, the movement direction of the polishing pad P1 supplied from the supply roll 100 is changed by the first supply side roller 110 and the second supply side roller 120. Then, the polishing pad P1 slides in the horizontal direction along the polishing pad holding surface SP1. After that, the movement direction of the polishing pad P1 is changed by the second winding side roller 220 and the first winding side roller 210. Then, the polishing pad P1 is wound onto the winding roll 200. In this way, the polishing device 1000 is configured so that the polishing pad P1 may slide along the polishing pad holding surface SP1. Thus, in the polishing device 1000, a used and worn portion of the polishing pad P1 may be slid and replaced with an unused portion for renewal.

[0037] FIG. 3 is a cross-sectional view showing a schematic configuration of the polishing table 30 of the present embodiment. As shown, the polishing table 30 of the present embodiment includes multiple suction holes 328 that open on the upper surface of the polishing table 30 and a flow path 90 that is in fluid communication with the multiple suction holes 328. The multiple suction holes 328 are through holes that penetrate the tabletop 32 of the polishing table 30 in the thickness direction. The polishing device 1000 further includes a vacuum source 91, a fluid source 92, and a pressure gauge 93 for measuring the pressure of the flow path 90. The flow path 90 may include a valve (not shown) and may be configured to selectively fluidly connect the multiple suction holes 328 with either the vacuum source 91 or the fluid source 92. Alternatively, the multiple suction holes 328 may be fluidly connected to the vacuum source 91, and fluid supply holes provided separately from the multiple suction holes 328 may be fluidly connected to the fluid source 92. It is noted that the polishing device 1000 does not have to include the fluid source 92. In the sub pad SP, multiple sub pad suction holes SP8 are formed at positions corresponding to the multiple suction holes 328. The sub pad suction holes SP8 penetrate the plate-shaped sub pad SP in the thickness direction. The sub pad SP is disposed on the upper surface of the polishing table 30 such that the multiple sub pad suction holes SP8 communicate with the multiple suction holes 328 formed on the upper surface of the polishing table 30.

[0038] When holding the polishing pad P1 on the polishing pad holding surface SP1, the controller 900 controls the vacuum source 91 to apply negative pressure to the flow path 90. As a result, the polishing pad P1 above the sub pad SP is adhered by suction to the polishing pad holding surface SP1. When peeling the polishing pad P1 from the polishing pad holding surface SP1, the controller 900 controls the fluid source 92 to supply fluid to the flow path 90. As a result, fluid is ejected from the sub pad suction holes SP8, and separation of the polishing pad P1 from the polishing pad holding surface SP1 may be promoted. This ejection of fluid is called blow. As an example, the fluid for blow supplied from the fluid source 92 may be a gas such as nitrogen or air, or a fluid such as water.

[0039] In the present embodiment, multiple cooling grooves 31a are formed in the polishing table body 31. The upper part of the cooling grooves 31a is closed by the tabletop 32. As a result, the cooling grooves 31a may function as flow paths. As an example, the flow paths defined by the cooling grooves 31a are provided separately so as not to communicate with the suction holes 328 and the flow path 90. The cooling grooves 31a are in fluid communication with a cooling water supply source (not shown). As a result, cooling water may flow through the cooling grooves 31a. With such a configuration, polishing of the substrate WF may be performed while cooling the polishing table 30.

[0040] Further, the polishing table 30 of the present embodiment includes a movable member 330 that may move in a direction perpendicular to the polishing pad holding surface SP1 (vertical direction) and a drive mechanism 340 that moves the movable member 330. The movable member 330 may move between a protruding state in which it protrudes from the polishing pad holding surface SP1 and a retracted state in which it does not protrude from the polishing pad holding surface SP1. FIG. 4 is a diagram showing an example of the movable member 330 and the drive mechanism 340 in the retracted state, and FIG. 5 is a diagram showing an example of the movable member 330 and the drive mechanism 340 in the protruding state. As shown in FIG. 3 to FIG. 5, the movable member 330 is disposed in an opening part 338 that opens on the upper surface of the polishing table 30 separately from the suction holes 328 and may move up and down within the opening part 338. The movable member 330 is, although not limited thereto, made of resin as an example and has a generally cylindrical shape. Further, in the example shown in FIG. 3 to FIG. 5, the movable member 330 has a flange part 331, and the opening part 338 has a contact part 339 formed with dimensions smaller than the flange part 331. As a result, as shown in FIG. 5, in the protruding state, the flange part 331 and the contact part 339 come into contact, and further movement of the movable member 330 is restricted.

