Display device, electronic device including the same, and driving method thereof

Abstract

An electronic device includes a display device including a display panel in which a plurality of sub-pixels and a plurality of photosensors are arranged, a memory in which a bio-signal sensing application is loaded, and a processor that executes a loaded bio-signal sense application to perform fingerprint authentication in the display device and sequentially generate a bio-signal proximate to an area in which fingerprint authentication is performed in the display device.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims priority under 35 U.S.C. § 119 to Korean Patent Application No. 10-2025-0039195, filed on Mar. 27, 2025, the disclosure of which is incorporated by reference herein in its entirety.TECHNICAL FIELD

[0002] Embodiments of the present disclosure relate to a display device, an electronic device including the same, and a driving method thereof.DISCUSSION OF RELATED ART

[0003] With advances in information technology, electronic devices, such as, e.g., mobile and wearable devices, are evolving to offer a wide range of functions beyond simply displaying images on a screen. For example, electronic devices may now provide high-security biometric authentication using the user's unique biometric information (e.g., a fingerprint, etc.).

[0004] More recently, various types of software have been developed to enable electronic devices to assist medical applications, such as supporting the user in managing their health. As a result of software innovations and structural improvements in display devices, electronic devices capable of continuously tracking health-related data, such as, e.g., a user's bio-signals, have emerged.SUMMARY

[0005] Embodiments of the present disclosure provide a display device with enhanced security relating to collecting bio-signal information (or bio-signal sensing data) of a user, an electronic device including the same, and a driving method thereof.

[0006] According to an embodiment of the present disclosure, a display device includes a display panel in which a plurality of unit pixels are arranged, at least one of the plurality of unit pixels including a plurality of sub-pixels and at least one photosensor, a data driving circuit configured to output a data signal to display an image using the plurality of sub-pixels, a readout circuit configured to read a sensing signal from the at least one photosensor, a scan driving circuit configured to output a scan signal to the plurality of sub-pixels and the at least one photosensor, and a timing controller configured to control driving timings of the data driving circuit, the readout circuit, and the scan driving circuit in response to a control signal. The timing controller is configured to control a plurality of sub-pixels located in a first area of the display panel to display an image of a first pattern, read a plurality of sensing signals from a plurality of photosensors located in the first area while the first pattern is displayed, and generate a fingerprint image based on the plurality of sensing signals, and when fingerprint authentication based on the fingerprint image passes, control a plurality of sub-pixels located in a second area of the display panel to display an image of a second pattern, and read a plurality of sensing signals from a plurality of photosensors located in a third area around the second area while the second pattern is displayed.

[0007] In an embodiment, the display device further includes a touch panel on which a touch electrode is arranged, and a touch driving circuit configured to detect a touch position and a touch coordinate based on a signal of the touch electrode. The timing controller controls an image of the first pattern to be displayed in the first area including a periphery of a sensed touch area, and controls photosensors located in the first area to be read while the first pattern is displayed.

[0008] In an embodiment, an area including the second area and the third area includes the first area.

[0009] According to an embodiment of the present disclosure, an electronic device includes a display device including a display panel in which a plurality of sub-pixels and a plurality of photosensors are arranged, a memory on which a bio-signal sensing application is loaded, and a processor configured to execute the bio-signal sensing application loaded on the memory, perform fingerprint authentication on the display device, and sequentially detect a bio-signal proximate to an area in which the fingerprint authentication is performed.

[0010] In an embodiment, the display device further includes a touch panel including a plurality of touch electrodes, and the processor is further configured to detect a touch area sensed by the touch panel.

[0011] In an embodiment, the processor is further configured to set a first area including the touch area which is sensed, and control the plurality of sub-pixels in the first area to display an image of a first pattern.

[0012] In an embodiment, the image of the first pattern is a green image.

[0013] In an embodiment, the processor is further configured to read sensing signals from the photosensors located in the first area while the first pattern is displayed, and generate a fingerprint image based on the sensing signals.

[0014] In an embodiment, the processor is further configured to compare the fingerprint image with a reference fingerprint image, and generate the bio-signal when the fingerprint image matches the reference fingerprint image.

[0015] In an embodiment, the processor is further configured to set a second area and a third area, wherein the sensed touch area is included in the second area and third area, control the display device to display an image of a second pattern in the second area, and control the display device to display an image of a third pattern in the third area.

[0016] In an embodiment, the image of the second pattern is a green image.

[0017] In an embodiment, the image of the third pattern is a black image.

[0018] In an embodiment, the processor is further configured to read at least one photosensor located in the third area among the plurality of photosensors, and generate bio-signal sensing data corresponding to the bio-signal based on reading the at least one photosensor.

[0019] In an embodiment, the bio-signal sensing data includes at least one of cardiovascular health information, blood pressure, atrial rhythm, atrial fibrillation, heart rate, and respiratory rate, which are associated with a user of the electronic device.

[0020] In an embodiment, the display device includes a plurality of unit pixels, and each unit pixel includes a first sub-pixel, a second sub-pixel, and a third sub-pixel among the plurality of sub-pixels, which emit light of different wavelength bands, and any one of the plurality of photosensors.

[0021] In an embodiment, the first pattern is a pattern in which the second sub-pixel emits light of a green wavelength band while the photosensor in a same unit pixel as the second sub-pixel emitting the light of the green wavelength band is read.

[0022] In an embodiment, the second pattern is a pattern in which the second sub-pixel emits light of a green wavelength band while the photosensor in a same unit pixel as the second sub-pixel emitting the light of the green wavelength band is not read.

[0023] In an embodiment, the third pattern is a pattern in which the first to third sub-pixels do not emit light and the photosensors in a same unit pixel as the first to third sub-pixels are read.

[0024] According to an embodiment of the present disclosure, a driving method of an electronic device including a processor for loading a bio-signal sensing application into a memory and executing the bio-signal sensing application which is loaded includes performing fingerprint authentication, determining whether the fingerprint authentication has passed, measuring a bio-signal when it is determined that the fingerprint authentication has passed, and storing the measured bio-signal.

[0025] In an embodiment, the electronic device further includes a display device that is controlled by the processor and displays an image for fingerprint authentication and an image for measuring the bio-signal, and performing the fingerprint authentication includes detecting a touch area, displaying, by the display device, an image of a first pattern in a first area that includes the detected touch area, and reading sensing signals from photosensors located in the first area while the first pattern is displayed to generate a fingerprint image. Measuring the bio-signal includes displaying, by the display device, an image of a second pattern in a second area that includes the detected touch area, and reading sensing signals from photosensors located in a third area around the second area while the second pattern is displayed.BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The above and other features of the present disclosure will become more apparent by describing in detail embodiments thereof with reference to the accompanying drawings.

[0027] FIG. 1 is a schematic system diagram of an electronic device according to embodiments of the present disclosure.

[0028] FIG. 2 is a block diagram illustrating driving of an electronic device according to embodiments of the present disclosure.

[0029] FIG. 3A is a cross-sectional view of the display device of FIG. 2 according to embodiments of the present disclosure.

[0030] FIG. 3B is a cross-sectional view of the display device of FIG. 2 according to embodiments of the present disclosure.

[0031] FIG. 4 is a system block diagram of a display device according to embodiments of the present disclosure.

[0032] FIG. 5 is a diagram illustrating a touch panel and a touch driving circuit of FIG. 2.

[0033] FIG. 6 is an example of the touch panel of FIG. 5.

[0034] FIG. 7 is an enlarged view of a first area of FIG. 6.

[0035] FIG. 8 is a cross-sectional view taken along line I-I′ of FIG. 7.

[0036] FIG. 9 is an enlarged view of a second area of FIG. 6.

[0037] FIG. 10 is a cross-sectional view taken along line II-II′ of FIG. 9.

[0038] FIG. 11 is a layout diagram illustrating a display area according to an embodiment.

[0039] FIG. 12 is an equivalent circuit diagram of a sub-pixel and a photosensor according to an embodiment.

[0040] FIG. 13 is an equivalent circuit diagram of a sub-pixel and a photosensor according to an embodiment.

[0041] FIG. 14 is a diagram illustrating some of configurations of a sub-pixel and a photosensor in a cross-sectional view of a display device according to embodiments of the present disclosure.

[0042] FIG. 15 is an equivalent circuit diagram of a readout circuit according to embodiments of the present disclosure.

[0043] FIG. 16 is a timing diagram of a display device for sensing a photosensor at a first sensing resolution in case that a first mode is selected in embodiments of the present disclosure.

[0044] FIGS. 17 and 18 are timing diagrams of a display device for sensing a photosensor at a second sensing resolution in case that a second mode is selected in embodiments of the present disclosure.

[0045] FIG. 19 is a flowchart schematically illustrating a method of driving an electronic device according to embodiments of the present disclosure.

[0046] FIG. 20 is a flowchart illustrating a method of driving an electronic device in which a bio-signal sensing application is executed, according to an embodiment.

[0047] FIGS. 21 to 26 are diagrams illustrating execution of a bio-sensing application in an electronic device with reference to the flowchart of FIG. 20 according to embodiments.

[0048] FIG. 27 is a diagram conceptually illustrating a first pattern.

[0049] FIG. 28 is an embodiment of the first pattern.

[0050] FIGS. 29 and 30 are embodiments of the first pattern.

[0051] FIG. 31 is a diagram conceptually illustrating a second pattern.

[0052] FIG. 32 is an embodiment of the second pattern.

[0053] FIG. 33 is a diagram conceptually illustrating a third pattern.

[0054] FIG. 34 is an embodiment of the third pattern.

[0055] FIG. 35 is a flowchart illustrating a method of driving an electronic device in which a bio-signal sensing application is executed according to an embodiment.

[0056] FIG. 36 is a diagram illustrating a state in which a bio-signal sensing application is executed in a wearable device according to an embodiment of FIG. 35.

[0057] FIG. 37 is a flowchart illustrating a method of driving an electronic device in which a bio-signal sensing application is executed according to an embodiment.

[0058] FIG. 38 is a diagram illustrating a state in which a bio-signal sensing application is executed in a wearable device according to an embodiment of FIG. 37.

[0059] FIG. 39 is a flowchart illustrating a method of driving an electronic device in which a bio-signal sensing application is executed according to an embodiment.

[0060] FIG. 40 is a block diagram of an electronic device according to an embodiment of the present disclosure.

[0061] FIG. 41 is a schematic diagram of an electronic device according to various embodiments.DETAILED DESCRIPTION OF THE EMBODIMENTS

[0062] Embodiments of the present disclosure will be described more fully hereinafter with reference to the accompanying drawings. Like reference numerals may refer to like elements throughout the accompanying drawings.

[0063] It will be understood that the terms “first,”“second,”“third,” etc. are used herein to distinguish one element from another, and the elements are not limited by these terms. Thus, a “first” element in an embodiment may be described as a “second” element in another embodiment.

[0064] It should be understood that descriptions of features or aspects within each embodiment should typically be considered as available for other similar features or aspects in other embodiments, unless the context clearly indicates otherwise.

[0065] As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0066] Spatially relative terms, such as “beneath”, “below”, “lower”, “under”, “above”, “upper”, etc., may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as “below” or “beneath” or “under” other elements or features would then be oriented “above” the other elements or features. Thus, the example terms “below” and “under” can encompass both an orientation of above and below.

[0067] It will be understood that when a component is referred to as being “on”, “connected to”, “coupled to”, or “adjacent to” another component, it can be directly on, connected, coupled, or adjacent to the other component, or intervening components may be present. It will also be understood that when a component is referred to as being “between” two components, it can be the only component between the two components, or one or more intervening components may also be present. It will also be understood that when a component is referred to as “covering” another component, it can be the only component covering the other component, or one or more intervening components may also be covering the other component. Other words used to describe the relationships between components should be interpreted in a like fashion.

[0068] Herein, when two or more elements or values are described as being substantially the same as or about equal to each other, it is to be understood that the elements or values are identical to each other, the elements or values are equal to each other within a measurement error, or if measurably unequal, are close enough in value to be functionally equal to each other as would be understood by a person having ordinary skill in the art. For example, the term “about” as used herein is inclusive of the stated value and means within an acceptable range of deviation for the particular value as determined by one of ordinary skill in the art, considering the measurement in question and the error associated with measurement of the particular quantity (e.g., the limitations of the measurement system). For example, “about” may mean within one or more standard deviations as understood by one of the ordinary skill in the art, for example, within ±30%, 20%, 10% or 5% of the stated value. Further, it is to be understood that while parameters may be described herein as having “about” a certain value, according to embodiments, the parameter may be exactly the certain value or approximately the certain value within a measurement error as would be understood by a person having ordinary skill in the art.

[0069] It is to be understood that the terms “comprise” or “have” and the like are intended to designate the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification, and do not preclude the presence or possibility of addition of one or more other features or numbers, steps, operations, components, parts, or combinations thereof.

[0070] Embodiments of the present disclosure relate to a system and method for enhancing biometric security in electronic devices by linking fingerprint authentication and bio-signal sensing within a unified display-driven framework. Embodiments are applicable to mobile and wearable devices that incorporate display panels with integrated photosensors and sub-pixels. By coordinating the operation of these components, the embodiments may perform fingerprint authentication and, upon successful verification, initiate bio-signal sensing in a spatially proximate region.

[0071] In systems and methods according to a comparative example, bio-signal sensing (e.g., for heart rate or respiratory monitoring) may occur without verification of the user's identity, creating potential security and privacy risks when collecting sensitive health information. Embodiments of the present disclosure address this issue by introducing a sequential, conditional sensing process: fingerprint authentication is performed first, and bio-signal data is collected only if the fingerprint is authenticated. This structure may improve the integrity of the bio-signal data and prevent unauthorized users from triggering or accessing biometric sensing functions.

[0072] Embodiments of the present disclosure utilize the coordinated use of display elements, such as sub-pixel-driven display patterns, and embedded photosensors, along with timing control logic that governs when and where sensing operations occur. A first pattern may be displayed for fingerprint imaging and a second pattern may be displayed for bio-signal detection. During each pattern, sensing signals from photosensors may be read from designated areas of the display panel. This approach may enable secure, efficient, and integrated multi-modal biometric interaction within compact electronic devices.

[0073] FIG. 1 is a schematic system diagram of an electronic device 100 according to embodiments of the present disclosure.

[0074] Referring to FIG. 1, an electronic device 100 according to embodiments of the present disclosure may include a display device 110, a processor 130, a memory 150, and the like.

[0075] The display device 110 may visually provide information to a user of the electronic device 100. The display device 110 may include, for example, a display panel, a driving circuit, and the like. The display device 110 according to embodiments of the present disclosure may include a touch sensor set to detect a touch and / or a pressure sensor set to measure intensity of a force generated by the touch.

[0076] The processor 130 may, for example, execute software (e.g., a program 160) to control at least one other component (e.g., a hardware component or a software component) of the electronic device 100 coupled to the processor 130, and may perform various data processing or operations. According to embodiments of the present disclosure, as at least part of data processing or operation, the processor 130 may store data received from another component (e.g., the display device 110) in a volatile memory 152, process instructions or data stored in the volatile memory 152, and store result data in a non-volatile memory 154. According to embodiments of the present disclosure, the processor 130 may include a main processor 132 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 134 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, a communication processor (CP), etc.) operable independently of or in conjunction with the main processor 132. For example, in case that the electronic device 100 includes a main processor 132 and an auxiliary processor 134, the auxiliary processor 134 may use lower power than the main processor 132 or may be set to be specialized for a specified function. The auxiliary processor 134 may be implemented separately from, or as part of, the main processor 132.

[0077] The auxiliary processor 134 may control at least a portion of a function or states associated with at least one component (e.g., the display device 110) of the components of the electronic device 100, for example, on behalf of the main processor 132 while the main processor 132 is in an inactive (e.g., sleep) state, or in conjunction with the main processor 132 when the main processor 132 was in an active state (e.g., executing an application). According to embodiments of the present disclosure, the auxiliary processor 134 (e.g., an image signal processor or a communication processor) may be implemented as part of another functionally relevant component (e.g., a camera module, a communication module, etc.). According to embodiments of the present disclosure, the auxiliary processor 134 (e.g., a neural network processing device) may include a hardware structure specialized in processing of an artificial intelligence model. The artificial intelligence models may be created through machine learning.

[0078] The memory 150 may store various data used by at least one component (e.g., the processor 130) of the electronic device 100. Data may include, for example, software (e.g., a program 160) and input data or output data for instructions associated with the software. The memory 150 may include a volatile memory 152 or a non-volatile memory 154. The non-volatile memory 154 may include an embedded memory 155. The non-volatile memory 154 may further include an external memory 156.

[0079] The program 160 may be stored as software in the memory 150 and may include, for example, an application 162, a middleware 164, an operating system (OS) 166, and the like.

[0080] The electronic device 100 according to embodiments of the present disclosure may be referred to as, for example, a mobile station, a mobile equipment (ME), a user equipment (UE), a user terminal (UT), a subscriber station (SS), a wireless device, a handheld device, an access terminal (AT), or the like. The electronic device 100 according to embodiments of the present disclosure may be, for example, a device having a communication function, such as a mobile phone, a personal digital assistant (PDA), a smartphone, a wireless modem, or a laptop computer.

[0081] The electronic device 100 according to embodiments of the present disclosure may include a power management module configured to manage power supplied to the electronic device 100. The power management module may be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0082] At least some of the components of the electronic device 100 according to embodiments of the present disclosure may be connected to each other through a communication method between peripheral devices (for example, a bus, a general purpose input and output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI), or the like), and may exchange signals (e.g., commands or data) with each other.

[0083] FIG. 2 is a block diagram illustrating driving of an electronic device 100 according to embodiments of the present disclosure.

[0084] Referring to FIG. 2, an electronic device 100 according to embodiments of the present disclosure may include a display device 110, a processor 130, and a memory 150.

[0085] Referring to FIG. 2, a display device 110 according to embodiments of the present disclosure may include a touch panel 210, a display panel 220, a touch driving circuit 230, a display driving circuit 240, and the like.

[0086] The display device 110 according to embodiments of the present disclosure may be applied to a mobile communication terminal. The display device 110 may constitute a portable terminal by being disposed on a bracket and / or a case together with electronic modules, a camera module, a power module, and the like mounted on a main board. However, the display device 110 is not limited thereto. For example, the display device 110 may be applied to an electronic device 100 such as a television, a notebook, a monitor, a billboard, an Internet of Things (IoT) device, or the like, as well as an electronic device 100 (e.g., a small or medium-sized electronic device) such as a mobile phone, a smartphone, a tablet personal computer (PC), navigation, a smart watch, a watch phone, a Ultra-Mobile Personal Computer (UMPC), a Portable Multimedia Player (PMP), an electronic notebook, an electronic book, or the like.

[0087] Referring to FIG. 2, a touch panel 210 and a display panel 220 are shown separately from each other. However, this is merely for functionally distinguishing the touch panel 210 and the display panel 220 in the display device 110. In an embodiment, the touch panel 210 according to embodiments of the present disclosure may be formed in a separate process from the display panel 220 so that the touch panel 210 and the display panel 220 are coupled to each other (e.g., the touch panel 220 is attached and coupled to one surface of the display panel 220). In an embodiment as described above, the touch panel 210 may be formed in an add-on type. In an embodiment, the touch panel 210 according to embodiments of the present disclosure may be formed in one process (e.g., a process of manufacturing the display panel 220) with the display panel 220. In an embodiment as described above, the touch panel 210 may be formed in an in-cell type.

[0088] The touch panel 210 may be provided on one surface of the display panel 220. For example, the touch panel 210 may be disposed on one surface (e.g., an upper surface) of both surfaces of the display panel 220 in a direction in which an image is emitted. In an embodiment, the touch panel 210 may be formed directly on at least one of both surfaces of the display panel 220 or may be formed inside the display panel 220. For example, the touch panel 210 may be formed directly on an outer surface of an upper substrate or a lower substrate of the display panel 220 (e.g., an upper surface of the upper substrate or a lower surface of the lower substrate), or may be formed directly onto an inner surface of the upper substrate (e.g., a lower surface of the upper substrate) or an inner surface of the lower substrate (e.g., an upper surface of the lower substrate).

[0089] The touch panel 210 may include a touch active area TA capable of sensing a touch input, and a touch inactive area TN located in a peripheral area of the touch active area TA (e.g., an edge area of the touch active area TA). According to an embodiment, the location of the touch active area TA may correspond to a display area DA of the display panel 220.

[0090] According to an embodiment, the touch panel 210 may overlap at least one area with the display panel 220. For example, the touch active area TA of the touch panel 210 may be located in the display area DA of the display panel 220. According to an embodiment, at least one electrode that detects a touch input may be disposed in the touch active area TA. The at least one electrode that detects a touch input may include, for example, a first touch electrode Tx and a second touch electrode Rx. The first touch electrode Tx and the second touch electrode Rx may be provided in the display area DA of the display panel 220.

[0091] Wirings for electrically connecting the at least one electrode provided in the touch active area TA to the touch driving circuit 230 may be disposed in the touch inactive area TN. For example, wirings for electrically connecting the first touch electrode Tx and the second touch electrode Rx to the touch driving circuit 230 may be disposed in the touch inactive area TN. The location of the touch inactive area TN may correspond to a non-display area NA of the display panel 220.

[0092] The touch panel 210 may include at least one first touch electrode Tx and a second touch electrode Rx provided in the touch active area TA. For example, the touch panel 210 may include the first touch electrode Tx and the second touch electrode Rx that intersects the first touch electrode TX. In an embodiment, the first touch electrode Tx may extend along a first direction. In an embodiment, the second touch electrode Rx may extend along a second direction crossing the first direction while being insulated from the first touch electrode Tx by an insulating film. A capacitance Cse may be formed between the first touch electrode Tx and the second touch electrode Rx. The capacitance Cse may be changed when a touch input occurs at or around a corresponding point. By detecting a change in the capacitance Cse, a touch input and / or a position (or coordinate) at which the touch input occurred may be detected.

[0093] A shape, size, and / or arrangement direction of the first touch electrode Tx and the second touch electrode Rx are not particularly limited. Example embodiments related thereto are described with reference to FIGS. 5 and 6.

[0094] The display panel 220 may include a display area DA and a non-display area NA located in a peripheral area of the display area DA (e.g., an edge area of the display area DA).

[0095] A signal line SL and a data line DL may be located in the display area DA. A sub-pixel SP may be located in the display area DA, and the sub-pixel SP is electrically connected to the signal line SL and the data line DL. Various driving signals that drive the sub-pixel SP and / or wirings that supply power may be provided in the non-display area NA.

[0096] In embodiments of the present disclosure, the type of the display panel 220 is not particularly limited. For example, in embodiments of the present disclosure, the display panel 220 may be a self-luminous display panel. In an embodiment as described above, the display panel 220 may include a plurality of light-emitting elements. For example, a light-emitting element may be an organic light-emitting diode. For example, the light-emitting element may be an inorganic light-emitting diode, such as a micro light-emitting diode (LED), a quantum dot light-emitting diode. For example, the light-emitting element may be an element in which an organic material and an inorganic material are combined.

[0097] For example, in embodiments of the present disclosure, the display panel 220 may be a non-light-emitting display panel such as a liquid crystal display panel (LCD panel), an electro-permanent display panel (EPD panel), or an electro-wetting display panel (EWD panel). In a case in which the display panel 220 is the non-light-emitting display panel, the display device 110 may further include a backlight unit that supply light to the display panel 220.

[0098] The touch driving circuit 230 may be connected (e.g., electrically connected) to the touch panel 210, and transmit a signal input to the touch panel 210 or receive a signal output from the touch panel 210. The touch driving circuit 230 may supply a touch driving signal to the touch panel 210, and thereafter receive a touch sensing signal (or a touch detection signal) corresponding to the touch driving signal from the touch panel 210 to detect a touch input. According to an embodiment, the touch driving circuit 230 may be integrated in one integrated circuit (IC), but may be divided and disposed in two or more integrated circuits according to functions. According to an embodiment, the touch driving circuit 230 may simultaneously (or sequentially) supply a touch driving signal to the plurality of first touch electrodes Tx. The touch driving circuit 230 may simultaneously (or sequentially) receive a touch sensing signal from the plurality of second touch electrodes Rx. The touch driving circuit 230 may receive the touch sensing signal from the touch panel 210 and detect whether a touch is input and / or a touch coordinate by performing signal processing on the touch sensing signal.

[0099] The display driving circuit 240 may be connected to (e.g., electrically connected to) the display panel 220, and supply a signal input to the display panel 220 or receive a signal output from the display panel 220. The display driving circuit 240 may supply a scan signal, a light emission signal, or the like to the signal line SL, and may supply a data signal (or a data voltage) to the data line DL.

[0100] The processor 130 may provide a signal to the display device 110 or receive a signal generated by the display device 110. The processor 130 may provide a signal to the display device 110 with reference to the memory 150. The processor 130 may store data in the memory 150 based on a signal received from the display device 110. For example, information for fingerprint authentication of a user of the electronic device 100 (e.g., a reference fingerprint image for fingerprint authentication) may be stored in the memory 150. For example, the memory 150 may store bio-signal sensing data (e.g., blood pressure, heart rate, oxygen saturation, etc.) of a user of the electronic device 100. A code for executing an application may be stored in the memory 150, and the processor 130 may execute the application with reference to the memory 150 to provide a signal to the display device 110.

[0101] FIG. 3A is a cross-sectional view of the display device 110 of FIG. 2 according to embodiments of the present disclosure.

[0102] Referring to FIG. 3A, the display device 110 may include a display panel 220 and a touch panel 210 disposed on the display panel 220. A cover window CW may be disposed on the touch panel 210.

[0103] In FIG. 3A, an embodiment in which the display panel 220 is a self-luminous display panel including a light-emitting element is described as an example. However, embodiments of the present disclosure are not limited thereto.

[0104] The display panel 220 may include a base substrate BSL, an element layer DSL, an encapsulation layer TFE, and the like.

[0105] The base substrate BSL may support the element layer DSL. The base substrate BSL may provide a plane defined by a first direction DR1 and a second direction DR2, and support the element layer DSL on the plane. The base substrate BSL may include an insulating material. As an example of the insulating material, at least one among glass, quartz, ceramic, and plastic may be included. In an embodiment, the base substrate BSL may be a rigid substrate. In an embodiment, the base substrate BSL may be a flexible substrate.

[0106] The element layer DSL may be positioned on the base substrate BSL (e.g., in a third direction DR3 from the base substrate BSL). The element layer DSL may include a sub-pixel SP (see FIG. 2) and a photosensor PHS (see FIG. 2) located on the base substrate BSL. The sub-pixel may include a light-emitting element and a pixel circuit that drives the light-emitting element. The photosensor may include a light-receiving element and a sensor circuit that drives the light-receiving element. Each of the pixel circuit and the sensor circuit may include a switching element (e.g., a transistor) and a storage element (e.g., a capacitor). A transistor, a capacitor, a light-emitting element, and a light-receiving element may be disposed in the element layer DSL. A signal line that provides a signal to the sub-pixel and the photosensor and a power line that provides a power voltage may be disposed in the element layer DSL. The signal line may include a scan line configured to transmit a scan signal to the sub-pixel and the photosensor. A data line configured to supply a data voltage to the sub-pixel may be disposed in the element layer DSL. The sub-pixel and the photosensor may be disposed in the display area DA. A common electrode (e.g., a cathode electrode of a light-emitting element and a light-receiving element) may be formed in the element layer DSL.

[0107] The encapsulation layer TFE may be disposed on the element layer DSL. The encapsulation layer TFE may protect the element layer DSL from external moisture and / or oxygen. The encapsulation layer TFE may include two or more thin film layers formed on the element layer DSL. For example, the encapsulation layer TFE may include an inorganic thin film layer formed on the element layer DSL, an organic thin film layer formed on the inorganic thin film layer, and an inorganic thin film layer disposed on the organic thin film layer. According to an embodiment, the encapsulation layer TFE may be formed of a glass substrate to cover the element layer DSL. The encapsulation layer TFE may cover the element layer DSL in the display area DA and the non-display area NA.

[0108] The touch panel 210 may be disposed on the encapsulation layer TFE. In an embodiment, the touch panel 210 may be formed directly on the encapsulation layer TFE. In an embodiment, the touch panel 210 may be formed through a separate process from the display panel 220 and disposed (e.g., attached) on the encapsulation layer TFE. The touch panel 210 may include a touch active area TA, and at least a portion of the touch active area TA may overlap the display area DA. The touch panel 210 may include a touch inactive area TN (see FIG. 2), and at least a portion of the touch inactive area TN may overlap the non-display area NA.

[0109] The cover window CW may be disposed on the touch panel 210. The cover window CW may protect the display panel 220 and the touch panel 210 from an external impact or the like. The cover window CW may be embodied as a film of a light-transmitting (e.g., transparent) material, for example glass and / or plastic.

[0110] According to an embodiment, the display device 110 may further include one or more optical layers (e.g., an anti-glare layer, a polarizing plate, a color filter, a liquid crystal, and the like).

[0111] FIG. 3B is a cross-sectional view of the display device 110 of FIG. 2 according to embodiments of the present disclosure.

[0112] The display panel 220 may include a base substrate BSL, a first element layer DSL1, a second element layer DSL2, an encapsulation layer TFE, and the like.

[0113] The base substrate BSL may support the first element layer DSL1 and the second element layer DSL2. The base substrate BSL may provide a plane defined by the first direction DR1 and the second direction DR2, and support the first element layer DSL1 and the second element layer DSL2 on the plane.

[0114] The first element layer DSL1 may be positioned on the base substrate BSL (e.g., in a third direction DR3 from the base substrate BSL). The first element layer DSL1 may include a sub-pixel SP (see FIG. 2) and a photosensor PHS (see FIG. 2) positioned on the base substrate BSL. The sub-pixel may include a light-emitting element and a pixel circuit that drives the light-emitting element. The photosensor may include a light-receiving element and a sensor circuit that drives the light-receiving element. Each of the pixel circuit and the sensor circuit may include a switching element (e.g., a transistor) and a storage element (e. g., a capacitor). A transistor, a capacitor, a light-emitting element, and a light-receiving element may be disposed in the first element layer DSL1. A signal line that provides a signal to the sub-pixel and the photosensor and a power line that provides a power voltage may be disposed in the first element layer DSL1. The signal line may include a scan line configured to transmit a scan signal to the sub-pixel and the photosensor. The first element layer DSL1 may include a data line configured to provide a data signal to a sub-pixel. The sub-pixel and the photosensor may be disposed in the display area DA. A common electrode (e.g., a cathode electrode of a light-emitting element and a light-receiving element) may be formed in the first element layer DSL1.

[0115] The second element layer DSL2 may be located below the base substrate BSL (e.g., in a direction opposite to the third direction DR3 from the base substrate BSL). The second element layer DSL2 may include a light-emitting element and a light-receiving element positioned under the base substrate BSL. A signal line through which a signal that controls driving timings of the light-emitting element and the light-receiving element is transmitted may be disposed in the second element layer DSL2. A power line that provides a power voltage to the light-emitting element and the light-receiving element may be disposed in the second element layer DSL2. The signal line may include a scan line that controls a light emission timing of the light-emitting element and that controls a sensing timing of the light-receiving element. The light-emitting element and the light-receiving element may be disposed in the display area DA. A common electrode (e.g., a cathode electrode of the light-emitting element and the light-receiving element) may be formed in the second element layer DSL2. In an embodiment, an encapsulation layer covering the second element layer DSL2 may be further provided. However, embodiments of the present disclosure are not limited thereto.

[0116] The touch panel 210 may be disposed on the encapsulation layer TFE. In an embodiment, the touch panel 210 may be formed directly on the encapsulation layer TFE. In an embodiment, the touch panel 210 may be formed through a separate process from the display panel 220 and disposed (e.g., attached) on the encapsulation layer TFE. The touch panel 210 may include a touch active area TA, and at least a portion of the touch active area TA may overlap the display area DA. The touch panel 210 may include a touch inactive area TN (see FIG. 2), and at least a portion of the touch inactive area TN may overlap the non-display area NA.

[0117] The first cover window CW1 may be disposed on the touch panel 210. The first cover window CW1 may protect the display panel 220 and the touch panel 210 from an external impact or the like. The first cover window CW1 may be implemented as a film of a light-transmitting (e.g., transparent) material, for example glass and / or plastic.

[0118] The second cover window CW2 may be disposed under the second element layer DSL2. The second cover window CW2 may protect the second element layer DSL2 from an external impact or the like. The second cover window CW2 may be implemented as a film of a light-transmitting (e.g., transparent) material, for example, glass and / or plastic.

[0119] FIG. 4 is a system block diagram of a display device 110 according to embodiments of the present disclosure.

[0120] Referring to FIG. 4, a display device 110 according to embodiments of the present disclosure may include a display panel 220, a data driving circuit 410, a scan driving circuit 420, an emission driving circuit 430, a timing controller 440, a readout circuit 450, a reset circuit 460, and the like.

[0121] The above-described display driving circuit 240 (see FIG. 2) may include the data driving circuit 410, the scan driving circuit 420, the emission driving circuit 430, the timing controller 440, the readout circuit 450, the reset circuit 460, and the like.

[0122] One or more sub-pixels SP may be disposed on the display panel 220. One or more photosensors PHS may be disposed on the display panel 220. One or more signal lines configured to provide signals to the sub-pixel SP and the photosensor PHS may be disposed on the display panel 220. One or more data lines configured to provide a data voltage to the sub-pixel SP may be disposed on the display panel 220. A power line configured to supply a power voltage to the sub-pixel SP and the photosensor PHS may be disposed on the display panel 220. The sub-pixel SP and the photosensor PHS may be disposed on a display substrate DSUB. The signal line, the data lines DL1 to DLn (n is an integer of 2 or more), and the power line may be disposed on the display substrate DSUB. The display substrate DSUB may include the base substrate BSL described above (see FIGS. 3A and 3B).

[0123] The power voltage may include, for example, a first power voltage VDD, a second power voltage VSS, a third power voltage VRST, a fourth power voltage VCOM, and the like. The power voltage is commonly input to the plurality of sub-pixels SP and / or the plurality of photosensors PHS, and is also referred to as a common voltage. The power voltage may be generated, for example, in a power management integrated circuit.

[0124] A plurality of data lines DL1 to DLn (where n is a positive integer of 2 or more) may be arranged in the display panel 220. The plurality of data lines DL1 to DLn may be arranged to extend in a second direction DR2 in the display panel 220. The second direction DR2 may be, for example, a column direction extending from an upper side of the display panel 220 to a lower side of the display panel 220, but embodiments of the present disclosure are not limited thereto.

