Liquid-cooling heat exchange device

Abstract

The present application provides a liquid-cooled heat exchange device including a cover module, a base module, a flow guide plate, a spacer unit, and a heat dissipation module. The flow guide plate is assembled between the cover module and the base module and has a plurality of inlet holes arranged in an array and a plurality of adjacent outlet holes. The spacer unit defines a first space and a second space between the cover module and the flow guide plate. The inlet holes correspond to the first space and communicate with a third space between the flow guide plate and the base module. The third space accommodates the heat dissipation module and communicates with the outlet holes and the second space, such that liquid flows through the heat dissipation module and is discharged through the second space, thereby improving heat dissipation efficiency.

Description

FIELD OF THE INVENTION

[0001] The present application relates to a heat exchange device, and more particularly to a liquid-cooled heat exchange device that performs heat exchange by using a liquid.BACKGROUND OF THE INVENTION

[0002] With the advancement of computer technology, the functions of central processing units in servers have become increasingly powerful. In order to provide better processing performance for the central processing units, heat dissipation structures such as heat dissipation fins or fans are usually provided, whereby a heat dissipation effect is achieved through the flow of air.

[0003] However, although structures such as heat dissipation fins or fans can rapidly conduct the heat to the fins for cooling and can even increase air flow, the spacing between the fins is limited, and the cooling efficiency of the airflow is constrained. Therefore, it is necessary to provide a device that utilizes cooling liquid for heat exchange, thereby overcoming the above-mentioned drawbacks.SUMMARY OF THE INVENTION

[0004] In order to solve the above-mentioned drawbacks, the present application provides a liquid-cooled heat exchange device, configured to dissipate heat by performing heat exchange with a liquid, the liquid-cooled heat exchange device comprising a cover module, a base module, a flow guide plate, a spacer unit, and a heat dissipation module; the cover module is provided with a first through hole and a second through hole on a surface thereof, the first through hole being connected in communication with a first pipe, and the second through hole being connected in communication with a second pipe; the base module is assembled on another surface of the cover module; the flow guide plate is assembled and is accommodated between the cover module and the base module, wherein a third space is formed between the flow guide plate and the base module, and the flow guide plate is provided with a plurality of inlet holes arranged in an array and a plurality of outlet holes adjacent to the plurality of inlet holes; the spacer unit is assembled between the flow guide plate and the cover module, wherein the spacer unit defines a first space and a second space adjacent to the first space to be formed between the flow guide plate and the cover module; the heat dissipation module is assembled between the flow guide plate and the base module, wherein the heat dissipation module is provided with a plurality of protruding portions, a plurality of recessed portions, and a plurality of communicating portions, the plurality of protruding portions and the plurality of recessed portions being alternately arranged along a direction, each of the plurality of protruding portions being provided with the plurality of communicating portions in communication with the adjacent recessed portions; wherein the liquid flows from the first pipe and sequentially flows through the first space, the third space, and the second space, and then flows out from the second pipe; wherein the spacer unit protrudes from the flow guide plate between the plurality of inlet holes and the plurality of outlet holes.

[0005] In one embodiment, the heat dissipation module is provided with an outlet portion having a hollow structure at each position corresponding to one of the outlet holes.

[0006] In one embodiment, the heat dissipation module is provided with a plurality of connecting portions along a first direction, each of the plurality of connecting portions extending along the first direction and connecting the protruding portions protruding toward a second direction.

[0007] In one embodiment, a plurality of upright portions is disposed between two adjacent connecting portions, and the plurality of upright portions is disposed between the plurality of protruding portions and the plurality of recessed portions of the two adjacent connecting portions, and the two adjacent connecting portions are spaced apart from each other to form the plurality of communicating portions therebetween.

[0008] In one embodiment, the spacer unit is a frame body and is welded between the flow guide plate and the cover module.

[0009] In one embodiment, when the first through hole and the second through hole are projected onto the flow guide plate, the first through hole and the second through hole do not overlap with any one of the plurality of inlet holes or any one of the plurality of outlet holes.

[0010] In one embodiment, the plurality of inlet holes is arranged in one of an array distribution and an irregular distribution, and an inlet diameter width of each of the plurality of inlet holes is less than or equal to an outlet diameter width of each of the plurality of outlet holes and is greater than zero.

[0011] In one embodiment, a cooling module is connected between the first pipe and the second pipe.

[0012] In one embodiment, the cooling module comprises a liquid pump unit, a cooling unit, and a liquid storage unit, one end of the liquid pump unit being connected to the cooling unit, and another end thereof being connected to the liquid storage unit, and wherein the liquid delivered from the second pipe is cooled by the cooling unit to reduce the temperature thereof, then is delivered to the liquid storage unit by the liquid pump unit, and the liquid accommodated in the liquid storage unit is then delivered to the first pipe.

[0013] In the liquid-cooled heat exchange device of the present application, the first pipe and the second pipe are respectively connected to two ends of the cooling module, such that cooled liquid enters through the first through hole connected in communication with the first pipe and then flows out through the second through hole connected in communication with the second pipe. The spacer unit defines the first space and the second space to be formed between the cover module and the flow guide plate. The flow guide plate not only forms the plurality of inlet holes at positions corresponding to the first space, but also forms the plurality of outlet holes at positions corresponding to the second space, and further defines the third space between the flow guide plate and the base module for accommodating the heat dissipation module having the plurality of protruding portions, the plurality of recessed portions, the plurality of communicating portions, the plurality of connecting portions, and the plurality of upright portions. Accordingly, the liquid entering through the first through hole forms a substantially uniform pressure distribution in the first space, then flows from the plurality of inlet holes into the third space where heat is dissipated through the heat dissipation module, and is then guided by the plurality of outlet portions having a hollow structure to the second space corresponding to the plurality of outlet portions, and finally flows out through the second through hole toward the second pipe and into the cooling module. Accordingly, the liquid-cooled heat exchange device increases heat dissipation efficiency through the flow guide plate and the heat dissipation module.BRIEF DESCRIPTION OF FIGURES

[0014] FIG. 1 is a perspective schematic view of the liquid-cooled heat exchange device of the present application.