[0041] In the present embodiment, the drive mechanism 340 includes a diaphragm 342 and a first pressure adjustment mechanism 344. The diaphragm 342 defines a pressure chamber 343 within the opening part 338, and the first pressure adjustment mechanism 344 is connected to the pressure chamber 343. The movable member 330 is disposed on the diaphragm 342. Further, the polishing table 30 of the present embodiment includes a stopper 348 on which the movable member 330 on the diaphragm 342 is placed in the retracted state. With this configuration, when pressure is not supplied into the pressure chamber 343, the entire movable member 330 is in the retracted state where it does not protrude from the polishing pad holding surface SP1 (see FIG. 4). In the retracted state, the movable member 330 is positioned on the stopper 348 via the diaphragm 342. In the retracted state, the movable member 330 may protrude from the upper surface of the polishing table 30, or may be positioned below the upper surface without protruding from the upper surface of the polishing table 30. On the other hand, when the inside of the pressure chamber 343 is pressurized by the first pressure adjustment mechanism 344, the diaphragm 342 expands upward, and a part of the movable member 330 exits from the opening part 338 and enters the protruding state where it protrudes from the polishing pad holding surface SP1 (see FIG. 5). In the protruding state, the flange part 331 of the movable member 330 contacts the contact part 339 of the opening part 338, and upward movement is restricted. Further, in the protruding state, the movable member 330 protrudes from the polishing pad holding surface SP1, thereby pushing the polishing pad P1 placed on the polishing pad holding surface SP1 and physically separating it from the polishing pad holding surface SP1. The diaphragm 342 may be any member that displaces according to the pressure in the pressure chamber 343, and is, for example, a bellofram. Further, the first pressure adjustment mechanism 344 may be any mechanism capable of adjusting the pressure of the pressure chamber 343 by supplying a fluid such as gas or liquid to the pressure chamber 343, and the fluid source 92 may be used. Furthermore, although not limiting, the movable member 330 preferably has rounded corners at the top so as not to damage the polishing pad P1 upon contact with the polishing pad P1.

[0042] Further, in the polishing table 30 of the present embodiment, a second pressure adjustment mechanism 345 is connected to the space within the opening part 338 where the movable member 330 is disposed, that is, the space outside the pressure chamber 343 within the opening part 338. The second pressure adjustment mechanism 345 may be any mechanism capable of supplying a fluid such as gas or liquid to pressurize the inside of the opening part 338, and the fluid source 92 may be used. By supplying a first pressure higher than the ambient pressure in the polishing device 1000 from the second pressure adjustment mechanism 345 into the opening part 338, fluid flows out from the gap between the movable member 330 and the opening part 338. This may suppress polishing liquid and the like from flowing into the opening part 338. In such a configuration, in the case of moving the movable member 330 to the protruding state, the first pressure adjustment mechanism 344 may supply a second pressure higher than the first pressure to the pressure chamber 343 to inflate the diaphragm 342. Further, in the case of moving the movable member 330 to the retracted state, the pressure chamber 343 may be opened to atmosphere, or a third pressure lower than the first pressure may be supplied from the first pressure adjustment mechanism 344 to the pressure chamber 343.