[0125] A plurality of scan lines SCL1 to SCLm (where m is a positive integer of 2 or more) may be arranged in the display panel 220. The plurality of scan lines SCL1 to SCLm may be arranged to extend in a first direction DR1 in the display panel 220. The first direction DR1 may be, for example, a row direction extending from a left side of the display panel 220 to a right side of the display panel 220, but embodiments of the present disclosure are not limited thereto.

[0126] In an embodiment, being arranged to extend in the second direction DR2 may mean being arranged to extend in a direction connecting the upper side and the lower side of the display panel 220 as a whole, and partially extending in a direction different from the second direction DR2, is not excluded. For example, in embodiments of the present disclosure, at least one data line of the plurality of data lines DL1 to DLn may be designed to extend partially bypassing in a direction different from the second direction DR2 in order to avoid a specific area (e.g., an area in which transmittance is set high). A meaning of being arranged to extend in the first direction DR1 may also be understood in the same sense as the meaning of being arranged to extend in the second direction DR2.

[0127] A plurality of light emission control lines EML1 to EMLm may be arranged in the display panel 220. The plurality of light emission control lines EML1 to EMLm may be arranged to extend in the first direction DR1 in the display panel 220.

[0128] A plurality of sensing lines RX1 to RXo (where o is a positive integer of 2 or more) may be arranged in the display panel 220. A plurality of sensing lines RX1 to RXo may be arranged to extend in the second direction DR2 in the display panel 220.

[0129] One or more reset control lines RSTL may be arranged in the display panel 220.

[0130] The sub-pixel SP may be electrically connected to any one of the plurality of data lines DL1 to DLn. The sub-pixel SP may be electrically connected to at least one scan line among the plurality of scan lines SCL1 to SCLm. The sub-pixel SP may be electrically connected to at least one light emission control line among the plurality of light emission control lines EML1 to EMLm.

[0131] The photosensor PHS may be electrically connected to any one of the plurality of sensing lines RX1 to RXo. According to an embodiment, the photosensor PHS may be electrically connected to the reset control line RSTL. According to an embodiment, the photosensor PHS may be electrically connected to at least one scan line among the plurality of scan lines SCL1 to SCLm. According to an embodiment, the photosensor PHS may be electrically connected to at least one light emission control line among the plurality of light emission control lines EML1 to EMLm.

[0132] The sub-pixel SP and the photosensor PHS may be electrically connected to any one of the plurality of scan lines SCL1 to SCLm.

[0133] According to an embodiment, a plurality of sub-pixels SP may be arranged in a matrix type in the display panel 220. For example, the plurality of sub-pixels SP may be arranged in an RGB type, or may be arranged in a rhombus-shaped PENTILE™ structure.

[0134] The data driving circuit 410 may be configured to supply a data voltage to the plurality of data lines DL1 to DLn. The data driving circuit 410 may receive second image data DATA2 and supply a data voltage corresponding to the second image data TATA2 to the plurality of data lines DL1 to DLn in response to a data driving circuit control signal DCS.

[0135] The scan driving circuit 420 may be configured to supply a scan signal to the plurality of scan lines SCL1 to SCLm. According to an embodiment, the scan driving circuit 420 may be configured to sequentially supply scan signals to the plurality of scan lines SCL1 to SCLm, but is not limited thereto. For example, the scan driving circuit 420 may include a plurality of sub-scan driving circuits 422, 424, and 426. The sub-scan driving circuits 422, 424, and 426 may be configured to spatially divide the display area DA to provide a scan signal. For example, the first scan driving circuit 422 may supply a scan signal to an upper ⅓ area (e.g., an area including a first scan line SCL1) of the display area DA. The second scan driving circuit 424 may supply a scan signal to a central ⅓ area (e.g., an area including a p-th scan line SCLp) of the display area DA. The third scan driving circuit 426 may supply a scan signal to a lower ⅓ area (e.g., an area including a m-th scan line SCLm) of the display area DA. The scan driving circuit 420 may receive the scan driving circuit control signal SCS and supply the scan signal to the plurality of scan lines SCL1 to SCLm according to timing.

[0136] The emission driving circuit 430 may be configured to supply a light emission control signal to the plurality of light emission control lines EML1 to EMLm. According to an embodiment, the emission driving circuit 430 may be configured to sequentially supply light emission control signals to the plurality of light emission control lines EML1 to EMLm, but is not limited thereto. For example, the emission driving circuit 430 may include a plurality of sub-emission driving circuits 432, 434, and 436. The sub-emission driving circuits 432, 434, and 436 may be configured to spatially divide the display area DA to provide a light emission control signal. For example, the first emission driving circuit 432 may supply a light emission control signal to an upper ⅓ area of the display area DA (e.g., an area including a first light emission control line EML1). The second emission driving circuit 434 may supply a light emission control signal to a central ⅓ area (e.g., an area including a p-th light emission control line EMLp) of the display area DA. The third emission driving circuit 436 may supply a light emission control signal to a lower ⅓ area (e.g., an area including a m-th light emission control line EMLm) of the display area DA. The emission driving circuit 430 may receive an emission driving circuit control signal ECS and supply the light-emitting control signal to the plurality of light emission control lines EML1 to EMLm according to timing.

[0137] The timing controller 440 may receive a control signal CS and first image data DATA1, e.g., from the processor 130 (see FIG. 1). The timing controller 440 may generate the data driving circuit control signal DCS, the scan driving circuit control signal SCS, the emission driving circuit control signal ECS, the second image data DATA2, a readout circuit control signal RCS, and the like based on the control signal CS and the first image data DATA1 which are input.

[0138] The readout circuit 450 may be electrically connected to the plurality of sensing lines RX1 to RXo. The readout circuit 450 may be configured to receive sensing signals from the plurality of photosensors PHS through the plurality of sensing lines RX1 to RXo. For example, according to the design of the readout circuit 450, the readout circuit 450 may integrate a current flowing through at least one of the plurality of sensing lines RX1 to RXo or sense a voltage of at least one of the plurality of the sensing lines RX1 to RXo. The readout circuit 450 may further include a multiplexer configured to integrate a current (or sense a voltage) of at least one of the plurality of sensing lines RX1 to RXo. Hereinafter, for convenience of description, the readout circuit 450 will be described as an example in which a current sensing method is applied, but embodiments of the present disclosure are not limited thereto.

[0139] The readout circuit 450 may include an analog-to-digital converter (ADC) 452 configured to convert an analog voltage to a digital value DSEN.

[0140] The reset circuit 460 may be configured to supply a reset signal RST to the plurality of photosensors PHS. When the reset signal RST is supplied to the photosensor PHS, an electrical connection between the photosensors PHS and the sensing lines RX1 to Rxo may be broken. A timing at which the reset circuit 460 outputs the reset signal RST may be controlled by the timing controller 440.

[0141] One or more circuits constituting the display driving circuit 240 (see FIG. 2) may be disposed in the display device 110 in the form of an integrated circuit (IC). For example, the data driving circuit 410 and the readout circuit 450 may be disposed in the display device 110 in the form of a source readout integrated circuit (SRIC). One or more circuits constituting the display driving circuit 240 may be formed together in the process of forming the display panel 220. For example, the scan driver circuit 420 and / or the emission driving circuit 430 may be formed together in a process of forming one or more circuit elements (e.g., transistors, etc.) included in the sub-pixel SP and the photosensor PHS.

[0142] The data driving circuit 410, the scan driving circuit 420, the emission driving circuit 430, and the timing controller 440 may be classified according to functions, and two or more components may be functionally distinguished within one integrated circuit. For example, the data driving circuit 410 and the timing controller 440 may be implemented as one integrated circuit, but may be functionally separated within the integrated circuit. For example, the scan driving circuit 420 and the emission driving circuit 430 may be implemented as one integrated circuit, but may be functionally separated within the integrated circuit.

[0143] FIG. 5 is a diagram illustrating the touch panel 210 and the touch driving circuit 230 of FIG. 2.

[0144] The display device 110 may include the touch panel 210 and the touch driving circuit 230.

[0145] Referring to FIG. 5, the touch panel 210 according to embodiments of the present disclosure may include a touch substrate TSUB, first touch electrodes Tx1, Tx2 to Txa-1, Txa (hereinafter, Tx1 to Txa, where a is an integer of 2 or more), second touch electrodes Rx1, Rx2 to Rxb (hereinafter, Rx1 to Rxb, where b is an integer of 2 or more), a pad portion 520, and a touch wiring 530.

[0146] The touch substrate TSBU may be a substrate serving as a substrate of the touch panel 210, and may be a rigid or flexible substrate. For example, the touch substrate TSUB may be a rigid substrate including glass or tempered glass. For example, the touch substrate TSUB may be a flexible substrate including a thin film made of a flexible plastic material. The first touch electrodes Tx1 to Txa, the second touch electrodes Rx1 to Rxb, the pad portion 520, the touch wiring 530, and the like may be disposed on the touch substrate TSUB. According to an embodiment, the touch substrate TUSB may be omitted or replaced with another configuration. For example, in case that the first touch electrodes Tx1 to Txa and the second touch electrodes Rx1 to Rxb are directly formed on the display panel 220 (see FIG. 2), the touch substrate TSUB may be replaced with the base substrate BSL (see FIGS. 3A and 3B) or the encapsulation layer TFE (see FIG. 3A and FIG. 3B) described above, or the like.

[0147] The first touch electrodes Tx1 to Txa may extend along a first direction (e.g., a direction transverse from left to right of the touch panel 210, or a row direction). Referring to FIG. 5, each of the plurality of first touch electrodes Tx1 to Txa may be arranged to extend in a row direction in the touch panel 210.

[0148] The second touch electrodes Rx1 to Rxb may extend along a second direction (e.g., a direction transverse from an upper side to a lower side of the touch panel 210, or a column direction). Referring to FIG. 5, each of the plurality of second touch electrodes Rx1 to Rxb may be arranged to extend in a column direction in the touch panel 210.

[0149] The touch panel 210 according to embodiments of the present disclosure may be driven in a mutual capacitance manner. In the mutual capacitance manner, any one of the first touch electrodes Tx1 to Txa and the second touch electrodes Rx1 to Rxb may be a touch driving electrode. In the mutual capacitance manner, the other of the first touch electrodes Tx1 to Txa and the second touch electrodes Rx1 to Rxb may be a touch sensing electrode. A touch driving signal TDS may be input to the touch driving electrode. A touch sensing signal TSS may be output through the touch sensing electrode. In an embodiment, the first touch electrodes Tx1 to Txa may receive the touch driving signal TDS for touch driving, and the second touch electrodes Rx1 to Rxb may output the touch sensing signal TSS generated in response to the touch driving signal TDS. In an embodiment, the second touch electrodes Rx1 to Rxb may receive the touch driving signal TDS, and the first touch electrodes Tx1 to Txa may output the touch sensing signal TSS generated in response to the touch driving signal TDS. Hereinafter, for convenience of description, an embodiment in which the touch driving signal TDS is input to the first touch electrodes Tx1 to Txa and the touch sensing signal TSS is output through the second touch electrodes Rx1 to Rxb will be described as an example. However, embodiments of the present disclosure are not limited thereto.

[0150] A capacitance Cse may be formed between the first touch electrodes Tx1 to Txa and the second touch electrodes Rx1 to Rxb. For example, referring to FIG. 5, the first touch electrodes Tx1 to Txa and the second touch electrodes Rx1 to Rxb may overlap each other in a vertical direction (e.g., a third direction DR3) in an overlapping area OLA. In the overlapping area OLA, the first touch electrodes Tx1 to Txa may be one electrode of a capacitor, and the second touch electrodes Rx1 to Rxb may be the other electrode of the capacitor. The capacitance Cse may be formed between the first touch electrodes Tx1 to Txa and the second touch electrodes Rx1 to Rxb in the overlapping area OLA. When an object (e.g., a finger of a human, a stylus pen, or the like) approaches the touch panel 210, the capacitance Cse value may be changed due to the object. The touch driving circuit 230 may detect whether a touch is input and / or touch coordinates based on a value of the changed capacitance Cse.

[0151] The pad portion 520 may include one or more pads PAD. The pads PAD may connect (e.g., electrically connect) the first touch electrodes Tx1 to Txa and the second touch electrodes Rx1 to Rxb with the touch driving circuit 230. For example, the touch driving signal TDS may be input to the first touch electrodes Tx1 to Txa through a first pad portion 520a. For example, the touch sensing signal TSS may be output from the second touch electrodes Rx1 to Rxb through a second pad portion 520b.

[0152] In an embodiment, the touch wiring 530 may connect (e.g., electrically connect) the first pad portion 520a and the first touch electrodes Tx1 to Txa. In an embodiment, the touch wiring 530 may connect (e.g., electrically connect) between the second pad portion 520b and the second touch electrodes Rx1 to Rxb.

[0153] In an embodiment, the pad portion 520 and the touch wiring 530 may be located in the touch inactive area TN.

[0154] FIG. 6 is an example of the touch panel 210 of FIG. 5.

[0155] A first touch electrode Tx of the touch panel 210 according to embodiments of the present disclosure may include a first sensing cell 612 and a first connection electrode 614. A second touch electrode Rx may include a second sensing cell 622 and a second connection electrode 624.

[0156] The first touch electrode Tx may extend along the first direction DR1. The first touch electrode Tx may include a plurality of first sensing cells 612 and a first connection electrode 614 configured to connect the plurality of first sensing cells 612 to each other. In an embodiment, the first connection electrode 614 may be integrally configured with the first sensing cell 612. In an embodiment, the first connection electrode 614 may be configured with a connection pattern in the form of a bridge.

[0157] The second touch electrode Rx may extend along the second direction DR2. The second touch electrode Rx may include a plurality of second sensing cells 622 and a second connection electrode 624 configured to connect the plurality of second sensing cells 622 to each other. In an embodiment, the second connection electrode 624 may be integrally configured with the second sensing cell 622. In an embodiment, the second connection electrode 624 may be configured in a bridge-shaped connection pattern.

[0158] The first connection electrode 614 and the second connection electrode 624 may be positioned to overlap each other in the vertical direction (e.g., the third direction DR3). The first connection electrode 614 and the second connection electrode 624 may be insulated from each other by an insulating layer.

[0159] Referring to FIG. 6, a capacitance Cse may be formed between the first touch electrode Tx and the second touch electrode Rx. For example, the first touch electrode Tx may be one electrode of a capacitor, and the second touch electrode Rx adjacent to the first touch electrode Tx may be the other electrode of the capacitor. A capacitance Cse may be formed in an adjacent area CTA between the first touch electrode Tx and the second touch electrode Rx. Air (e.g., atmosphere) between the first touch electrode Tx and the second touch electrode Rx may be an insulating material of the capacitor. Thereby, whether a touch is input and / or touch coordinates may be detected in a mutual capacitance manner.

[0160] FIG. 7 is an enlarged view of a first area AR1 of FIG. 6.

[0161] The pixel PXL may include a plurality of sub-pixels SP1, SP2, and SP3. Each of the plurality of sub-pixels SP1, SP2, and SP3 may include an emission area and a non-emission area NEM. Referring to FIG. 7, the pixel PXL may include a first sub-pixel SP1, a second sub-pixel SP2, and a third sub-pixel SP3.

[0162] The emission area is an area in which light may be emitted. The light-receiving area is an area capable of receiving light. In an embodiment in which the sub-pixels SP1, SP2, and SP3 include a light-emitting element, the emission area may correspond to an area where the light-emitting element is located. A first emission area EMA_R may be located in the first sub-pixel SP1. A second emission area EMA_G may be located in the second sub-pixel SP2. A third emission area EMA_B may be located in the third sub-pixel SP3.

[0163] The non-emissive area NEM may be located in a periphery (e.g., edge area) of the emission areas EMA_R, EMA_G, and EMA_B and a periphery of the light-receiving area (e.g., edge area). The sub-pixels SP1, SP2, and SP3 may be distinguished from each other by the non-emission area NEM. In an embodiment, a pixel driving circuit of each of the first to third sub-pixels SP1 to SP3 may be located in at least some of areas overlapping the non-emission area NEM. In an embodiment, a sensor circuit of the photosensor PHS may be located in at least some of areas overlapping the non-emission area NEM. In an embodiment, the non-emission area NEM may correspond to an area in which a pixel defining layer, a black matrix, or the like is located. The emission areas EMA_R, EMA_G, and EMA_B, the light-receiving area, and the non-emission area NEM may constitute the above-described display area DA (see FIG. 2).

[0164] The first sub-pixel SP1 may be configured to emit light in a first wavelength band (e.g., a red wavelength band). The second sub-pixel SP2 may emit light in a second wavelength band (e.g., a green wavelength band). The third sub-pixel SP3 may emit light in a third wavelength band (e.g., a blue wavelength band). The red wavelength band may be a wavelength band of about 600 nm to about 750 nm. The green wavelength band may be a wavelength band of about 480 nm to about 560 nm. The blue wavelength band may be a wavelength band of about 370 nm to about 460 nm. In an embodiment, the first sub-pixel SP1 may be a red sub-pixel that emits light in a red wavelength band, the second sub-pixel SP2 may be a green sub-pixel that emits light in a green wavelength band, and the third sub-pixel SP3 may be a blue sub-pixel that emits light in a blue wavelength band. However, embodiments of the present disclosure are not limited thereto.

[0165] In the pixel PXL, a plurality of sub-pixels SP1, SP2, and SP3 may be arranged in various ways. For example, referring to FIG. 7, the first sub-pixel SP1 and the third sub-pixel SP3 may be alternately arranged along the first direction DR1 in any one of a plurality of pixel rows. Referring to FIG. 7, the second sub-pixel SP2 and the photosensor PHS may be alternately arranged in another row among the plurality of pixel rows. Referring to FIG. 7, the first sub-pixel SP1 and the second sub-pixel SP2 may be alternately arranged along a fourth direction DR4 in a diagonal direction intersecting each of the first direction DR1 and the second direction DR2. Referring to FIG. 7, the third sub-pixel SP3 and the photosensor PHS may be alternately arranged along the fourth direction DR4. A row in which the first sub-pixel SP1 and the second sub-pixel SP2 are alternately arranged and a row in which the third sub-pixel SP3 and the photosensor PHS are alternately arranged may be located adjacent to each other in a fifth direction DR5. The fifth direction DR5 may intersect the fourth direction DR4. For example, the fifth direction DR5 may be a direction perpendicular to the fourth direction DR4.

[0166] An area of the emission area of any one of the first sub-pixel SP1, the second sub-pixel SP2, and the third sub-pixel SP3 may be different from those of the other two. For example, an area of the emission area EMA_B of the third sub-pixel SP3 may be larger than an area of the emission area EMA_R of the first sub-pixel SP1. For example, an area of the emission area EMA_R of the first sub-pixel SP1 may be larger than an area of the emission area EMA_G of the second sub-pixel SP2. However, embodiments of the present disclosure are not limited thereto. For example, the areas of the emission areas of the first sub-pixel SP1, the second sub-pixel SP2, and the third sub-pixel SP3 may all be designed to be the same.

[0167] Shapes of the emission area and the light-receiving area may be variously designed. For example, referring to FIG. 7, the shapes of the emission areas EMA_R, EMA_G, and EMA_B and the light-receiving area of the photosensor PHS are shown to be octagonal, but according to embodiments, may have a shape such as a circle, another polygon, or a polygon with rounded corners.

[0168] In an embodiment, the shapes of the first emission area EMA_R and the third emission area EMA_B may be regular octagons. However, embodiments of the present disclosure are not limited thereto.

[0169] In an embodiment, the shape of the second emission area EMA_G may be an octagon long in the fourth direction DR4. However, embodiments of the present disclosure are not limited thereto.

[0170] In an embodiment, the shape of the photosensor PHS (e.g., the light-receiving area of the photosensor PHS) may be an octagon long in the fifth direction DR5 (e.g., extending lengthwise in the fifth direction DR5). However, embodiments of the present disclosure are not limited thereto.

[0171] Still referring to FIG. 7, the first touch electrode Tx may include a mesh hole MH and a body portion BP.

[0172] The mesh hole MH may overlap the emission areas EMA_R, EMA_G, and EMA_B and the light-receiving area of the photosensor PHS in a thickness direction (e.g., the third direction DR3). An area of the mesh hole MH may be larger than an area of the emission areas EMA_R, EMA_G, and EMA_B and the light-receiving area of the photosensor PHS.

[0173] The body portion BP may overlap the non-emission area NEM in the thickness direction (e.g., the third direction DR3). The width of the body portion BP may be smaller than the width of the non-emission area NEM.

[0174] Through the above structure, light output from the emission areas EMA_R, EMA_G, and EMA_B may effectively pass through the first touch electrode Tx (see FIG. 6). Through the above structure, light incident on the light-receiving area of the photosensor PHS may effectively transmit through the first touch electrode Tx.

[0175] FIG. 8 is a cross-sectional view taken along line I-I′ of FIG. 7.

[0176] FIG. 8 mainly describes a cross-sectional view of the first sub-pixel SP1 and the second sub-pixel SP2. A cross-sectional view of the third sub-pixel SP3 and the photosensor PHS of FIG. 7 may be understood through the description of FIG. 10. Accordingly, in FIG. 8, a cross-sectional view of a first light-emitting element LD1 which is a light-emitting element of the first sub-pixel SP1, and a second light-emitting element LD2 which is a light-emitting element of the second sub-pixel SP2, will be mainly described.

[0177] Referring to FIG. 8, a pixel defining layer PDL, light-emitting elements LD1 and LD2, an encapsulation layer TFE, a first sensing cell 612, and a first insulating layer IL1 may be positioned on a lower layer LWL. The lower layer LWL may include the above-described base substrate BSL (see FIGS. 3A and 3B) and at least a part of the element layer DSL (see FIG. 3A) positioned on the base substrate BSL. The light-emitting elements LD1 and LD2 may include the remaining part of the element layer DSL described above. The first sensing cell 612 and the first insulating layer IL1 may be included in the touch panel 210 described above (see FIG. 2).

[0178] In the light-emitting elements LD1 and LD2, the first light-emitting element LD1 of the above-described first sub-pixel SP1 (see FIG. 7) and the second light-emitting element LD2 of the second sub-pixel SP2 (see FIG. 7) are exemplarily shown. The first light-emitting element LD1 may include an anode electrode AE, a first light-emitting layer EML1, and a cathode electrode CE. The second light-emitting element LD2 may include an anode electrode AE, a second light-emitting layer EML2, and a cathode electrode CE.

[0179] The anode electrode AE may be disposed for each sub-pixel. The pixel defining layer PDL exposing the anode electrode AE may be disposed on the anode electrode AE. The anode electrode AE may include a metal layer such as, for example, silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), an alloy thereof, and / or indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), or the like.

[0180] The pixel defining layer PDL may be positioned to overlap the non-emission area NEM. The pixel defining layer PDL may include an organic insulating layer including an organic material. The organic material may include, for example, one or more of an acryl resin, an epoxy resin, a phenol resin, a polyamide resin, and a polyimide resin. The pixel defining layer PDL may include a light absorbing material. The pixel defining layer PDL may be coated with a light absorber that absorbs external light introduced to the device. In an embodiment, the pixel defining layer PDL may include a carbon-based black pigment. In an embodiment, the pixel defining layer PDL may include an opaque metal material such as, for example, chromium (Cr), molybdenum (Mo), an alloy (MoTi) of molybdenum (Mo) and titanium (Ti), tungsten (W), vanadium (V), niobium (Nb), tantalum (Ta), manganese (Mn), cobalt (Co), or nickel (Ni) having a high light absorption rate. However, embodiments of the present disclosure are not limited thereto.

[0181] The light-emitting layers EML1 and EML2 may be disposed to overlap an area where at least a part of the pixel defining layer PDL is removed and the anode electrode AE is exposed. The light-emitting layers EML1 and EML2 may include an organic light-emitting layer. Depending on the organic material included in the light-emitting layers EML1 and EML2, the light-emitting layers EML1 and EML2 may emit light of different wavelength bands. For example, the first light-emitting layer EML1 may emit light in a first wavelength band (e.g., a red wavelength band). For example, the second light-emitting layer EML2 may emit light in a second wavelength band (e.g., a green wavelength band). An area where the first light-emitting layer EML1 is located may correspond to the first emission area EMA_R. An area where the second light-emitting layer EML2 is located may correspond to the second emission area EMA_G.

[0182] The cathode electrode CE may be disposed on the light-emitting layers EML1 and EML2 (e.g., in the third direction DR3). The cathode electrode CE may be deposited (e.g., entirely deposited) in the emission areas EMA_R and EMA_G and the non-emission area NEM. The cathode electrode CE may include a metal layer such as, for example, silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), or chromium (Cr), and / or a light-transmitting conductive layer such as ITO, IZO, ZnO, or ITZO. For example, the cathode electrode CE may include a multilayer of two or more layers including a thin metal layer. For example, the cathode electrode CE may include a triple layer of ITO / Ag / ITO.

[0183] In an embodiment, the light-emitting elements LD1 and LD2 may further include a hole transport layer disposed between the anode electrode AE and the light-emitting layers EML1 and EML2. In an embodiment, the light-emitting elements LD1 and LD2 may further include an electron transport layer disposed between the cathode electrode CE and the light-emitting layers EML1 and EML2.

[0184] The encapsulation layer TFE may be located on the cathode electrode CE (e.g., in the third direction DR3). The encapsulation layer TFE may have a laminated structure formed of an inorganic material, an organic material, and an inorganic material in that order. Referring to FIG. 8, the encapsulation layer TFE may be formed by sequentially depositing a first inorganic encapsulation layer IOL1 including an inorganic material, an organic encapsulation layer OL including an organic material, and a second inorganic encapsulation layer IOL2 including an inorganic material. The encapsulation layer TFE may protect the light-emitting elements LD1 and LD2 (e.g., the light-emitting layers EML1 and EML2) under the encapsulation layer TFE from external moisture and / or oxygen.

[0185] The body portion BP of the first sensing cell 612 may be disposed on the encapsulation layer TFE. The first insulating layer IL1 may be positioned on the body portion BP of the first sensing cell 612.

[0186] The first insulating layer IL1 may insulate the touch electrodes from each other. Referring to FIG. 5, the plurality of first touch electrodes Tx1 to Txa may be insulated from each other by the first insulating layer IL1. The plurality of second touch electrodes Rx1 to Rxb may be insulated from each other by the first insulating layer IL1. Referring to FIG. 6, the first connection electrode 614 and the second connection electrode 624 may be insulated from each other by the first insulating layer IL1. For example, the first connection electrode 614 and the second connection electrode 624 may be positioned to overlap each other in the thickness direction (for example, the third direction DR3) with the first insulating layer IL1 interposed therebetween.

[0187] The mesh hole MH of the first sensing cell 612 may be positioned to overlap the first and second emission areas EMA_R and EMA_G.

[0188] FIG. 9 is an enlarged view of a second area AR2 of FIG. 6.

[0189] Comparing FIGS. 9 and 7, the description of the first sensing cell 612 may be applied as a description of the second sensing cell 622 as a whole. The second sensing cell 622 may include a body portion BP and a mesh hole MH. The description of the remaining configurations is as described above with reference to FIG. 7.

[0190] FIG. 10 is a cross-sectional view taken along line II-II′ of FIG. 9.

[0191] FIG. 10 mainly describes a cross-sectional view of the third sub-pixel SP3 and the photosensor PHS. A cross-sectional view of the first sub-pixel SP1 and the second sub-pixel SP2 of FIG. 9 may be understood through the description of FIG. 8 described above. Accordingly, in FIG. 10, a cross-sectional view of a third light-emitting element LD3 which is a light-emitting element of the third sub-pixel SP3 and a light-receiving element LRD of the photosensor PHS will be mainly described.

[0192] Referring to FIG. 10, a pixel defining layer PDL, a third light-emitting element LD3, a light-receiving element LRD, an encapsulation layer TFE, a second sensing cell 622, and a first insulating layer IL1 may be positioned on a lower layer LWL. The lower layer LWL may include the above-described base substrate BSL (see FIGS. 3A and 3B) and at least a part of the element layer DSL (see FIG. 3A) positioned on the base substrate BSL. The third light-emitting element LD3 and the light-receiving element LRD may include the remaining part of the element layer DSL described above. The second sensing cell 622 and the first insulating layer IL1 may be included in the touch panel 210 described above (see FIG. 2).

[0193] The third light-emitting element LD3 may include an anode electrode AE, a third light-emitting layer EML3, and a cathode electrode CE. The light-receiving element LRD may include an anode electrode AE, a light-receiving layer LRL, and a cathode electrode CE.

[0194] The anode electrode AE may be disposed for each sub-pixel and each photosensor. A pixel defining layer PDL exposing the anode electrode AE may be disposed on the anode electrode AE.

[0195] The pixel defining layer PDL may be positioned to overlap the non-emission area NEM. The non-emission area NEM may include a peripheral area of each of the third emission area EMA_B and a light-receiving area SA. The pixel defining layer PDL may include an organic insulating layer including an organic material. The pixel defining layer PDL may include a light absorbing material. However, embodiments of the present disclosure are not limited thereto.

[0196] The third light-emitting layer EML3 may be disposed to overlap an area where at least a part of the pixel defining layer PDL is removed and the anode electrode AE is exposed. The third light-emitting layer EML3 may include an organic light-emitting layer. For example, the third light-emitting layer EML3 may emit light in a third wavelength band (e.g., a blue wavelength band). An area where the third light-emitting layer EML3 is located may correspond to the third emission area EMA_B.

[0197] The light-receiving layer LRL may be disposed to overlap an area where at least a part of the pixel defining layer PDL is removed and the anode electrode AE is exposed. An area where the light-receiving layer LRL is located may correspond to the light-receiving area SA.

[0198] The cathode electrode CE may be disposed on the third light-emitting layer EML3 and the light-receiving layer LRL (e.g., in the third direction DR3 thereof). The cathode electrode CE may be deposited (e.g., entirely deposited) in the third emission area EMA_B, the light-receiving area SA, and the non-emission area NEM. The cathode electrode CE may include a light-transmitting conductive layer. For example, the cathode electrode CE may include a multilayer of two or more layers including a thin metal layer. For example, the cathode electrode CE may include a triple layer of ITO / Ag / ITO.

[0199] In an embodiment, the third light-emitting element LD3 may further include a hole transport layer disposed between the anode electrode AE and the third light-emitting layer EML3. In an embodiment, the third light-emitting element LD3 may further include an electron transport layer disposed between the cathode electrode CE and the third light-emitting layer EML3.

[0200] The encapsulation layer TFE may be located on the cathode electrode CE (e.g., in the third direction DR3). The encapsulation layer TFE may have a laminated structure formed of an inorganic material, an organic material, and an inorganic material in that order. Referring to FIG. 10, the encapsulation layer TFE may be formed by sequentially depositing a first inorganic encapsulation layer IOL1 containing an inorganic material, an organic encapsulation layer OL containing an organic material, and a second inorganic encapsulation layer IOL2 containing an inorganic material. The encapsulation layer TFE may protect the lower third light-emitting element LD3 (e.g., the third light-emitting layer EML3) and the light-receiving element LRD (e.g., a light-receiving layer LRL) from external moisture and / or oxygen.

[0201] The body portion BP of the second sensing cell 622 may be disposed on the encapsulation layer TFE. The first insulating layer IL1 may be positioned on the body portion BP of the second sensing cell 622.

[0202] The mesh hole MH of the second sensing cell 622 may be positioned to overlap the third emission area EMA_B and the light-receiving area SA.

[0203] FIG. 11 is a layout diagram illustrating a display area DA according to an embodiment.

[0204] Referring to FIG. 11, the display area DA may include sub-pixels SP1, SP2, and SP3 and a photosensor PHS. The sub-pixels SP1, SP2, and SP3 and the photosensor PHS may be included in one unit pixel UP.

[0205] The unit pixel UP may be defined as a minimum unit of pixels capable of displaying a white image. The unit pixel UP may sense light. In an embodiment, the unit pixels UP may be alternately arranged in a zigzag shape in a plan view. For example, the unit pixels UP may be arranged in a diagonal direction. For example, the unit pixels UP may be alternately arranged in the form of horizontal or vertical stripes in a plan view.

[0206] The first sub-pixel SP1 may include a first light-emitting element LD1 that emits light in a first wavelength band (e.g., a red wavelength band), and a first pixel driving circuit PXC1 that applies a driving current to the first light-emitting elements LD1.

[0207] The second sub-pixel SP2 may include a second light-emitting element LD2 that emits light in a second wavelength band (e.g., a green wavelength band), and a second pixel driving circuit PXC2 that applies a driving current to the second light-emitting elements LD2.

[0208] The third sub-pixel SP3 may include a third light-emitting element LD3 that emits light in a third wavelength band (e.g., a blue wavelength band), and a third pixel driving circuit PXC3 that applies a driving current to the third light-emitting elements LD3.

[0209] The photosensor PHS may include a light-receiving element LRD that detects light (for example, light of a predetermined wavelength band) and a sensor circuit PSC connected to the light-receiver element LRD.

[0210] Referring to FIG. 11, a distance between a center C1 of the first light-emitting element LD1 and a center C2 of the second light-emitting element LD2 adjacent to each other in the unit pixel UP may be a first distance D12. A distance between the center C2 of the second light-emitting element LD2 and a center C3 of the third light-emitting element LD3 adjacent to each other in the unit pixel UP may be a second distance D23. The distance between the center C3 of the third light-emitting element LD3 and a center C4 of the light-receiving element LRD adjacent to each other in the unit pixel UP may be a third distance D34. The distance between the center C4 of the light-receiving elements LRD adjacent to each other in the unit pixel UP and the first light-emitting element LD1 may be a fourth distance D14. In an embodiment, the first distance D12, the second distance D23, the third distance D34, and the fourth distance D14 may each be substantially the same. However, embodiments of the present disclosure are not limited thereto.

[0211] FIG. 12 is an equivalent circuit diagram of a sub-pixel SP and a photosensor PHS according to an embodiment.

[0212] Referring to FIG. 12, the sub-pixel SP may include a pixel driving circuit PXC and a light-emitting element LD. The photosensor PHS may include a sensor circuit PSC and a light-receiving element LRD.

[0213] The pixel driving circuit PXC may be configured to control a magnitude of a current flowing through the light-emitting element LD. The pixel driving circuit PXC may include at least one switching element (e.g., a transistor) and one or more storage elements (e.g., capacitors).

[0214] Referring to FIG. 12, the pixel driving circuit PXC may include first to seventh pixel transistors TR1 to TR7 and a capacitor Cst.

[0215] The pixel driving circuit PXC may be connected to an i-th scan line SCLi (hereinafter, also referred to as a scan line SCLi), an i-th light emission control line EMLi (hereinafter, referred to as a light emission control line EMLi), and a j-th data line DLj (hereinafter, referred to as a data line DLj).