[0015] FIG. 2 is an exploded perspective schematic view of the liquid-cooled heat exchange device of the present application.

[0016] FIG. 3A is a partial enlarged schematic view of the circled portion 3A of FIG. 2.

[0017] FIG. 4 is an exploded perspective schematic view of the liquid-cooled heat exchange device of the present application from another viewing angle.

[0018] FIG. 5 is a top view of the liquid-cooled heat exchange device of the present application.

[0019] FIG. 6B is a cross-sectional schematic view taken along line 6B-6B of FIG. 5.

[0020] FIG. 7 and FIG. 8 are schematic views showing dynamic flow of the liquid-cooled heat exchange device of the present application.

[0021] FIG. 9 is an exploded perspective schematic view of the liquid-cooled heat exchange device of the present application from another viewing angle, in which the spacer unit is a partition plate structure.

[0022] FIG. 10 is a perspective schematic view of the liquid-cooled heat exchange device of the present application being connected to a cooling module.DETAILED DESCRIPTION

[0023] Preferred embodiments of the technical features and operations of the present application are described below with reference to the drawings. In addition, the drawings of the present application are not necessarily drawn to actual scale, and the proportions shown therein are not intended to limit the scope of the present application.

[0024] Referring to FIG. 1, FIG. 2, FIG. 3A, FIG. 4, FIG. 5, FIG. 6B, FIG. 7, FIG. 8, FIG. 9, and FIG. 10, the present application provides a liquid-cooled heat exchange device 100 that performs heat exchange by using a liquid to achieve a heat dissipation function. The liquid may be a coolant, water, or any liquid having a heat absorption effect. The liquid-cooled heat exchange device 100 mainly includes a cover module 10, a base module 20, a flow guide plate 30, a spacer unit 40, and a heat dissipation module 50.

[0025] The cover module 10 is provided with a first through hole 11 and a second through hole 12 on a surface thereof. The first through hole 11 is connected in communication with a first pipe 13, and the second through hole 12 is connected in communication with a second pipe 14.

[0026] The base module 20 is assembled on another surface of the cover module 10, and the base module 20 is provided with a plurality of fastening holes 21. In one embodiment, the base module 20 is assembled to the cover module 10 by welding. In addition, in one embodiment, the base module 20 is recessed with a bottom groove (not labelled) on a side thereof opposite to the surface assembled to the cover module 10, and the bottom groove is configured to receive the cover module 10 therein, but the present application is not limited thereto.

[0027] The flow guide plate 30 is assembled and accommodated between the cover module 10 and the base module 20. A third space 31 is formed between the flow guide plate 30 and the base module 20, and the flow guide plate 30 is provided with a plurality of inlet holes 32 and a plurality of outlet holes 33 adjacent to the plurality of inlet holes 32. In one embodiment, the plurality of inlet holes 32 is arranged in an array distribution, but the present application is not limited thereto, and the plurality of inlet holes 32 may alternatively be arranged in an irregular distribution, for example.

[0028] The spacer unit 40 is assembled between the flow guide plate 30 and the cover module 10. The spacer unit 40 defines a first space 41 and a second space 42 adjacent to the first space 41 to be formed between the flow guide plate 30 and the cover module 10. In one embodiment, the spacer unit 40 is a frame body and is welded between the flow guide plate 30 and the cover module 10, but the present application is not limited thereto. Referring to FIG. 9, the spacer unit 40 may also be a partition plate structure protruding between the plurality of inlet holes 32 and the plurality of outlet holes 33, and the spacer unit 40 defines the first space 41 and the second space 42 to be formed between the cover module 10 and the flow guide plate 30.

[0029] Referring to FIG. 2, FIG. 3A, and FIG. 4, the heat dissipation module 50 is assembled between the flow guide plate 30 and the base module 20, and the heat dissipation module 50 is provided with a plurality of protruding portions 51, a plurality of recessed portions 52, and a plurality of communicating portions 53. The plurality of protruding portions 51 and the plurality of recessed portions 52 are alternately arranged along the same direction, and each of the plurality of protruding portions 51 is provided with one of the plurality of communicating portions 53 in communication with the adjacent recessed portions 52. In addition, the heat dissipation module 50 is provided with a plurality of connecting portions 54 along a first direction D1, and each of the plurality of connecting portions 54 extends along the first direction D1 and connects the protruding portions 51 protruding toward a second direction D2. A plurality of upright portions 55 are further disposed between two adjacent connecting portions 54. The plurality of upright portions 55 are disposed between the plurality of protruding portions 51 and the plurality of recessed portions 52 of the two adjacent connecting portions 54, such that the two adjacent connecting portions 54 are spaced apart from each other to form the communicating portions 53 therebetween. In addition, in one embodiment, the heat dissipation module 50 is provided with an outlet portion 56 having a hollow structure at each position corresponding to one of the outlet holes 33, but the present application is not limited thereto.

[0030] Referring to FIG. 2, FIG. 6B, FIG. 7, and FIG. 8, liquid flows in from the first pipe 13 and sequentially flows through the first space 41, the third space 31, and the second space 42, and then flows out from the second pipe 14. The liquid flows from the inlet holes 32 corresponding to the ends of the plurality of connecting portions 54 of the heat dissipation module 50 into the third space 31, flows through the heat dissipation module 50 in the third space 31, and then flows to the second space 42 through the plurality of outlet holes 33 corresponding to the plurality of outlet portions 56. When the first through hole 11 and the second through hole 12 are projected onto the flow guide plate 30, the first through hole 11 and the second through hole 12 do not overlap with any one of the plurality of inlet holes 32 or any one of the plurality of outlet holes 33. In addition, the spacer unit 40 protrudes from the flow guide plate 30 between the plurality of inlet holes 32 and the plurality of outlet holes 33, and each of the plurality of inlet holes 32 has an inlet diameter width R1 and each of the plurality of outlet holes 33 has an outlet diameter width R2. In one embodiment, the inlet diameter width R1 is less than the outlet diameter width R2 and greater than zero, but the present application is not limited thereto, and the inlet diameter widths R1 and the outlet diameter widths R2 may be different from each other or substantially identical.