[0043] FIG. 6 is a plan view schematically showing the polishing table 30 of the present embodiment. As one example, the movable member 330 is disposed over the entire area of the tabletop 32. As another example, the movable member 330 is not disposed in the region where the substrate WF contacts on the polishing pad holding surface SP1 (the region R1 enclosed by the two-dot chain line in FIG. 6), but is disposed in a region where the substrate WF does not contact on the polishing pad holding surface SP1. As yet another example, the movable member 330 is disposed at a position farther from the center shaft C1 of the polishing table 30 than the suction hole 328. As still another example, the movable member 330 is not disposed in a region where the cooling groove 31a is provided in the polishing table 30, but is disposed in a region where the cooling groove 31a is not provided. The position and number of the movable members 330 may be determined by experiment or simulation, and the movable members 330 may be provided in any manner. As one example, the movable members 330 are disposed at positions that are rotationally symmetric about the center shaft C1.

[0044] It is noted that the polishing device 1000 does not need to include the second pressure adjustment mechanism 345. Further, the drive mechanism 340 is not limited to one that moves the movable member 330 by adjusting the pressure within the pressure chamber 343 defined by the diaphragm 342, and various known mechanisms capable of moving the movable member 330 may be adopted.

[0045] Next, the feed operation of the polishing pad P1 by the polishing device 1000 of the present embodiment will be described. FIG. 7A to FIG. 7C are diagrams for describing the feed operation of the polishing pad P1. As described above, when the substrate WF is polished, with the polishing pad P1 held by suction on the polishing pad holding surface SP1 (see FIG. 7A), the substrate WF held by the top ring 40 is pressed against the polishing pad P1. Then, as one example, the feed operation of the polishing pad P1 is performed by polishing a predetermined number (such as one or several) of substrates WF, or by external input from a user. The controller 900 may rotate the polishing table 30 to remove liquid on the polishing pad P1 prior to the feed operation of the polishing pad P1.

[0046] In the feed operation of the polishing pad P1, first, the controller 900 stops the supply of negative pressure from the vacuum source 91 and moves the movable member 330 to the protruding state (see FIG. 7B). It is noted that in FIG. 7B, the movable member 330 is drawn larger for ease of understanding. By the movable member 330 moving to the protruding state, the movable member 330 contacts the back surface of the polishing pad P1 (the surface placed on the polishing pad holding surface SP1) and may push the polishing pad P1 in a direction to separate it from the polishing pad holding surface SP1. As a result, even in cases where the polishing pad P1 and the polishing pad holding surface SP1 are stuck together, the polishing pad P1 may be smoothly removed from the polishing table 30. Further, the controller 900 may move the movable member 330 to the protruding state and also control the fluid source 92 to blow (inject fluid) between the polishing pad holding surface SP1 and the polishing pad P1. In this way, separation of the polishing pad P1 from the polishing pad holding surface SP1 may be further promoted.

[0047] Subsequently, the controller 900 controls the first motor 130 and the second motor 230 to supply the polishing pad P1 from the supply roll 100 and to wind the polishing pad P1 with the winding roll 200 (see FIG. 7C). As a result, the polishing pad P1 slides along the polishing pad holding surface SP1, and the polishing pad P1 is fed. When the polishing pad P1 is fed, as one example, the movable member 330 is placed in the retracted state. Further, blowing may be continued when the polishing pad P1 is fed. The controller 900 stops the first motor 130 and the second motor 230 when the polishing pad P1 has been fed by a desired amount. Then, the controller 900 supplies negative pressure from the vacuum source 91 with the movable member 330 in the retracted state and the blowing stopped. As a result, the renewed polishing pad P1 is held by suction on the polishing pad holding surface SP1 (see FIG. 7A). The polishing device 1000 may feed the polishing pad P1 through such operations.