[0216] The scan line SCLi may include first to fourth scan lines S1i, S2i, S3i, and S4i.

[0217] The first pixel transistor TR1 may be configured to adjust a magnitude of a current flowing between a second node N2 and a third node N3 in response to a voltage of a first node N1. The first node N1 may be electrically connected to a gate electrode of the first pixel transistor TR1. The second node N2 may be electrically connected to a first electrode (e.g., any one of a source electrode and a drain electrode) of the first pixel transistor TR1. The third node N3 may be electrically connected to a second electrode (e.g., another one of a source electrode and a drain electrode) of the first pixel transistor TR1. The first pixel transistor TR1 may be referred to as a driving transistor.

[0218] The second pixel transistor TR2 may be configured to switch an electrical connection between the second node N2 and the data line DLj. The second pixel transistor TR2 may include a gate electrode connected to the first scan line S1i. The second pixel transistor TR2 may be configured to transfer a voltage (e.g., a data voltage) applied to the data line DLj to the second node N2 in response to a first scan signal GW[i] of a turn-on level. The first scan signal GW[i] may be applied to the first scan line S1i. The second pixel transistor TR2 may be referred to as a switching transistor.

[0219] The third pixel transistor TR3 may be configured to switch an electrical connection between the first node N1 and the third node N3. The third pixel transistor TR3 may include a gate electrode connected to the fourth scan line S4i. The third pixel transistor TR3 may be configured to switch an electrical connection between the first node N1 and the third node N3 in response to a fourth scan signal GC[i]. The fourth scan signal GC[i] may be applied to the fourth scan line S4i. When the third pixel transistor TR3 is turned on, the first pixel transistor TR1 may be connected in the form of a diode. The third pixel transistor TR3 may be referred to as a compensation transistor.

[0220] The fourth pixel transistor TR4 may be configured to switch an electrical connection between the first node N1 and a third power line PL3. The fourth pixel transistor TR4 may include a gate electrode connected to the second scan line S2i. The fourth pixel transistor TR4 may be configured to switch an electrical connection between the first node N1 and the third power line PL3 in response to a second scan signal GI[i]. The second scan signal GI[i] may be applied to the second scan line S2i. A first initialization voltage Vint1 may be applied to the third power line PL3. When the fourth pixel transistor TR4 is turned on, the voltage of the first node N1 may be initialized to the first initialization voltage Vint1. The fourth pixel transistor TR4 may be referred to as a first initialization transistor.

[0221] The fifth pixel transistor TR5 may be configured to switch an electrical connection between the second node N2 and a first power line PL1. The fifth pixel transistor TR5 may include a gate electrode connected to the light emission control line EMLi. The fifth pixel transistor TR5 may be configured to switch an electrical connection between the second node N2 and the first power line PL1 in response to a light emission control signal EM[i]. When the fifth pixel transistor TR5 is turned on, a first power voltage VDD may be applied to the second node N2. The fifth pixel transistor TR5 may be referred to as a first light emission control transistor.

[0222] The sixth pixel transistor TR6 may be configured to switch an electrical connection between the third node N3 and a fourth node N4. The sixth pixel transistor TR6 may include a gate electrode connected to the light emission control line EMLi. The sixth pixel transistor TR6 may be configured to switch an electrical connection between the third node N3 and the fourth node N4 in response to the light emission control signal EM[i]. Referring to FIG. 12, the sixth pixel transistor TR6 and the fifth pixel transistor TR5 may be electrically connected to the same emission control line EMLi. However, embodiments of the present disclosure are not limited thereto. The sixth pixel transistor TR6 may be referred to as a second light emission control transistor.

[0223] The seventh pixel transistor TR7 may be configured to switch an electrical connection between the fourth node N4 and a fourth power line PL4. The seventh pixel transistor TR7 may include a gate electrode connected to the third scan line S3i. The seventh pixel transistor TR7 may be configured to switch an electrical connection between the fourth node N4 and the fourth power line PL4 in response to a third scan signal GB[i]. When the seventh pixel transistor TR7 is turned on, the voltage of the fourth node N4 may be initialized to a second initialization voltage Vint2. The second initialization voltage Vint2 may be applied to the fourth power line PL4. The seventh pixel transistor TR7 may be referred to as a second initialization transistor.

[0224] The capacitor Cst may be configured to maintain a voltage of the first node N1. The capacitor Cst may be configured to supply a voltage to the first node N1 during one frame period. The capacitor Cst may include one electrode electrically connected to the first node N1 and the other electrode electrically connected to a power line (e.g., the first power line PL1). A data voltage Vdata (or a voltage corresponding to data voltage Vdata) may be applied to one electrode of the capacitor Cst. The capacitor Cst may supply the data voltage Vdata (or a voltage corresponding to the data voltage Vdata) to the first node N1 for one frame period. The capacitor Cst may be referred to as a storage capacitor.

[0225] Each of the first to seventh pixel transistors TR1 to TR7 may be formed of an N-type transistor or a P-type transistor.

[0226] In the N-type transistor, a voltage at a turn-on level may be a voltage at a high logic level, and a voltage at a turned-off level may be a power at a low logic level. In the P-type transistor, a voltage at a turn-on level may be a voltage at a low logic level, and a voltage at a turned-off level may be a power at a high logic level.

[0227] Still referring to FIG. 12, among the first to seventh pixel transistors TR1 to TR7, the third pixel transistor TR3 and the fourth pixel transistor TR4 are shown to be N-type transistors, and the rest are shown to be P-type transistors. However, embodiments of the present disclosure are not limited thereto.

[0228] One or more of the first to seventh pixel transistors TR1 to TR7 may include an oxide semiconductor. One or more of the first to seventh pixel transistors TR1 to TR7 may include a silicon semiconductor (e.g., an amorphous silicon (a-Si) semiconductor or a low temperature polycrystalline silicon (LTPS) semiconductor). For example, the third pixel transistor TR3 and the fourth pixel transistor TR4 may include an oxide semiconductor. However, embodiments of the present disclosure are not limited thereto.

[0229] The light-emitting element LD may be connected between the fourth node N4 and a second power line PL2. The fourth node N4 may be electrically connected to the anode electrode of the light-emitting element LD. The second power line PL2 may be electrically connected to the cathode electrode of the light-emitting element LD. A second power voltage VSS may be applied to the second power line PL2.

[0230] The light-emitting element LD may include a light-emitting layer. Depending on the type of the light-emitting layer, the light-emitting element LD may be implemented as an organic light-emitting element including an organic light-emitting layer, an inorganic light-emitting element including an inorganic light-emitting layer, a quantum dot light-emitting element including quantum dots (e.g., nano-rods), or the like.

[0231] One pixel driving circuit PXC may be connected to two or more light-emitting elements LD. Two or more light-emitting elements LD may be connected in series and / or parallel to each other.

[0232] The sensor circuit PSC may include first to third sensor transistors M1, M2, and M3a.

[0233] The first sensor transistor M1 may be configured to switch an electrical connection between a sixth power line PL6 and the second sensor transistor M2. The first sensor transistor M1 may include a gate electrode connected to a fifth node N5. The first sensor transistor M1 may switch an electrical connection between a fifth power line PL5 and the second sensor transistor M2 according to a voltage level of the fifth node N5. A fourth power voltage VCOM may be applied to the sixth power line PL6.

[0234] The second sensor transistor M2 may be configured to switch an electrical connection between the first sensor transistor M1 and a k-th sensing line RXk (or a sensing line RXk). The second sensor transistor M2 may include a gate electrode connected to the first scan line S1i. The second sensor transistor M2 may be configured to switch an electrical connection between the first sensor transistor M1 and the sensing line RXk in response to a scan signal (e.g., the first scan signal GW[i]). The second sensor transistor M2 may include a gate electrode electrically connected to the first scan line S1i.

[0235] The third sensor transistor M3a may be configured to switch an electrical connection between the fifth power line PL5 and the fifth node N5. The third sensor transistor M3a may include a gate electrode electrically connected to a reset control line RSTL. The third sensor transistor M3a may be configured to switch an electrical connection between the fifth power line PL5 and the fifth node N5 in response to a reset signal RST input to the reset control line RSTL. The third sensor transistor M3a may include a gate electrode connected to the reset control line RSTL. When the third sensor transistor M3a is turned on, a voltage of the fifth node N5 may be initialized to a third power voltage VRST. Thereby, the third power voltage VRST may be applied to the light-receiving element LRD. The third power voltage VRST may be a turn-off level voltage of the first sensor transistor M1. The third power voltage VRST may be referred to as a reset voltage.

[0236] Each of the first to third sensor transistors M1, M2, and M3a may be a P-type transistor or an N-type transistor. In an embodiment, the first to third sensor transistors M1, M2, and M3a may each include any one of, for example, an amorphous silicon semiconductor, a low-temperature polysilicon semiconductor, and an oxide semiconductor.

[0237] Referring to FIG. 12, the third sensor transistor M3a may be an N-type transistor, and the first and second sensor transistors M1 and M2 may be P-type transistors. However, embodiments of the present disclosure are not limited thereto.

[0238] The light-receiving element LRD may provide a current flowing in a direction from the fifth node N5 to the second power line PL2 in response to an irradiated light. The light-receiving element LRD may be implemented as, for example, a photodiode. When a current flows through the light-receiving element LRD, the voltage of the fifth node N5 may be lowered to the second power voltage VSS.

[0239] In embodiments of the present disclosure, a process in which a current flows through the sensing line RXk will be briefly described as follows.

[0240] In embodiments of the present disclosure, when light is irradiated to the light-receiving element LRD, a current may flow through the light-receiving element LRD. When a current flows through the light-receiving element LRD, the voltage of the fifth node N5 may gradually decrease. When the voltage of the fifth node N5 gradually decreases and becomes lower than a threshold voltage of the first sensor transistor M1, the first sensor transistors M1 may be turned on. When the first scan signal GW[i] of a turn-on level is input to the second sensor transistor M2, the second sensor transistors M2 may be turned on. Accordingly, when the first and second sensor transistors M1 and M2 are turned on, a current path from the sixth power line PL6 to the sensing line RXk may be formed. By integrating the current flowing through the sensing line RXk, the amount of light incident on the light-receiving element LRD may be calculated.

[0241] Embodiments of the present disclosure may use the photosensor PHS to measure the amount of reflected light reflected from an object adjacent to the photosensor PHS.

[0242] FIG. 13 is an equivalent circuit diagram of a sub-pixel SP and a photosensor PHS according to an embodiment.

[0243] Compared with the equivalent circuit diagram of FIG. 13 and the equivalent circuit diagram in FIG. 12, in the equivalent circuit diagram shown in FIG. 13, the pixel driving circuit PXC may include the third pixel transistor TR3 and the fourth pixel transistor TR4 as P-type transistors.

[0244] The third pixel transistor TR3 may include a gate electrode electrically connected to the first scan line S1i. The third pixel transistor TR3 may be commonly connected to the first scan line S1itogether with the second pixel transistor TR2.

[0245] The fourth pixel transistor TR4 may be configured to switch an electrical connection between a third power line PL3′ and the first node N1. An initialization voltage Vint may be applied to the third power line PL3′.

[0246] The seventh pixel transistor TR7 may be configured to switch an electrical connection between the third power line PL3′ and the fourth node N4.

[0247] According to an embodiment of FIG. 13, the number of scan lines and the number of power lines are reduced compared to an embodiment of FIG. 12, and thus the circuit configuration may be simplified.

[0248] According to an embodiment of FIG. 12, by implementing the third pixel transistor TR3 and the fourth pixel transistor TR4 as N-type transistors compared to an embodiment of FIG. 13, it is possible to reduce leakage current and provide an image at a low frame rate.

[0249] Referring to FIGS. 12 and 13, the electronic device 100 (refer to FIG. 1) may acquire (or generate) a pattern of an object (e.g., a pattern of a fingerprint, etc.) adjacent to the photosensor PHS by sensing the photosensor PHS. Accordingly, the electronic device 100 according to embodiments of the present disclosure may provide a fingerprint authentication function.

[0250] In an embodiment, the electronic device 100 (see FIG. 1) may sense a change in the amount of light around the electronic device 100 by sensing the photosensor PHS, and generate information associated with a blood vessel of a user using the electronic device 100 with reference to the sensed change in the amount of the light. The information related to the blood vessel may include, for example, at least one of cardiovascular health information, blood pressure, atrial rhythm, atrial fibrillation, heart rate, and respiratory rate.

[0251] In an embodiment, the electronic device 100 (see FIG. 1) may provide a function of sensing illuminance around the electronic device 100 by sensing the photosensor PHS, and adaptively adjusting the luminance of the electronic device 100 according to the sensed illuminance.

[0252] FIG. 14 is a diagram illustrating some configurations of a sub-pixel and a photosensor in a cross-sectional view of a display device according to embodiments of the present disclosure.

[0253] Referring to the foregoing drawings, pixel transistors TR1 to TR7 and sensor transistors M1, M2, and M3a may be included in a backplane structure BP of the display panel 220. The backplane structure may be disposed on the base substrate BSL.

[0254] FIG. 14 illustrates a first pixel transistor TR1, a third pixel transistor TR3, a first sensor transistor M1, a second sensor transistor M2, and a third sensor transistor M3a.

[0255] The base substrate BSL may include an insulating material such as, for example, glass, resin, or the like. In an embodiment, the base substrate BSL may include a material having flexibility to bend, fold, or roll. The base substrate BSL may have a single-layer structure or a multi-layer structure. In an embodiment, the base substrate BSL may include a first base layer, a first barrier layer, a second base layer, a second barrier layer, and the like sequentially stacked (e.g., sequentially stacked in the third direction DR3). The first base layer and the second base layer may include, for example, polyimide (PI), polyethersulfone (PES), polyarylate, polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polycarbonate (PC), cellulose triacetate (CTA), and / or cellulose acetate propionate (CAP), and the like. The first barrier layer and the second barrier layer may include an inorganic insulator such as, for example, silicon oxide, silicon oxynitride, and / or silicon nitride. The base substrate BSL may be flexible.

[0256] A buffer layer BF may be disposed on the base substrate BSL. The buffer layer BF may prevent diffusion of impurities introduced from under the base substrate BSL. The buffer layer BF may be omitted depending on a material and process conditions of the base substrate BSL. The buffer layer BF may include an inorganic insulator such as, for example, silicon oxide, silicon oxynitride, or silicon nitride. The buffer layer BF may have a single-layer or multi-layer structure including the above-described materials.

[0257] First to third active patterns ACT11, ACT12, and ACT13 may be provided on the buffer layer BF. In an embodiment, the first to third active patterns ACT11, ACT12, and ACT13 may be formed of a polysilicon semiconductor. For example, the first to third active patterns ACT11, ACT12, and ACT13 may be formed through a low temperature polysilicon process (e.g., a low temperature polycrystalline silicon (LTPS) process).

[0258] A first gate insulating layer GI1 may be disposed on the first to third active patterns ACT11, ACT12, and ACT13. The first gate insulating layer GI1 may be an inorganic insulating layer including an inorganic material. The first gate insulating layer GI1 may include an inorganic insulating material such as, for example, silicon oxide (SiO2), silicon nitride (SiNx, where x is a positive number), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), and / or zinc oxide (ZnO2).

[0259] First to third gate electrodes GE11, GE12, and GE13 may be disposed on the first gate insulating layer GI1. The first gate electrode GE11 may overlap a channel area of the first active pattern ACT11 in the third direction DR3. The second gate electrode GE12 may overlap a channel area of the second active pattern ACT12 in the third direction DR3. The third gate electrode GE13 may overlap a channel area of the third active pattern ACT13 in the third direction DR3.

[0260] The first to third gate electrodes GE11, GE12, and GE13 may include a metal. For example, the first to third gate electrodes GE11, GE12, and GE13 may include at least one of a metal such as gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), or an alloy of metals. In addition, the first to third gate electrodes GE11, GE12, and GE13 may be formed of a single layer or may be formed of multiple layers in which two or more of metals and alloys are stacked.

[0261] An interlayer insulating layer IL may be disposed on the first to third gate electrodes GE11, GE12, and GE13. The interlayer insulating layer IL may be an inorganic insulating layer including an inorganic material. For example, polysiloxane, silicon nitride, silicon oxide, silicon oxynitride, or the like may be used as the inorganic material.

[0262] Conductive patterns CL1, CL2, and CL3 may be disposed on the interlayer insulating layer IL. Referring to FIGS. 12 and 13, the conductive patterns CL1, CL2, and CL3 may constitute at least one of an electrode of a capacitor Cst, scan lines (e.g., first to fourth scan lines S1ito S4i), a reset control line RSTL, a data line DLj, and a sensing line RXk, and power lines PL1 to PL6. The conductive patterns CL1, CL2, and CL3 may include at least one of a metal such as, for example, gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), or copper (Cu), or an alloy of metals. The conductive patterns CL1, CL2, and CL3 may be formed of a single layer, or may be formed of multiple layers in which two or more of metals and alloys are stacked.

[0263] A first insulating layer INS1 may be disposed on the conductive patterns CL1, CL2, and CL3. The first insulating layer INS1 may be an inorganic insulating layer including an inorganic material. For example, polysiloxane, silicon nitride, silicon oxide, silicon oxynitride, or the like may be used as the inorganic material.

[0264] A fourth active pattern ACT21 and a fifth active pattern ACT22 may be disposed on the first insulating layer INS1. In an embodiment, the fourth and fifth active patterns ACT21 and ACT22 may include an oxide semiconductor. For example, the fourth and fifth active patterns ACT21 and ACT22 may be formed through a metal oxide semiconductor formation process.

[0265] A second gate insulating layer GI2 may be disposed on the fourth active pattern ACT21 and the fifth active pattern ACT22. The second gate insulating layer GI2 may be an inorganic insulating layer including an inorganic material. For example, one or more of polysiloxane, silicon nitride, silicon oxide, and silicon oxynitride may be used as the inorganic material.

[0266] Fourth and fifth gate electrodes GE21 and GE22 may be disposed on the second gate insulating layer GI2. The fourth gate electrode GE21 may overlap a channel area of the fourth active pattern ACT21 in the third direction DR3. The fifth gate electrode GE22 may overlap a channel area of the fifth active pattern ACT22 in the third direction DR3. The fourth and fifth gate electrodes GE21 and GE22 may include a metal. For example, the fourth and fifth gate electrodes GE21 and GE22 may include at least one of a metal such as gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), or an alloy of metals. In addition, the fourth and fifth gate electrodes GE21 and GE22 may be formed of a single layer or may be formed of multiple layers in which two or more of metals and alloys are stacked.

[0267] A second insulating layer INS2 may be disposed on the fourth and fifth gate electrodes GE21 and GE22. For example, the second insulating layer INS2 may be an inorganic insulating layer including an inorganic material. For example, one or more of polysiloxane, silicon nitride, silicon oxide, and silicon oxynitride may be used as the inorganic material.

[0268] First source / drain electrodes 1421 and 1422, second source / drain electrode 1423 and 1424, third source / drain electrode 1425 and 1426, fourth source / drain electrodes 1431 and 1432, and fifth source / drain electrons 1433 and 1434 may be disposed on the second insulating layer INS2. The first to fifth source / drain electrodes 1421, 1422, 1423, 1424, 1425, 1426, 1431, 1432, 1433, and 1434 may be connected to corresponding first to fifth active patterns ACT11, ACT12, ACT13, AC21, and ACT22 through contact holes, respectively.

[0269] The first to fifth source / drain electrodes 1421, 1422, 1423, 1424, 1425, 1426, 1431, 1432, 1433, and 1434 may include a metal. The first to fifth source / drain electrodes 1421, 1422, 1423, 1424, 1425, 1426, 1431, 1432, 1433, and 1434 may include a material having excellent conductivity. For example, the first to fifth source / drain electrodes 1421, 1422, 1423, 1424, 1425, 1426, 1431, 1432, 1433, and 1434 may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), and the like. The first to fifth source / drain electrodes 1421, 1422, 1423, 1424, 1425, 1426, 1431, 1432, 1433, and 1434 may be formed of a single-layer structure or a multi-layer structure including the above material. For example, the first to fifth source / drain electrodes 1421, 1422, 1423, 1424, 1425, 1426, 1431, 1432, 1433, and 1434 may have a multilayer structure of Ti / Al / Ti.

[0270] A third insulating layer INS3 may be disposed on the first to fifth source / drain electrodes 1421, 1422, 1423, 1424, 1425, 1426, 1431, 1432, 1433, and 1434. For example, the third insulating layer INS3 may be an organic insulating layer including an organic material. The third insulating layer INS3 may include an organic insulating material such as a general-purpose polymer such as, for example, polymethylmethacrylate or polystyrene, a polymer derivative having a phenolic group, an acrylic polymer, an imide polymer, an aryl ether polymer, an amide polymer, a fluorine polymer, a p-xylene polymer, a vinyl alcohol polymer, or a blend thereof. The third insulating layer INS3 may planarize an area on the first to fifth source / drain electrodes 1421, 1422, 1423, 1424, 1425, 1426, 1431, 1432, 1433, and 1434.

[0271] Connection patterns CNP1 and CNP2 may be disposed on the third insulating layer INS3. The first connection pattern CNP1 may be connected to the first drain electrode 1422 through a contact hole penetrating the third insulating layer INS3. The second connection pattern CNP2 may be connected to the fifth source electrode 1434 through a contact hole penetrating the third insulating layer INS3.

[0272] The connection patterns CNP1 and CNP2 may be made of at least one of metals such as, for example, gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), or an alloy of metals.

[0273] A fourth insulating layer INS4 may be disposed on the connection patterns CNP1 and CNP2. The fourth insulating layer INS4 may be an organic insulating layer including an organic material. The fourth insulating layer INS4 may include an organic insulating material such as a general-purpose polymer such as, for example, polymethylmethacrylate or polystyrene, a polymer derivative having a phenolic group, an acrylic polymer, an imide polymer, an aryl ether polymer, an amide polymer, a fluorine polymer, a p-xylene polymer, a vinyl alcohol polymer, or a blend thereof. The fourth insulating layer INS4 may planarize areas on the connection patterns CNP1 and CNP2.

[0274] A pixel layer including a first pixel electrode PEL1, a first sensor electrode SEL1, and a bank layer BK may be provided on the fourth insulating layer INS4.

[0275] The pixel layer may include a light-emitting element LD connected to a pixel driving circuit (e.g., the pixel driving circuit PXC of FIGS. 12 and 13) and a light-receiving element LRD connected to a sensor circuit (e.g., the sensor circuit PSC of FIG. 12 or 13).

[0276] In an embodiment, the light-emitting element LD may include a first pixel electrode PEL1, a hole transport layer HTL1, a light-emitting layer EML, an electron transport layer ETL, and a second pixel electrode PEL2. In an embodiment, the light-receiving element LRD may include a first sensor electrode SEL1, a second hole transport layer HTL2, a light-receiving layer LRL, an electron transport layer ETL, and a second sensor electrode SEL2.

[0277] In an embodiment, the first pixel electrode PEL1 and the first sensor electrode SEL1 may include metal layers such as, for example, silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), alloys thereof, and / or indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), and the like. The first pixel electrode PEL1 may be connected to the first drain electrode 1422 through a contact hole. The first sensor electrode SEL1 may be connected to the fifth source electrode 1434 through a contact hole.

[0278] The first pixel electrode PEL1 and the first sensor electrode SEL1 may be formed in the same process through patterning using a mask.

[0279] The bank layer (or a pixel defining layer) PDL that divides the emission area and the light-receiving area may be disposed on the fourth insulating layer INS4 on which the first pixel electrode PEL1 and the first sensor electrode SEL1 are formed.

[0280] The pixel defining layer PDL may include openings corresponding to the emission area and the light-receiving area.

[0281] A first hole transport layer HTL1 may be provided on an upper surface of the first pixel electrode PEL1 exposed by the pixel defining layer PDL. A second hole transport layer HTL2 may be disposed on an upper surface of the first sensor electrode SEL1 which is exposed. A hole may move to the light-emitting layer EML through the first hole transport layer HTL1, and a hole may move to a light-receiving layer LRL through the second hole transport layer HLT2.

[0282] Depending on the materials of the light-emitting layer EML and the light-receiving layer LRL, the first hole transport layer HTL1 and the second hole transport layer HLT2 may be the same or different.

[0283] The light-emitting layer EML may be disposed on the first hole transport layer HTL1. In an embodiment, the light-emitting layer EML may include an organic light-emitting layer. Depending on the organic material included in the light-emitting layer EML, the light-emitting layer EML may emit light in a red wavelength band, light in a green wavelength band, or light in a blue wavelength band. However, embodiments of the present disclosure are not limited thereto.

[0284] In an embodiment, an electron blocking layer may be disposed on the second hole transport layer HTL2 in the light-receiving area. The electron blocking layer may prevent a charge of the light-receiving layer LRL from moving to the second hole transport layer HTL2. In an embodiment, the electron blocking layer may be omitted.

[0285] The light-receiving layer LRL may be disposed on the second hole transport layer HTL2. The light-receiving layer LRL may emit electrons corresponding to light of a specific wavelength band. Thereby, the intensity (or amount) of light may be sensed.

[0286] In an embodiment, the light-receiving layer LRL may include a low-molecular-weight organic material. The low-molecular-weight organic material may include a phthalocyanine compound including at least one of, for example, copper (Cu), iron (Fe), nickel (Ni), cobalt (Co), manganese (Mn), aluminum (Al), palladium (Pd), tin (Sn), indium (In), lead (Pb), titanium (Ti), rubidium (Rb), vanadium (V), gallium (Ga), terbium (Tb), cerium (Ce), lanthanum (La) and zinc (Zn).

[0287] In an embodiment, the light-receiving layer LRL may be composed of two layers (or bi-layers). In an embodiment, the light-receiving layer LRL may include a layer including a phthalocyanine compound and a layer including C60. In an embodiment, the light-receiving layer LRL may include one mixing layer in which a phthalocyanine compound and C60 are mixed. However, this is an example, and the light-receiving layer LRL may include a polymer organic layer.

[0288] In an embodiment, a light detection band of the light-receiving element LRD may be determined according to a selection of the metal component of the phthalocyanine compound included in the light-receiving layer LRL. For example, in a case of a phthalocyanine compound including copper, visible light wavelengths in a range of about 600 to about 800 nm may be absorbed. In a case of a phthalocyanine compound comprising tin (Sn), near-infrared wavelengths in a range of about 800 nm to about 1000 nm may be absorbed. Depending on the selection of the metal included in the phthalocyanine compound, a photosensor capable of detecting a wavelength in a band desired by a user may be implemented. For example, the light-receiving layer LRL may be formed to selectively absorb light in a red wavelength band, light in a green wavelength band, or light in a blue wavelength band.

[0289] In an embodiment, an area of the light-receiving area may be smaller than an area of the emission area. The area of the light-receiving area may correspond to a width d of an opening BMH.

[0290] The second pixel electrode PEL2 and the second sensor electrode SEL2 may be disposed on the electron transport layer ETL. The second pixel electrode PEL2 and the second sensor electrode SEL2 may be provided as a common electrode CD integrally formed in the display area. Referring to FIGS. 12 and 13, a second power voltage VSS may be supplied to the second pixel electrode PEL2 and the second sensor electrode SEL2. The common electrode CD may be formed of a metal layer such as, for example, silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), or chromium (Cr), and / or a transparent conductive layer such as ITO, IZO, ZnO, or ITZO. In an embodiment, the common electrode CD may be formed of a multilayer of a double layer or more including a thin metal layer. For example, the common electrode CD may include a triple layer of ITO / Ag / ITO.

[0291] An encapsulation layer TFE may be provided on the common electrode CD including the second pixel electrode PEL2 and the second sensor electrode SEL2. In an embodiment, the encapsulation layer TFE may have a laminated structure formed of an inorganic material, an organic material, and an inorganic material in that order. The top layer of the encapsulation layer TFE may include an inorganic material.

[0292] The touch panel 210 may be disposed on the encapsulation layer TFE. The touch panel 210 may include a touch electrode configured to sense a user's touch. In an embodiment, the touch panel 210 may be implemented in a self-capacitance manner. In an embodiment, the touch panel 210 may be implemented in a mutual capacitive manner.

[0293] A black matrix BM may be disposed on the touch panel 210. According to an embodiment, a color filter CF may be further disposed on the black matrix BM. In an embodiment, the color filter CF may be omitted. A cover window CW may be disposed on an uppermost layer of the display panel (e.g., an upper layer of the color filter CF).

[0294] At least a portion of the black matrix BM may overlap the pixel defining layer PDL. The black matrix BM may distinguish each sub-pixel so that light is not mixed between a plurality of sub-pixels. The black matrix BM may function as an optical system that collects light in the light-receiving element LRD. For example, referring to FIG. 12, at least a portion of the black matrix BM may be removed from an area corresponding to an opening BMH. The opening BMH may be positioned to overlap the light-receiving element LRD. The opening BMH allows the black matrix BM to function like an optical system.

[0295] The amount of light incident in a direction to the light-receiving element LRD (e.g., reflected light emitted from the light-emitting element LD and reflected by an external object or the like) may be adjusted by the optical system formed by the black matrix BM (e.g., the width d of the optical system).

[0296] The electronic device according to embodiments of the present disclosure may sense photosensors at different sensing resolutions in a mode for fingerprint authentication and in a mode for measuring bio-signal sensing data (or bio-signal).

[0297] FIG. 15 is an equivalent circuit diagram of a readout circuit 450 (see FIG. 4) according to embodiments of the present disclosure.

[0298] Referring to FIG. 15, a readout circuit 450 (see FIG. 4) according to embodiments of the present disclosure may include an integrator 1510 and a sample and hold circuit (also referred to as correlated double sampling circuit) 1520.

[0299] The integrator 1510 may include an operational amplifier OP-AMP, a feedback capacitor Cfb, and a first switching element SW1. An operation timing of the first switching element SW1 may be controlled by an integrator reset signal IRST.

[0300] The operational amplifier OP-AMP may include a first input terminal (e.g., “(−)” input terminal), a second input terminal (e.g., “(+)” input terminal), and an output terminal. The first input terminal may be an inverted input terminal. The second input terminal may be a non-inverted input terminal.

[0301] The first input terminal of the operational amplifier OP-AMP may be electrically connected to a sensing line RX. In an embodiment, a multiplexer may be further disposed between the first input terminal of the operational amplifier OP-AMP and the sensing line RX. A voltage VCrx from a capacitor Crx corresponding to a voltage of the sensing line RX may be applied to the first input terminal of the operational amplifier OP-AMP.

[0302] The second input terminal of the operational amplifier OP-AMP may be electrically connected to a constant voltage line PL. In an embodiment, the second input terminal of the operational amplifier OP-AMP may be grounded GND.

[0303] The feedback capacitor Cfb may include one electrode connected to the first input terminal of the operational amplifier OP-AMP and the other electrode connected to the output terminal of the operational amplifier OP-AMP.

[0304] The first switching element SW1 may be configured to switch an electrical connection between the first input terminal and the output terminal of the operational amplifier OP-AMP. When the first switching element SW1 is turned on, a charge stored in the feedback capacitor Cfb may be discharged and the feedback capacitor Cfb may be reset.

[0305] The sample and hold circuit 1520 may include a second switching element SW2, a third switching element SW3, a first sampling capacitor Cs1, a second sampling capacitor Cs2, a differential amplifier (DA), a fourth switching element SW4, and the like. The sample and hold circuit 1520 may include a sixth node N6 electrically connected to an output end of the integrator 1510 (e.g., an output end of an operational amplifier OP-AMP). The sample and hold circuit 1520 may be configured to store a value sensed by the photosensor and output an analog voltage obtained by removing (or reducing) a noise component from the sensed value.

[0306] The second switching element SW2 may be configured to switch an electrical connection between the sixth node N6 and the first sampling capacitor Cs1. An operation timing of the second switching element SW2 may be controlled by a second sampling signal SHR.

[0307] The first sampling capacitor Cs1 may be configured to store a value corresponding to the noise component. The noise component may include, for example, a noise component basically present in the sensing line RX. The first sampling capacitor Cs1 may include one electrode electrically connected to the second switching element SW2 and the other electrode electrically connected to a constant voltage source (or a ground power source GND).

[0308] The third switching element SW3 may be configured to switch an electrical connection between the sixth node N6 and the second sampling capacitor Cs2. An operation timing of the third switching element SW3 may be controlled by a first sampling signal SHS.

[0309] The second sampling capacitor Cs2 may be configured to store a value sensed by the photosensor including the noise component. The second sampling capacitor Cs2 may include one electrode electrically connected to the third switching element SW3 and the other electrode electrically connected to a constant voltage source (or a ground power source GND).

[0310] The differential amplifier may include a first input terminal (e.g., “(−)” input terminal), a second input terminal (e.g., “(+)” input terminal), and an output terminal. The differential amplifier may be configured to amplify and output a signal (e.g., a voltage) corresponding to a difference between a signal (e.g., a voltage) input to the second input terminal and a signal (e.g., a voltage) input to the first input terminal. The first input terminal may be an inverted input terminal. The second input terminal may be a non-inverted input terminal. The first input terminal of the differential amplifier may be configured to receive a voltage applied from the first sampling capacitor Cs1. In an embodiment, a buffer BUF may be further disposed between the first input terminal of the differential amplifier and the first sampling capacitor Cs1.

[0311] The second input terminal of the differential amplifier may be configured to receive a voltage applied from the second sampling capacitor Cs2. A buffer BUF may be further disposed between the second input terminal of the differential amplifier and the second sampling capacitor Cs2.

[0312] The fourth switching element SW4 may be configured to switch an electrical connection between an output end of the differential amplifier and an input end OUT of the analog-to-digital converter 452. When the fourth switching element SW4 is turned on, a sensing voltage VSEN corresponding to the amount of light received by the photosensor may be input to the analog-to-digital converter 452.

[0313] The second switching element SW2 and the third switching element SW3 may correspond to switching elements for sampling signals. The fourth switching element SW4 may correspond to a switching element for holding a signal.

[0314] The analog-to-digital converter 452 may convert the input sensing voltage VSEN into a digital value and output a converted digital value DSEN.

[0315] FIG. 16 is a driving timing diagram for sensing a photosensor at a first sensing resolution in case that the electronic device 100 (see FIG. 1) operates in a fingerprint authentication mode.

[0316] Referring to FIG. 16, a timing diagram of a reset signal RST, first scan signals GW[1] to GW[n], and a first sampling signal SHS is shown.