[0031] Referring to FIG. 1, FIG. 2, FIG. 3A, FIG. 4, FIG. 5, FIG. 6B, FIG. 7, FIG. 8, and FIG. 9, in the liquid-cooled heat exchange device 100, the flow guide plate 30, the spacer unit 40, and the heat dissipation module 50 are sequentially assembled between the cover module 10 and the base module 20. The spacer unit 40 defines the first space 41 and the second space 42 to be formed between the cover module 10 and the flow guide plate 30, such that liquid can flow from the first pipe 13 through the first through hole 11 to the first space 41, and the pressure of the liquid in the first space 41 is substantially uniform. The liquid is then guided by the plurality of inlet holes 32 corresponding to the first space 41 to flow into the third space 31. At this time, the liquid absorbs heat generated by equipment assembled to the base module 20, and heat is dissipated through the heat dissipation module 50. That is, after the liquid flows from the plurality of inlet holes 32 into the third space 31, the liquid flows among the plurality of protruding portions 51, the plurality of recessed portions 52, the plurality of communicating portions 53, and the plurality of upright portions 55, thereby increasing heat dissipation efficiency through the surface area of the heat dissipation module 50. The liquid is then guided to the plurality of outlet portions 56 having hollow structures, such that the liquid flows from the third space 31 to the second space 42 through the plurality of outlet holes 33, and is then discharged through the second pipe 14 connected in communication with the second through hole 12. In addition, the inlet diameter widths R1 of the plurality of inlet holes 32 are less than the outlet diameter widths R2 of the plurality of outlet holes 33. Accordingly, differences of pressure are generated to guide the liquid to flow from the first space 41 through the third space 31 to the second space 42, and the heat absorbed by the liquid is reduced through the heat dissipation module 50 so as to achieve a heat dissipation effect.

[0032] Referring further to FIG. 10, a cooling module 60 is connected between the first pipe 13 and the second pipe 14 of the liquid-cooled heat exchange device 100. The cooling module 60 includes a liquid pump unit 61, a cooling unit 62, and a liquid storage unit 63. One end of the liquid pump unit 61 is connected to the cooling unit 62, and another end thereof is connected to the liquid storage unit 63, such that the liquid delivered from the second pipe 14 is cooled by the cooling unit 62, then delivered to the liquid storage unit 63 by the liquid pump unit 61, and the liquid accommodated in the liquid storage unit 63 is then delivered to the first pipe 13. Thus, the liquid output from the second pipe 14 can be cooled through the cooling unit 62, and the liquid is then delivered by the liquid pump unit 61 through the liquid storage unit 63 to the first pipe 13. In particular, as the liquid flows through the cooling unit 62, its temperature is reduced, after which the cooled liquid is directed back to the first pipe 13 and is introduced into the first space 41. Accordingly, the liquid-cooled heat exchange device 100 is configured to connect to the cooling module 60 so that the liquid can be cooled by the cooling unit 62 before being reintroduced into the first space 41, thereby enhancing heat dissipation efficiency.

[0033] In summary, in the liquid-cooled heat exchange device 100 of the present application, the first pipe 13 and the second pipe 14 are respectively connected to two ends of the cooling module 60, such that cooled liquid enters through the first through hole 11 connected in communication with the first pipe 13 and then flows out through the second through hole 12 connected in communication with the second pipe 14. The spacer unit 40 defines the first space 41 and the second space 42 to be formed between the cover module 10 and the flow guide plate 30. The flow guide plate 30 not only forms the plurality of inlet holes 32 at positions corresponding to the first space 41, but also forms the plurality of outlet holes 33 at positions corresponding to the second space 42, and further defines the third space 31 between the flow guide plate 30 and the base module 20 for accommodating the heat dissipation module 50 having the plurality of protruding portions 51, the plurality of recessed portions 52, the plurality of communicating portions 53, the plurality of connecting portions 54, and the plurality of upright portions 55. Accordingly, the liquid entering through the first through hole 11 forms a substantially uniform pressure distribution in the first space 41, then flows from the plurality of inlet holes 32 into the third space 31 where heat is dissipated through the heat dissipation module 50, and is then guided by the plurality of outlet portions 56 having a hollow structure to the second space 42 corresponding to the plurality of outlet portions 56, and finally flows out through the second through hole 12 toward the second pipe 14 and into the cooling module 60. Accordingly, the liquid-cooled heat exchange device 100 increases heat dissipation efficiency through the flow guide plate 30 and the heat dissipation module 50.