[0048] It is noted that the controller 900 may refer to the feed rate of the polishing pad P1 by the first motor 130 and the second motor 230, and when the speed difference between the winding speed of the winding roll 200 and the supply speed of the supply roll 100 is equal to or greater than a threshold value, the controller 900 may stop the feed operation or provide an error notification. In this case, the controller 900 may execute a retry operation in which the movable member 330 is placed in the protruding state again and then the first motor 130 and the second motor 230 are controlled. In the retry operation, the first pressure adjustment mechanism 344 may be controlled so that a pressure higher than the pressure previously supplied to the pressure chamber 343 is supplied.Second Embodiment

[0049] FIG. 8A to FIG. 8D are diagrams for describing the feed operation of the polishing table 30B of the second embodiment. The polishing table 30B of the second embodiment differs from the above-described embodiment in the positions of the second supply side roller 120 and the second winding side roller 220, and other configurations are the same as the above-described embodiment. That is, in the polishing table 30B of the second embodiment, the second supply side roller (first tension roller) 120 and the second winding side roller (second tension roller) 220 are arranged to support the polishing pad P1 at a position higher than the polishing pad holding surface SP1. Hereinafter, the feed operation of the polishing pad P1 in the polishing table 30B of the second embodiment will be described. It is noted that the polishing table 30B of the second embodiment does not need to include the movable member 330. In FIG. 8A to FIG. 8D, illustration of the movable member 330 is omitted. Further, in the feed operation in the second embodiment, the movable member 330 may operate in the same manner as the feed operation described above with reference to FIG. 7A to FIG. 7C, and in the following description, the description of the operation of the movable member 330 is omitted.

[0050] In the polishing table 30B of the second embodiment, when the substrate WF is polished, the substrate WF held by the top ring 40 is pressed against the polishing pad P1 while the polishing pad P1 is held by suction on the polishing pad holding surface SP1 (see FIG. 8A). When feeding the polishing pad P1, first, the controller 900 stops the supply of negative pressure from the vacuum source 91. Further, the controller 900 controls the first motor 130 to keep the rotation of the supply roll 100 stopped, while controlling the second motor 230 to cause the winding roll 200 to wind the polishing pad P1 at the torque limit value (see FIG. 8B). At this time, since the rotation of the supply roll 100 is stopped, the polishing pad P1 is hardly wound on the winding roll 200. The torque limit value is a torque set to apply a constant tension to the polishing pad P1 and may be set based on the radius of the supply roll 100 as an example. Here, since the second supply side roller 120 and the second winding side roller 220 are arranged at a position higher than the polishing pad holding surface SP1, the polishing pad P1 is stretched between the second supply side roller 120 and the second winding side roller 220, and separation of the polishing pad P1 from the polishing pad holding surface SP1 may be promoted. It is noted that the controller 900 may control the first motor 130 and the second motor 230, and also control the fluid source 92 to blow (inject fluid) between the polishing pad holding surface SP1 and the polishing pad P1. In this way, separation of the polishing pad P1 from the polishing pad holding surface SP1 may be further promoted.

[0051] Subsequently, the controller 900 drives the first motor 130 so that the feed rate of the polishing pad P1 becomes constant to supply the polishing pad P1 from the supply roll 100 and drives the second motor 230 at the torque limit value to cause the winding roll 200 to wind the polishing pad P1 (see FIG. 8C). At this time, under torque limitation, the target winding speed of the winding roll 200 is set to be greater than the feed rate V1 of the supply roll 100, so that the winding roll 200 pulls the polishing pad P1 by the tension corresponding to the torque limit value while rotating at a winding speed equal to the feed rate V1. As a result, the polishing pad P1 is fed from the supply roll 100 to the winding roll 200 in a taut state. That is, the feed rate V1 of the supply roll 100 becomes the same as the effective winding speed of the winding roll 200.

[0052] Next, when the polishing pad P1 has been fed by a desired amount, the controller 900 stops driving the first motor 130 and the second motor 230 (see FIG. 8D) and causes negative pressure to be supplied from the vacuum source 91. As a result, the updated polishing pad P1 is held by suction on the polishing pad holding surface SP1 (see FIG. 8A). The polishing device 1000 may feed the polishing pad P1 through such operations. In the case where the positions of the second supply side roller 120 and the second winding side roller 220 are high and the polishing pad P1 is not suitably held by suction on the polishing pad holding surface SP1, the controller 900 may perform control to drive the second motor 230 to rotate the winding roll 200 in reverse. In this way, the polishing pad P1 may be loosened and brought closer to the polishing pad holding surface SP1, and suction of the polishing pad P1 to the polishing pad holding surface SP1 may be promoted. Further, the controller 900 may determine that suction of the polishing pad P1 to the polishing pad holding surface SP1 has not been completed in the case where the pressure at the suction hole 328 does not reach a predetermined pressure. Furthermore, the controller 900 may provide an error notification in the case where the pressure at the suction hole 328 does not reach the predetermined pressure even after negative pressure has been applied to the suction hole 328 for a predetermined time.Third Embodiment