[0317] Referring further to FIGS. 4 and 15, the reset circuit 460 may output the reset signal RST. The scan driving circuit 420 may output the first scan signals GW[1] to GW[n]. The first sampling signal SHS is included in the readout circuit control signal RCS. The timing controller 440 may output the first sampling signal SHS. A timing at which the readout circuit 450 reads the output of the photosensor PHS may be controlled in response to the first sampling signal SHS. A length of a period during which the readout circuit 450 reads the output of the photosensor PHS may be controlled in response to the first sampling signal SHS.

[0318] When operating in the fingerprint authentication mode, a reset frame may be started. The reset circuit 460 (see FIG. 4) may output the reset signal RST in the reset frame. The reset signal RST may be output before the first scan signals GW[1] to GW[n]. Accordingly, the voltages of the sensing lines RX1 to RXk (see FIG. 4) may be reset (or initialized). Referring to FIGS. 12, 13, and 15 together, when the reset signal RST is input and the third sensor transistor M3a is turned on, the third power voltage VRST is applied to the fifth node N5. The first sensor transistor M1 may be turned on in response to the third power voltage VRST applied to the fifth node N5. The second sensor transistor M2 may be turned on in response to a corresponding one of the plurality of first scan signals GW[p] to GW[q] (where p, q being an integer of 1 or more). When the first sensor transistor M1 and the second sensor transistor M2 are turned on, a voltage level of the sensing line RXk may be initialized to the fourth power voltage VCOM.

[0319] After the reset frame, an exposure time (or exposure integration time EIT) may proceed. The exposure time may include one or more hold frames. The exposure time may correspond to a period in which the photosensor receives light (e.g., a period in which light is received from after the reset frame to before the readout frame). Further referring to FIGS. 12, 13, and 15, the light sensor PHS may receive light during the exposure time so that a current may flow through the light-receiving element LRD. In the fingerprint authentication mode, the length of the exposure time may be set to be long enough that the magnitude of the current flowing through the light-receiving element LRD becomes relatively constant (or converges to a constant value). For example, the length of the exposure time may be about 100 ms (or about 12 frame periods based on a scan rate of about 120 Hz). However, embodiments of the present disclosure are not limited thereto. Accordingly, each of the plurality of photosensors PHS may reflect a difference in the amount of light received.

[0320] After the exposure time, one or more readout frames may be performed. In the readout frame, a first sampling signal SHS of a turn-on level may be input to the readout circuit 450 (see FIG. 4). During the readout frame, a plurality of photosensors may be read by the readout circuit in response to the first sampling signal SHS. In the fingerprint authentication mode, the first sampling signal SHS of the turn-on level may be applied for one horizontal period.

[0321] Embodiments of the present disclosure may read output signals (e.g., sensing signals) from a plurality of photosensors in one readout frame period in a fingerprint authentication mode. Embodiments of the present disclosure may selectively read only a corresponding photosensor of the plurality of photosensors in each readout frame divided into two or more readout frame periods. FIG. 16 illustrates an embodiment in which two or more readout frame periods are divided and a corresponding photosensor among a plurality of photosensors is selectively read during each readout frame period. For example, in each of four readout frame periods Readout Frame #1 to Readout Frame #4, a corresponding photosensor among the plurality of photosensors may be selectively read.

[0322] Referring to FIG. 16, in a first readout frame period Readout Frame #1 among four readout frame periods Readout Frame #1 to Readout Frame #4, a photosensor located in first, fifth, . . . , and (n−3)-th pixel rows (e.g., a pixel row in which the remainder is 1 when a row number is divided by 4) among a plurality of pixel rows may be read. In the second readout frame period Readout Frame #2, a photosensor located in the second, sixth, . . . , and (n−2)-th pixel rows (e.g., a pixel row in which the remainder is 2 when the row number is divided by 4) among the plurality of pixel rows may be read. In the third readout frame period Readout Frame #3, a photosensor located in the third, seventh, . . . , and (n−1)-th pixel rows (e.g., a pixel row in which the remainder is 3 when the row number is divided by 4) among a plurality of pixel rows may be read. In the fourth readout frame period Readout Frame #4, a photosensor located in the fourth, eighth, . . . , and n-th pixel row (e.g., a pixel row in which the remainder is 0 when the row number is divided by 4) among the plurality of pixel rows may be read.

[0323] According to embodiments of the present disclosure, a plurality of photosensors may be read in units of pixel rows in the fingerprint authentication mode. Accordingly, an image (e.g., a fingerprint image) having a relatively high sensing resolution (a first sensing resolution) may be generated.

[0324] Referring to FIG. 16, the reset frame is shown to be initiated immediately after the readout frame (e.g., the fourth readout frame Readout Frame #4), but after the readout frame, the reset frame may not be initiated and the fingerprint authentication mode may end.

[0325] In an embodiment, an area to which the first scan signals GW[p] to GW[q] of the turn-on level are applied may be limited to a partial area including an area to which a user's touch is input in the display area DA (see FIG. 4). In an embodiment, the area to which the first scan signals GW[p] to GW[q] of the turn-on level are applied may be the entire display area DA.

[0326] FIGS. 17 and 18 are timing diagrams of a display device for sensing a photosensor at a second sensing resolution in case that a bio-signal sensing mode is selected in embodiments of the present disclosure.

[0327] The reset frame is as described above with reference to FIG. 16.

[0328] The length of the exposure time in the bio-signal sensing mode may be relatively short compared to the length of the exposure times in the fingerprint authentication mode. For example, the length of the exposure time in the bio-signal sensing mode may be about 8.3 ms (or about 1 frame based on an about 120 Hz scan rate). The exposure time in the bio-signal sensing mode may include two or more hold frames.

[0329] A length of a period during which the photosensor receives light in the bio-signal sensing mode (e.g., the period during which light is received from after the reset frame to before the readout frame) may be relatively short. The electronic device 100 (see FIG. 1) according to embodiments of the present disclosure may calculate the degree to which the amount of reflected light incident on the photosensor changes over time in the bio-signal sensing mode.

[0330] The first sampling signal SHS of the turn-on level may be input to the readout circuit 450 (see FIG. 4) in a readout frame period. The first sampling signal SHS of the turn-on level may be applied for at least two horizontal periods.

[0331] A description will be given with reference to FIGS. 4 and 17. The first scan signal GW[p] of the turn-on level may be applied to a p-th pixel row, and a first scan signal GW[p+1] pf the turn-on level may be apply to a (p+1)-th pixel row. In the above period, the first sampling signal SHS of the turn-on level may be input to the readout circuit 450. A first scan signal GW[q−3] of the turn-on level may be applied to the (q−3)-th pixel row, and a first scan signal GW[q−2] of the turn-on level may also be applied to a (q−2)-th pixel row. In the above period, the first sampling signal SHS of the turn-on level may be input to the readout circuit 450.

[0332] A description will be given with reference to FIGS. 4 and 18. The first scan signal GW[p] of the turn-on level may be applied to the p-th pixel row, a first scan signal GW[p+1] of the turn-on level may be apply to a (p+1)-th pixel row and a first scan signal GW[p+2] may be applied to a (p+2)-th pixel row. A first scan signal GW[p+3] may be applied to a (p+3)-th pixel row. In the above period, the first sampling signal SHS of the turn-on level may be input to the readout circuit 450. A first scan signal GW[q−3] of the turn-on level may be applied to a (q−3)-th pixel row, a first scan signal GW[q−2] of the turn-on level may be used to a (q−2)-th pixel row, a first scan signal GW[q−1] of the turn-on level may be applied to a (q−1)-th pixel row, and a first scan signal GW[q] of the turn-on level may also applied to a q-th pixel row. In the above period, the first sampling signal SHS of the turn-on level may be input to the readout circuit 450.

[0333] The electronic device 100 (see FIG. 1) according to embodiments of the present disclosure may generate an image corresponding to a bio-signal based on a result of continuously sensing two or more pixel rows in the bio-signal sensing mode. Accordingly, an image (or image) having a relatively low sensing resolution (a second sensing resolution) may be generated based on a result of integrally sensing two or more pixel rows (e.g., photosensors located in the two or more pixel rows).

[0334] According to embodiments of the present disclosure, a display device may include a display panel in which a plurality of unit pixels are arranged, where at least one of the unit pixels includes a plurality of sub-pixels SP and at least one photosensor PHS. The display device may further include a data driving circuit 410 configured to output a data signal for displaying an image using the plurality of sub-pixels SP, a readout circuit 450 configured to read sensing signals from the at least one photosensor PHS, and a scan driving circuit 420 configured to output a scan signal to the plurality of sub-pixels SP and the at least one photosensor PHS. A timing controller 440 may be configured to control the driving timings of the data driving circuit 410, the readout circuit 450, and the scan driving circuit 420 in response to a control signal. The timing controller 440 may control a plurality of sub-pixels SP located in a first area of the display panel to display an image of a first pattern. While the first pattern is displayed, the timing controller 440 may read a plurality of sensing signals from a plurality of photosensors PHS located in the first area and generate a fingerprint image based on the sensing signals. When fingerprint authentication based on the fingerprint image is successful, the timing controller 440 may control a plurality of sub-pixels SP located in a second area of the display panel to display an image of a second pattern and may read a plurality of sensing signals from a plurality of photosensors PHS located in a third area around the second area while the second pattern is displayed.

[0335] FIG. 19 is a flowchart schematically illustrating a driving method 1900 of an electronic device according to embodiments of the present disclosure.

[0336] In embodiments of the present disclosure, the driving method 1900 may be referred to as a driving method 1900 of an electronic device. The driving method 1900 may be applied to the electronic device 100 of FIG. 1.

[0337] In operation S1910, fingerprint authentication may be performed. In operation S1910, a fingerprint authentication function may be activated in a bio-signal sensing application executed in the electronic device.

[0338] In operation S1920, it may be determined whether fingerprint authentication has been passed.

[0339] In operation S1930, a bio-signal may be measured. In operation S1930, the bio-signal sensing function may be activated in the bio-signal sensing application executed in the electronic device.

[0340] In operation S1940, the measured bio-signal may be stored.

[0341] Referring to FIG. 19, according to embodiments of the present disclosure, the driving method 1900 utilizes a security-enhanced biometric workflow in which fingerprint authentication is performed before initiating bio-signal sensing. When a user launches a bio-signal sensing application on the electronic device 100, the driving method 1900 first activates fingerprint authentication (S1910) and determines whether the authentication is successful (S1920). Only upon successful authentication does the method proceed to activate the bio-signal sensing function to measure the user's bio-signal (S1930). The measured bio-signal is then stored (S1940). This sequence allows for bio-signal data to be collected only from authenticated users, thereby enhancing the security and reliability of sensitive biometric sensing.

[0342] The driving method 1900 according to embodiments of the present disclosure will be described with reference to a flowchart of FIG. 20, a flowchart of FIG. 35, a flowchart of FIG. 37, and a flowchart of FIG. 39, respectively.

[0343] FIG. 20 is a flowchart illustrating a method 2000 of driving an electronic device in which a bio-signal sensing application is executed, according to an embodiment.

[0344] In operation S2010, a touch area may be sensed. A structure and a method of sensing whether to touch and / or touch coordinates in the electronic device are the same as those described with reference to FIGS. 5 to 10.

[0345] In operation S2020, pixels may display an image of a first pattern in a first area set to include the sensed touch area. In an embodiment, the image of the first pattern may be an image of a single color (e.g., green).

[0346] In operation S2030, photosensors located in the first area may be activated to sense reflected light while the first pattern is displayed.

[0347] In operation S2040, it may be determined whether a generated image matches a pre-stored fingerprint image.

[0348] If it is determined that the image generated does not match the pre-stored fingerprint image in the operation S2040, the bio-signal may be terminated without being stored.

[0349] If it is determined that the image generated matches the pre-stored fingerprint image in the operation S2040, operation S2050 and subsequent operations may be performed.

[0350] In operation S2050, pixels may display an image of a second pattern in a second area set to include the sensed touch area.

[0351] In operation S2060, photosensors of a third pattern may be read in a third area around the second area. In an embodiment, the third area may be an area surrounded by the second area and located inside the second area in a plan view. In an embodiment, the third area may be an area surrounding the second area and located outside the second area in a plan view. However, embodiments of the present disclosure are not limited thereto, and any one of the second area and the third area may be adjacent to each other without surrounding the other.

[0352] In operation S2070, the measured bio-signal may be stored.

[0353] Still referring to FIG. 20, embodiments of the present disclosure provide a secure biometric workflow in which fingerprint authentication gates access to subsequent bio-signal sensing. According to embodiments, the process begins by detecting a touch input on the display (S2010). In response, a first area that includes the detected touch area is illuminated using a specific display pattern-such as, e.g., a green image (S2020)-designed to improve fingerprint capture conditions. Photo sensors corresponding to this first area are then activated to generate a fingerprint image (S2030). The method may then compare the captured image to a reference fingerprint stored in memory to determine whether the user is authorized (S2040). If the fingerprint does not match, the process is terminated and no bio-signal is collected or stored, thus protecting sensitive biometric data.

[0354] If the fingerprint authentication is successful, the method transitions to the sensing phase. A second visual pattern is displayed in a second area encompassing the touch region (S2050), and bio-signal sensing is performed in a third area surrounding or adjacent to the second area (S2060). This spatial partitioning between fingerprint sensing and bio-signal acquisition may reduce interference and improve accuracy. Once the bio-signal has been measured, it is stored in memory for further processing or analysis (S2070). In this method according to embodiments, fingerprint authentication precedes bio-signal sensing, so that bio-signal data is captured only after the user has been verified. This sequencing limits the potential for unauthorized access, spoofing, or unintentional collection of sensitive health information.

[0355] FIGS. 21 to 26 are diagrams illustrating that the bio-signal sensing application 2110 is executed in the electronic device with reference to the flowchart of FIG. 20 according to embodiments.

[0356] The electronic device in which the bio-signal sensing application 2110 of FIGS. 21 to 26 is executed may be applied to the electronic device 100 of FIG. 1.

[0357] Referring to FIG. 21, a message MSG may be displayed in the display area DA of the display device 110. The message MSG may be, for example, “touch the screen”, “TOUCH THE SCREEN”, or the like. Thereby, the user of the electronic device may place a finger on the touch active area TA.

[0358] The processor 130 may control the message MSG to be displayed in the display area DA of the display device 110 with reference to the memory 150 loaded with the bio-signal sensing application 2110. The display driving circuit 240 may display the message MSG in the display area DA in response to the control of the processor 130.

[0359] Referring to FIG. 22, the processor 130 may detect whether a user's finger is located in the touch active area TA of the display device 110 with reference to the memory 150 loaded with the bio-signal sensing application 2110. The processor 130 may output a touch control signal TCS to the display device 110 and receive touch sensing data TSD from the display device 110.

[0360] The display device 110 (e.g., the touch driving circuit 230) may drive the touch active area TA in response to the touch control signal TCS and sense the touch active area TA to output the touch sensing data TSD.

[0361] The processor 130 may set a sensed touch area STA based on the touch sensing data TSD received. The sensed touch area STA may include an area to which a user's finger touch is input.

[0362] Referring to FIG. 23, the processor 130 may transmit a control signal CS and first image data DATA1 to the display device 110. The display device 110 (e.g., the display driving circuit 240) may display an image of a first pattern PAT1 in a first area AR1 of the display area DA based on the control signal CS and the first image data DATA1. At least one sub-pixel SP located in the first area AR1 may display an image.

[0363] The first area AR1 may be set to include the sensed touch area STA of FIG. 22. For example, referring to FIG. 4, the first area AR1 may be an area covered by any one of the first to third scan driving circuits 422, 424, and 426. However, embodiments of the present disclosure are not limited thereto, and the first area AR1 may be an area covered by two or more of the first to third scan driving circuits 422, 424, and 426.

[0364] Referring to FIG. 24, the processor 130 may output the control signal CS. The display driving circuit 240 may read the photosensors PHS of the first pattern PAT1 located in the first area AR1 in response to the control signal CS input. The display device 110, for example, the display driving circuit 240 may output a digital value DSEN obtained by sensing the photosensors PHS. The processor 130 may generate a fingerprint image based on the digital value DSEN input.

[0365] The processor 130 may compare the generated fingerprint image with a reference fingerprint image 2410 loaded in the memory 150. The processor 130 may determine whether the generated fingerprint image matches the reference fingerprint image 2410. If it is determined that the generated fingerprint image matches the reference fingerprint image 2410, a bio-signal may be measured. If it is determined that the generated fingerprint image and the reference fingerprint image 2410 do not match, the bio-signal is not measured.

[0366] Referring to FIG. 25, the processor 130 may output the control signal CS and the first image data DATA1. The display device 110, for example, the display driving circuit 240 may display an image of a second pattern PAT2 in a second area AR2 and display an image of a third pattern PAT3 in a third area AR3 in response to the input control signal CS and the first image data DATA1.

[0367] The sensed touch area STA above-described may be located in the second area AR2 and third area AR3 which are set.

[0368] In an embodiment, the second area AR2 may be an emission area, and the third area AR3 may be a sensing area. In an embodiment, the second area AR2 may be a sensing area, and the third area AR3 may be an emission area. Hereinafter, for convenience of description, the second area AR2 is an emission area, and the third area AR3 is a sensing area.

[0369] The emission area refers to an area in which the sub-pixel SP located in the area emits light and the photosensor PHS located in the area is not read.

[0370] The sensing area refers to an area in which the photosensor PHS located in the area is read and the sub-pixel SP located in the area does not emit light.

[0371] Referring to FIG. 25, each of the second area AR2 and the third area AR3 is shown to have a rectangular shape as a whole. However, embodiments of the present disclosure are not limited thereto, and the second area AR2 and / or the third area AR3 may have a circular shape or a polygonal shape other than the rectangular shape.

[0372] The display device 110, for example, the display driving circuit 240 may display an image of the second pattern PAT2 in the second area AR2 and display an image of the third pattern PAT3 in the third area AR3 in response to the control signal CS and the first image data DATA1. In an embodiment, the image of the second pattern PAT2 may be an image of a single color (e.g., green). In an embodiment, the image of the third pattern PAT3 may be a black image.

[0373] Referring to FIG. 26, the processor 130 may output a control signal CS. The display device 110, for example, the display driving circuit 240, may read the photosensor PHS located in the third area AR3 in response to the control signal CS. The display driving circuit 240 may output a digital value DSEN sensing the photosensor PHS.

[0374] The processor 130 may generate bio-signal sensing data 2610 based on the received digital value DSEN. For example, the processor 130 may input the received digital value DSEN into an algorithm and generate the bio-signal sensing data 2610 based on the value output from the algorithm. The processor 130 may store the generated bio-signal sensing data 2610 in the memory 150.

[0375] The processor 130 may detect a change in the amount of light input to the photosensor PHS according to contraction and relaxation of a blood vessel based on the received digital value DSEN. The processor 130 may detect a change in the shape of a blood vessel over time by schematizing a waveform of an amount of light input to the photosensor PHS. Thereby, e.g., a systolic peak, a diastolic peak, a reflection index, a stiffness index, and the like may be calculated. The processor 130 may input the generated information into an algorithm and generate bio-signal sensing data associated with cardiovascular based on a value output from the algorithm. Bio-signal sensing data associated with cardiovascular may include, for example, at least one of cardiovascular health information, blood pressure, atrial rhythm, atrial fibrillation, heart rate, and respiratory rate. However, embodiments of the present disclosure are not limited thereto.

[0376] According to embodiments of the present disclosure, security may be enhanced by generating bio-signal sensing data in association with fingerprint authentication.

[0377] Additionally, when the bio-signal sensing data is obtained, it can be inferred that the fingerprint authentication was performed using the actual user's finger rather than an artificial medium such as silicon or paper. As a result, the system may provide an anti-spoofing function that helps prevent fingerprint authentication from being bypassed using counterfeit materials.

[0378] FIG. 26 illustrates a process in which, according to embodiments of the present disclosure, the processor 130 outputs a control signal CS to the display device 110. In response, the display driving circuit 240 senses the photo sensor PHS located in the third area AR3 and outputs a digital value DSEN. The processor 130 receives the digital value DSEN and generates bio-signal sensing data 2610 by inputting the value into an algorithm and processing the output.

[0379] This process allows the processor 130 to detect changes in light received by the photo sensor PHS corresponding to, e.g., contraction and relaxation of blood vessels. By schematizing the resulting waveform, the processor 130 can analyze features such as, e.g., a systolic peak, diastolic peak, reflection index, and stiffness index. These values may be used to generate bio-signal sensing data 2610 associated with cardiovascular health, which may include information such as, e.g., blood pressure, atrial rhythm, atrial fibrillation, heart rate, and respiratory rate. The data may then be stored in the memory 150.

[0380] Because this sensing operation occurs after fingerprint authentication, embodiments strengthen security by tying sensitive biometric data collection to user verification. Furthermore, the presence of bio-signal sensing data confirms that the fingerprint input originated from a live finger rather than a spoofing material (e.g., silicon or paper), thereby contributing to an anti-spoofing function that may prevent circumvention of fingerprint authentication.

[0381] FIG. 27 is a diagram conceptually illustrating the first pattern PAT1.

[0382] The first pattern PAT1 may include one or more pixels PXL and one or more photosensors PHS. Although one pixel PXL and one photosensor PHS are shown as an example in FIG. 27, embodiments of the present disclosure are not limited thereto.

[0383] The pixel PXL of the first pattern PAT1 may emit light. The photosensor PHS of the first pattern PAT1 may be read.

[0384] FIG. 28 is an embodiment of the first pattern PAT1.

[0385] Referring to FIG. 28, in embodiments of the present disclosure, a plurality of unit pixels UP may be disposed in the first pattern PAT1. The unit pixel UP may include a plurality of sub-pixels SP1, SP2, and SP3 and at least one photosensor PHS. Referring to FIG. 28, the unit pixel UP may include a first sub-pixel SP1, a second sub-pixel SP2, a third sub-pixel SP3, and a photosensor PHS. A plurality of sub-pixels SP1, SP2, and SP3 and at least one photosensor PHS included in the unit pixel UP may be connected (e.g., electrically connected) to one scan line.

[0386] Still referring to FIG. 28, the second sub-pixel SP2 and the photosensor PHS in one unit pixel UP are shown to be positioned adjacent to each other in the second direction DR2. The photosensor PHS may be adjacent to the first sub-pixel SP1 in a fifth direction DR5. The photosensor PHS may be adjacent to the third sub-pixel SP3 in a fourth direction DR4. The second sub-pixel SP2 may be adjacent to the first sub-pixel SP1 in the fourth direction DR4. The second sub-pixel SP2 may be adjacent to the third sub-pixel SP3 in the fifth direction DR5. The first sub-pixel SP1 and the third sub-pixel SP3 may be adjacent to each other in a first direction DR1. The photosensor PHS and the second sub-pixel SP2 may be adjacent to each other in a second direction DR2. Accordingly, one unit pixel UP may have a rhombus shape as a whole. However, embodiments of the present disclosure are not limited thereto.

[0387] At least one sub-pixel included in the unit pixel UP may emit light in the first pattern PAT1. Referring to FIG. 28, the second sub-pixel SP2 included in the unit pixel UP may emit light. According to an embodiment, at least one of the first sub-pixel SP1 and the third sub-pixel SP3 included in the unit pixel UP des not emit light.

[0388] In the first pattern PAT1, the second sub-pixel SP2 included in one unit pixel UP emits light, and the photosensor PHS may sense light (e.g., reflected light). Thereby, a precise image may be obtained.

[0389] FIGS. 29 and 30 are embodiments of the first pattern PAT1.

[0390] FIGS. 29 and 30 are examples of a case where alternative sensing driving is applied to the first pattern PAT1.

[0391] Referring to FIGS. 29 and 30, a first pattern PAT1 in a first frame and a first pattern PAT1 in a second frame are shown, respectively. The first frame and the second frame may be consecutive frames. In one frame, the second sub-pixel SP2 in a first unit pixel PU1 may emit light. The photosensor PHS in a second unit pixel PU2 may be read. In a subsequent frame, the photosensor PHS in the first unit pixel PU1 may sense light. The second sub-pixel SP2 in the second unit pixel PU2 may emit light. The first unit pixel PU1 and the second unit pixel PU2 may be adjacent to each other in the first direction DR1. A plurality of first unit pixels PU1 may be arranged in parallel in the fourth direction DR4. A plurality of second unit pixels PU2 may be arranged in parallel in the fourth direction DR4. The first unit pixel PU1 and the second unit pixel PU2 may be adjacent to each other in the fifth direction DR5.

[0392] Compared with FIG. 28, according to FIGS. 29 and 30, each of the unit pixels PU1 and PU2 may emit light or receive light. Accordingly, a noise (or internal light effect) due to light directly incident from a sub-pixel (e.g., the second sub-pixel SP2) located adjacent to the photosensor PHS in one unit pixel may be reduced. Accordingly, reflected light may be more effectively detected through the photosensor PHS.

[0393] In this way, the driving method of alternately performing the operation of emitting and receiving the unit pixel UP according to the progress of the frame may be referred to as alternative sensing driving.

[0394] FIG. 31 is a diagram conceptually illustrating a second pattern PAT2. FIG. 32 is an embodiment of the second pattern PAT2.

[0395] Referring to FIG. 31, the pixel PXL located in the second pattern PAT2 may emit light. The pixel PXL may emit, for example, light in a green wavelength band. The photosensor PHS located in the second pattern PAT2 may not be read.

[0396] In embodiments of the present disclosure, a plurality of unit pixels UP may be disposed in the second pattern PAT2. At least one sub-pixel (e.g., the second sub-pixel SP2) located in the unit pixel UP in the second pattern PAT2 may emit light.

[0397] FIG. 33 is a diagram conceptually illustrating a third pattern PAT3. FIG. 34 is an embodiment of the third pattern PAT3.

[0398] Referring to FIGS. 33 and 34, in an embodiment, the pixel PXL located in the third pattern PAT3 does not emit light, and the photosensor PHS located in the third pattern PAT3 may be read.

[0399] In embodiments of the present disclosure, a plurality of unit pixels UP may be disposed in the third pattern PAT3. At least one photosensor PHS located in the unit pixel UP in the third pattern PAT3 may be read.

[0400] FIG. 35 is a flowchart illustrating a driving method 3500 of an electronic device in which a bio-signal sensing application is executed according to an embodiment.

[0401] In operation S3510, a touch area may be sensed. The structure and method of sensing whether to touch and / or touch coordinates in the electronic device are the same as those described with reference to FIGS. 5 to 10.

[0402] In operation S3520, pixels in a first area of a first element layer set to include the sensed touch area may display an image of a first pattern. The first element layer may be the first element layer DSL1 described with reference to FIG. 3B.

[0403] In operation S3530, photosensors of the first pattern may be read in the first area.

[0404] In operation S3540, it may be determined whether a generated image matches a pre-stored fingerprint image. If the generated image matches the pre-stored fingerprint image, operation S3550 may be performed.

[0405] In operation S3550, a light-emitting element may emit light in a second area where a second element layer is located. The second element layer may be the second element layer DSL2 described with reference to FIG. 3B.

[0406] In operation S3560, a photosensor may be read in a third area where the second element layer is located. In an embodiment, the third area may be an area surrounded by the second area and located inside the second area in a plan view. In an embodiment, the third area may be an area surrounding the second area and located outside the second area in a plan view. However, embodiments of the present disclosure are not limited thereto, and any one of the second area and the third area may be adjacent to each other without surrounding the other.

[0407] In operation S3570, a measured bio-signal may be stored.

[0408] FIG. 35 illustrates a driving method 3500, according to embodiments of the present disclosure, in which a bio-signal sensing application is executed on an electronic device that includes multiple sensing layers. In operation S3510, a touch area is sensed, using the same sensing structure described in FIGS. 5 to 10. In response, pixels in a first area of a first element layer DSL1 (S3520) display an image of a first pattern to facilitate fingerprint acquisition. Photosensors in the first area are then activated to generate a fingerprint image (S3530). In operation S3540, the processor 130 determines whether the generated fingerprint image matches a pre-stored reference fingerprint image. If a match is confirmed, the method proceeds to activate a second element layer DSL2.

[0409] In operation S3550, a light-emitting element in the second area of the second element layer DSL2 emits light, and in operation S3560, a photosensor located in a third area of DSL2 is read. The third area may be spatially adjacent to or surrounding the second area, depending on the implementation. Finally, in operation S3570, the resulting bio-signal is stored. This method may enable bio-signal sensing using a layered structure, where fingerprint authentication on a first layer serves as a security gate for bio-signal sensing performed via a second layer, enhancing both user authentication and the integrity of the collected biometric data.

[0410] FIG. 36 is a diagram illustrating a state in which a bio-signal sensing application is executed in a wearable device 3600 according to an embodiment of FIG. 35.

[0411] The wearable device 3600 is an embodiment of the electronic device 100 of FIG. 1.

[0412] A user's finger FNG may approach the cover window CW on the first element layer DSL1 of the wearable device 3600. The sub-pixels located in the first element layer DSL1 may display an image of the first pattern PAT1. During display of the first pattern PAT1, photosensors located in the first element layer DSL1 may be read to capture reflected light from the user's finger. Thereby, fingerprint authentication may be performed in the wearable device 3600.

[0413] If fingerprint authentication is successful in the wearable device 3600, bio-signal sensing data may be obtained by a light-emitting element LD_DSL2 and a photosensor PHS_DSL2 located in the second element layer DSL2.

[0414] Light emitted from the light-emitting element LD_DSL2 may provide light to the user's wrist WST. A blood vessel BV is positioned below the user's wrist WST, and reflected light reflected from the blood vessel BV may be input to the photosensor PHS_DSL2.

[0415] The wearable device 3600 may generate bio-signal sensing data using a digital value DSEN (see FIG. 15) generated from the photosensor PHS_DSL2 located in the second element layer DSL2.

[0416] According to embodiments of the present disclosure, an electronic device may include a display device 110 having a display panel in which a plurality of sub-pixels SP and a plurality of photosensors PHS are arranged. The electronic device may further include a memory 150 on which a bio-signal sensing application is loaded, and a processor 130 configured to execute the bio-signal sensing application loaded on the memory. The processor 130 may perform fingerprint authentication using the display device 110 and may sequentially detect a bio-signal proximate to an area in which the fingerprint authentication is performed on the display device.

[0417] FIG. 37 is a flowchart illustrating a method 3700 of driving an electronic device in which a bio-signal sensing application is executed according to an embodiment.

[0418] In operation S3710, a fingerprint authentication device may generate a fingerprint image. The fingerprint authentication device may be included in the electronic device 100 (see FIG. 1).

[0419] In operation S3720, it may be determined whether a generated image matches a pre-stored fingerprint image. If the generated image matches the pre-stored image, operation S3730 may be performed.

[0420] In operation S3730, a light-emitting element may emit light in a second area where a second element layer is located. The second element layer may be the second element layer DSL2 described with reference to FIG. 3B.

[0421] In operation S3740, a photosensor may be read in a third area where the second element layer is located.

[0422] In operation S3750, a measured bio-signal may be stored.

[0423] FIG. 37 illustrates a driving method 3700, according to embodiments of the present disclosure, of driving an electronic device that executes a bio-signal sensing application, where fingerprint authentication is performed using a separate fingerprint authentication device. In operation S3710, the fingerprint authentication device—configured as part of the electronic device 100 generates a fingerprint image. The method then determines whether the generated image matches a pre-stored reference fingerprint image (S3720). If the authentication is successful, the method continues to operation S3730, where a light-emitting element emits light in a second area of the second element layer DSL2 (as described with reference to FIG. 3B).

[0424] In operation S3740, a photosensor located in a third area of the second element layer DSL2 is activated to sense the bio-signal. The method concludes in operation S3750, where the measured bio-signal is stored. Thus, according to embodiments, the fingerprint authentication hardware is separated from the display-integrated sensing structure, allowing for flexible device configurations while still allowing for bio-signal sensing to be conditionally performed only after successful fingerprint verification.

[0425] FIG. 38 is a diagram illustrating a state in which a bio-signal sensing application is executed in a wearable device 3800 according to an embodiment of FIG. 37.

[0426] The wearable device 3800 is an embodiment of the electronic device 100 of FIG. 1.

[0427] The user's finger FNG may access a fingerprint authentication device 3810 of the wearable device 3800. The fingerprint authentication device 3810 may be disposed in the wearable device 3800 separately from the first element layer DSL1 and the second element layer DSL2. For example, fingerprint authentication device 3810 may be disposed on a side of wearable device 3800. Fingerprint authentication may be performed by the fingerprint authentication device 3810.

[0428] If fingerprint authentication is successful in the wearable device 3800, bio-signal sensing data may be obtained by the light-emitting element LD_DSL2 and the photosensor PHS_DSL2 located in the second element layer DSL2.

[0429] Light emitted from the light-emitting element LD_DSL2 may provide light to the user's wrist WST. A blood vessel BV is positioned below the user's wrist WST, and reflected light reflected from the blood vessel BV may be input to the photosensor PHS_DSL2.

[0430] The wearable device 3800 may generate bio-signal sensing data using a digital value DSEN (see FIG. 15) generated from the photosensor PHS_DSL2 located in the second element layer DSL2.

[0431] FIG. 39 is a flowchart illustrating a method 3900 of driving an electronic device in which a bio-signal sensing application is executed according to an embodiment.

[0432] In operation S3910, a bio-signal may be measured.

[0433] In operation S3920, the measured bio-signal may be stored.

[0434] In operation S3930, fingerprint authentication may be performed.

[0435] In operation S3940, it may be determined whether fingerprint authentication has been passed.

[0436] If the fingerprint authentication is not passed, the stored bio-signal may be deleted in operation S3950.

[0437] According to embodiments of the present disclosure, security may be enhanced by generating bio-signal sensing data in association with fingerprint authentication.

[0438] FIG. 40 is a block diagram of an electronic device 4000 according to an embodiment of the present disclosure.

[0439] Referring to FIG. 40, an electronic device 4000 according to an embodiment may include a display module 4010, a processor 4020, a memory 4030, and a power module 4040.

[0440] The processor 4020 may include at least one of, for example, a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), a communication processor (CP), an image signal processor (ISP), and a controller.

[0441] The memory 4030 may store data information utilized for operation of the processor 4020 or the display module 4010. When the processor 4020 executes an application stored in the memory 4030, an image data signal and / or an input control signal are transmitted to the display module 4010, and the display module 4010 may process the received signal and output image information through a display screen.

[0442] The power module 4040 may include a power supply module such as, for example, a power adapter or a battery device, and a power conversion module that converts power supplied by the power supply module to generate power used for operation of the electronic device 4000.