[0034] What is claimed is:

[0035] 1. A liquid-cooled heat exchange device, configured to dissipate heat by performing heat exchange with a liquid, the liquid-cooled heat exchange device comprising:

[0036] a cover module, provided with a first through hole and a second through hole on a surface thereof, the first through hole being connected in communication with a first pipe, and the second through hole being connected in communication with a second pipe;

[0037] a base module, assembled on another surface of the cover module;

[0038] a flow guide plate, assembled and accommodated between the cover module and the base module, wherein a third space is formed between the flow guide plate and the base module, and the flow guide plate is provided with a plurality of inlet holes arranged in an array and a plurality of outlet holes adjacent to the plurality of inlet holes;

[0039] a spacer unit, assembled between the flow guide plate and the cover module, wherein the spacer unit defines a first space and a second space adjacent to the first space to be formed between the flow guide plate and the cover module; and

[0040] a heat dissipation module, assembled between the flow guide plate and the base module, wherein the heat dissipation module is provided with a plurality of protruding portions, a plurality of recessed portions, and a plurality of communicating portions, the plurality of protruding portions and the plurality of recessed portions being alternately arranged along a direction, each of the plurality of protruding portions being provided with the plurality of communicating portions in communication with the adjacent recessed portions, and the heat dissipation module being provided with a plurality of connecting portions along a first direction, each of the plurality of connecting portions extending along the first direction and connecting the protruding portions protruding toward a second direction;

[0041] wherein the liquid flows from the first pipe and sequentially flows through the first space, the third space, and the second space, and then flows out from the second pipe;

[0042] wherein the liquid flows from the plurality of inlet holes corresponding to ends of the plurality of connecting portions of the heat dissipation module into the third space, flows through the heat dissipation module in the third space, and then flows into the second space through the outlet holes; and

[0043] wherein the spacer unit protrudes from the flow guide plate between the plurality of inlet holes and the plurality of outlet holes.

[0044] 2. The liquid-cooled heat exchange device as claimed in claim 1, wherein the heat dissipation module is provided with an outlet portion having a hollow structure at each position corresponding to one of the outlet holes.

[0045] 3. The liquid-cooled heat exchange device as claimed in claim 1, wherein a plurality of upright portions is disposed between two adjacent connecting portions, and the plurality of upright portions is disposed between the plurality of protruding portions and the plurality of recessed portions of the two adjacent connecting portions, and the two adjacent connecting portions are spaced apart from each other to form the plurality of communicating portions therebetween.

[0046] 4. The liquid-cooled heat exchange device as claimed in claim 1, wherein the spacer unit is a frame body and is welded between the flow guide plate and the cover module.

[0047] 5. The liquid-cooled heat exchange device as claimed in claim 1, wherein the spacer unit is a partition plate structure protruding between the plurality of inlet holes and the plurality of outlet holes, and the spacer unit defines the first space and the second space between the cover module and the flow guide plate.

[0048] 6. The liquid-cooled heat exchange device as claimed in claim 1, wherein when the first through hole and the second through hole are projected onto the flow guide plate, the first through hole and the second through hole do not overlap with any one of the plurality of inlet holes or any one of the plurality of outlet holes.

[0049] 7. The liquid-cooled heat exchange device as claimed in claim 1, wherein the plurality of inlet holes is arranged in one of an array distribution and an irregular distribution, and an inlet diameter width of each of the plurality of inlet holes is less than or equal to an outlet diameter width of each of the plurality of outlet holes and is greater than zero.

[0050] 8. The liquid-cooled heat exchange device as claimed in claim 1, wherein a cooling module is connected between the first pipe and the second pipe.

[0051] 9. The liquid-cooled heat exchange device as claimed in claim 8, wherein the cooling module comprises a liquid pump unit, a cooling unit, and a liquid storage unit, one end of the liquid pump unit being connected to the cooling unit, and another end thereof being connected to the liquid storage unit, and wherein temperature of the liquid delivered from the second pipe is reduced by the cooling unit, then is delivered to the liquid storage unit by the liquid pump unit, and the liquid accommodated in the liquid storage unit is then delivered to the first pipe.

Examples

Embodiment Construction

[0023]Preferred embodiments of the technical features and operations of the present application are described below with reference to the drawings. In addition, the drawings of the present application are not necessarily drawn to actual scale, and the proportions shown therein are not intended to limit the scope of the present application.

[0024]Referring to FIG. 1, FIG. 2, FIG. 3A, FIG. 4, FIG. 5, FIG. 6B, FIG. 7, FIG. 8, FIG. 9, and FIG. 10, the present application provides a liquid-cooled heat exchange device 100 that performs heat exchange by using a liquid to achieve a heat dissipation function. The liquid may be a coolant, water, or any liquid having a heat absorption effect. The liquid-cooled heat exchange device 100 mainly includes a cover module 10, a base module 20, a flow guide plate 30, a spacer unit 40, and a heat dissipation module 50.

[0025]The cover module 10 is provided with a first through hole 11 and a second through hole 12 on a surface thereof. The first through h...

FIELD OF THE INVENTION

[0001] The present application relates to a heat exchange device, and more particularly to a liquid-cooled heat exchange device that performs heat exchange by using a liquid.BACKGROUND OF THE INVENTION

[0002] With the advancement of computer technology, the functions of central processing units in servers have become increasingly powerful. In order to provide better processing performance for the central processing units, heat dissipation structures such as heat dissipation fins or fans are usually provided, whereby a heat dissipation effect is achieved through the flow of air.

[0003] However, although structures such as heat dissipation fins or fans can rapidly conduct the heat to the fins for cooling and can even increase air flow, the spacing between the fins is limited, and the cooling efficiency of the airflow is constrained. Therefore, it is necessary to provide a device that utilizes cooling liquid for heat exchange, thereby overcoming the above-mentioned drawbacks.SUMMARY OF THE INVENTION

[0004] In order to solve the above-mentioned drawbacks, the present application provides a liquid-cooled heat exchange device, configured to dissipate heat by performing heat exchange with a liquid, the liquid-cooled heat exchange device comprising a cover module, a base module, a flow guide plate, a spacer unit, and a heat dissipation module; the cover module is provided with a first through hole and a second through hole on a surface thereof, the first through hole being connected in communication with a first pipe, and the second through hole being connected in communication with a second pipe; the base module is assembled on another surface of the cover module; the flow guide plate is assembled and is accommodated between the cover module and the base module, wherein a third space is formed between the flow guide plate and the base module, and the flow guide plate is provided with a plurality of inlet holes arranged in an array and a plurality of outlet holes adjacent to the plurality of inlet holes; the spacer unit is assembled between the flow guide plate and the cover module, wherein the spacer unit defines a first space and a second space adjacent to the first space to be formed between the flow guide plate and the cover module; the heat dissipation module is assembled between the flow guide plate and the base module, wherein the heat dissipation module is provided with a plurality of protruding portions, a plurality of recessed portions, and a plurality of communicating portions, the plurality of protruding portions and the plurality of recessed portions being alternately arranged along a direction, each of the plurality of protruding portions being provided with the plurality of communicating portions in communication with the adjacent recessed portions; wherein the liquid flows from the first pipe and sequentially flows through the first space, the third space, and the second space, and then flows out from the second pipe; wherein the spacer unit protrudes from the flow guide plate between the plurality of inlet holes and the plurality of outlet holes.