[0053] FIG. 9 is a diagram showing a schematic configuration of a polishing table 30C of the third embodiment. The polishing table 30C of the third embodiment differs from the above-described embodiments in that the second supply side roller 120 and the second winding side roller 220 are configured to be movable up and down, and other configurations are the same as the embodiment described with reference to FIG. 1 and the like. In the polishing table 30C of the third embodiment, the second supply side roller (first tension roller) 120 and the second winding side roller (second tension roller) 220 are configured to be movable up and down between a first position that supports the polishing pad P1 at substantially the same height position as the polishing pad holding surface SP1 and a second position that supports the polishing pad P1 at a position higher than the polishing pad holding surface SP1. Further, the polishing table 30C includes a drive mechanism 150 that moves the second supply side roller 120 and the second winding side roller 220 up and down. As the drive mechanism 150, various known mechanisms may be adopted, such as a mechanism using a ball screw.

[0054] In the polishing table 30C of the third embodiment configured in this manner, the controller 900 positions the second supply side roller 120 and the second winding side roller 220 at the first position when causing the polishing pad P1 to be held by suction on the polishing pad holding surface SP1. Further, the controller 900 positions the second supply side roller 120 and the second winding side roller 220 at the second position when feeding the polishing pad P1. At this time, the controller 900 may place at least one of the first motor 130 and the second motor 230 in a free-run state (a state in which the rotation of the motor is not electromagnetically constrained and rotates according to external force). In this way, the second supply side roller 120 and the second winding side roller 220 may be easily moved to the second position. By the second supply side roller 120 and the second winding side roller 220 moving to the second position, separation of the polishing pad P1 from the polishing pad holding surface SP1 may be promoted, similar to what was described in the polishing table 30B of the second embodiment.

[0055] In the third embodiment, both the second supply side roller 120 and the second winding side roller 220 are configured to be movable up and down. However, in the polishing table 30C, only one of the second supply side roller 120 and the second winding side roller 220 may be configured to be movable up and down. Further, the polishing table 30C includes the drive mechanism 150 that moves the second supply side roller 120 and the second winding side roller 220 up and down. However, the polishing table 30C does not need to include the drive mechanism 150. As an example, the second supply side roller 120 may be configured to be lifted upward by outputting a torque equal to or greater than a predetermined torque from the second motor 230.Modification Example

[0056] In the embodiments described above, the polishing device 1000 is configured to be able to feed the polishing pad P1 from the supply roll 100 to the winding roll 200. However, the polishing device 1000 does not need to include a feed mechanism for the polishing pad P1, and as an example, the polishing pad P1 may be adhered to and held on the polishing pad holding surface SP1.

[0057] The present embodiment described above may also be described as the following aspects. [Aspect 1] According to Aspect 1, a polishing device for polishing a substrate using a polishing pad is proposed, and the polishing device includes a polishing table configured to be capable of spinning and defining a polishing pad holding surface for holding the polishing pad. The polishing pad holding surface is formed with a suction hole connected to a vacuum source, and the polishing table includes a movable member configured to be movable between a protruding state in which the movable member protrudes from the polishing pad holding surface and pushes the polishing pad held on the polishing table in a direction to separate the polishing pad from the polishing pad holding surface, and a retracted state in which the movable member does not protrude from the polishing pad holding surface. According to Aspect 1, the polishing pad held on the polishing table may be smoothly removed from the polishing table.

[0058] [Aspect 2] According to Aspect 2, in Aspect 1, a drive mechanism for moving the movable member between the protruding state and the retracted state is further provided. According to Aspect 2, the movable member may be moved between the protruding state and the retracted state by the drive mechanism.