[0443] At least one of the above-described components of the electronic device 4000 may be included in the display device 110 (see FIG. 1) according to the above-described embodiments. In addition, some of the individual modules functionally included in one module may be included in the display device 110, and others may be provided separately from the display device 110. For example, the display device 110 may include a display module 4010, and the processor 4020, the memory 4030, and the power module 4040 may be provided in the form of other devices in the electronic device 4000 other than the display device.

[0444] In an embodiment, the processor 4020 according to embodiments of the present disclosure may correspond to the above-described processor 130 (see FIG. 1).

[0445] FIG. 41 is a schematic diagram of an electronic device 4000 according to various embodiments.

[0446] Referring to FIG. 41, various electronic devices to which a display device according to embodiments is applied may include not only an electronic device for displaying an image, such as a smartphone 4000_1a, a tablet PC 4000_1b, a laptop 4000_1c, a TV 4000_1d, and a desk monitor 4000_1e, but also a wearable electronic device including a display module, such as smart glasses 4000_2a, a head mounted display 4000_2b, and a smart watch 4000_2c, an electronic device for a vehicle 4000_3 including a display module such as a CID (Center Information Display) disposed on an instrument panel, a center fascia, and a dashboard of a vehicle, a room mirror display, and the like.

[0447] As is traditional in the field of the present disclosure, embodiments are described, and illustrated in the drawings, in terms of functional blocks, units and / or modules. Those skilled in the art will appreciate that these blocks, units and / or modules are physically implemented by electronic (or optical) circuits such as logic circuits, discrete components, microprocessors, hard-wired circuits, memory elements, wiring connections, etc., which may be formed using semiconductor-based fabrication techniques or other manufacturing technologies. In the case of the blocks, units and / or modules being implemented by microprocessors or similar, they may be programmed using software (e.g., microcode) to perform various functions discussed herein and may optionally be driven by firmware and / or software. Alternatively, each block, unit and / or module may be implemented by dedicated hardware, or as a combination of dedicated hardware to perform some functions and a processor (e.g., one or more programmed microprocessors and associated circuitry) to perform other functions.

[0448] According to the display device, the electronic device including the same, and the driving method thereof according to embodiments of the present disclosure, security may be enhanced by way of an operation of collecting biometric information (or bio-signal sensing data) of a user.

[0449] While the present disclosure has been particularly shown and described with reference to embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the present disclosure as defined by the following claims.

Examples

Embodiment Construction

[0062]Embodiments of the present disclosure will be described more fully hereinafter with reference to the accompanying drawings. Like reference numerals may refer to like elements throughout the accompanying drawings.

[0063]It will be understood that the terms “first,”“second,”“third,” etc. are used herein to distinguish one element from another, and the elements are not limited by these terms. Thus, a “first” element in an embodiment may be described as a “second” element in another embodiment.

[0064]It should be understood that descriptions of features or aspects within each embodiment should typically be considered as available for other similar features or aspects in other embodiments, unless the context clearly indicates otherwise.

[0065]As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0066]Spatially relative terms, such as “beneath”, “below”, “lower”, “under”, “above”, “upper”...

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims priority under 35 U.S.C. § 119 to Korean Patent Application No. 10-2025-0039195, filed on Mar. 27, 2025, the disclosure of which is incorporated by reference herein in its entirety.TECHNICAL FIELD

[0002] Embodiments of the present disclosure relate to a display device, an electronic device including the same, and a driving method thereof.DISCUSSION OF RELATED ART

[0003] With advances in information technology, electronic devices, such as, e.g., mobile and wearable devices, are evolving to offer a wide range of functions beyond simply displaying images on a screen. For example, electronic devices may now provide high-security biometric authentication using the user's unique biometric information (e.g., a fingerprint, etc.).

[0004] More recently, various types of software have been developed to enable electronic devices to assist medical applications, such as supporting the user in managing their health. As a result of software innovations and structural improvements in display devices, electronic devices capable of continuously tracking health-related data, such as, e.g., a user's bio-signals, have emerged.SUMMARY

[0005] Embodiments of the present disclosure provide a display device with enhanced security relating to collecting bio-signal information (or bio-signal sensing data) of a user, an electronic device including the same, and a driving method thereof.

[0006] According to an embodiment of the present disclosure, a display device includes a display panel in which a plurality of unit pixels are arranged, at least one of the plurality of unit pixels including a plurality of sub-pixels and at least one photosensor, a data driving circuit configured to output a data signal to display an image using the plurality of sub-pixels, a readout circuit configured to read a sensing signal from the at least one photosensor, a scan driving circuit configured to output a scan signal to the plurality of sub-pixels and the at least one photosensor, and a timing controller configured to control driving timings of the data driving circuit, the readout circuit, and the scan driving circuit in response to a control signal. The timing controller is configured to control a plurality of sub-pixels located in a first area of the display panel to display an image of a first pattern, read a plurality of sensing signals from a plurality of photosensors located in the first area while the first pattern is displayed, and generate a fingerprint image based on the plurality of sensing signals, and when fingerprint authentication based on the fingerprint image passes, control a plurality of sub-pixels located in a second area of the display panel to display an image of a second pattern, and read a plurality of sensing signals from a plurality of photosensors located in a third area around the second area while the second pattern is displayed.

[0007] In an embodiment, the display device further includes a touch panel on which a touch electrode is arranged, and a touch driving circuit configured to detect a touch position and a touch coordinate based on a signal of the touch electrode. The timing controller controls an image of the first pattern to be displayed in the first area including a periphery of a sensed touch area, and controls photosensors located in the first area to be read while the first pattern is displayed.

[0008] In an embodiment, an area including the second area and the third area includes the first area.

[0009] According to an embodiment of the present disclosure, an electronic device includes a display device including a display panel in which a plurality of sub-pixels and a plurality of photosensors are arranged, a memory on which a bio-signal sensing application is loaded, and a processor configured to execute the bio-signal sensing application loaded on the memory, perform fingerprint authentication on the display device, and sequentially detect a bio-signal proximate to an area in which the fingerprint authentication is performed.

[0010] In an embodiment, the display device further includes a touch panel including a plurality of touch electrodes, and the processor is further configured to detect a touch area sensed by the touch panel.

[0011] In an embodiment, the processor is further configured to set a first area including the touch area which is sensed, and control the plurality of sub-pixels in the first area to display an image of a first pattern.

[0012] In an embodiment, the image of the first pattern is a green image.

[0013] In an embodiment, the processor is further configured to read sensing signals from the photosensors located in the first area while the first pattern is displayed, and generate a fingerprint image based on the sensing signals.

[0014] In an embodiment, the processor is further configured to compare the fingerprint image with a reference fingerprint image, and generate the bio-signal when the fingerprint image matches the reference fingerprint image.

[0015] In an embodiment, the processor is further configured to set a second area and a third area, wherein the sensed touch area is included in the second area and third area, control the display device to display an image of a second pattern in the second area, and control the display device to display an image of a third pattern in the third area.

[0016] In an embodiment, the image of the second pattern is a green image.

[0017] In an embodiment, the image of the third pattern is a black image.

[0018] In an embodiment, the processor is further configured to read at least one photosensor located in the third area among the plurality of photosensors, and generate bio-signal sensing data corresponding to the bio-signal based on reading the at least one photosensor.

[0019] In an embodiment, the bio-signal sensing data includes at least one of cardiovascular health information, blood pressure, atrial rhythm, atrial fibrillation, heart rate, and respiratory rate, which are associated with a user of the electronic device.

[0020] In an embodiment, the display device includes a plurality of unit pixels, and each unit pixel includes a first sub-pixel, a second sub-pixel, and a third sub-pixel among the plurality of sub-pixels, which emit light of different wavelength bands, and any one of the plurality of photosensors.

[0021] In an embodiment, the first pattern is a pattern in which the second sub-pixel emits light of a green wavelength band while the photosensor in a same unit pixel as the second sub-pixel emitting the light of the green wavelength band is read.

[0022] In an embodiment, the second pattern is a pattern in which the second sub-pixel emits light of a green wavelength band while the photosensor in a same unit pixel as the second sub-pixel emitting the light of the green wavelength band is not read.

[0023] In an embodiment, the third pattern is a pattern in which the first to third sub-pixels do not emit light and the photosensors in a same unit pixel as the first to third sub-pixels are read.

[0024] According to an embodiment of the present disclosure, a driving method of an electronic device including a processor for loading a bio-signal sensing application into a memory and executing the bio-signal sensing application which is loaded includes performing fingerprint authentication, determining whether the fingerprint authentication has passed, measuring a bio-signal when it is determined that the fingerprint authentication has passed, and storing the measured bio-signal.

[0025] In an embodiment, the electronic device further includes a display device that is controlled by the processor and displays an image for fingerprint authentication and an image for measuring the bio-signal, and performing the fingerprint authentication includes detecting a touch area, displaying, by the display device, an image of a first pattern in a first area that includes the detected touch area, and reading sensing signals from photosensors located in the first area while the first pattern is displayed to generate a fingerprint image. Measuring the bio-signal includes displaying, by the display device, an image of a second pattern in a second area that includes the detected touch area, and reading sensing signals from photosensors located in a third area around the second area while the second pattern is displayed.BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The above and other features of the present disclosure will become more apparent by describing in detail embodiments thereof with reference to the accompanying drawings.

[0027] FIG. 1 is a schematic system diagram of an electronic device according to embodiments of the present disclosure.

[0028] FIG. 2 is a block diagram illustrating driving of an electronic device according to embodiments of the present disclosure.

[0029] FIG. 3A is a cross-sectional view of the display device of FIG. 2 according to embodiments of the present disclosure.

[0030] FIG. 3B is a cross-sectional view of the display device of FIG. 2 according to embodiments of the present disclosure.

[0031] FIG. 4 is a system block diagram of a display device according to embodiments of the present disclosure.

[0032] FIG. 5 is a diagram illustrating a touch panel and a touch driving circuit of FIG. 2.

[0033] FIG. 6 is an example of the touch panel of FIG. 5.

[0034] FIG. 7 is an enlarged view of a first area of FIG. 6.

[0035] FIG. 8 is a cross-sectional view taken along line I-I′ of FIG. 7.

[0036] FIG. 9 is an enlarged view of a second area of FIG. 6.

[0037] FIG. 10 is a cross-sectional view taken along line II-II′ of FIG. 9.

[0038] FIG. 11 is a layout diagram illustrating a display area according to an embodiment.

[0039] FIG. 12 is an equivalent circuit diagram of a sub-pixel and a photosensor according to an embodiment.

[0040] FIG. 13 is an equivalent circuit diagram of a sub-pixel and a photosensor according to an embodiment.

[0041] FIG. 14 is a diagram illustrating some of configurations of a sub-pixel and a photosensor in a cross-sectional view of a display device according to embodiments of the present disclosure.

[0042] FIG. 15 is an equivalent circuit diagram of a readout circuit according to embodiments of the present disclosure.

[0043] FIG. 16 is a timing diagram of a display device for sensing a photosensor at a first sensing resolution in case that a first mode is selected in embodiments of the present disclosure.

[0044] FIGS. 17 and 18 are timing diagrams of a display device for sensing a photosensor at a second sensing resolution in case that a second mode is selected in embodiments of the present disclosure.

[0045] FIG. 19 is a flowchart schematically illustrating a method of driving an electronic device according to embodiments of the present disclosure.

[0046] FIG. 20 is a flowchart illustrating a method of driving an electronic device in which a bio-signal sensing application is executed, according to an embodiment.

[0047] FIGS. 21 to 26 are diagrams illustrating execution of a bio-sensing application in an electronic device with reference to the flowchart of FIG. 20 according to embodiments.

[0048] FIG. 27 is a diagram conceptually illustrating a first pattern.

[0049] FIG. 28 is an embodiment of the first pattern.

[0050] FIGS. 29 and 30 are embodiments of the first pattern.

[0051] FIG. 31 is a diagram conceptually illustrating a second pattern.

[0052] FIG. 32 is an embodiment of the second pattern.

[0053] FIG. 33 is a diagram conceptually illustrating a third pattern.

[0054] FIG. 34 is an embodiment of the third pattern.

[0055] FIG. 35 is a flowchart illustrating a method of driving an electronic device in which a bio-signal sensing application is executed according to an embodiment.

[0056] FIG. 36 is a diagram illustrating a state in which a bio-signal sensing application is executed in a wearable device according to an embodiment of FIG. 35.

[0057] FIG. 37 is a flowchart illustrating a method of driving an electronic device in which a bio-signal sensing application is executed according to an embodiment.

[0058] FIG. 38 is a diagram illustrating a state in which a bio-signal sensing application is executed in a wearable device according to an embodiment of FIG. 37.

[0059] FIG. 39 is a flowchart illustrating a method of driving an electronic device in which a bio-signal sensing application is executed according to an embodiment.

[0060] FIG. 40 is a block diagram of an electronic device according to an embodiment of the present disclosure.

[0061] FIG. 41 is a schematic diagram of an electronic device according to various embodiments.DETAILED DESCRIPTION OF THE EMBODIMENTS

[0062] Embodiments of the present disclosure will be described more fully hereinafter with reference to the accompanying drawings. Like reference numerals may refer to like elements throughout the accompanying drawings.

[0063] It will be understood that the terms “first,”“second,”“third,” etc. are used herein to distinguish one element from another, and the elements are not limited by these terms. Thus, a “first” element in an embodiment may be described as a “second” element in another embodiment.

[0064] It should be understood that descriptions of features or aspects within each embodiment should typically be considered as available for other similar features or aspects in other embodiments, unless the context clearly indicates otherwise.

[0065] As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0066] Spatially relative terms, such as “beneath”, “below”, “lower”, “under”, “above”, “upper”, etc., may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as “below” or “beneath” or “under” other elements or features would then be oriented “above” the other elements or features. Thus, the example terms “below” and “under” can encompass both an orientation of above and below.

[0067] It will be understood that when a component is referred to as being “on”, “connected to”, “coupled to”, or “adjacent to” another component, it can be directly on, connected, coupled, or adjacent to the other component, or intervening components may be present. It will also be understood that when a component is referred to as being “between” two components, it can be the only component between the two components, or one or more intervening components may also be present. It will also be understood that when a component is referred to as “covering” another component, it can be the only component covering the other component, or one or more intervening components may also be covering the other component. Other words used to describe the relationships between components should be interpreted in a like fashion.

[0068] Herein, when two or more elements or values are described as being substantially the same as or about equal to each other, it is to be understood that the elements or values are identical to each other, the elements or values are equal to each other within a measurement error, or if measurably unequal, are close enough in value to be functionally equal to each other as would be understood by a person having ordinary skill in the art. For example, the term “about” as used herein is inclusive of the stated value and means within an acceptable range of deviation for the particular value as determined by one of ordinary skill in the art, considering the measurement in question and the error associated with measurement of the particular quantity (e.g., the limitations of the measurement system). For example, “about” may mean within one or more standard deviations as understood by one of the ordinary skill in the art, for example, within ±30%, 20%, 10% or 5% of the stated value. Further, it is to be understood that while parameters may be described herein as having “about” a certain value, according to embodiments, the parameter may be exactly the certain value or approximately the certain value within a measurement error as would be understood by a person having ordinary skill in the art.

[0069] It is to be understood that the terms “comprise” or “have” and the like are intended to designate the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification, and do not preclude the presence or possibility of addition of one or more other features or numbers, steps, operations, components, parts, or combinations thereof.

[0070] Embodiments of the present disclosure relate to a system and method for enhancing biometric security in electronic devices by linking fingerprint authentication and bio-signal sensing within a unified display-driven framework. Embodiments are applicable to mobile and wearable devices that incorporate display panels with integrated photosensors and sub-pixels. By coordinating the operation of these components, the embodiments may perform fingerprint authentication and, upon successful verification, initiate bio-signal sensing in a spatially proximate region.

[0071] In systems and methods according to a comparative example, bio-signal sensing (e.g., for heart rate or respiratory monitoring) may occur without verification of the user's identity, creating potential security and privacy risks when collecting sensitive health information. Embodiments of the present disclosure address this issue by introducing a sequential, conditional sensing process: fingerprint authentication is performed first, and bio-signal data is collected only if the fingerprint is authenticated. This structure may improve the integrity of the bio-signal data and prevent unauthorized users from triggering or accessing biometric sensing functions.

[0072] Embodiments of the present disclosure utilize the coordinated use of display elements, such as sub-pixel-driven display patterns, and embedded photosensors, along with timing control logic that governs when and where sensing operations occur. A first pattern may be displayed for fingerprint imaging and a second pattern may be displayed for bio-signal detection. During each pattern, sensing signals from photosensors may be read from designated areas of the display panel. This approach may enable secure, efficient, and integrated multi-modal biometric interaction within compact electronic devices.

[0073] FIG. 1 is a schematic system diagram of an electronic device 100 according to embodiments of the present disclosure.

[0074] Referring to FIG. 1, an electronic device 100 according to embodiments of the present disclosure may include a display device 110, a processor 130, a memory 150, and the like.

[0075] The display device 110 may visually provide information to a user of the electronic device 100. The display device 110 may include, for example, a display panel, a driving circuit, and the like. The display device 110 according to embodiments of the present disclosure may include a touch sensor set to detect a touch and / or a pressure sensor set to measure intensity of a force generated by the touch.

[0076] The processor 130 may, for example, execute software (e.g., a program 160) to control at least one other component (e.g., a hardware component or a software component) of the electronic device 100 coupled to the processor 130, and may perform various data processing or operations. According to embodiments of the present disclosure, as at least part of data processing or operation, the processor 130 may store data received from another component (e.g., the display device 110) in a volatile memory 152, process instructions or data stored in the volatile memory 152, and store result data in a non-volatile memory 154. According to embodiments of the present disclosure, the processor 130 may include a main processor 132 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 134 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, a communication processor (CP), etc.) operable independently of or in conjunction with the main processor 132. For example, in case that the electronic device 100 includes a main processor 132 and an auxiliary processor 134, the auxiliary processor 134 may use lower power than the main processor 132 or may be set to be specialized for a specified function. The auxiliary processor 134 may be implemented separately from, or as part of, the main processor 132.

[0077] The auxiliary processor 134 may control at least a portion of a function or states associated with at least one component (e.g., the display device 110) of the components of the electronic device 100, for example, on behalf of the main processor 132 while the main processor 132 is in an inactive (e.g., sleep) state, or in conjunction with the main processor 132 when the main processor 132 was in an active state (e.g., executing an application). According to embodiments of the present disclosure, the auxiliary processor 134 (e.g., an image signal processor or a communication processor) may be implemented as part of another functionally relevant component (e.g., a camera module, a communication module, etc.). According to embodiments of the present disclosure, the auxiliary processor 134 (e.g., a neural network processing device) may include a hardware structure specialized in processing of an artificial intelligence model. The artificial intelligence models may be created through machine learning.

[0078] The memory 150 may store various data used by at least one component (e.g., the processor 130) of the electronic device 100. Data may include, for example, software (e.g., a program 160) and input data or output data for instructions associated with the software. The memory 150 may include a volatile memory 152 or a non-volatile memory 154. The non-volatile memory 154 may include an embedded memory 155. The non-volatile memory 154 may further include an external memory 156.

[0079] The program 160 may be stored as software in the memory 150 and may include, for example, an application 162, a middleware 164, an operating system (OS) 166, and the like.

[0080] The electronic device 100 according to embodiments of the present disclosure may be referred to as, for example, a mobile station, a mobile equipment (ME), a user equipment (UE), a user terminal (UT), a subscriber station (SS), a wireless device, a handheld device, an access terminal (AT), or the like. The electronic device 100 according to embodiments of the present disclosure may be, for example, a device having a communication function, such as a mobile phone, a personal digital assistant (PDA), a smartphone, a wireless modem, or a laptop computer.

[0081] The electronic device 100 according to embodiments of the present disclosure may include a power management module configured to manage power supplied to the electronic device 100. The power management module may be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0082] At least some of the components of the electronic device 100 according to embodiments of the present disclosure may be connected to each other through a communication method between peripheral devices (for example, a bus, a general purpose input and output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI), or the like), and may exchange signals (e.g., commands or data) with each other.

[0083] FIG. 2 is a block diagram illustrating driving of an electronic device 100 according to embodiments of the present disclosure.

[0084] Referring to FIG. 2, an electronic device 100 according to embodiments of the present disclosure may include a display device 110, a processor 130, and a memory 150.

[0085] Referring to FIG. 2, a display device 110 according to embodiments of the present disclosure may include a touch panel 210, a display panel 220, a touch driving circuit 230, a display driving circuit 240, and the like.

[0086] The display device 110 according to embodiments of the present disclosure may be applied to a mobile communication terminal. The display device 110 may constitute a portable terminal by being disposed on a bracket and / or a case together with electronic modules, a camera module, a power module, and the like mounted on a main board. However, the display device 110 is not limited thereto. For example, the display device 110 may be applied to an electronic device 100 such as a television, a notebook, a monitor, a billboard, an Internet of Things (IoT) device, or the like, as well as an electronic device 100 (e.g., a small or medium-sized electronic device) such as a mobile phone, a smartphone, a tablet personal computer (PC), navigation, a smart watch, a watch phone, a Ultra-Mobile Personal Computer (UMPC), a Portable Multimedia Player (PMP), an electronic notebook, an electronic book, or the like.

[0087] Referring to FIG. 2, a touch panel 210 and a display panel 220 are shown separately from each other. However, this is merely for functionally distinguishing the touch panel 210 and the display panel 220 in the display device 110. In an embodiment, the touch panel 210 according to embodiments of the present disclosure may be formed in a separate process from the display panel 220 so that the touch panel 210 and the display panel 220 are coupled to each other (e.g., the touch panel 220 is attached and coupled to one surface of the display panel 220). In an embodiment as described above, the touch panel 210 may be formed in an add-on type. In an embodiment, the touch panel 210 according to embodiments of the present disclosure may be formed in one process (e.g., a process of manufacturing the display panel 220) with the display panel 220. In an embodiment as described above, the touch panel 210 may be formed in an in-cell type.

[0088] The touch panel 210 may be provided on one surface of the display panel 220. For example, the touch panel 210 may be disposed on one surface (e.g., an upper surface) of both surfaces of the display panel 220 in a direction in which an image is emitted. In an embodiment, the touch panel 210 may be formed directly on at least one of both surfaces of the display panel 220 or may be formed inside the display panel 220. For example, the touch panel 210 may be formed directly on an outer surface of an upper substrate or a lower substrate of the display panel 220 (e.g., an upper surface of the upper substrate or a lower surface of the lower substrate), or may be formed directly onto an inner surface of the upper substrate (e.g., a lower surface of the upper substrate) or an inner surface of the lower substrate (e.g., an upper surface of the lower substrate).

[0089] The touch panel 210 may include a touch active area TA capable of sensing a touch input, and a touch inactive area TN located in a peripheral area of the touch active area TA (e.g., an edge area of the touch active area TA). According to an embodiment, the location of the touch active area TA may correspond to a display area DA of the display panel 220.

[0090] According to an embodiment, the touch panel 210 may overlap at least one area with the display panel 220. For example, the touch active area TA of the touch panel 210 may be located in the display area DA of the display panel 220. According to an embodiment, at least one electrode that detects a touch input may be disposed in the touch active area TA. The at least one electrode that detects a touch input may include, for example, a first touch electrode Tx and a second touch electrode Rx. The first touch electrode Tx and the second touch electrode Rx may be provided in the display area DA of the display panel 220.

[0091] Wirings for electrically connecting the at least one electrode provided in the touch active area TA to the touch driving circuit 230 may be disposed in the touch inactive area TN. For example, wirings for electrically connecting the first touch electrode Tx and the second touch electrode Rx to the touch driving circuit 230 may be disposed in the touch inactive area TN. The location of the touch inactive area TN may correspond to a non-display area NA of the display panel 220.

[0092] The touch panel 210 may include at least one first touch electrode Tx and a second touch electrode Rx provided in the touch active area TA. For example, the touch panel 210 may include the first touch electrode Tx and the second touch electrode Rx that intersects the first touch electrode TX. In an embodiment, the first touch electrode Tx may extend along a first direction. In an embodiment, the second touch electrode Rx may extend along a second direction crossing the first direction while being insulated from the first touch electrode Tx by an insulating film. A capacitance Cse may be formed between the first touch electrode Tx and the second touch electrode Rx. The capacitance Cse may be changed when a touch input occurs at or around a corresponding point. By detecting a change in the capacitance Cse, a touch input and / or a position (or coordinate) at which the touch input occurred may be detected.

[0093] A shape, size, and / or arrangement direction of the first touch electrode Tx and the second touch electrode Rx are not particularly limited. Example embodiments related thereto are described with reference to FIGS. 5 and 6.

[0094] The display panel 220 may include a display area DA and a non-display area NA located in a peripheral area of the display area DA (e.g., an edge area of the display area DA).

[0095] A signal line SL and a data line DL may be located in the display area DA. A sub-pixel SP may be located in the display area DA, and the sub-pixel SP is electrically connected to the signal line SL and the data line DL. Various driving signals that drive the sub-pixel SP and / or wirings that supply power may be provided in the non-display area NA.

[0096] In embodiments of the present disclosure, the type of the display panel 220 is not particularly limited. For example, in embodiments of the present disclosure, the display panel 220 may be a self-luminous display panel. In an embodiment as described above, the display panel 220 may include a plurality of light-emitting elements. For example, a light-emitting element may be an organic light-emitting diode. For example, the light-emitting element may be an inorganic light-emitting diode, such as a micro light-emitting diode (LED), a quantum dot light-emitting diode. For example, the light-emitting element may be an element in which an organic material and an inorganic material are combined.

[0097] For example, in embodiments of the present disclosure, the display panel 220 may be a non-light-emitting display panel such as a liquid crystal display panel (LCD panel), an electro-permanent display panel (EPD panel), or an electro-wetting display panel (EWD panel). In a case in which the display panel 220 is the non-light-emitting display panel, the display device 110 may further include a backlight unit that supply light to the display panel 220.

[0098] The touch driving circuit 230 may be connected (e.g., electrically connected) to the touch panel 210, and transmit a signal input to the touch panel 210 or receive a signal output from the touch panel 210. The touch driving circuit 230 may supply a touch driving signal to the touch panel 210, and thereafter receive a touch sensing signal (or a touch detection signal) corresponding to the touch driving signal from the touch panel 210 to detect a touch input. According to an embodiment, the touch driving circuit 230 may be integrated in one integrated circuit (IC), but may be divided and disposed in two or more integrated circuits according to functions. According to an embodiment, the touch driving circuit 230 may simultaneously (or sequentially) supply a touch driving signal to the plurality of first touch electrodes Tx. The touch driving circuit 230 may simultaneously (or sequentially) receive a touch sensing signal from the plurality of second touch electrodes Rx. The touch driving circuit 230 may receive the touch sensing signal from the touch panel 210 and detect whether a touch is input and / or a touch coordinate by performing signal processing on the touch sensing signal.

[0099] The display driving circuit 240 may be connected to (e.g., electrically connected to) the display panel 220, and supply a signal input to the display panel 220 or receive a signal output from the display panel 220. The display driving circuit 240 may supply a scan signal, a light emission signal, or the like to the signal line SL, and may supply a data signal (or a data voltage) to the data line DL.

[0100] The processor 130 may provide a signal to the display device 110 or receive a signal generated by the display device 110. The processor 130 may provide a signal to the display device 110 with reference to the memory 150. The processor 130 may store data in the memory 150 based on a signal received from the display device 110. For example, information for fingerprint authentication of a user of the electronic device 100 (e.g., a reference fingerprint image for fingerprint authentication) may be stored in the memory 150. For example, the memory 150 may store bio-signal sensing data (e.g., blood pressure, heart rate, oxygen saturation, etc.) of a user of the electronic device 100. A code for executing an application may be stored in the memory 150, and the processor 130 may execute the application with reference to the memory 150 to provide a signal to the display device 110.

[0101] FIG. 3A is a cross-sectional view of the display device 110 of FIG. 2 according to embodiments of the present disclosure.

[0102] Referring to FIG. 3A, the display device 110 may include a display panel 220 and a touch panel 210 disposed on the display panel 220. A cover window CW may be disposed on the touch panel 210.

[0103] In FIG. 3A, an embodiment in which the display panel 220 is a self-luminous display panel including a light-emitting element is described as an example. However, embodiments of the present disclosure are not limited thereto.

[0104] The display panel 220 may include a base substrate BSL, an element layer DSL, an encapsulation layer TFE, and the like.

[0105] The base substrate BSL may support the element layer DSL. The base substrate BSL may provide a plane defined by a first direction DR1 and a second direction DR2, and support the element layer DSL on the plane. The base substrate BSL may include an insulating material. As an example of the insulating material, at least one among glass, quartz, ceramic, and plastic may be included. In an embodiment, the base substrate BSL may be a rigid substrate. In an embodiment, the base substrate BSL may be a flexible substrate.

[0106] The element layer DSL may be positioned on the base substrate BSL (e.g., in a third direction DR3 from the base substrate BSL). The element layer DSL may include a sub-pixel SP (see FIG. 2) and a photosensor PHS (see FIG. 2) located on the base substrate BSL. The sub-pixel may include a light-emitting element and a pixel circuit that drives the light-emitting element. The photosensor may include a light-receiving element and a sensor circuit that drives the light-receiving element. Each of the pixel circuit and the sensor circuit may include a switching element (e.g., a transistor) and a storage element (e.g., a capacitor). A transistor, a capacitor, a light-emitting element, and a light-receiving element may be disposed in the element layer DSL. A signal line that provides a signal to the sub-pixel and the photosensor and a power line that provides a power voltage may be disposed in the element layer DSL. The signal line may include a scan line configured to transmit a scan signal to the sub-pixel and the photosensor. A data line configured to supply a data voltage to the sub-pixel may be disposed in the element layer DSL. The sub-pixel and the photosensor may be disposed in the display area DA. A common electrode (e.g., a cathode electrode of a light-emitting element and a light-receiving element) may be formed in the element layer DSL.

[0107] The encapsulation layer TFE may be disposed on the element layer DSL. The encapsulation layer TFE may protect the element layer DSL from external moisture and / or oxygen. The encapsulation layer TFE may include two or more thin film layers formed on the element layer DSL. For example, the encapsulation layer TFE may include an inorganic thin film layer formed on the element layer DSL, an organic thin film layer formed on the inorganic thin film layer, and an inorganic thin film layer disposed on the organic thin film layer. According to an embodiment, the encapsulation layer TFE may be formed of a glass substrate to cover the element layer DSL. The encapsulation layer TFE may cover the element layer DSL in the display area DA and the non-display area NA.

[0108] The touch panel 210 may be disposed on the encapsulation layer TFE. In an embodiment, the touch panel 210 may be formed directly on the encapsulation layer TFE. In an embodiment, the touch panel 210 may be formed through a separate process from the display panel 220 and disposed (e.g., attached) on the encapsulation layer TFE. The touch panel 210 may include a touch active area TA, and at least a portion of the touch active area TA may overlap the display area DA. The touch panel 210 may include a touch inactive area TN (see FIG. 2), and at least a portion of the touch inactive area TN may overlap the non-display area NA.

[0109] The cover window CW may be disposed on the touch panel 210. The cover window CW may protect the display panel 220 and the touch panel 210 from an external impact or the like. The cover window CW may be embodied as a film of a light-transmitting (e.g., transparent) material, for example glass and / or plastic.

[0110] According to an embodiment, the display device 110 may further include one or more optical layers (e.g., an anti-glare layer, a polarizing plate, a color filter, a liquid crystal, and the like).

[0111] FIG. 3B is a cross-sectional view of the display device 110 of FIG. 2 according to embodiments of the present disclosure.

[0112] The display panel 220 may include a base substrate BSL, a first element layer DSL1, a second element layer DSL2, an encapsulation layer TFE, and the like.

[0113] The base substrate BSL may support the first element layer DSL1 and the second element layer DSL2. The base substrate BSL may provide a plane defined by the first direction DR1 and the second direction DR2, and support the first element layer DSL1 and the second element layer DSL2 on the plane.

[0114] The first element layer DSL1 may be positioned on the base substrate BSL (e.g., in a third direction DR3 from the base substrate BSL). The first element layer DSL1 may include a sub-pixel SP (see FIG. 2) and a photosensor PHS (see FIG. 2) positioned on the base substrate BSL. The sub-pixel may include a light-emitting element and a pixel circuit that drives the light-emitting element. The photosensor may include a light-receiving element and a sensor circuit that drives the light-receiving element. Each of the pixel circuit and the sensor circuit may include a switching element (e.g., a transistor) and a storage element (e. g., a capacitor). A transistor, a capacitor, a light-emitting element, and a light-receiving element may be disposed in the first element layer DSL1. A signal line that provides a signal to the sub-pixel and the photosensor and a power line that provides a power voltage may be disposed in the first element layer DSL1. The signal line may include a scan line configured to transmit a scan signal to the sub-pixel and the photosensor. The first element layer DSL1 may include a data line configured to provide a data signal to a sub-pixel. The sub-pixel and the photosensor may be disposed in the display area DA. A common electrode (e.g., a cathode electrode of a light-emitting element and a light-receiving element) may be formed in the first element layer DSL1.

[0115] The second element layer DSL2 may be located below the base substrate BSL (e.g., in a direction opposite to the third direction DR3 from the base substrate BSL). The second element layer DSL2 may include a light-emitting element and a light-receiving element positioned under the base substrate BSL. A signal line through which a signal that controls driving timings of the light-emitting element and the light-receiving element is transmitted may be disposed in the second element layer DSL2. A power line that provides a power voltage to the light-emitting element and the light-receiving element may be disposed in the second element layer DSL2. The signal line may include a scan line that controls a light emission timing of the light-emitting element and that controls a sensing timing of the light-receiving element. The light-emitting element and the light-receiving element may be disposed in the display area DA. A common electrode (e.g., a cathode electrode of the light-emitting element and the light-receiving element) may be formed in the second element layer DSL2. In an embodiment, an encapsulation layer covering the second element layer DSL2 may be further provided. However, embodiments of the present disclosure are not limited thereto.

[0116] The touch panel 210 may be disposed on the encapsulation layer TFE. In an embodiment, the touch panel 210 may be formed directly on the encapsulation layer TFE. In an embodiment, the touch panel 210 may be formed through a separate process from the display panel 220 and disposed (e.g., attached) on the encapsulation layer TFE. The touch panel 210 may include a touch active area TA, and at least a portion of the touch active area TA may overlap the display area DA. The touch panel 210 may include a touch inactive area TN (see FIG. 2), and at least a portion of the touch inactive area TN may overlap the non-display area NA.