[0005] In one embodiment, the heat dissipation module is provided with an outlet portion having a hollow structure at each position corresponding to one of the outlet holes.

[0006] In one embodiment, the heat dissipation module is provided with a plurality of connecting portions along a first direction, each of the plurality of connecting portions extending along the first direction and connecting the protruding portions protruding toward a second direction.

[0007] In one embodiment, a plurality of upright portions is disposed between two adjacent connecting portions, and the plurality of upright portions is disposed between the plurality of protruding portions and the plurality of recessed portions of the two adjacent connecting portions, and the two adjacent connecting portions are spaced apart from each other to form the plurality of communicating portions therebetween.

[0008] In one embodiment, the spacer unit is a frame body and is welded between the flow guide plate and the cover module.

[0009] In one embodiment, when the first through hole and the second through hole are projected onto the flow guide plate, the first through hole and the second through hole do not overlap with any one of the plurality of inlet holes or any one of the plurality of outlet holes.

[0010] In one embodiment, the plurality of inlet holes is arranged in one of an array distribution and an irregular distribution, and an inlet diameter width of each of the plurality of inlet holes is less than or equal to an outlet diameter width of each of the plurality of outlet holes and is greater than zero.

[0011] In one embodiment, a cooling module is connected between the first pipe and the second pipe.

[0012] In one embodiment, the cooling module comprises a liquid pump unit, a cooling unit, and a liquid storage unit, one end of the liquid pump unit being connected to the cooling unit, and another end thereof being connected to the liquid storage unit, and wherein the liquid delivered from the second pipe is cooled by the cooling unit to reduce the temperature thereof, then is delivered to the liquid storage unit by the liquid pump unit, and the liquid accommodated in the liquid storage unit is then delivered to the first pipe.

[0013] In the liquid-cooled heat exchange device of the present application, the first pipe and the second pipe are respectively connected to two ends of the cooling module, such that cooled liquid enters through the first through hole connected in communication with the first pipe and then flows out through the second through hole connected in communication with the second pipe. The spacer unit defines the first space and the second space to be formed between the cover module and the flow guide plate. The flow guide plate not only forms the plurality of inlet holes at positions corresponding to the first space, but also forms the plurality of outlet holes at positions corresponding to the second space, and further defines the third space between the flow guide plate and the base module for accommodating the heat dissipation module having the plurality of protruding portions, the plurality of recessed portions, the plurality of communicating portions, the plurality of connecting portions, and the plurality of upright portions. Accordingly, the liquid entering through the first through hole forms a substantially uniform pressure distribution in the first space, then flows from the plurality of inlet holes into the third space where heat is dissipated through the heat dissipation module, and is then guided by the plurality of outlet portions having a hollow structure to the second space corresponding to the plurality of outlet portions, and finally flows out through the second through hole toward the second pipe and into the cooling module. Accordingly, the liquid-cooled heat exchange device increases heat dissipation efficiency through the flow guide plate and the heat dissipation module.BRIEF DESCRIPTION OF FIGURES

[0014] FIG. 1 is a perspective schematic view of the liquid-cooled heat exchange device of the present application.

[0015] FIG. 2 is an exploded perspective schematic view of the liquid-cooled heat exchange device of the present application.

[0016] FIG. 3A is a partial enlarged schematic view of the circled portion 3A of FIG. 2.

[0017] FIG. 4 is an exploded perspective schematic view of the liquid-cooled heat exchange device of the present application from another viewing angle.

[0018] FIG. 5 is a top view of the liquid-cooled heat exchange device of the present application.

[0019] FIG. 6B is a cross-sectional schematic view taken along line 6B-6B of FIG. 5.

[0020] FIG. 7 and FIG. 8 are schematic views showing dynamic flow of the liquid-cooled heat exchange device of the present application.

[0021] FIG. 9 is an exploded perspective schematic view of the liquid-cooled heat exchange device of the present application from another viewing angle, in which the spacer unit is a partition plate structure.

[0022] FIG. 10 is a perspective schematic view of the liquid-cooled heat exchange device of the present application being connected to a cooling module.DETAILED DESCRIPTION

[0023] Preferred embodiments of the technical features and operations of the present application are described below with reference to the drawings. In addition, the drawings of the present application are not necessarily drawn to actual scale, and the proportions shown therein are not intended to limit the scope of the present application.

[0024] Referring to FIG. 1, FIG. 2, FIG. 3A, FIG. 4, FIG. 5, FIG. 6B, FIG. 7, FIG. 8, FIG. 9, and FIG. 10, the present application provides a liquid-cooled heat exchange device 100 that performs heat exchange by using a liquid to achieve a heat dissipation function. The liquid may be a coolant, water, or any liquid having a heat absorption effect. The liquid-cooled heat exchange device 100 mainly includes a cover module 10, a base module 20, a flow guide plate 30, a spacer unit 40, and a heat dissipation module 50.

[0025] The cover module 10 is provided with a first through hole 11 and a second through hole 12 on a surface thereof. The first through hole 11 is connected in communication with a first pipe 13, and the second through hole 12 is connected in communication with a second pipe 14.