[0059] [Aspect 3] According to Aspect 3, in Aspect 2, the drive mechanism has a diaphragm defining a pressure chamber connected to a pressure adjustment mechanism and moves the movable member by pressure adjustment in the pressure chamber by the pressure adjustment mechanism. According to Aspect 2, the movable member may be moved between the protruding state and the retracted state by pressure adjustment in the pressure chamber.

[0060] [Aspect 4] According to Aspect 4, in Aspect 3, the polishing table is formed with an accommodation space in which the movable member is accommodated, a second pressure adjustment mechanism is connected to the accommodation space, and the polishing device includes a controller that controls the pressure adjustment mechanism and the second pressure adjustment mechanism to supply a first pressure higher than an ambient pressure to the accommodation space and supply a second pressure higher than the first pressure to the pressure chamber when moving the movable member from the protruding state to the retracted state. According to Aspect 4, inflow of polishing liquid or the like into the accommodation space may be suppressed.

[0061] [Aspect 5] According to Aspect 5, in Aspects 1 to 4, when viewed from a direction perpendicular to the polishing pad holding surface, the movable member is disposed at a position farther from a spin axis of the polishing table than the suction hole. According to Aspect 5, the configuration of the region where the suction hole is formed may be suppressed from becoming complicated.

[0062] [Aspect 6] According to Aspect 6, in Aspects 1 to 5, the polishing device includes a first polishing pad holding module configured to be rotatable integrally with the polishing table and configured to hold the polishing pad wound in a roll shape and a second polishing pad holding module configured to be rotatable integrally with the polishing table and configured to hold the polishing pad wound in a roll shape. The polishing pad is configured to slide along the polishing pad holding surface by the polishing pad supplied from the first polishing pad holding module being wound by the second polishing pad holding module. According to Aspect 6, the polishing pad may be fed along the polishing pad holding surface.

[0063] [Aspect 7] According to Aspect 7, in Aspect 6, the polishing device includes a first tension roller configured to be rotatable integrally with the polishing table, having a rotation axis disposed along a first side of the polishing pad holding surface, and on which the polishing pad is hung, and a second tension roller configured to be rotatable integrally with the polishing table, having a rotation axis disposed along a second side opposite to the first side of the polishing pad holding surface, and on which the polishing pad is hung. The polishing pad holding surface is defined on an upper surface of the polishing table, and at least one of the first tension roller and the second tension roller is configured to be capable of supporting the polishing pad at a position higher than the polishing pad holding surface. According to Aspect 7, the polishing pad held on the polishing table may be smoothly removed from the polishing table.

[0064] [Aspect 8] According to Aspect 8, in Aspect 7, at least one of the first tension roller and the second tension roller is configured to be movable in an up-down direction and configured to be capable of supporting the polishing pad at a same height as the polishing pad holding surface and at a position higher than the polishing pad holding surface. According to Aspect 8, the polishing pad held on the polishing table may be smoothly removed from the polishing table.

[0065] [Aspect 9] According to Aspect 9, a polishing device for polishing a substrate using a polishing pad is proposed, and the polishing device includes a polishing table configured to be capable of spinning and defining a polishing pad holding surface on an upper surface for holding the polishing pad, a first polishing pad holding module configured to be rotatable integrally with the polishing table and configured to hold the polishing pad wound in a roll shape, a second polishing pad holding module configured to be rotatable integrally with the polishing table and configured to hold the polishing pad wound in a roll shape, a first tension roller configured to be rotatable integrally with the polishing table, having a rotation axis disposed along a first side of the polishing pad holding surface, and on which the polishing pad is hung, and a second tension roller configured to be rotatable integrally with the polishing table, having a rotation axis disposed along a second side opposite to the first side of the polishing pad holding surface, and on which the polishing pad is hung. At least one of the first tension roller and the second tension roller is configured to be capable of supporting the polishing pad at a position higher than the polishing pad holding surface. The polishing pad is configured to slide along the polishing pad holding surface by the polishing pad supplied from the first polishing pad holding module being wound by the second polishing pad holding module. According to Aspect 9, the polishing pad held on the polishing table may be smoothly removed from the polishing table.