[0117] The first cover window CW1 may be disposed on the touch panel 210. The first cover window CW1 may protect the display panel 220 and the touch panel 210 from an external impact or the like. The first cover window CW1 may be implemented as a film of a light-transmitting (e.g., transparent) material, for example glass and / or plastic.

[0118] The second cover window CW2 may be disposed under the second element layer DSL2. The second cover window CW2 may protect the second element layer DSL2 from an external impact or the like. The second cover window CW2 may be implemented as a film of a light-transmitting (e.g., transparent) material, for example, glass and / or plastic.

[0119] FIG. 4 is a system block diagram of a display device 110 according to embodiments of the present disclosure.

[0120] Referring to FIG. 4, a display device 110 according to embodiments of the present disclosure may include a display panel 220, a data driving circuit 410, a scan driving circuit 420, an emission driving circuit 430, a timing controller 440, a readout circuit 450, a reset circuit 460, and the like.

[0121] The above-described display driving circuit 240 (see FIG. 2) may include the data driving circuit 410, the scan driving circuit 420, the emission driving circuit 430, the timing controller 440, the readout circuit 450, the reset circuit 460, and the like.

[0122] One or more sub-pixels SP may be disposed on the display panel 220. One or more photosensors PHS may be disposed on the display panel 220. One or more signal lines configured to provide signals to the sub-pixel SP and the photosensor PHS may be disposed on the display panel 220. One or more data lines configured to provide a data voltage to the sub-pixel SP may be disposed on the display panel 220. A power line configured to supply a power voltage to the sub-pixel SP and the photosensor PHS may be disposed on the display panel 220. The sub-pixel SP and the photosensor PHS may be disposed on a display substrate DSUB. The signal line, the data lines DL1 to DLn (n is an integer of 2 or more), and the power line may be disposed on the display substrate DSUB. The display substrate DSUB may include the base substrate BSL described above (see FIGS. 3A and 3B).

[0123] The power voltage may include, for example, a first power voltage VDD, a second power voltage VSS, a third power voltage VRST, a fourth power voltage VCOM, and the like. The power voltage is commonly input to the plurality of sub-pixels SP and / or the plurality of photosensors PHS, and is also referred to as a common voltage. The power voltage may be generated, for example, in a power management integrated circuit.

[0124] A plurality of data lines DL1 to DLn (where n is a positive integer of 2 or more) may be arranged in the display panel 220. The plurality of data lines DL1 to DLn may be arranged to extend in a second direction DR2 in the display panel 220. The second direction DR2 may be, for example, a column direction extending from an upper side of the display panel 220 to a lower side of the display panel 220, but embodiments of the present disclosure are not limited thereto.

[0125] A plurality of scan lines SCL1 to SCLm (where m is a positive integer of 2 or more) may be arranged in the display panel 220. The plurality of scan lines SCL1 to SCLm may be arranged to extend in a first direction DR1 in the display panel 220. The first direction DR1 may be, for example, a row direction extending from a left side of the display panel 220 to a right side of the display panel 220, but embodiments of the present disclosure are not limited thereto.

[0126] In an embodiment, being arranged to extend in the second direction DR2 may mean being arranged to extend in a direction connecting the upper side and the lower side of the display panel 220 as a whole, and partially extending in a direction different from the second direction DR2, is not excluded. For example, in embodiments of the present disclosure, at least one data line of the plurality of data lines DL1 to DLn may be designed to extend partially bypassing in a direction different from the second direction DR2 in order to avoid a specific area (e.g., an area in which transmittance is set high). A meaning of being arranged to extend in the first direction DR1 may also be understood in the same sense as the meaning of being arranged to extend in the second direction DR2.

[0127] A plurality of light emission control lines EML1 to EMLm may be arranged in the display panel 220. The plurality of light emission control lines EML1 to EMLm may be arranged to extend in the first direction DR1 in the display panel 220.

[0128] A plurality of sensing lines RX1 to RXo (where o is a positive integer of 2 or more) may be arranged in the display panel 220. A plurality of sensing lines RX1 to RXo may be arranged to extend in the second direction DR2 in the display panel 220.

[0129] One or more reset control lines RSTL may be arranged in the display panel 220.

[0130] The sub-pixel SP may be electrically connected to any one of the plurality of data lines DL1 to DLn. The sub-pixel SP may be electrically connected to at least one scan line among the plurality of scan lines SCL1 to SCLm. The sub-pixel SP may be electrically connected to at least one light emission control line among the plurality of light emission control lines EML1 to EMLm.

[0131] The photosensor PHS may be electrically connected to any one of the plurality of sensing lines RX1 to RXo. According to an embodiment, the photosensor PHS may be electrically connected to the reset control line RSTL. According to an embodiment, the photosensor PHS may be electrically connected to at least one scan line among the plurality of scan lines SCL1 to SCLm. According to an embodiment, the photosensor PHS may be electrically connected to at least one light emission control line among the plurality of light emission control lines EML1 to EMLm.

[0132] The sub-pixel SP and the photosensor PHS may be electrically connected to any one of the plurality of scan lines SCL1 to SCLm.

[0133] According to an embodiment, a plurality of sub-pixels SP may be arranged in a matrix type in the display panel 220. For example, the plurality of sub-pixels SP may be arranged in an RGB type, or may be arranged in a rhombus-shaped PENTILE™ structure.

[0134] The data driving circuit 410 may be configured to supply a data voltage to the plurality of data lines DL1 to DLn. The data driving circuit 410 may receive second image data DATA2 and supply a data voltage corresponding to the second image data TATA2 to the plurality of data lines DL1 to DLn in response to a data driving circuit control signal DCS.

[0135] The scan driving circuit 420 may be configured to supply a scan signal to the plurality of scan lines SCL1 to SCLm. According to an embodiment, the scan driving circuit 420 may be configured to sequentially supply scan signals to the plurality of scan lines SCL1 to SCLm, but is not limited thereto. For example, the scan driving circuit 420 may include a plurality of sub-scan driving circuits 422, 424, and 426. The sub-scan driving circuits 422, 424, and 426 may be configured to spatially divide the display area DA to provide a scan signal. For example, the first scan driving circuit 422 may supply a scan signal to an upper ⅓ area (e.g., an area including a first scan line SCL1) of the display area DA. The second scan driving circuit 424 may supply a scan signal to a central ⅓ area (e.g., an area including a p-th scan line SCLp) of the display area DA. The third scan driving circuit 426 may supply a scan signal to a lower ⅓ area (e.g., an area including a m-th scan line SCLm) of the display area DA. The scan driving circuit 420 may receive the scan driving circuit control signal SCS and supply the scan signal to the plurality of scan lines SCL1 to SCLm according to timing.

[0136] The emission driving circuit 430 may be configured to supply a light emission control signal to the plurality of light emission control lines EML1 to EMLm. According to an embodiment, the emission driving circuit 430 may be configured to sequentially supply light emission control signals to the plurality of light emission control lines EML1 to EMLm, but is not limited thereto. For example, the emission driving circuit 430 may include a plurality of sub-emission driving circuits 432, 434, and 436. The sub-emission driving circuits 432, 434, and 436 may be configured to spatially divide the display area DA to provide a light emission control signal. For example, the first emission driving circuit 432 may supply a light emission control signal to an upper ⅓ area of the display area DA (e.g., an area including a first light emission control line EML1). The second emission driving circuit 434 may supply a light emission control signal to a central ⅓ area (e.g., an area including a p-th light emission control line EMLp) of the display area DA. The third emission driving circuit 436 may supply a light emission control signal to a lower ⅓ area (e.g., an area including a m-th light emission control line EMLm) of the display area DA. The emission driving circuit 430 may receive an emission driving circuit control signal ECS and supply the light-emitting control signal to the plurality of light emission control lines EML1 to EMLm according to timing.

[0137] The timing controller 440 may receive a control signal CS and first image data DATA1, e.g., from the processor 130 (see FIG. 1). The timing controller 440 may generate the data driving circuit control signal DCS, the scan driving circuit control signal SCS, the emission driving circuit control signal ECS, the second image data DATA2, a readout circuit control signal RCS, and the like based on the control signal CS and the first image data DATA1 which are input.

[0138] The readout circuit 450 may be electrically connected to the plurality of sensing lines RX1 to RXo. The readout circuit 450 may be configured to receive sensing signals from the plurality of photosensors PHS through the plurality of sensing lines RX1 to RXo. For example, according to the design of the readout circuit 450, the readout circuit 450 may integrate a current flowing through at least one of the plurality of sensing lines RX1 to RXo or sense a voltage of at least one of the plurality of the sensing lines RX1 to RXo. The readout circuit 450 may further include a multiplexer configured to integrate a current (or sense a voltage) of at least one of the plurality of sensing lines RX1 to RXo. Hereinafter, for convenience of description, the readout circuit 450 will be described as an example in which a current sensing method is applied, but embodiments of the present disclosure are not limited thereto.

[0139] The readout circuit 450 may include an analog-to-digital converter (ADC) 452 configured to convert an analog voltage to a digital value DSEN.

[0140] The reset circuit 460 may be configured to supply a reset signal RST to the plurality of photosensors PHS. When the reset signal RST is supplied to the photosensor PHS, an electrical connection between the photosensors PHS and the sensing lines RX1 to Rxo may be broken. A timing at which the reset circuit 460 outputs the reset signal RST may be controlled by the timing controller 440.

[0141] One or more circuits constituting the display driving circuit 240 (see FIG. 2) may be disposed in the display device 110 in the form of an integrated circuit (IC). For example, the data driving circuit 410 and the readout circuit 450 may be disposed in the display device 110 in the form of a source readout integrated circuit (SRIC). One or more circuits constituting the display driving circuit 240 may be formed together in the process of forming the display panel 220. For example, the scan driver circuit 420 and / or the emission driving circuit 430 may be formed together in a process of forming one or more circuit elements (e.g., transistors, etc.) included in the sub-pixel SP and the photosensor PHS.

[0142] The data driving circuit 410, the scan driving circuit 420, the emission driving circuit 430, and the timing controller 440 may be classified according to functions, and two or more components may be functionally distinguished within one integrated circuit. For example, the data driving circuit 410 and the timing controller 440 may be implemented as one integrated circuit, but may be functionally separated within the integrated circuit. For example, the scan driving circuit 420 and the emission driving circuit 430 may be implemented as one integrated circuit, but may be functionally separated within the integrated circuit.

[0143] FIG. 5 is a diagram illustrating the touch panel 210 and the touch driving circuit 230 of FIG. 2.

[0144] The display device 110 may include the touch panel 210 and the touch driving circuit 230.

[0145] Referring to FIG. 5, the touch panel 210 according to embodiments of the present disclosure may include a touch substrate TSUB, first touch electrodes Tx1, Tx2 to Txa-1, Txa (hereinafter, Tx1 to Txa, where a is an integer of 2 or more), second touch electrodes Rx1, Rx2 to Rxb (hereinafter, Rx1 to Rxb, where b is an integer of 2 or more), a pad portion 520, and a touch wiring 530.

[0146] The touch substrate TSBU may be a substrate serving as a substrate of the touch panel 210, and may be a rigid or flexible substrate. For example, the touch substrate TSUB may be a rigid substrate including glass or tempered glass. For example, the touch substrate TSUB may be a flexible substrate including a thin film made of a flexible plastic material. The first touch electrodes Tx1 to Txa, the second touch electrodes Rx1 to Rxb, the pad portion 520, the touch wiring 530, and the like may be disposed on the touch substrate TSUB. According to an embodiment, the touch substrate TUSB may be omitted or replaced with another configuration. For example, in case that the first touch electrodes Tx1 to Txa and the second touch electrodes Rx1 to Rxb are directly formed on the display panel 220 (see FIG. 2), the touch substrate TSUB may be replaced with the base substrate BSL (see FIGS. 3A and 3B) or the encapsulation layer TFE (see FIG. 3A and FIG. 3B) described above, or the like.

[0147] The first touch electrodes Tx1 to Txa may extend along a first direction (e.g., a direction transverse from left to right of the touch panel 210, or a row direction). Referring to FIG. 5, each of the plurality of first touch electrodes Tx1 to Txa may be arranged to extend in a row direction in the touch panel 210.

[0148] The second touch electrodes Rx1 to Rxb may extend along a second direction (e.g., a direction transverse from an upper side to a lower side of the touch panel 210, or a column direction). Referring to FIG. 5, each of the plurality of second touch electrodes Rx1 to Rxb may be arranged to extend in a column direction in the touch panel 210.

[0149] The touch panel 210 according to embodiments of the present disclosure may be driven in a mutual capacitance manner. In the mutual capacitance manner, any one of the first touch electrodes Tx1 to Txa and the second touch electrodes Rx1 to Rxb may be a touch driving electrode. In the mutual capacitance manner, the other of the first touch electrodes Tx1 to Txa and the second touch electrodes Rx1 to Rxb may be a touch sensing electrode. A touch driving signal TDS may be input to the touch driving electrode. A touch sensing signal TSS may be output through the touch sensing electrode. In an embodiment, the first touch electrodes Tx1 to Txa may receive the touch driving signal TDS for touch driving, and the second touch electrodes Rx1 to Rxb may output the touch sensing signal TSS generated in response to the touch driving signal TDS. In an embodiment, the second touch electrodes Rx1 to Rxb may receive the touch driving signal TDS, and the first touch electrodes Tx1 to Txa may output the touch sensing signal TSS generated in response to the touch driving signal TDS. Hereinafter, for convenience of description, an embodiment in which the touch driving signal TDS is input to the first touch electrodes Tx1 to Txa and the touch sensing signal TSS is output through the second touch electrodes Rx1 to Rxb will be described as an example. However, embodiments of the present disclosure are not limited thereto.

[0150] A capacitance Cse may be formed between the first touch electrodes Tx1 to Txa and the second touch electrodes Rx1 to Rxb. For example, referring to FIG. 5, the first touch electrodes Tx1 to Txa and the second touch electrodes Rx1 to Rxb may overlap each other in a vertical direction (e.g., a third direction DR3) in an overlapping area OLA. In the overlapping area OLA, the first touch electrodes Tx1 to Txa may be one electrode of a capacitor, and the second touch electrodes Rx1 to Rxb may be the other electrode of the capacitor. The capacitance Cse may be formed between the first touch electrodes Tx1 to Txa and the second touch electrodes Rx1 to Rxb in the overlapping area OLA. When an object (e.g., a finger of a human, a stylus pen, or the like) approaches the touch panel 210, the capacitance Cse value may be changed due to the object. The touch driving circuit 230 may detect whether a touch is input and / or touch coordinates based on a value of the changed capacitance Cse.

[0151] The pad portion 520 may include one or more pads PAD. The pads PAD may connect (e.g., electrically connect) the first touch electrodes Tx1 to Txa and the second touch electrodes Rx1 to Rxb with the touch driving circuit 230. For example, the touch driving signal TDS may be input to the first touch electrodes Tx1 to Txa through a first pad portion 520a. For example, the touch sensing signal TSS may be output from the second touch electrodes Rx1 to Rxb through a second pad portion 520b.

[0152] In an embodiment, the touch wiring 530 may connect (e.g., electrically connect) the first pad portion 520a and the first touch electrodes Tx1 to Txa. In an embodiment, the touch wiring 530 may connect (e.g., electrically connect) between the second pad portion 520b and the second touch electrodes Rx1 to Rxb.

[0153] In an embodiment, the pad portion 520 and the touch wiring 530 may be located in the touch inactive area TN.

[0154] FIG. 6 is an example of the touch panel 210 of FIG. 5.

[0155] A first touch electrode Tx of the touch panel 210 according to embodiments of the present disclosure may include a first sensing cell 612 and a first connection electrode 614. A second touch electrode Rx may include a second sensing cell 622 and a second connection electrode 624.

[0156] The first touch electrode Tx may extend along the first direction DR1. The first touch electrode Tx may include a plurality of first sensing cells 612 and a first connection electrode 614 configured to connect the plurality of first sensing cells 612 to each other. In an embodiment, the first connection electrode 614 may be integrally configured with the first sensing cell 612. In an embodiment, the first connection electrode 614 may be configured with a connection pattern in the form of a bridge.

[0157] The second touch electrode Rx may extend along the second direction DR2. The second touch electrode Rx may include a plurality of second sensing cells 622 and a second connection electrode 624 configured to connect the plurality of second sensing cells 622 to each other. In an embodiment, the second connection electrode 624 may be integrally configured with the second sensing cell 622. In an embodiment, the second connection electrode 624 may be configured in a bridge-shaped connection pattern.

[0158] The first connection electrode 614 and the second connection electrode 624 may be positioned to overlap each other in the vertical direction (e.g., the third direction DR3). The first connection electrode 614 and the second connection electrode 624 may be insulated from each other by an insulating layer.

[0159] Referring to FIG. 6, a capacitance Cse may be formed between the first touch electrode Tx and the second touch electrode Rx. For example, the first touch electrode Tx may be one electrode of a capacitor, and the second touch electrode Rx adjacent to the first touch electrode Tx may be the other electrode of the capacitor. A capacitance Cse may be formed in an adjacent area CTA between the first touch electrode Tx and the second touch electrode Rx. Air (e.g., atmosphere) between the first touch electrode Tx and the second touch electrode Rx may be an insulating material of the capacitor. Thereby, whether a touch is input and / or touch coordinates may be detected in a mutual capacitance manner.

[0160] FIG. 7 is an enlarged view of a first area AR1 of FIG. 6.

[0161] The pixel PXL may include a plurality of sub-pixels SP1, SP2, and SP3. Each of the plurality of sub-pixels SP1, SP2, and SP3 may include an emission area and a non-emission area NEM. Referring to FIG. 7, the pixel PXL may include a first sub-pixel SP1, a second sub-pixel SP2, and a third sub-pixel SP3.

[0162] The emission area is an area in which light may be emitted. The light-receiving area is an area capable of receiving light. In an embodiment in which the sub-pixels SP1, SP2, and SP3 include a light-emitting element, the emission area may correspond to an area where the light-emitting element is located. A first emission area EMA_R may be located in the first sub-pixel SP1. A second emission area EMA_G may be located in the second sub-pixel SP2. A third emission area EMA_B may be located in the third sub-pixel SP3.

[0163] The non-emissive area NEM may be located in a periphery (e.g., edge area) of the emission areas EMA_R, EMA_G, and EMA_B and a periphery of the light-receiving area (e.g., edge area). The sub-pixels SP1, SP2, and SP3 may be distinguished from each other by the non-emission area NEM. In an embodiment, a pixel driving circuit of each of the first to third sub-pixels SP1 to SP3 may be located in at least some of areas overlapping the non-emission area NEM. In an embodiment, a sensor circuit of the photosensor PHS may be located in at least some of areas overlapping the non-emission area NEM. In an embodiment, the non-emission area NEM may correspond to an area in which a pixel defining layer, a black matrix, or the like is located. The emission areas EMA_R, EMA_G, and EMA_B, the light-receiving area, and the non-emission area NEM may constitute the above-described display area DA (see FIG. 2).

[0164] The first sub-pixel SP1 may be configured to emit light in a first wavelength band (e.g., a red wavelength band). The second sub-pixel SP2 may emit light in a second wavelength band (e.g., a green wavelength band). The third sub-pixel SP3 may emit light in a third wavelength band (e.g., a blue wavelength band). The red wavelength band may be a wavelength band of about 600 nm to about 750 nm. The green wavelength band may be a wavelength band of about 480 nm to about 560 nm. The blue wavelength band may be a wavelength band of about 370 nm to about 460 nm. In an embodiment, the first sub-pixel SP1 may be a red sub-pixel that emits light in a red wavelength band, the second sub-pixel SP2 may be a green sub-pixel that emits light in a green wavelength band, and the third sub-pixel SP3 may be a blue sub-pixel that emits light in a blue wavelength band. However, embodiments of the present disclosure are not limited thereto.

[0165] In the pixel PXL, a plurality of sub-pixels SP1, SP2, and SP3 may be arranged in various ways. For example, referring to FIG. 7, the first sub-pixel SP1 and the third sub-pixel SP3 may be alternately arranged along the first direction DR1 in any one of a plurality of pixel rows. Referring to FIG. 7, the second sub-pixel SP2 and the photosensor PHS may be alternately arranged in another row among the plurality of pixel rows. Referring to FIG. 7, the first sub-pixel SP1 and the second sub-pixel SP2 may be alternately arranged along a fourth direction DR4 in a diagonal direction intersecting each of the first direction DR1 and the second direction DR2. Referring to FIG. 7, the third sub-pixel SP3 and the photosensor PHS may be alternately arranged along the fourth direction DR4. A row in which the first sub-pixel SP1 and the second sub-pixel SP2 are alternately arranged and a row in which the third sub-pixel SP3 and the photosensor PHS are alternately arranged may be located adjacent to each other in a fifth direction DR5. The fifth direction DR5 may intersect the fourth direction DR4. For example, the fifth direction DR5 may be a direction perpendicular to the fourth direction DR4.

[0166] An area of the emission area of any one of the first sub-pixel SP1, the second sub-pixel SP2, and the third sub-pixel SP3 may be different from those of the other two. For example, an area of the emission area EMA_B of the third sub-pixel SP3 may be larger than an area of the emission area EMA_R of the first sub-pixel SP1. For example, an area of the emission area EMA_R of the first sub-pixel SP1 may be larger than an area of the emission area EMA_G of the second sub-pixel SP2. However, embodiments of the present disclosure are not limited thereto. For example, the areas of the emission areas of the first sub-pixel SP1, the second sub-pixel SP2, and the third sub-pixel SP3 may all be designed to be the same.

[0167] Shapes of the emission area and the light-receiving area may be variously designed. For example, referring to FIG. 7, the shapes of the emission areas EMA_R, EMA_G, and EMA_B and the light-receiving area of the photosensor PHS are shown to be octagonal, but according to embodiments, may have a shape such as a circle, another polygon, or a polygon with rounded corners.

[0168] In an embodiment, the shapes of the first emission area EMA_R and the third emission area EMA_B may be regular octagons. However, embodiments of the present disclosure are not limited thereto.

[0169] In an embodiment, the shape of the second emission area EMA_G may be an octagon long in the fourth direction DR4. However, embodiments of the present disclosure are not limited thereto.

[0170] In an embodiment, the shape of the photosensor PHS (e.g., the light-receiving area of the photosensor PHS) may be an octagon long in the fifth direction DR5 (e.g., extending lengthwise in the fifth direction DR5). However, embodiments of the present disclosure are not limited thereto.

[0171] Still referring to FIG. 7, the first touch electrode Tx may include a mesh hole MH and a body portion BP.

[0172] The mesh hole MH may overlap the emission areas EMA_R, EMA_G, and EMA_B and the light-receiving area of the photosensor PHS in a thickness direction (e.g., the third direction DR3). An area of the mesh hole MH may be larger than an area of the emission areas EMA_R, EMA_G, and EMA_B and the light-receiving area of the photosensor PHS.

[0173] The body portion BP may overlap the non-emission area NEM in the thickness direction (e.g., the third direction DR3). The width of the body portion BP may be smaller than the width of the non-emission area NEM.

[0174] Through the above structure, light output from the emission areas EMA_R, EMA_G, and EMA_B may effectively pass through the first touch electrode Tx (see FIG. 6). Through the above structure, light incident on the light-receiving area of the photosensor PHS may effectively transmit through the first touch electrode Tx.

[0175] FIG. 8 is a cross-sectional view taken along line I-I′ of FIG. 7.

[0176] FIG. 8 mainly describes a cross-sectional view of the first sub-pixel SP1 and the second sub-pixel SP2. A cross-sectional view of the third sub-pixel SP3 and the photosensor PHS of FIG. 7 may be understood through the description of FIG. 10. Accordingly, in FIG. 8, a cross-sectional view of a first light-emitting element LD1 which is a light-emitting element of the first sub-pixel SP1, and a second light-emitting element LD2 which is a light-emitting element of the second sub-pixel SP2, will be mainly described.

[0177] Referring to FIG. 8, a pixel defining layer PDL, light-emitting elements LD1 and LD2, an encapsulation layer TFE, a first sensing cell 612, and a first insulating layer IL1 may be positioned on a lower layer LWL. The lower layer LWL may include the above-described base substrate BSL (see FIGS. 3A and 3B) and at least a part of the element layer DSL (see FIG. 3A) positioned on the base substrate BSL. The light-emitting elements LD1 and LD2 may include the remaining part of the element layer DSL described above. The first sensing cell 612 and the first insulating layer IL1 may be included in the touch panel 210 described above (see FIG. 2).

[0178] In the light-emitting elements LD1 and LD2, the first light-emitting element LD1 of the above-described first sub-pixel SP1 (see FIG. 7) and the second light-emitting element LD2 of the second sub-pixel SP2 (see FIG. 7) are exemplarily shown. The first light-emitting element LD1 may include an anode electrode AE, a first light-emitting layer EML1, and a cathode electrode CE. The second light-emitting element LD2 may include an anode electrode AE, a second light-emitting layer EML2, and a cathode electrode CE.

[0179] The anode electrode AE may be disposed for each sub-pixel. The pixel defining layer PDL exposing the anode electrode AE may be disposed on the anode electrode AE. The anode electrode AE may include a metal layer such as, for example, silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), an alloy thereof, and / or indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), or the like.

[0180] The pixel defining layer PDL may be positioned to overlap the non-emission area NEM. The pixel defining layer PDL may include an organic insulating layer including an organic material. The organic material may include, for example, one or more of an acryl resin, an epoxy resin, a phenol resin, a polyamide resin, and a polyimide resin. The pixel defining layer PDL may include a light absorbing material. The pixel defining layer PDL may be coated with a light absorber that absorbs external light introduced to the device. In an embodiment, the pixel defining layer PDL may include a carbon-based black pigment. In an embodiment, the pixel defining layer PDL may include an opaque metal material such as, for example, chromium (Cr), molybdenum (Mo), an alloy (MoTi) of molybdenum (Mo) and titanium (Ti), tungsten (W), vanadium (V), niobium (Nb), tantalum (Ta), manganese (Mn), cobalt (Co), or nickel (Ni) having a high light absorption rate. However, embodiments of the present disclosure are not limited thereto.

[0181] The light-emitting layers EML1 and EML2 may be disposed to overlap an area where at least a part of the pixel defining layer PDL is removed and the anode electrode AE is exposed. The light-emitting layers EML1 and EML2 may include an organic light-emitting layer. Depending on the organic material included in the light-emitting layers EML1 and EML2, the light-emitting layers EML1 and EML2 may emit light of different wavelength bands. For example, the first light-emitting layer EML1 may emit light in a first wavelength band (e.g., a red wavelength band). For example, the second light-emitting layer EML2 may emit light in a second wavelength band (e.g., a green wavelength band). An area where the first light-emitting layer EML1 is located may correspond to the first emission area EMA_R. An area where the second light-emitting layer EML2 is located may correspond to the second emission area EMA_G.

[0182] The cathode electrode CE may be disposed on the light-emitting layers EML1 and EML2 (e.g., in the third direction DR3). The cathode electrode CE may be deposited (e.g., entirely deposited) in the emission areas EMA_R and EMA_G and the non-emission area NEM. The cathode electrode CE may include a metal layer such as, for example, silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), or chromium (Cr), and / or a light-transmitting conductive layer such as ITO, IZO, ZnO, or ITZO. For example, the cathode electrode CE may include a multilayer of two or more layers including a thin metal layer. For example, the cathode electrode CE may include a triple layer of ITO / Ag / ITO.

[0183] In an embodiment, the light-emitting elements LD1 and LD2 may further include a hole transport layer disposed between the anode electrode AE and the light-emitting layers EML1 and EML2. In an embodiment, the light-emitting elements LD1 and LD2 may further include an electron transport layer disposed between the cathode electrode CE and the light-emitting layers EML1 and EML2.

[0184] The encapsulation layer TFE may be located on the cathode electrode CE (e.g., in the third direction DR3). The encapsulation layer TFE may have a laminated structure formed of an inorganic material, an organic material, and an inorganic material in that order. Referring to FIG. 8, the encapsulation layer TFE may be formed by sequentially depositing a first inorganic encapsulation layer IOL1 including an inorganic material, an organic encapsulation layer OL including an organic material, and a second inorganic encapsulation layer IOL2 including an inorganic material. The encapsulation layer TFE may protect the light-emitting elements LD1 and LD2 (e.g., the light-emitting layers EML1 and EML2) under the encapsulation layer TFE from external moisture and / or oxygen.

[0185] The body portion BP of the first sensing cell 612 may be disposed on the encapsulation layer TFE. The first insulating layer IL1 may be positioned on the body portion BP of the first sensing cell 612.

[0186] The first insulating layer IL1 may insulate the touch electrodes from each other. Referring to FIG. 5, the plurality of first touch electrodes Tx1 to Txa may be insulated from each other by the first insulating layer IL1. The plurality of second touch electrodes Rx1 to Rxb may be insulated from each other by the first insulating layer IL1. Referring to FIG. 6, the first connection electrode 614 and the second connection electrode 624 may be insulated from each other by the first insulating layer IL1. For example, the first connection electrode 614 and the second connection electrode 624 may be positioned to overlap each other in the thickness direction (for example, the third direction DR3) with the first insulating layer IL1 interposed therebetween.

[0187] The mesh hole MH of the first sensing cell 612 may be positioned to overlap the first and second emission areas EMA_R and EMA_G.

[0188] FIG. 9 is an enlarged view of a second area AR2 of FIG. 6.

[0189] Comparing FIGS. 9 and 7, the description of the first sensing cell 612 may be applied as a description of the second sensing cell 622 as a whole. The second sensing cell 622 may include a body portion BP and a mesh hole MH. The description of the remaining configurations is as described above with reference to FIG. 7.

[0190] FIG. 10 is a cross-sectional view taken along line II-II′ of FIG. 9.

[0191] FIG. 10 mainly describes a cross-sectional view of the third sub-pixel SP3 and the photosensor PHS. A cross-sectional view of the first sub-pixel SP1 and the second sub-pixel SP2 of FIG. 9 may be understood through the description of FIG. 8 described above. Accordingly, in FIG. 10, a cross-sectional view of a third light-emitting element LD3 which is a light-emitting element of the third sub-pixel SP3 and a light-receiving element LRD of the photosensor PHS will be mainly described.

[0192] Referring to FIG. 10, a pixel defining layer PDL, a third light-emitting element LD3, a light-receiving element LRD, an encapsulation layer TFE, a second sensing cell 622, and a first insulating layer IL1 may be positioned on a lower layer LWL. The lower layer LWL may include the above-described base substrate BSL (see FIGS. 3A and 3B) and at least a part of the element layer DSL (see FIG. 3A) positioned on the base substrate BSL. The third light-emitting element LD3 and the light-receiving element LRD may include the remaining part of the element layer DSL described above. The second sensing cell 622 and the first insulating layer IL1 may be included in the touch panel 210 described above (see FIG. 2).

[0193] The third light-emitting element LD3 may include an anode electrode AE, a third light-emitting layer EML3, and a cathode electrode CE. The light-receiving element LRD may include an anode electrode AE, a light-receiving layer LRL, and a cathode electrode CE.

[0194] The anode electrode AE may be disposed for each sub-pixel and each photosensor. A pixel defining layer PDL exposing the anode electrode AE may be disposed on the anode electrode AE.

[0195] The pixel defining layer PDL may be positioned to overlap the non-emission area NEM. The non-emission area NEM may include a peripheral area of each of the third emission area EMA_B and a light-receiving area SA. The pixel defining layer PDL may include an organic insulating layer including an organic material. The pixel defining layer PDL may include a light absorbing material. However, embodiments of the present disclosure are not limited thereto.

[0196] The third light-emitting layer EML3 may be disposed to overlap an area where at least a part of the pixel defining layer PDL is removed and the anode electrode AE is exposed. The third light-emitting layer EML3 may include an organic light-emitting layer. For example, the third light-emitting layer EML3 may emit light in a third wavelength band (e.g., a blue wavelength band). An area where the third light-emitting layer EML3 is located may correspond to the third emission area EMA_B.

[0197] The light-receiving layer LRL may be disposed to overlap an area where at least a part of the pixel defining layer PDL is removed and the anode electrode AE is exposed. An area where the light-receiving layer LRL is located may correspond to the light-receiving area SA.

[0198] The cathode electrode CE may be disposed on the third light-emitting layer EML3 and the light-receiving layer LRL (e.g., in the third direction DR3 thereof). The cathode electrode CE may be deposited (e.g., entirely deposited) in the third emission area EMA_B, the light-receiving area SA, and the non-emission area NEM. The cathode electrode CE may include a light-transmitting conductive layer. For example, the cathode electrode CE may include a multilayer of two or more layers including a thin metal layer. For example, the cathode electrode CE may include a triple layer of ITO / Ag / ITO.

[0199] In an embodiment, the third light-emitting element LD3 may further include a hole transport layer disposed between the anode electrode AE and the third light-emitting layer EML3. In an embodiment, the third light-emitting element LD3 may further include an electron transport layer disposed between the cathode electrode CE and the third light-emitting layer EML3.

[0200] The encapsulation layer TFE may be located on the cathode electrode CE (e.g., in the third direction DR3). The encapsulation layer TFE may have a laminated structure formed of an inorganic material, an organic material, and an inorganic material in that order. Referring to FIG. 10, the encapsulation layer TFE may be formed by sequentially depositing a first inorganic encapsulation layer IOL1 containing an inorganic material, an organic encapsulation layer OL containing an organic material, and a second inorganic encapsulation layer IOL2 containing an inorganic material. The encapsulation layer TFE may protect the lower third light-emitting element LD3 (e.g., the third light-emitting layer EML3) and the light-receiving element LRD (e.g., a light-receiving layer LRL) from external moisture and / or oxygen.

[0201] The body portion BP of the second sensing cell 622 may be disposed on the encapsulation layer TFE. The first insulating layer IL1 may be positioned on the body portion BP of the second sensing cell 622.

[0202] The mesh hole MH of the second sensing cell 622 may be positioned to overlap the third emission area EMA_B and the light-receiving area SA.

[0203] FIG. 11 is a layout diagram illustrating a display area DA according to an embodiment.

[0204] Referring to FIG. 11, the display area DA may include sub-pixels SP1, SP2, and SP3 and a photosensor PHS. The sub-pixels SP1, SP2, and SP3 and the photosensor PHS may be included in one unit pixel UP.

[0205] The unit pixel UP may be defined as a minimum unit of pixels capable of displaying a white image. The unit pixel UP may sense light. In an embodiment, the unit pixels UP may be alternately arranged in a zigzag shape in a plan view. For example, the unit pixels UP may be arranged in a diagonal direction. For example, the unit pixels UP may be alternately arranged in the form of horizontal or vertical stripes in a plan view.