[0026] The base module 20 is assembled on another surface of the cover module 10, and the base module 20 is provided with a plurality of fastening holes 21. In one embodiment, the base module 20 is assembled to the cover module 10 by welding. In addition, in one embodiment, the base module 20 is recessed with a bottom groove (not labelled) on a side thereof opposite to the surface assembled to the cover module 10, and the bottom groove is configured to receive the cover module 10 therein, but the present application is not limited thereto.

[0027] The flow guide plate 30 is assembled and accommodated between the cover module 10 and the base module 20. A third space 31 is formed between the flow guide plate 30 and the base module 20, and the flow guide plate 30 is provided with a plurality of inlet holes 32 and a plurality of outlet holes 33 adjacent to the plurality of inlet holes 32. In one embodiment, the plurality of inlet holes 32 is arranged in an array distribution, but the present application is not limited thereto, and the plurality of inlet holes 32 may alternatively be arranged in an irregular distribution, for example.

[0028] The spacer unit 40 is assembled between the flow guide plate 30 and the cover module 10. The spacer unit 40 defines a first space 41 and a second space 42 adjacent to the first space 41 to be formed between the flow guide plate 30 and the cover module 10. In one embodiment, the spacer unit 40 is a frame body and is welded between the flow guide plate 30 and the cover module 10, but the present application is not limited thereto. Referring to FIG. 9, the spacer unit 40 may also be a partition plate structure protruding between the plurality of inlet holes 32 and the plurality of outlet holes 33, and the spacer unit 40 defines the first space 41 and the second space 42 to be formed between the cover module 10 and the flow guide plate 30.

[0029] Referring to FIG. 2, FIG. 3A, and FIG. 4, the heat dissipation module 50 is assembled between the flow guide plate 30 and the base module 20, and the heat dissipation module 50 is provided with a plurality of protruding portions 51, a plurality of recessed portions 52, and a plurality of communicating portions 53. The plurality of protruding portions 51 and the plurality of recessed portions 52 are alternately arranged along the same direction, and each of the plurality of protruding portions 51 is provided with one of the plurality of communicating portions 53 in communication with the adjacent recessed portions 52. In addition, the heat dissipation module 50 is provided with a plurality of connecting portions 54 along a first direction D1, and each of the plurality of connecting portions 54 extends along the first direction D1 and connects the protruding portions 51 protruding toward a second direction D2. A plurality of upright portions 55 are further disposed between two adjacent connecting portions 54. The plurality of upright portions 55 are disposed between the plurality of protruding portions 51 and the plurality of recessed portions 52 of the two adjacent connecting portions 54, such that the two adjacent connecting portions 54 are spaced apart from each other to form the communicating portions 53 therebetween. In addition, in one embodiment, the heat dissipation module 50 is provided with an outlet portion 56 having a hollow structure at each position corresponding to one of the outlet holes 33, but the present application is not limited thereto.

[0030] Referring to FIG. 2, FIG. 6B, FIG. 7, and FIG. 8, liquid flows in from the first pipe 13 and sequentially flows through the first space 41, the third space 31, and the second space 42, and then flows out from the second pipe 14. The liquid flows from the inlet holes 32 corresponding to the ends of the plurality of connecting portions 54 of the heat dissipation module 50 into the third space 31, flows through the heat dissipation module 50 in the third space 31, and then flows to the second space 42 through the plurality of outlet holes 33 corresponding to the plurality of outlet portions 56. When the first through hole 11 and the second through hole 12 are projected onto the flow guide plate 30, the first through hole 11 and the second through hole 12 do not overlap with any one of the plurality of inlet holes 32 or any one of the plurality of outlet holes 33. In addition, the spacer unit 40 protrudes from the flow guide plate 30 between the plurality of inlet holes 32 and the plurality of outlet holes 33, and each of the plurality of inlet holes 32 has an inlet diameter width R1 and each of the plurality of outlet holes 33 has an outlet diameter width R2. In one embodiment, the inlet diameter width R1 is less than the outlet diameter width R2 and greater than zero, but the present application is not limited thereto, and the inlet diameter widths R1 and the outlet diameter widths R2 may be different from each other or substantially identical.

[0031] Referring to FIG. 1, FIG. 2, FIG. 3A, FIG. 4, FIG. 5, FIG. 6B, FIG. 7, FIG. 8, and FIG. 9, in the liquid-cooled heat exchange device 100, the flow guide plate 30, the spacer unit 40, and the heat dissipation module 50 are sequentially assembled between the cover module 10 and the base module 20. The spacer unit 40 defines the first space 41 and the second space 42 to be formed between the cover module 10 and the flow guide plate 30, such that liquid can flow from the first pipe 13 through the first through hole 11 to the first space 41, and the pressure of the liquid in the first space 41 is substantially uniform. The liquid is then guided by the plurality of inlet holes 32 corresponding to the first space 41 to flow into the third space 31. At this time, the liquid absorbs heat generated by equipment assembled to the base module 20, and heat is dissipated through the heat dissipation module 50. That is, after the liquid flows from the plurality of inlet holes 32 into the third space 31, the liquid flows among the plurality of protruding portions 51, the plurality of recessed portions 52, the plurality of communicating portions 53, and the plurality of upright portions 55, thereby increasing heat dissipation efficiency through the surface area of the heat dissipation module 50. The liquid is then guided to the plurality of outlet portions 56 having hollow structures, such that the liquid flows from the third space 31 to the second space 42 through the plurality of outlet holes 33, and is then discharged through the second pipe 14 connected in communication with the second through hole 12. In addition, the inlet diameter widths R1 of the plurality of inlet holes 32 are less than the outlet diameter widths R2 of the plurality of outlet holes 33. Accordingly, differences of pressure are generated to guide the liquid to flow from the first space 41 through the third space 31 to the second space 42, and the heat absorbed by the liquid is reduced through the heat dissipation module 50 so as to achieve a heat dissipation effect.