[0066] [Aspect 10] According to Aspect 10, in Aspect 9, at least one of the first tension roller and the second tension roller is configured to be movable in an up-down direction and configured to be capable of supporting the polishing pad at a same height as the polishing pad holding surface and at a position higher than the polishing pad holding surface. According to Aspect 10, the polishing pad held on the polishing table may be smoothly removed from the polishing table.

[0067] Although the embodiments of the disclosure and the modification examples related thereto have been described above, it goes without saying that each of the above-described examples is for facilitating understanding of the disclosure and does not limit the disclosure. The disclosure may be appropriately changed and improved without departing from the spirit thereof, and equivalents thereof are included in the disclosure. Further, any combination or omission of the constituent elements described in the claims and the specification is possible within a range in which at least a part of the above-described problems may be solved or within a range in which at least a part of the effects may be achieved. As an example, the drive control of the first motor 130 and the second motor 230 described in the second embodiment may be applied to other embodiments.

Claims

1. A polishing device for polishing a substrate using a polishing pad, the polishing device comprising:a polishing table, configured to be capable of spinning and defining a polishing pad holding surface for holding the polishing pad,wherein the polishing pad holding surface is formed with a suction hole connected to a vacuum source, andthe polishing table comprises a movable member configured to be movable between a protruding state in which the movable member protrudes from the polishing pad holding surface and pushes the polishing pad held on the polishing table in a direction to separate the polishing pad from the polishing pad holding surface, and a retracted state in which the movable member does not protrude from the polishing pad holding surface.

2. The polishing device according to claim 1, further comprising a drive mechanism for moving the movable member between the protruding state and the retracted state.

3. The polishing device according to claim 2, wherein the drive mechanism has a diaphragm defining a pressure chamber connected to a pressure adjustment mechanism and moves the movable member by pressure adjustment in the pressure chamber by the pressure adjustment mechanism.

4. The polishing device according to claim 3, wherein the polishing table is formed with an accommodation space in which the movable member is accommodated,a second pressure adjustment mechanism is connected to the accommodation space, andthe polishing device comprises a controller that controls the pressure adjustment mechanism and the second pressure adjustment mechanism to supply a first pressure higher than an ambient pressure to the accommodation space and supply a second pressure higher than the first pressure to the pressure chamber when moving the movable member from the protruding state to the retracted state.

5. The polishing device according to claim 1, wherein when viewed from a direction perpendicular to the polishing pad holding surface, the movable member is disposed at a position farther from a spin axis of the polishing table than the suction hole.

6. The polishing device according to claim 1, the polishing device comprising:a first polishing pad holding module configured to be rotatable integrally with the polishing table and configured to hold the polishing pad wound in a roll shape; anda second polishing pad holding module configured to be rotatable integrally with the polishing table and configured to hold the polishing pad wound in a roll shape,wherein the polishing pad is configured to slide along the polishing pad holding surface by the polishing pad supplied from the first polishing pad holding module being wound by the second polishing pad holding module.

7. The polishing device according to claim 6, comprising:a first tension roller configured to be rotatable integrally with the polishing table, having a rotation axis disposed along a first side of the polishing pad holding surface, and on which the polishing pad is hung; anda second tension roller configured to be rotatable integrally with the polishing table, having a rotation axis disposed along a second side opposite to the first side of the polishing pad holding surface, and on which the polishing pad is hung,wherein the polishing pad holding surface is defined on an upper surface of the polishing table, andat least one of the first tension roller and the second tension roller is configured to be capable of supporting the polishing pad at a position higher than the polishing pad holding surface.

8. The polishing device according to claim 7, wherein at least one of the first tension roller and the second tension roller is configured to be movable in an up-down direction and configured to be capable of supporting the polishing pad at a same height as the polishing pad holding surface and at a position higher than the polishing pad holding surface.

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