[0206] The first sub-pixel SP1 may include a first light-emitting element LD1 that emits light in a first wavelength band (e.g., a red wavelength band), and a first pixel driving circuit PXC1 that applies a driving current to the first light-emitting elements LD1.

[0207] The second sub-pixel SP2 may include a second light-emitting element LD2 that emits light in a second wavelength band (e.g., a green wavelength band), and a second pixel driving circuit PXC2 that applies a driving current to the second light-emitting elements LD2.

[0208] The third sub-pixel SP3 may include a third light-emitting element LD3 that emits light in a third wavelength band (e.g., a blue wavelength band), and a third pixel driving circuit PXC3 that applies a driving current to the third light-emitting elements LD3.

[0209] The photosensor PHS may include a light-receiving element LRD that detects light (for example, light of a predetermined wavelength band) and a sensor circuit PSC connected to the light-receiver element LRD.

[0210] Referring to FIG. 11, a distance between a center C1 of the first light-emitting element LD1 and a center C2 of the second light-emitting element LD2 adjacent to each other in the unit pixel UP may be a first distance D12. A distance between the center C2 of the second light-emitting element LD2 and a center C3 of the third light-emitting element LD3 adjacent to each other in the unit pixel UP may be a second distance D23. The distance between the center C3 of the third light-emitting element LD3 and a center C4 of the light-receiving element LRD adjacent to each other in the unit pixel UP may be a third distance D34. The distance between the center C4 of the light-receiving elements LRD adjacent to each other in the unit pixel UP and the first light-emitting element LD1 may be a fourth distance D14. In an embodiment, the first distance D12, the second distance D23, the third distance D34, and the fourth distance D14 may each be substantially the same. However, embodiments of the present disclosure are not limited thereto.

[0211] FIG. 12 is an equivalent circuit diagram of a sub-pixel SP and a photosensor PHS according to an embodiment.

[0212] Referring to FIG. 12, the sub-pixel SP may include a pixel driving circuit PXC and a light-emitting element LD. The photosensor PHS may include a sensor circuit PSC and a light-receiving element LRD.

[0213] The pixel driving circuit PXC may be configured to control a magnitude of a current flowing through the light-emitting element LD. The pixel driving circuit PXC may include at least one switching element (e.g., a transistor) and one or more storage elements (e.g., capacitors).

[0214] Referring to FIG. 12, the pixel driving circuit PXC may include first to seventh pixel transistors TR1 to TR7 and a capacitor Cst.

[0215] The pixel driving circuit PXC may be connected to an i-th scan line SCLi (hereinafter, also referred to as a scan line SCLi), an i-th light emission control line EMLi (hereinafter, referred to as a light emission control line EMLi), and a j-th data line DLj (hereinafter, referred to as a data line DLj).

[0216] The scan line SCLi may include first to fourth scan lines S1i, S2i, S3i, and S4i.

[0217] The first pixel transistor TR1 may be configured to adjust a magnitude of a current flowing between a second node N2 and a third node N3 in response to a voltage of a first node N1. The first node N1 may be electrically connected to a gate electrode of the first pixel transistor TR1. The second node N2 may be electrically connected to a first electrode (e.g., any one of a source electrode and a drain electrode) of the first pixel transistor TR1. The third node N3 may be electrically connected to a second electrode (e.g., another one of a source electrode and a drain electrode) of the first pixel transistor TR1. The first pixel transistor TR1 may be referred to as a driving transistor.

[0218] The second pixel transistor TR2 may be configured to switch an electrical connection between the second node N2 and the data line DLj. The second pixel transistor TR2 may include a gate electrode connected to the first scan line S1i. The second pixel transistor TR2 may be configured to transfer a voltage (e.g., a data voltage) applied to the data line DLj to the second node N2 in response to a first scan signal GW[i] of a turn-on level. The first scan signal GW[i] may be applied to the first scan line S1i. The second pixel transistor TR2 may be referred to as a switching transistor.

[0219] The third pixel transistor TR3 may be configured to switch an electrical connection between the first node N1 and the third node N3. The third pixel transistor TR3 may include a gate electrode connected to the fourth scan line S4i. The third pixel transistor TR3 may be configured to switch an electrical connection between the first node N1 and the third node N3 in response to a fourth scan signal GC[i]. The fourth scan signal GC[i] may be applied to the fourth scan line S4i. When the third pixel transistor TR3 is turned on, the first pixel transistor TR1 may be connected in the form of a diode. The third pixel transistor TR3 may be referred to as a compensation transistor.

[0220] The fourth pixel transistor TR4 may be configured to switch an electrical connection between the first node N1 and a third power line PL3. The fourth pixel transistor TR4 may include a gate electrode connected to the second scan line S2i. The fourth pixel transistor TR4 may be configured to switch an electrical connection between the first node N1 and the third power line PL3 in response to a second scan signal GI[i]. The second scan signal GI[i] may be applied to the second scan line S2i. A first initialization voltage Vint1 may be applied to the third power line PL3. When the fourth pixel transistor TR4 is turned on, the voltage of the first node N1 may be initialized to the first initialization voltage Vint1. The fourth pixel transistor TR4 may be referred to as a first initialization transistor.

[0221] The fifth pixel transistor TR5 may be configured to switch an electrical connection between the second node N2 and a first power line PL1. The fifth pixel transistor TR5 may include a gate electrode connected to the light emission control line EMLi. The fifth pixel transistor TR5 may be configured to switch an electrical connection between the second node N2 and the first power line PL1 in response to a light emission control signal EM[i]. When the fifth pixel transistor TR5 is turned on, a first power voltage VDD may be applied to the second node N2. The fifth pixel transistor TR5 may be referred to as a first light emission control transistor.

[0222] The sixth pixel transistor TR6 may be configured to switch an electrical connection between the third node N3 and a fourth node N4. The sixth pixel transistor TR6 may include a gate electrode connected to the light emission control line EMLi. The sixth pixel transistor TR6 may be configured to switch an electrical connection between the third node N3 and the fourth node N4 in response to the light emission control signal EM[i]. Referring to FIG. 12, the sixth pixel transistor TR6 and the fifth pixel transistor TR5 may be electrically connected to the same emission control line EMLi. However, embodiments of the present disclosure are not limited thereto. The sixth pixel transistor TR6 may be referred to as a second light emission control transistor.

[0223] The seventh pixel transistor TR7 may be configured to switch an electrical connection between the fourth node N4 and a fourth power line PL4. The seventh pixel transistor TR7 may include a gate electrode connected to the third scan line S3i. The seventh pixel transistor TR7 may be configured to switch an electrical connection between the fourth node N4 and the fourth power line PL4 in response to a third scan signal GB[i]. When the seventh pixel transistor TR7 is turned on, the voltage of the fourth node N4 may be initialized to a second initialization voltage Vint2. The second initialization voltage Vint2 may be applied to the fourth power line PL4. The seventh pixel transistor TR7 may be referred to as a second initialization transistor.

[0224] The capacitor Cst may be configured to maintain a voltage of the first node N1. The capacitor Cst may be configured to supply a voltage to the first node N1 during one frame period. The capacitor Cst may include one electrode electrically connected to the first node N1 and the other electrode electrically connected to a power line (e.g., the first power line PL1). A data voltage Vdata (or a voltage corresponding to data voltage Vdata) may be applied to one electrode of the capacitor Cst. The capacitor Cst may supply the data voltage Vdata (or a voltage corresponding to the data voltage Vdata) to the first node N1 for one frame period. The capacitor Cst may be referred to as a storage capacitor.

[0225] Each of the first to seventh pixel transistors TR1 to TR7 may be formed of an N-type transistor or a P-type transistor.

[0226] In the N-type transistor, a voltage at a turn-on level may be a voltage at a high logic level, and a voltage at a turned-off level may be a power at a low logic level. In the P-type transistor, a voltage at a turn-on level may be a voltage at a low logic level, and a voltage at a turned-off level may be a power at a high logic level.

[0227] Still referring to FIG. 12, among the first to seventh pixel transistors TR1 to TR7, the third pixel transistor TR3 and the fourth pixel transistor TR4 are shown to be N-type transistors, and the rest are shown to be P-type transistors. However, embodiments of the present disclosure are not limited thereto.

[0228] One or more of the first to seventh pixel transistors TR1 to TR7 may include an oxide semiconductor. One or more of the first to seventh pixel transistors TR1 to TR7 may include a silicon semiconductor (e.g., an amorphous silicon (a-Si) semiconductor or a low temperature polycrystalline silicon (LTPS) semiconductor). For example, the third pixel transistor TR3 and the fourth pixel transistor TR4 may include an oxide semiconductor. However, embodiments of the present disclosure are not limited thereto.

[0229] The light-emitting element LD may be connected between the fourth node N4 and a second power line PL2. The fourth node N4 may be electrically connected to the anode electrode of the light-emitting element LD. The second power line PL2 may be electrically connected to the cathode electrode of the light-emitting element LD. A second power voltage VSS may be applied to the second power line PL2.

[0230] The light-emitting element LD may include a light-emitting layer. Depending on the type of the light-emitting layer, the light-emitting element LD may be implemented as an organic light-emitting element including an organic light-emitting layer, an inorganic light-emitting element including an inorganic light-emitting layer, a quantum dot light-emitting element including quantum dots (e.g., nano-rods), or the like.

[0231] One pixel driving circuit PXC may be connected to two or more light-emitting elements LD. Two or more light-emitting elements LD may be connected in series and / or parallel to each other.

[0232] The sensor circuit PSC may include first to third sensor transistors M1, M2, and M3a.

[0233] The first sensor transistor M1 may be configured to switch an electrical connection between a sixth power line PL6 and the second sensor transistor M2. The first sensor transistor M1 may include a gate electrode connected to a fifth node N5. The first sensor transistor M1 may switch an electrical connection between a fifth power line PL5 and the second sensor transistor M2 according to a voltage level of the fifth node N5. A fourth power voltage VCOM may be applied to the sixth power line PL6.

[0234] The second sensor transistor M2 may be configured to switch an electrical connection between the first sensor transistor M1 and a k-th sensing line RXk (or a sensing line RXk). The second sensor transistor M2 may include a gate electrode connected to the first scan line S1i. The second sensor transistor M2 may be configured to switch an electrical connection between the first sensor transistor M1 and the sensing line RXk in response to a scan signal (e.g., the first scan signal GW[i]). The second sensor transistor M2 may include a gate electrode electrically connected to the first scan line S1i.

[0235] The third sensor transistor M3a may be configured to switch an electrical connection between the fifth power line PL5 and the fifth node N5. The third sensor transistor M3a may include a gate electrode electrically connected to a reset control line RSTL. The third sensor transistor M3a may be configured to switch an electrical connection between the fifth power line PL5 and the fifth node N5 in response to a reset signal RST input to the reset control line RSTL. The third sensor transistor M3a may include a gate electrode connected to the reset control line RSTL. When the third sensor transistor M3a is turned on, a voltage of the fifth node N5 may be initialized to a third power voltage VRST. Thereby, the third power voltage VRST may be applied to the light-receiving element LRD. The third power voltage VRST may be a turn-off level voltage of the first sensor transistor M1. The third power voltage VRST may be referred to as a reset voltage.

[0236] Each of the first to third sensor transistors M1, M2, and M3a may be a P-type transistor or an N-type transistor. In an embodiment, the first to third sensor transistors M1, M2, and M3a may each include any one of, for example, an amorphous silicon semiconductor, a low-temperature polysilicon semiconductor, and an oxide semiconductor.

[0237] Referring to FIG. 12, the third sensor transistor M3a may be an N-type transistor, and the first and second sensor transistors M1 and M2 may be P-type transistors. However, embodiments of the present disclosure are not limited thereto.

[0238] The light-receiving element LRD may provide a current flowing in a direction from the fifth node N5 to the second power line PL2 in response to an irradiated light. The light-receiving element LRD may be implemented as, for example, a photodiode. When a current flows through the light-receiving element LRD, the voltage of the fifth node N5 may be lowered to the second power voltage VSS.

[0239] In embodiments of the present disclosure, a process in which a current flows through the sensing line RXk will be briefly described as follows.

[0240] In embodiments of the present disclosure, when light is irradiated to the light-receiving element LRD, a current may flow through the light-receiving element LRD. When a current flows through the light-receiving element LRD, the voltage of the fifth node N5 may gradually decrease. When the voltage of the fifth node N5 gradually decreases and becomes lower than a threshold voltage of the first sensor transistor M1, the first sensor transistors M1 may be turned on. When the first scan signal GW[i] of a turn-on level is input to the second sensor transistor M2, the second sensor transistors M2 may be turned on. Accordingly, when the first and second sensor transistors M1 and M2 are turned on, a current path from the sixth power line PL6 to the sensing line RXk may be formed. By integrating the current flowing through the sensing line RXk, the amount of light incident on the light-receiving element LRD may be calculated.

[0241] Embodiments of the present disclosure may use the photosensor PHS to measure the amount of reflected light reflected from an object adjacent to the photosensor PHS.

[0242] FIG. 13 is an equivalent circuit diagram of a sub-pixel SP and a photosensor PHS according to an embodiment.

[0243] Compared with the equivalent circuit diagram of FIG. 13 and the equivalent circuit diagram in FIG. 12, in the equivalent circuit diagram shown in FIG. 13, the pixel driving circuit PXC may include the third pixel transistor TR3 and the fourth pixel transistor TR4 as P-type transistors.

[0244] The third pixel transistor TR3 may include a gate electrode electrically connected to the first scan line S1i. The third pixel transistor TR3 may be commonly connected to the first scan line S1itogether with the second pixel transistor TR2.

[0245] The fourth pixel transistor TR4 may be configured to switch an electrical connection between a third power line PL3′ and the first node N1. An initialization voltage Vint may be applied to the third power line PL3′.

[0246] The seventh pixel transistor TR7 may be configured to switch an electrical connection between the third power line PL3′ and the fourth node N4.

[0247] According to an embodiment of FIG. 13, the number of scan lines and the number of power lines are reduced compared to an embodiment of FIG. 12, and thus the circuit configuration may be simplified.

[0248] According to an embodiment of FIG. 12, by implementing the third pixel transistor TR3 and the fourth pixel transistor TR4 as N-type transistors compared to an embodiment of FIG. 13, it is possible to reduce leakage current and provide an image at a low frame rate.

[0249] Referring to FIGS. 12 and 13, the electronic device 100 (refer to FIG. 1) may acquire (or generate) a pattern of an object (e.g., a pattern of a fingerprint, etc.) adjacent to the photosensor PHS by sensing the photosensor PHS. Accordingly, the electronic device 100 according to embodiments of the present disclosure may provide a fingerprint authentication function.

[0250] In an embodiment, the electronic device 100 (see FIG. 1) may sense a change in the amount of light around the electronic device 100 by sensing the photosensor PHS, and generate information associated with a blood vessel of a user using the electronic device 100 with reference to the sensed change in the amount of the light. The information related to the blood vessel may include, for example, at least one of cardiovascular health information, blood pressure, atrial rhythm, atrial fibrillation, heart rate, and respiratory rate.

[0251] In an embodiment, the electronic device 100 (see FIG. 1) may provide a function of sensing illuminance around the electronic device 100 by sensing the photosensor PHS, and adaptively adjusting the luminance of the electronic device 100 according to the sensed illuminance.

[0252] FIG. 14 is a diagram illustrating some configurations of a sub-pixel and a photosensor in a cross-sectional view of a display device according to embodiments of the present disclosure.

[0253] Referring to the foregoing drawings, pixel transistors TR1 to TR7 and sensor transistors M1, M2, and M3a may be included in a backplane structure BP of the display panel 220. The backplane structure may be disposed on the base substrate BSL.

[0254] FIG. 14 illustrates a first pixel transistor TR1, a third pixel transistor TR3, a first sensor transistor M1, a second sensor transistor M2, and a third sensor transistor M3a.

[0255] The base substrate BSL may include an insulating material such as, for example, glass, resin, or the like. In an embodiment, the base substrate BSL may include a material having flexibility to bend, fold, or roll. The base substrate BSL may have a single-layer structure or a multi-layer structure. In an embodiment, the base substrate BSL may include a first base layer, a first barrier layer, a second base layer, a second barrier layer, and the like sequentially stacked (e.g., sequentially stacked in the third direction DR3). The first base layer and the second base layer may include, for example, polyimide (PI), polyethersulfone (PES), polyarylate, polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polycarbonate (PC), cellulose triacetate (CTA), and / or cellulose acetate propionate (CAP), and the like. The first barrier layer and the second barrier layer may include an inorganic insulator such as, for example, silicon oxide, silicon oxynitride, and / or silicon nitride. The base substrate BSL may be flexible.

[0256] A buffer layer BF may be disposed on the base substrate BSL. The buffer layer BF may prevent diffusion of impurities introduced from under the base substrate BSL. The buffer layer BF may be omitted depending on a material and process conditions of the base substrate BSL. The buffer layer BF may include an inorganic insulator such as, for example, silicon oxide, silicon oxynitride, or silicon nitride. The buffer layer BF may have a single-layer or multi-layer structure including the above-described materials.

[0257] First to third active patterns ACT11, ACT12, and ACT13 may be provided on the buffer layer BF. In an embodiment, the first to third active patterns ACT11, ACT12, and ACT13 may be formed of a polysilicon semiconductor. For example, the first to third active patterns ACT11, ACT12, and ACT13 may be formed through a low temperature polysilicon process (e.g., a low temperature polycrystalline silicon (LTPS) process).

[0258] A first gate insulating layer GI1 may be disposed on the first to third active patterns ACT11, ACT12, and ACT13. The first gate insulating layer GI1 may be an inorganic insulating layer including an inorganic material. The first gate insulating layer GI1 may include an inorganic insulating material such as, for example, silicon oxide (SiO2), silicon nitride (SiNx, where x is a positive number), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), and / or zinc oxide (ZnO2).

[0259] First to third gate electrodes GE11, GE12, and GE13 may be disposed on the first gate insulating layer GI1. The first gate electrode GE11 may overlap a channel area of the first active pattern ACT11 in the third direction DR3. The second gate electrode GE12 may overlap a channel area of the second active pattern ACT12 in the third direction DR3. The third gate electrode GE13 may overlap a channel area of the third active pattern ACT13 in the third direction DR3.

[0260] The first to third gate electrodes GE11, GE12, and GE13 may include a metal. For example, the first to third gate electrodes GE11, GE12, and GE13 may include at least one of a metal such as gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), or an alloy of metals. In addition, the first to third gate electrodes GE11, GE12, and GE13 may be formed of a single layer or may be formed of multiple layers in which two or more of metals and alloys are stacked.

[0261] An interlayer insulating layer IL may be disposed on the first to third gate electrodes GE11, GE12, and GE13. The interlayer insulating layer IL may be an inorganic insulating layer including an inorganic material. For example, polysiloxane, silicon nitride, silicon oxide, silicon oxynitride, or the like may be used as the inorganic material.

[0262] Conductive patterns CL1, CL2, and CL3 may be disposed on the interlayer insulating layer IL. Referring to FIGS. 12 and 13, the conductive patterns CL1, CL2, and CL3 may constitute at least one of an electrode of a capacitor Cst, scan lines (e.g., first to fourth scan lines S1ito S4i), a reset control line RSTL, a data line DLj, and a sensing line RXk, and power lines PL1 to PL6. The conductive patterns CL1, CL2, and CL3 may include at least one of a metal such as, for example, gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), or copper (Cu), or an alloy of metals. The conductive patterns CL1, CL2, and CL3 may be formed of a single layer, or may be formed of multiple layers in which two or more of metals and alloys are stacked.

[0263] A first insulating layer INS1 may be disposed on the conductive patterns CL1, CL2, and CL3. The first insulating layer INS1 may be an inorganic insulating layer including an inorganic material. For example, polysiloxane, silicon nitride, silicon oxide, silicon oxynitride, or the like may be used as the inorganic material.

[0264] A fourth active pattern ACT21 and a fifth active pattern ACT22 may be disposed on the first insulating layer INS1. In an embodiment, the fourth and fifth active patterns ACT21 and ACT22 may include an oxide semiconductor. For example, the fourth and fifth active patterns ACT21 and ACT22 may be formed through a metal oxide semiconductor formation process.

[0265] A second gate insulating layer GI2 may be disposed on the fourth active pattern ACT21 and the fifth active pattern ACT22. The second gate insulating layer GI2 may be an inorganic insulating layer including an inorganic material. For example, one or more of polysiloxane, silicon nitride, silicon oxide, and silicon oxynitride may be used as the inorganic material.

[0266] Fourth and fifth gate electrodes GE21 and GE22 may be disposed on the second gate insulating layer GI2. The fourth gate electrode GE21 may overlap a channel area of the fourth active pattern ACT21 in the third direction DR3. The fifth gate electrode GE22 may overlap a channel area of the fifth active pattern ACT22 in the third direction DR3. The fourth and fifth gate electrodes GE21 and GE22 may include a metal. For example, the fourth and fifth gate electrodes GE21 and GE22 may include at least one of a metal such as gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), or an alloy of metals. In addition, the fourth and fifth gate electrodes GE21 and GE22 may be formed of a single layer or may be formed of multiple layers in which two or more of metals and alloys are stacked.

[0267] A second insulating layer INS2 may be disposed on the fourth and fifth gate electrodes GE21 and GE22. For example, the second insulating layer INS2 may be an inorganic insulating layer including an inorganic material. For example, one or more of polysiloxane, silicon nitride, silicon oxide, and silicon oxynitride may be used as the inorganic material.

[0268] First source / drain electrodes 1421 and 1422, second source / drain electrode 1423 and 1424, third source / drain electrode 1425 and 1426, fourth source / drain electrodes 1431 and 1432, and fifth source / drain electrons 1433 and 1434 may be disposed on the second insulating layer INS2. The first to fifth source / drain electrodes 1421, 1422, 1423, 1424, 1425, 1426, 1431, 1432, 1433, and 1434 may be connected to corresponding first to fifth active patterns ACT11, ACT12, ACT13, AC21, and ACT22 through contact holes, respectively.

[0269] The first to fifth source / drain electrodes 1421, 1422, 1423, 1424, 1425, 1426, 1431, 1432, 1433, and 1434 may include a metal. The first to fifth source / drain electrodes 1421, 1422, 1423, 1424, 1425, 1426, 1431, 1432, 1433, and 1434 may include a material having excellent conductivity. For example, the first to fifth source / drain electrodes 1421, 1422, 1423, 1424, 1425, 1426, 1431, 1432, 1433, and 1434 may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), and the like. The first to fifth source / drain electrodes 1421, 1422, 1423, 1424, 1425, 1426, 1431, 1432, 1433, and 1434 may be formed of a single-layer structure or a multi-layer structure including the above material. For example, the first to fifth source / drain electrodes 1421, 1422, 1423, 1424, 1425, 1426, 1431, 1432, 1433, and 1434 may have a multilayer structure of Ti / Al / Ti.

[0270] A third insulating layer INS3 may be disposed on the first to fifth source / drain electrodes 1421, 1422, 1423, 1424, 1425, 1426, 1431, 1432, 1433, and 1434. For example, the third insulating layer INS3 may be an organic insulating layer including an organic material. The third insulating layer INS3 may include an organic insulating material such as a general-purpose polymer such as, for example, polymethylmethacrylate or polystyrene, a polymer derivative having a phenolic group, an acrylic polymer, an imide polymer, an aryl ether polymer, an amide polymer, a fluorine polymer, a p-xylene polymer, a vinyl alcohol polymer, or a blend thereof. The third insulating layer INS3 may planarize an area on the first to fifth source / drain electrodes 1421, 1422, 1423, 1424, 1425, 1426, 1431, 1432, 1433, and 1434.

[0271] Connection patterns CNP1 and CNP2 may be disposed on the third insulating layer INS3. The first connection pattern CNP1 may be connected to the first drain electrode 1422 through a contact hole penetrating the third insulating layer INS3. The second connection pattern CNP2 may be connected to the fifth source electrode 1434 through a contact hole penetrating the third insulating layer INS3.

[0272] The connection patterns CNP1 and CNP2 may be made of at least one of metals such as, for example, gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), or an alloy of metals.

[0273] A fourth insulating layer INS4 may be disposed on the connection patterns CNP1 and CNP2. The fourth insulating layer INS4 may be an organic insulating layer including an organic material. The fourth insulating layer INS4 may include an organic insulating material such as a general-purpose polymer such as, for example, polymethylmethacrylate or polystyrene, a polymer derivative having a phenolic group, an acrylic polymer, an imide polymer, an aryl ether polymer, an amide polymer, a fluorine polymer, a p-xylene polymer, a vinyl alcohol polymer, or a blend thereof. The fourth insulating layer INS4 may planarize areas on the connection patterns CNP1 and CNP2.

[0274] A pixel layer including a first pixel electrode PEL1, a first sensor electrode SEL1, and a bank layer BK may be provided on the fourth insulating layer INS4.

[0275] The pixel layer may include a light-emitting element LD connected to a pixel driving circuit (e.g., the pixel driving circuit PXC of FIGS. 12 and 13) and a light-receiving element LRD connected to a sensor circuit (e.g., the sensor circuit PSC of FIG. 12 or 13).

[0276] In an embodiment, the light-emitting element LD may include a first pixel electrode PEL1, a hole transport layer HTL1, a light-emitting layer EML, an electron transport layer ETL, and a second pixel electrode PEL2. In an embodiment, the light-receiving element LRD may include a first sensor electrode SEL1, a second hole transport layer HTL2, a light-receiving layer LRL, an electron transport layer ETL, and a second sensor electrode SEL2.

[0277] In an embodiment, the first pixel electrode PEL1 and the first sensor electrode SEL1 may include metal layers such as, for example, silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), alloys thereof, and / or indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), and the like. The first pixel electrode PEL1 may be connected to the first drain electrode 1422 through a contact hole. The first sensor electrode SEL1 may be connected to the fifth source electrode 1434 through a contact hole.

[0278] The first pixel electrode PEL1 and the first sensor electrode SEL1 may be formed in the same process through patterning using a mask.

[0279] The bank layer (or a pixel defining layer) PDL that divides the emission area and the light-receiving area may be disposed on the fourth insulating layer INS4 on which the first pixel electrode PEL1 and the first sensor electrode SEL1 are formed.

[0280] The pixel defining layer PDL may include openings corresponding to the emission area and the light-receiving area.

[0281] A first hole transport layer HTL1 may be provided on an upper surface of the first pixel electrode PEL1 exposed by the pixel defining layer PDL. A second hole transport layer HTL2 may be disposed on an upper surface of the first sensor electrode SEL1 which is exposed. A hole may move to the light-emitting layer EML through the first hole transport layer HTL1, and a hole may move to a light-receiving layer LRL through the second hole transport layer HLT2.

[0282] Depending on the materials of the light-emitting layer EML and the light-receiving layer LRL, the first hole transport layer HTL1 and the second hole transport layer HLT2 may be the same or different.

[0283] The light-emitting layer EML may be disposed on the first hole transport layer HTL1. In an embodiment, the light-emitting layer EML may include an organic light-emitting layer. Depending on the organic material included in the light-emitting layer EML, the light-emitting layer EML may emit light in a red wavelength band, light in a green wavelength band, or light in a blue wavelength band. However, embodiments of the present disclosure are not limited thereto.

[0284] In an embodiment, an electron blocking layer may be disposed on the second hole transport layer HTL2 in the light-receiving area. The electron blocking layer may prevent a charge of the light-receiving layer LRL from moving to the second hole transport layer HTL2. In an embodiment, the electron blocking layer may be omitted.

[0285] The light-receiving layer LRL may be disposed on the second hole transport layer HTL2. The light-receiving layer LRL may emit electrons corresponding to light of a specific wavelength band. Thereby, the intensity (or amount) of light may be sensed.

[0286] In an embodiment, the light-receiving layer LRL may include a low-molecular-weight organic material. The low-molecular-weight organic material may include a phthalocyanine compound including at least one of, for example, copper (Cu), iron (Fe), nickel (Ni), cobalt (Co), manganese (Mn), aluminum (Al), palladium (Pd), tin (Sn), indium (In), lead (Pb), titanium (Ti), rubidium (Rb), vanadium (V), gallium (Ga), terbium (Tb), cerium (Ce), lanthanum (La) and zinc (Zn).

[0287] In an embodiment, the light-receiving layer LRL may be composed of two layers (or bi-layers). In an embodiment, the light-receiving layer LRL may include a layer including a phthalocyanine compound and a layer including C60. In an embodiment, the light-receiving layer LRL may include one mixing layer in which a phthalocyanine compound and C60 are mixed. However, this is an example, and the light-receiving layer LRL may include a polymer organic layer.

[0288] In an embodiment, a light detection band of the light-receiving element LRD may be determined according to a selection of the metal component of the phthalocyanine compound included in the light-receiving layer LRL. For example, in a case of a phthalocyanine compound including copper, visible light wavelengths in a range of about 600 to about 800 nm may be absorbed. In a case of a phthalocyanine compound comprising tin (Sn), near-infrared wavelengths in a range of about 800 nm to about 1000 nm may be absorbed. Depending on the selection of the metal included in the phthalocyanine compound, a photosensor capable of detecting a wavelength in a band desired by a user may be implemented. For example, the light-receiving layer LRL may be formed to selectively absorb light in a red wavelength band, light in a green wavelength band, or light in a blue wavelength band.

[0289] In an embodiment, an area of the light-receiving area may be smaller than an area of the emission area. The area of the light-receiving area may correspond to a width d of an opening BMH.

[0290] The second pixel electrode PEL2 and the second sensor electrode SEL2 may be disposed on the electron transport layer ETL. The second pixel electrode PEL2 and the second sensor electrode SEL2 may be provided as a common electrode CD integrally formed in the display area. Referring to FIGS. 12 and 13, a second power voltage VSS may be supplied to the second pixel electrode PEL2 and the second sensor electrode SEL2. The common electrode CD may be formed of a metal layer such as, for example, silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), or chromium (Cr), and / or a transparent conductive layer such as ITO, IZO, ZnO, or ITZO. In an embodiment, the common electrode CD may be formed of a multilayer of a double layer or more including a thin metal layer. For example, the common electrode CD may include a triple layer of ITO / Ag / ITO.

[0291] An encapsulation layer TFE may be provided on the common electrode CD including the second pixel electrode PEL2 and the second sensor electrode SEL2. In an embodiment, the encapsulation layer TFE may have a laminated structure formed of an inorganic material, an organic material, and an inorganic material in that order. The top layer of the encapsulation layer TFE may include an inorganic material.

[0292] The touch panel 210 may be disposed on the encapsulation layer TFE. The touch panel 210 may include a touch electrode configured to sense a user's touch. In an embodiment, the touch panel 210 may be implemented in a self-capacitance manner. In an embodiment, the touch panel 210 may be implemented in a mutual capacitive manner.

[0293] A black matrix BM may be disposed on the touch panel 210. According to an embodiment, a color filter CF may be further disposed on the black matrix BM. In an embodiment, the color filter CF may be omitted. A cover window CW may be disposed on an uppermost layer of the display panel (e.g., an upper layer of the color filter CF).

[0294] At least a portion of the black matrix BM may overlap the pixel defining layer PDL. The black matrix BM may distinguish each sub-pixel so that light is not mixed between a plurality of sub-pixels. The black matrix BM may function as an optical system that collects light in the light-receiving element LRD. For example, referring to FIG. 12, at least a portion of the black matrix BM may be removed from an area corresponding to an opening BMH. The opening BMH may be positioned to overlap the light-receiving element LRD. The opening BMH allows the black matrix BM to function like an optical system.

[0295] The amount of light incident in a direction to the light-receiving element LRD (e.g., reflected light emitted from the light-emitting element LD and reflected by an external object or the like) may be adjusted by the optical system formed by the black matrix BM (e.g., the width d of the optical system).

[0296] The electronic device according to embodiments of the present disclosure may sense photosensors at different sensing resolutions in a mode for fingerprint authentication and in a mode for measuring bio-signal sensing data (or bio-signal).

[0297] FIG. 15 is an equivalent circuit diagram of a readout circuit 450 (see FIG. 4) according to embodiments of the present disclosure.

[0298] Referring to FIG. 15, a readout circuit 450 (see FIG. 4) according to embodiments of the present disclosure may include an integrator 1510 and a sample and hold circuit (also referred to as correlated double sampling circuit) 1520.

[0299] The integrator 1510 may include an operational amplifier OP-AMP, a feedback capacitor Cfb, and a first switching element SW1. An operation timing of the first switching element SW1 may be controlled by an integrator reset signal IRST.

[0300] The operational amplifier OP-AMP may include a first input terminal (e.g., “(−)” input terminal), a second input terminal (e.g., “(+)” input terminal), and an output terminal. The first input terminal may be an inverted input terminal. The second input terminal may be a non-inverted input terminal.

[0301] The first input terminal of the operational amplifier OP-AMP may be electrically connected to a sensing line RX. In an embodiment, a multiplexer may be further disposed between the first input terminal of the operational amplifier OP-AMP and the sensing line RX. A voltage VCrx from a capacitor Crx corresponding to a voltage of the sensing line RX may be applied to the first input terminal of the operational amplifier OP-AMP.

[0302] The second input terminal of the operational amplifier OP-AMP may be electrically connected to a constant voltage line PL. In an embodiment, the second input terminal of the operational amplifier OP-AMP may be grounded GND.

[0303] The feedback capacitor Cfb may include one electrode connected to the first input terminal of the operational amplifier OP-AMP and the other electrode connected to the output terminal of the operational amplifier OP-AMP.

[0304] The first switching element SW1 may be configured to switch an electrical connection between the first input terminal and the output terminal of the operational amplifier OP-AMP. When the first switching element SW1 is turned on, a charge stored in the feedback capacitor Cfb may be discharged and the feedback capacitor Cfb may be reset.

[0305] The sample and hold circuit 1520 may include a second switching element SW2, a third switching element SW3, a first sampling capacitor Cs1, a second sampling capacitor Cs2, a differential amplifier (DA), a fourth switching element SW4, and the like. The sample and hold circuit 1520 may include a sixth node N6 electrically connected to an output end of the integrator 1510 (e.g., an output end of an operational amplifier OP-AMP). The sample and hold circuit 1520 may be configured to store a value sensed by the photosensor and output an analog voltage obtained by removing (or reducing) a noise component from the sensed value.

[0306] The second switching element SW2 may be configured to switch an electrical connection between the sixth node N6 and the first sampling capacitor Cs1. An operation timing of the second switching element SW2 may be controlled by a second sampling signal SHR.