[0032] Referring further to FIG. 10, a cooling module 60 is connected between the first pipe 13 and the second pipe 14 of the liquid-cooled heat exchange device 100. The cooling module 60 includes a liquid pump unit 61, a cooling unit 62, and a liquid storage unit 63. One end of the liquid pump unit 61 is connected to the cooling unit 62, and another end thereof is connected to the liquid storage unit 63, such that the liquid delivered from the second pipe 14 is cooled by the cooling unit 62, then delivered to the liquid storage unit 63 by the liquid pump unit 61, and the liquid accommodated in the liquid storage unit 63 is then delivered to the first pipe 13. Thus, the liquid output from the second pipe 14 can be cooled through the cooling unit 62, and the liquid is then delivered by the liquid pump unit 61 through the liquid storage unit 63 to the first pipe 13. In particular, as the liquid flows through the cooling unit 62, its temperature is reduced, after which the cooled liquid is directed back to the first pipe 13 and is introduced into the first space 41. Accordingly, the liquid-cooled heat exchange device 100 is configured to connect to the cooling module 60 so that the liquid can be cooled by the cooling unit 62 before being reintroduced into the first space 41, thereby enhancing heat dissipation efficiency.

[0033] In summary, in the liquid-cooled heat exchange device 100 of the present application, the first pipe 13 and the second pipe 14 are respectively connected to two ends of the cooling module 60, such that cooled liquid enters through the first through hole 11 connected in communication with the first pipe 13 and then flows out through the second through hole 12 connected in communication with the second pipe 14. The spacer unit 40 defines the first space 41 and the second space 42 to be formed between the cover module 10 and the flow guide plate 30. The flow guide plate 30 not only forms the plurality of inlet holes 32 at positions corresponding to the first space 41, but also forms the plurality of outlet holes 33 at positions corresponding to the second space 42, and further defines the third space 31 between the flow guide plate 30 and the base module 20 for accommodating the heat dissipation module 50 having the plurality of protruding portions 51, the plurality of recessed portions 52, the plurality of communicating portions 53, the plurality of connecting portions 54, and the plurality of upright portions 55. Accordingly, the liquid entering through the first through hole 11 forms a substantially uniform pressure distribution in the first space 41, then flows from the plurality of inlet holes 32 into the third space 31 where heat is dissipated through the heat dissipation module 50, and is then guided by the plurality of outlet portions 56 having a hollow structure to the second space 42 corresponding to the plurality of outlet portions 56, and finally flows out through the second through hole 12 toward the second pipe 14 and into the cooling module 60. Accordingly, the liquid-cooled heat exchange device 100 increases heat dissipation efficiency through the flow guide plate 30 and the heat dissipation module 50.

[0034] What is claimed is:

[0035] 1. A liquid-cooled heat exchange device, configured to dissipate heat by performing heat exchange with a liquid, the liquid-cooled heat exchange device comprising:

[0036] a cover module, provided with a first through hole and a second through hole on a surface thereof, the first through hole being connected in communication with a first pipe, and the second through hole being connected in communication with a second pipe;

[0037] a base module, assembled on another surface of the cover module;

[0038] a flow guide plate, assembled and accommodated between the cover module and the base module, wherein a third space is formed between the flow guide plate and the base module, and the flow guide plate is provided with a plurality of inlet holes arranged in an array and a plurality of outlet holes adjacent to the plurality of inlet holes;

[0039] a spacer unit, assembled between the flow guide plate and the cover module, wherein the spacer unit defines a first space and a second space adjacent to the first space to be formed between the flow guide plate and the cover module; and

[0040] a heat dissipation module, assembled between the flow guide plate and the base module, wherein the heat dissipation module is provided with a plurality of protruding portions, a plurality of recessed portions, and a plurality of communicating portions, the plurality of protruding portions and the plurality of recessed portions being alternately arranged along a direction, each of the plurality of protruding portions being provided with the plurality of communicating portions in communication with the adjacent recessed portions, and the heat dissipation module being provided with a plurality of connecting portions along a first direction, each of the plurality of connecting portions extending along the first direction and connecting the protruding portions protruding toward a second direction;

[0041] wherein the liquid flows from the first pipe and sequentially flows through the first space, the third space, and the second space, and then flows out from the second pipe;

[0042] wherein the liquid flows from the plurality of inlet holes corresponding to ends of the plurality of connecting portions of the heat dissipation module into the third space, flows through the heat dissipation module in the third space, and then flows into the second space through the outlet holes; and

[0043] wherein the spacer unit protrudes from the flow guide plate between the plurality of inlet holes and the plurality of outlet holes.

[0044] 2. The liquid-cooled heat exchange device as claimed in claim 1, wherein the heat dissipation module is provided with an outlet portion having a hollow structure at each position corresponding to one of the outlet holes.

[0045] 3. The liquid-cooled heat exchange device as claimed in claim 1, wherein a plurality of upright portions is disposed between two adjacent connecting portions, and the plurality of upright portions is disposed between the plurality of protruding portions and the plurality of recessed portions of the two adjacent connecting portions, and the two adjacent connecting portions are spaced apart from each other to form the plurality of communicating portions therebetween.

[0046] 4. The liquid-cooled heat exchange device as claimed in claim 1, wherein the spacer unit is a frame body and is welded between the flow guide plate and the cover module.

[0047] 5. The liquid-cooled heat exchange device as claimed in claim 1, wherein the spacer unit is a partition plate structure protruding between the plurality of inlet holes and the plurality of outlet holes, and the spacer unit defines the first space and the second space between the cover module and the flow guide plate.

[0048] 6. The liquid-cooled heat exchange device as claimed in claim 1, wherein when the first through hole and the second through hole are projected onto the flow guide plate, the first through hole and the second through hole do not overlap with any one of the plurality of inlet holes or any one of the plurality of outlet holes.

[0049] 7. The liquid-cooled heat exchange device as claimed in claim 1, wherein the plurality of inlet holes is arranged in one of an array distribution and an irregular distribution, and an inlet diameter width of each of the plurality of inlet holes is less than or equal to an outlet diameter width of each of the plurality of outlet holes and is greater than zero.

[0050] 8. The liquid-cooled heat exchange device as claimed in claim 1, wherein a cooling module is connected between the first pipe and the second pipe.

[0051] 9. The liquid-cooled heat exchange device as claimed in claim 8, wherein the cooling module comprises a liquid pump unit, a cooling unit, and a liquid storage unit, one end of the liquid pump unit being connected to the cooling unit, and another end thereof being connected to the liquid storage unit, and wherein temperature of the liquid delivered from the second pipe is reduced by the cooling unit, then is delivered to the liquid storage unit by the liquid pump unit, and the liquid accommodated in the liquid storage unit is then delivered to the first pipe.

Examples

Embodiment Construction

[0023]Preferred embodiments of the technical features and operations of the present application are described below with reference to the drawings. In addition, the drawings of the present application are not necessarily drawn to actual scale, and the proportions shown therein are not intended to limit the scope of the present application.

[0024]Referring to FIG. 1, FIG. 2, FIG. 3A, FIG. 4, FIG. 5, FIG. 6B, FIG. 7, FIG. 8, FIG. 9, and FIG. 10, the present application provides a liquid-cooled heat exchange device 100 that performs heat exchange by using a liquid to achieve a heat dissipation function. The liquid may be a coolant, water, or any liquid having a heat absorption effect. The liquid-cooled heat exchange device 100 mainly includes a cover module 10, a base module 20, a flow guide plate 30, a spacer unit 40, and a heat dissipation module 50.

[0025]The cover module 10 is provided with a first through hole 11 and a second through hole 12 on a surface thereof. The first through h...

Claims

1. A liquid-cooled heat exchange device, configured to dissipate heat by performing heat exchange with a liquid, the liquid-cooled heat exchange device comprising:a cover module, provided with a first through hole and a second through hole on a surface thereof, the first through hole being connected in communication with a first pipe, and the second through hole being connected in communication with a second pipe;a base module, assembled on another surface of the cover module;a flow guide plate, assembled and accommodated between the cover module and the base module, wherein a third space is formed between the flow guide plate and the base module, and the flow guide plate is provided with a plurality of inlet holes arranged in an array and a plurality of outlet holes adjacent to the plurality of inlet holes;a spacer unit, assembled between the flow guide plate and the cover module, wherein the spacer unit defines a first space and a second space adjacent to the first space to be formed between the flow guide plate and the cover module; anda heat dissipation module, assembled between the flow guide plate and the base module, wherein the heat dissipation module is provided with a plurality of protruding portions, a plurality of recessed portions, and a plurality of communicating portions, the plurality of protruding portions and the plurality of recessed portions being alternately arranged along a direction, each of the plurality of protruding portions being provided with the plurality of communicating portions in communication with the adjacent recessed portions, and the heat dissipation module being provided with a plurality of connecting portions along a first direction, each of the plurality of connecting portions extending along the first direction and connecting the protruding portions protruding toward a second direction;wherein the liquid flows from the first pipe and sequentially flows through the first space, the third space, and the second space, and then flows out from the second pipe;wherein the liquid flows from the plurality of inlet holes corresponding to ends of the plurality of connecting portions of the heat dissipation module into the third space, flows through the heat dissipation module in the third space, and then flows into the second space through the outlet holes; andwherein the spacer unit protrudes from the flow guide plate between the plurality of inlet holes and the plurality of outlet holes.

2. The liquid-cooled heat exchange device as claimed in claim 1, wherein the heat dissipation module is provided with an outlet portion having a hollow structure at each position corresponding to one of the outlet holes.

3. The liquid-cooled heat exchange device as claimed in claim 1, wherein a plurality of upright portions is disposed between two adjacent connecting portions, and the plurality of upright portions is disposed between the plurality of protruding portions and the plurality of recessed portions of the two adjacent connecting portions, and the two adjacent connecting portions are spaced apart from each other to form the plurality of communicating portions therebetween.

4. The liquid-cooled heat exchange device as claimed in claim 1, wherein the spacer unit is a frame body and is welded between the flow guide plate and the cover module.

5. The liquid-cooled heat exchange device as claimed in claim 1, wherein the spacer unit is a partition plate structure protruding between the plurality of inlet holes and the plurality of outlet holes, and the spacer unit defines the first space and the second space between the cover module and the flow guide plate.

6. The liquid-cooled heat exchange device as claimed in claim 1, wherein when the first through hole and the second through hole are projected onto the flow guide plate, the first through hole and the second through hole do not overlap with any one of the plurality of inlet holes or any one of the plurality of outlet holes.

7. The liquid-cooled heat exchange device as claimed in claim 1, wherein the plurality of inlet holes is arranged in one of an array distribution and an irregular distribution, and an inlet diameter width of each of the plurality of inlet holes is less than or equal to an outlet diameter width of each of the plurality of outlet holes and is greater than zero.

8. The liquid-cooled heat exchange device as claimed in claim 1, wherein a cooling module is connected between the first pipe and the second pipe.

9. The liquid-cooled heat exchange device as claimed in claim 8, wherein the cooling module comprises a liquid pump unit, a cooling unit, and a liquid storage unit, one end of the liquid pump unit being connected to the cooling unit, and another end thereof being connected to the liquid storage unit, and wherein temperature of the liquid delivered from the second pipe is reduced by the cooling unit, then is delivered to the liquid storage unit by the liquid pump unit, and the liquid accommodated in the liquid storage unit is then delivered to the first pipe.

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