[0307] The first sampling capacitor Cs1 may be configured to store a value corresponding to the noise component. The noise component may include, for example, a noise component basically present in the sensing line RX. The first sampling capacitor Cs1 may include one electrode electrically connected to the second switching element SW2 and the other electrode electrically connected to a constant voltage source (or a ground power source GND).

[0308] The third switching element SW3 may be configured to switch an electrical connection between the sixth node N6 and the second sampling capacitor Cs2. An operation timing of the third switching element SW3 may be controlled by a first sampling signal SHS.

[0309] The second sampling capacitor Cs2 may be configured to store a value sensed by the photosensor including the noise component. The second sampling capacitor Cs2 may include one electrode electrically connected to the third switching element SW3 and the other electrode electrically connected to a constant voltage source (or a ground power source GND).

[0310] The differential amplifier may include a first input terminal (e.g., “(−)” input terminal), a second input terminal (e.g., “(+)” input terminal), and an output terminal. The differential amplifier may be configured to amplify and output a signal (e.g., a voltage) corresponding to a difference between a signal (e.g., a voltage) input to the second input terminal and a signal (e.g., a voltage) input to the first input terminal. The first input terminal may be an inverted input terminal. The second input terminal may be a non-inverted input terminal. The first input terminal of the differential amplifier may be configured to receive a voltage applied from the first sampling capacitor Cs1. In an embodiment, a buffer BUF may be further disposed between the first input terminal of the differential amplifier and the first sampling capacitor Cs1.

[0311] The second input terminal of the differential amplifier may be configured to receive a voltage applied from the second sampling capacitor Cs2. A buffer BUF may be further disposed between the second input terminal of the differential amplifier and the second sampling capacitor Cs2.

[0312] The fourth switching element SW4 may be configured to switch an electrical connection between an output end of the differential amplifier and an input end OUT of the analog-to-digital converter 452. When the fourth switching element SW4 is turned on, a sensing voltage VSEN corresponding to the amount of light received by the photosensor may be input to the analog-to-digital converter 452.

[0313] The second switching element SW2 and the third switching element SW3 may correspond to switching elements for sampling signals. The fourth switching element SW4 may correspond to a switching element for holding a signal.

[0314] The analog-to-digital converter 452 may convert the input sensing voltage VSEN into a digital value and output a converted digital value DSEN.

[0315] FIG. 16 is a driving timing diagram for sensing a photosensor at a first sensing resolution in case that the electronic device 100 (see FIG. 1) operates in a fingerprint authentication mode.

[0316] Referring to FIG. 16, a timing diagram of a reset signal RST, first scan signals GW[1] to GW[n], and a first sampling signal SHS is shown.

[0317] Referring further to FIGS. 4 and 15, the reset circuit 460 may output the reset signal RST. The scan driving circuit 420 may output the first scan signals GW[1] to GW[n]. The first sampling signal SHS is included in the readout circuit control signal RCS. The timing controller 440 may output the first sampling signal SHS. A timing at which the readout circuit 450 reads the output of the photosensor PHS may be controlled in response to the first sampling signal SHS. A length of a period during which the readout circuit 450 reads the output of the photosensor PHS may be controlled in response to the first sampling signal SHS.

[0318] When operating in the fingerprint authentication mode, a reset frame may be started. The reset circuit 460 (see FIG. 4) may output the reset signal RST in the reset frame. The reset signal RST may be output before the first scan signals GW[1] to GW[n]. Accordingly, the voltages of the sensing lines RX1 to RXk (see FIG. 4) may be reset (or initialized). Referring to FIGS. 12, 13, and 15 together, when the reset signal RST is input and the third sensor transistor M3a is turned on, the third power voltage VRST is applied to the fifth node N5. The first sensor transistor M1 may be turned on in response to the third power voltage VRST applied to the fifth node N5. The second sensor transistor M2 may be turned on in response to a corresponding one of the plurality of first scan signals GW[p] to GW[q] (where p, q being an integer of 1 or more). When the first sensor transistor M1 and the second sensor transistor M2 are turned on, a voltage level of the sensing line RXk may be initialized to the fourth power voltage VCOM.

[0319] After the reset frame, an exposure time (or exposure integration time EIT) may proceed. The exposure time may include one or more hold frames. The exposure time may correspond to a period in which the photosensor receives light (e.g., a period in which light is received from after the reset frame to before the readout frame). Further referring to FIGS. 12, 13, and 15, the light sensor PHS may receive light during the exposure time so that a current may flow through the light-receiving element LRD. In the fingerprint authentication mode, the length of the exposure time may be set to be long enough that the magnitude of the current flowing through the light-receiving element LRD becomes relatively constant (or converges to a constant value). For example, the length of the exposure time may be about 100 ms (or about 12 frame periods based on a scan rate of about 120 Hz). However, embodiments of the present disclosure are not limited thereto. Accordingly, each of the plurality of photosensors PHS may reflect a difference in the amount of light received.

[0320] After the exposure time, one or more readout frames may be performed. In the readout frame, a first sampling signal SHS of a turn-on level may be input to the readout circuit 450 (see FIG. 4). During the readout frame, a plurality of photosensors may be read by the readout circuit in response to the first sampling signal SHS. In the fingerprint authentication mode, the first sampling signal SHS of the turn-on level may be applied for one horizontal period.

[0321] Embodiments of the present disclosure may read output signals (e.g., sensing signals) from a plurality of photosensors in one readout frame period in a fingerprint authentication mode. Embodiments of the present disclosure may selectively read only a corresponding photosensor of the plurality of photosensors in each readout frame divided into two or more readout frame periods. FIG. 16 illustrates an embodiment in which two or more readout frame periods are divided and a corresponding photosensor among a plurality of photosensors is selectively read during each readout frame period. For example, in each of four readout frame periods Readout Frame #1 to Readout Frame #4, a corresponding photosensor among the plurality of photosensors may be selectively read.

[0322] Referring to FIG. 16, in a first readout frame period Readout Frame #1 among four readout frame periods Readout Frame #1 to Readout Frame #4, a photosensor located in first, fifth, . . . , and (n−3)-th pixel rows (e.g., a pixel row in which the remainder is 1 when a row number is divided by 4) among a plurality of pixel rows may be read. In the second readout frame period Readout Frame #2, a photosensor located in the second, sixth, . . . , and (n−2)-th pixel rows (e.g., a pixel row in which the remainder is 2 when the row number is divided by 4) among the plurality of pixel rows may be read. In the third readout frame period Readout Frame #3, a photosensor located in the third, seventh, . . . , and (n−1)-th pixel rows (e.g., a pixel row in which the remainder is 3 when the row number is divided by 4) among a plurality of pixel rows may be read. In the fourth readout frame period Readout Frame #4, a photosensor located in the fourth, eighth, . . . , and n-th pixel row (e.g., a pixel row in which the remainder is 0 when the row number is divided by 4) among the plurality of pixel rows may be read.

[0323] According to embodiments of the present disclosure, a plurality of photosensors may be read in units of pixel rows in the fingerprint authentication mode. Accordingly, an image (e.g., a fingerprint image) having a relatively high sensing resolution (a first sensing resolution) may be generated.

[0324] Referring to FIG. 16, the reset frame is shown to be initiated immediately after the readout frame (e.g., the fourth readout frame Readout Frame #4), but after the readout frame, the reset frame may not be initiated and the fingerprint authentication mode may end.

[0325] In an embodiment, an area to which the first scan signals GW[p] to GW[q] of the turn-on level are applied may be limited to a partial area including an area to which a user's touch is input in the display area DA (see FIG. 4). In an embodiment, the area to which the first scan signals GW[p] to GW[q] of the turn-on level are applied may be the entire display area DA.

[0326] FIGS. 17 and 18 are timing diagrams of a display device for sensing a photosensor at a second sensing resolution in case that a bio-signal sensing mode is selected in embodiments of the present disclosure.

[0327] The reset frame is as described above with reference to FIG. 16.

[0328] The length of the exposure time in the bio-signal sensing mode may be relatively short compared to the length of the exposure times in the fingerprint authentication mode. For example, the length of the exposure time in the bio-signal sensing mode may be about 8.3 ms (or about 1 frame based on an about 120 Hz scan rate). The exposure time in the bio-signal sensing mode may include two or more hold frames.

[0329] A length of a period during which the photosensor receives light in the bio-signal sensing mode (e.g., the period during which light is received from after the reset frame to before the readout frame) may be relatively short. The electronic device 100 (see FIG. 1) according to embodiments of the present disclosure may calculate the degree to which the amount of reflected light incident on the photosensor changes over time in the bio-signal sensing mode.

[0330] The first sampling signal SHS of the turn-on level may be input to the readout circuit 450 (see FIG. 4) in a readout frame period. The first sampling signal SHS of the turn-on level may be applied for at least two horizontal periods.

[0331] A description will be given with reference to FIGS. 4 and 17. The first scan signal GW[p] of the turn-on level may be applied to a p-th pixel row, and a first scan signal GW[p+1] pf the turn-on level may be apply to a (p+1)-th pixel row. In the above period, the first sampling signal SHS of the turn-on level may be input to the readout circuit 450. A first scan signal GW[q−3] of the turn-on level may be applied to the (q−3)-th pixel row, and a first scan signal GW[q−2] of the turn-on level may also be applied to a (q−2)-th pixel row. In the above period, the first sampling signal SHS of the turn-on level may be input to the readout circuit 450.

[0332] A description will be given with reference to FIGS. 4 and 18. The first scan signal GW[p] of the turn-on level may be applied to the p-th pixel row, a first scan signal GW[p+1] of the turn-on level may be apply to a (p+1)-th pixel row and a first scan signal GW[p+2] may be applied to a (p+2)-th pixel row. A first scan signal GW[p+3] may be applied to a (p+3)-th pixel row. In the above period, the first sampling signal SHS of the turn-on level may be input to the readout circuit 450. A first scan signal GW[q−3] of the turn-on level may be applied to a (q−3)-th pixel row, a first scan signal GW[q−2] of the turn-on level may be used to a (q−2)-th pixel row, a first scan signal GW[q−1] of the turn-on level may be applied to a (q−1)-th pixel row, and a first scan signal GW[q] of the turn-on level may also applied to a q-th pixel row. In the above period, the first sampling signal SHS of the turn-on level may be input to the readout circuit 450.

[0333] The electronic device 100 (see FIG. 1) according to embodiments of the present disclosure may generate an image corresponding to a bio-signal based on a result of continuously sensing two or more pixel rows in the bio-signal sensing mode. Accordingly, an image (or image) having a relatively low sensing resolution (a second sensing resolution) may be generated based on a result of integrally sensing two or more pixel rows (e.g., photosensors located in the two or more pixel rows).

[0334] According to embodiments of the present disclosure, a display device may include a display panel in which a plurality of unit pixels are arranged, where at least one of the unit pixels includes a plurality of sub-pixels SP and at least one photosensor PHS. The display device may further include a data driving circuit 410 configured to output a data signal for displaying an image using the plurality of sub-pixels SP, a readout circuit 450 configured to read sensing signals from the at least one photosensor PHS, and a scan driving circuit 420 configured to output a scan signal to the plurality of sub-pixels SP and the at least one photosensor PHS. A timing controller 440 may be configured to control the driving timings of the data driving circuit 410, the readout circuit 450, and the scan driving circuit 420 in response to a control signal. The timing controller 440 may control a plurality of sub-pixels SP located in a first area of the display panel to display an image of a first pattern. While the first pattern is displayed, the timing controller 440 may read a plurality of sensing signals from a plurality of photosensors PHS located in the first area and generate a fingerprint image based on the sensing signals. When fingerprint authentication based on the fingerprint image is successful, the timing controller 440 may control a plurality of sub-pixels SP located in a second area of the display panel to display an image of a second pattern and may read a plurality of sensing signals from a plurality of photosensors PHS located in a third area around the second area while the second pattern is displayed.

[0335] FIG. 19 is a flowchart schematically illustrating a driving method 1900 of an electronic device according to embodiments of the present disclosure.

[0336] In embodiments of the present disclosure, the driving method 1900 may be referred to as a driving method 1900 of an electronic device. The driving method 1900 may be applied to the electronic device 100 of FIG. 1.

[0337] In operation S1910, fingerprint authentication may be performed. In operation S1910, a fingerprint authentication function may be activated in a bio-signal sensing application executed in the electronic device.

[0338] In operation S1920, it may be determined whether fingerprint authentication has been passed.

[0339] In operation S1930, a bio-signal may be measured. In operation S1930, the bio-signal sensing function may be activated in the bio-signal sensing application executed in the electronic device.

[0340] In operation S1940, the measured bio-signal may be stored.

[0341] Referring to FIG. 19, according to embodiments of the present disclosure, the driving method 1900 utilizes a security-enhanced biometric workflow in which fingerprint authentication is performed before initiating bio-signal sensing. When a user launches a bio-signal sensing application on the electronic device 100, the driving method 1900 first activates fingerprint authentication (S1910) and determines whether the authentication is successful (S1920). Only upon successful authentication does the method proceed to activate the bio-signal sensing function to measure the user's bio-signal (S1930). The measured bio-signal is then stored (S1940). This sequence allows for bio-signal data to be collected only from authenticated users, thereby enhancing the security and reliability of sensitive biometric sensing.

[0342] The driving method 1900 according to embodiments of the present disclosure will be described with reference to a flowchart of FIG. 20, a flowchart of FIG. 35, a flowchart of FIG. 37, and a flowchart of FIG. 39, respectively.

[0343] FIG. 20 is a flowchart illustrating a method 2000 of driving an electronic device in which a bio-signal sensing application is executed, according to an embodiment.

[0344] In operation S2010, a touch area may be sensed. A structure and a method of sensing whether to touch and / or touch coordinates in the electronic device are the same as those described with reference to FIGS. 5 to 10.

[0345] In operation S2020, pixels may display an image of a first pattern in a first area set to include the sensed touch area. In an embodiment, the image of the first pattern may be an image of a single color (e.g., green).

[0346] In operation S2030, photosensors located in the first area may be activated to sense reflected light while the first pattern is displayed.

[0347] In operation S2040, it may be determined whether a generated image matches a pre-stored fingerprint image.

[0348] If it is determined that the image generated does not match the pre-stored fingerprint image in the operation S2040, the bio-signal may be terminated without being stored.

[0349] If it is determined that the image generated matches the pre-stored fingerprint image in the operation S2040, operation S2050 and subsequent operations may be performed.

[0350] In operation S2050, pixels may display an image of a second pattern in a second area set to include the sensed touch area.

[0351] In operation S2060, photosensors of a third pattern may be read in a third area around the second area. In an embodiment, the third area may be an area surrounded by the second area and located inside the second area in a plan view. In an embodiment, the third area may be an area surrounding the second area and located outside the second area in a plan view. However, embodiments of the present disclosure are not limited thereto, and any one of the second area and the third area may be adjacent to each other without surrounding the other.

[0352] In operation S2070, the measured bio-signal may be stored.

[0353] Still referring to FIG. 20, embodiments of the present disclosure provide a secure biometric workflow in which fingerprint authentication gates access to subsequent bio-signal sensing. According to embodiments, the process begins by detecting a touch input on the display (S2010). In response, a first area that includes the detected touch area is illuminated using a specific display pattern-such as, e.g., a green image (S2020)-designed to improve fingerprint capture conditions. Photo sensors corresponding to this first area are then activated to generate a fingerprint image (S2030). The method may then compare the captured image to a reference fingerprint stored in memory to determine whether the user is authorized (S2040). If the fingerprint does not match, the process is terminated and no bio-signal is collected or stored, thus protecting sensitive biometric data.

[0354] If the fingerprint authentication is successful, the method transitions to the sensing phase. A second visual pattern is displayed in a second area encompassing the touch region (S2050), and bio-signal sensing is performed in a third area surrounding or adjacent to the second area (S2060). This spatial partitioning between fingerprint sensing and bio-signal acquisition may reduce interference and improve accuracy. Once the bio-signal has been measured, it is stored in memory for further processing or analysis (S2070). In this method according to embodiments, fingerprint authentication precedes bio-signal sensing, so that bio-signal data is captured only after the user has been verified. This sequencing limits the potential for unauthorized access, spoofing, or unintentional collection of sensitive health information.

[0355] FIGS. 21 to 26 are diagrams illustrating that the bio-signal sensing application 2110 is executed in the electronic device with reference to the flowchart of FIG. 20 according to embodiments.

[0356] The electronic device in which the bio-signal sensing application 2110 of FIGS. 21 to 26 is executed may be applied to the electronic device 100 of FIG. 1.

[0357] Referring to FIG. 21, a message MSG may be displayed in the display area DA of the display device 110. The message MSG may be, for example, “touch the screen”, “TOUCH THE SCREEN”, or the like. Thereby, the user of the electronic device may place a finger on the touch active area TA.

[0358] The processor 130 may control the message MSG to be displayed in the display area DA of the display device 110 with reference to the memory 150 loaded with the bio-signal sensing application 2110. The display driving circuit 240 may display the message MSG in the display area DA in response to the control of the processor 130.

[0359] Referring to FIG. 22, the processor 130 may detect whether a user's finger is located in the touch active area TA of the display device 110 with reference to the memory 150 loaded with the bio-signal sensing application 2110. The processor 130 may output a touch control signal TCS to the display device 110 and receive touch sensing data TSD from the display device 110.

[0360] The display device 110 (e.g., the touch driving circuit 230) may drive the touch active area TA in response to the touch control signal TCS and sense the touch active area TA to output the touch sensing data TSD.

[0361] The processor 130 may set a sensed touch area STA based on the touch sensing data TSD received. The sensed touch area STA may include an area to which a user's finger touch is input.

[0362] Referring to FIG. 23, the processor 130 may transmit a control signal CS and first image data DATA1 to the display device 110. The display device 110 (e.g., the display driving circuit 240) may display an image of a first pattern PAT1 in a first area AR1 of the display area DA based on the control signal CS and the first image data DATA1. At least one sub-pixel SP located in the first area AR1 may display an image.

[0363] The first area AR1 may be set to include the sensed touch area STA of FIG. 22. For example, referring to FIG. 4, the first area AR1 may be an area covered by any one of the first to third scan driving circuits 422, 424, and 426. However, embodiments of the present disclosure are not limited thereto, and the first area AR1 may be an area covered by two or more of the first to third scan driving circuits 422, 424, and 426.

[0364] Referring to FIG. 24, the processor 130 may output the control signal CS. The display driving circuit 240 may read the photosensors PHS of the first pattern PAT1 located in the first area AR1 in response to the control signal CS input. The display device 110, for example, the display driving circuit 240 may output a digital value DSEN obtained by sensing the photosensors PHS. The processor 130 may generate a fingerprint image based on the digital value DSEN input.

[0365] The processor 130 may compare the generated fingerprint image with a reference fingerprint image 2410 loaded in the memory 150. The processor 130 may determine whether the generated fingerprint image matches the reference fingerprint image 2410. If it is determined that the generated fingerprint image matches the reference fingerprint image 2410, a bio-signal may be measured. If it is determined that the generated fingerprint image and the reference fingerprint image 2410 do not match, the bio-signal is not measured.

[0366] Referring to FIG. 25, the processor 130 may output the control signal CS and the first image data DATA1. The display device 110, for example, the display driving circuit 240 may display an image of a second pattern PAT2 in a second area AR2 and display an image of a third pattern PAT3 in a third area AR3 in response to the input control signal CS and the first image data DATA1.

[0367] The sensed touch area STA above-described may be located in the second area AR2 and third area AR3 which are set.

[0368] In an embodiment, the second area AR2 may be an emission area, and the third area AR3 may be a sensing area. In an embodiment, the second area AR2 may be a sensing area, and the third area AR3 may be an emission area. Hereinafter, for convenience of description, the second area AR2 is an emission area, and the third area AR3 is a sensing area.

[0369] The emission area refers to an area in which the sub-pixel SP located in the area emits light and the photosensor PHS located in the area is not read.

[0370] The sensing area refers to an area in which the photosensor PHS located in the area is read and the sub-pixel SP located in the area does not emit light.

[0371] Referring to FIG. 25, each of the second area AR2 and the third area AR3 is shown to have a rectangular shape as a whole. However, embodiments of the present disclosure are not limited thereto, and the second area AR2 and / or the third area AR3 may have a circular shape or a polygonal shape other than the rectangular shape.

[0372] The display device 110, for example, the display driving circuit 240 may display an image of the second pattern PAT2 in the second area AR2 and display an image of the third pattern PAT3 in the third area AR3 in response to the control signal CS and the first image data DATA1. In an embodiment, the image of the second pattern PAT2 may be an image of a single color (e.g., green). In an embodiment, the image of the third pattern PAT3 may be a black image.

[0373] Referring to FIG. 26, the processor 130 may output a control signal CS. The display device 110, for example, the display driving circuit 240, may read the photosensor PHS located in the third area AR3 in response to the control signal CS. The display driving circuit 240 may output a digital value DSEN sensing the photosensor PHS.

[0374] The processor 130 may generate bio-signal sensing data 2610 based on the received digital value DSEN. For example, the processor 130 may input the received digital value DSEN into an algorithm and generate the bio-signal sensing data 2610 based on the value output from the algorithm. The processor 130 may store the generated bio-signal sensing data 2610 in the memory 150.

[0375] The processor 130 may detect a change in the amount of light input to the photosensor PHS according to contraction and relaxation of a blood vessel based on the received digital value DSEN. The processor 130 may detect a change in the shape of a blood vessel over time by schematizing a waveform of an amount of light input to the photosensor PHS. Thereby, e.g., a systolic peak, a diastolic peak, a reflection index, a stiffness index, and the like may be calculated. The processor 130 may input the generated information into an algorithm and generate bio-signal sensing data associated with cardiovascular based on a value output from the algorithm. Bio-signal sensing data associated with cardiovascular may include, for example, at least one of cardiovascular health information, blood pressure, atrial rhythm, atrial fibrillation, heart rate, and respiratory rate. However, embodiments of the present disclosure are not limited thereto.

[0376] According to embodiments of the present disclosure, security may be enhanced by generating bio-signal sensing data in association with fingerprint authentication.

[0377] Additionally, when the bio-signal sensing data is obtained, it can be inferred that the fingerprint authentication was performed using the actual user's finger rather than an artificial medium such as silicon or paper. As a result, the system may provide an anti-spoofing function that helps prevent fingerprint authentication from being bypassed using counterfeit materials.

[0378] FIG. 26 illustrates a process in which, according to embodiments of the present disclosure, the processor 130 outputs a control signal CS to the display device 110. In response, the display driving circuit 240 senses the photo sensor PHS located in the third area AR3 and outputs a digital value DSEN. The processor 130 receives the digital value DSEN and generates bio-signal sensing data 2610 by inputting the value into an algorithm and processing the output.

[0379] This process allows the processor 130 to detect changes in light received by the photo sensor PHS corresponding to, e.g., contraction and relaxation of blood vessels. By schematizing the resulting waveform, the processor 130 can analyze features such as, e.g., a systolic peak, diastolic peak, reflection index, and stiffness index. These values may be used to generate bio-signal sensing data 2610 associated with cardiovascular health, which may include information such as, e.g., blood pressure, atrial rhythm, atrial fibrillation, heart rate, and respiratory rate. The data may then be stored in the memory 150.

[0380] Because this sensing operation occurs after fingerprint authentication, embodiments strengthen security by tying sensitive biometric data collection to user verification. Furthermore, the presence of bio-signal sensing data confirms that the fingerprint input originated from a live finger rather than a spoofing material (e.g., silicon or paper), thereby contributing to an anti-spoofing function that may prevent circumvention of fingerprint authentication.

[0381] FIG. 27 is a diagram conceptually illustrating the first pattern PAT1.

[0382] The first pattern PAT1 may include one or more pixels PXL and one or more photosensors PHS. Although one pixel PXL and one photosensor PHS are shown as an example in FIG. 27, embodiments of the present disclosure are not limited thereto.

[0383] The pixel PXL of the first pattern PAT1 may emit light. The photosensor PHS of the first pattern PAT1 may be read.

[0384] FIG. 28 is an embodiment of the first pattern PAT1.

[0385] Referring to FIG. 28, in embodiments of the present disclosure, a plurality of unit pixels UP may be disposed in the first pattern PAT1. The unit pixel UP may include a plurality of sub-pixels SP1, SP2, and SP3 and at least one photosensor PHS. Referring to FIG. 28, the unit pixel UP may include a first sub-pixel SP1, a second sub-pixel SP2, a third sub-pixel SP3, and a photosensor PHS. A plurality of sub-pixels SP1, SP2, and SP3 and at least one photosensor PHS included in the unit pixel UP may be connected (e.g., electrically connected) to one scan line.

[0386] Still referring to FIG. 28, the second sub-pixel SP2 and the photosensor PHS in one unit pixel UP are shown to be positioned adjacent to each other in the second direction DR2. The photosensor PHS may be adjacent to the first sub-pixel SP1 in a fifth direction DR5. The photosensor PHS may be adjacent to the third sub-pixel SP3 in a fourth direction DR4. The second sub-pixel SP2 may be adjacent to the first sub-pixel SP1 in the fourth direction DR4. The second sub-pixel SP2 may be adjacent to the third sub-pixel SP3 in the fifth direction DR5. The first sub-pixel SP1 and the third sub-pixel SP3 may be adjacent to each other in a first direction DR1. The photosensor PHS and the second sub-pixel SP2 may be adjacent to each other in a second direction DR2. Accordingly, one unit pixel UP may have a rhombus shape as a whole. However, embodiments of the present disclosure are not limited thereto.

[0387] At least one sub-pixel included in the unit pixel UP may emit light in the first pattern PAT1. Referring to FIG. 28, the second sub-pixel SP2 included in the unit pixel UP may emit light. According to an embodiment, at least one of the first sub-pixel SP1 and the third sub-pixel SP3 included in the unit pixel UP des not emit light.

[0388] In the first pattern PAT1, the second sub-pixel SP2 included in one unit pixel UP emits light, and the photosensor PHS may sense light (e.g., reflected light). Thereby, a precise image may be obtained.

[0389] FIGS. 29 and 30 are embodiments of the first pattern PAT1.

[0390] FIGS. 29 and 30 are examples of a case where alternative sensing driving is applied to the first pattern PAT1.

[0391] Referring to FIGS. 29 and 30, a first pattern PAT1 in a first frame and a first pattern PAT1 in a second frame are shown, respectively. The first frame and the second frame may be consecutive frames. In one frame, the second sub-pixel SP2 in a first unit pixel PU1 may emit light. The photosensor PHS in a second unit pixel PU2 may be read. In a subsequent frame, the photosensor PHS in the first unit pixel PU1 may sense light. The second sub-pixel SP2 in the second unit pixel PU2 may emit light. The first unit pixel PU1 and the second unit pixel PU2 may be adjacent to each other in the first direction DR1. A plurality of first unit pixels PU1 may be arranged in parallel in the fourth direction DR4. A plurality of second unit pixels PU2 may be arranged in parallel in the fourth direction DR4. The first unit pixel PU1 and the second unit pixel PU2 may be adjacent to each other in the fifth direction DR5.

[0392] Compared with FIG. 28, according to FIGS. 29 and 30, each of the unit pixels PU1 and PU2 may emit light or receive light. Accordingly, a noise (or internal light effect) due to light directly incident from a sub-pixel (e.g., the second sub-pixel SP2) located adjacent to the photosensor PHS in one unit pixel may be reduced. Accordingly, reflected light may be more effectively detected through the photosensor PHS.

[0393] In this way, the driving method of alternately performing the operation of emitting and receiving the unit pixel UP according to the progress of the frame may be referred to as alternative sensing driving.

[0394] FIG. 31 is a diagram conceptually illustrating a second pattern PAT2. FIG. 32 is an embodiment of the second pattern PAT2.

[0395] Referring to FIG. 31, the pixel PXL located in the second pattern PAT2 may emit light. The pixel PXL may emit, for example, light in a green wavelength band. The photosensor PHS located in the second pattern PAT2 may not be read.

[0396] In embodiments of the present disclosure, a plurality of unit pixels UP may be disposed in the second pattern PAT2. At least one sub-pixel (e.g., the second sub-pixel SP2) located in the unit pixel UP in the second pattern PAT2 may emit light.

[0397] FIG. 33 is a diagram conceptually illustrating a third pattern PAT3. FIG. 34 is an embodiment of the third pattern PAT3.

[0398] Referring to FIGS. 33 and 34, in an embodiment, the pixel PXL located in the third pattern PAT3 does not emit light, and the photosensor PHS located in the third pattern PAT3 may be read.

[0399] In embodiments of the present disclosure, a plurality of unit pixels UP may be disposed in the third pattern PAT3. At least one photosensor PHS located in the unit pixel UP in the third pattern PAT3 may be read.

[0400] FIG. 35 is a flowchart illustrating a driving method 3500 of an electronic device in which a bio-signal sensing application is executed according to an embodiment.

[0401] In operation S3510, a touch area may be sensed. The structure and method of sensing whether to touch and / or touch coordinates in the electronic device are the same as those described with reference to FIGS. 5 to 10.

[0402] In operation S3520, pixels in a first area of a first element layer set to include the sensed touch area may display an image of a first pattern. The first element layer may be the first element layer DSL1 described with reference to FIG. 3B.

[0403] In operation S3530, photosensors of the first pattern may be read in the first area.

[0404] In operation S3540, it may be determined whether a generated image matches a pre-stored fingerprint image. If the generated image matches the pre-stored fingerprint image, operation S3550 may be performed.

[0405] In operation S3550, a light-emitting element may emit light in a second area where a second element layer is located. The second element layer may be the second element layer DSL2 described with reference to FIG. 3B.

[0406] In operation S3560, a photosensor may be read in a third area where the second element layer is located. In an embodiment, the third area may be an area surrounded by the second area and located inside the second area in a plan view. In an embodiment, the third area may be an area surrounding the second area and located outside the second area in a plan view. However, embodiments of the present disclosure are not limited thereto, and any one of the second area and the third area may be adjacent to each other without surrounding the other.

[0407] In operation S3570, a measured bio-signal may be stored.

[0408] FIG. 35 illustrates a driving method 3500, according to embodiments of the present disclosure, in which a bio-signal sensing application is executed on an electronic device that includes multiple sensing layers. In operation S3510, a touch area is sensed, using the same sensing structure described in FIGS. 5 to 10. In response, pixels in a first area of a first element layer DSL1 (S3520) display an image of a first pattern to facilitate fingerprint acquisition. Photosensors in the first area are then activated to generate a fingerprint image (S3530). In operation S3540, the processor 130 determines whether the generated fingerprint image matches a pre-stored reference fingerprint image. If a match is confirmed, the method proceeds to activate a second element layer DSL2.

[0409] In operation S3550, a light-emitting element in the second area of the second element layer DSL2 emits light, and in operation S3560, a photosensor located in a third area of DSL2 is read. The third area may be spatially adjacent to or surrounding the second area, depending on the implementation. Finally, in operation S3570, the resulting bio-signal is stored. This method may enable bio-signal sensing using a layered structure, where fingerprint authentication on a first layer serves as a security gate for bio-signal sensing performed via a second layer, enhancing both user authentication and the integrity of the collected biometric data.

[0410] FIG. 36 is a diagram illustrating a state in which a bio-signal sensing application is executed in a wearable device 3600 according to an embodiment of FIG. 35.

[0411] The wearable device 3600 is an embodiment of the electronic device 100 of FIG. 1.

[0412] A user's finger FNG may approach the cover window CW on the first element layer DSL1 of the wearable device 3600. The sub-pixels located in the first element layer DSL1 may display an image of the first pattern PAT1. During display of the first pattern PAT1, photosensors located in the first element layer DSL1 may be read to capture reflected light from the user's finger. Thereby, fingerprint authentication may be performed in the wearable device 3600.

[0413] If fingerprint authentication is successful in the wearable device 3600, bio-signal sensing data may be obtained by a light-emitting element LD_DSL2 and a photosensor PHS_DSL2 located in the second element layer DSL2.

[0414] Light emitted from the light-emitting element LD_DSL2 may provide light to the user's wrist WST. A blood vessel BV is positioned below the user's wrist WST, and reflected light reflected from the blood vessel BV may be input to the photosensor PHS_DSL2.

[0415] The wearable device 3600 may generate bio-signal sensing data using a digital value DSEN (see FIG. 15) generated from the photosensor PHS_DSL2 located in the second element layer DSL2.

[0416] According to embodiments of the present disclosure, an electronic device may include a display device 110 having a display panel in which a plurality of sub-pixels SP and a plurality of photosensors PHS are arranged. The electronic device may further include a memory 150 on which a bio-signal sensing application is loaded, and a processor 130 configured to execute the bio-signal sensing application loaded on the memory. The processor 130 may perform fingerprint authentication using the display device 110 and may sequentially detect a bio-signal proximate to an area in which the fingerprint authentication is performed on the display device.

[0417] FIG. 37 is a flowchart illustrating a method 3700 of driving an electronic device in which a bio-signal sensing application is executed according to an embodiment.

[0418] In operation S3710, a fingerprint authentication device may generate a fingerprint image. The fingerprint authentication device may be included in the electronic device 100 (see FIG. 1).

[0419] In operation S3720, it may be determined whether a generated image matches a pre-stored fingerprint image. If the generated image matches the pre-stored image, operation S3730 may be performed.

[0420] In operation S3730, a light-emitting element may emit light in a second area where a second element layer is located. The second element layer may be the second element layer DSL2 described with reference to FIG. 3B.

[0421] In operation S3740, a photosensor may be read in a third area where the second element layer is located.

[0422] In operation S3750, a measured bio-signal may be stored.

[0423] FIG. 37 illustrates a driving method 3700, according to embodiments of the present disclosure, of driving an electronic device that executes a bio-signal sensing application, where fingerprint authentication is performed using a separate fingerprint authentication device. In operation S3710, the fingerprint authentication device—configured as part of the electronic device 100 generates a fingerprint image. The method then determines whether the generated image matches a pre-stored reference fingerprint image (S3720). If the authentication is successful, the method continues to operation S3730, where a light-emitting element emits light in a second area of the second element layer DSL2 (as described with reference to FIG. 3B).

[0424] In operation S3740, a photosensor located in a third area of the second element layer DSL2 is activated to sense the bio-signal. The method concludes in operation S3750, where the measured bio-signal is stored. Thus, according to embodiments, the fingerprint authentication hardware is separated from the display-integrated sensing structure, allowing for flexible device configurations while still allowing for bio-signal sensing to be conditionally performed only after successful fingerprint verification.

[0425] FIG. 38 is a diagram illustrating a state in which a bio-signal sensing application is executed in a wearable device 3800 according to an embodiment of FIG. 37.

[0426] The wearable device 3800 is an embodiment of the electronic device 100 of FIG. 1.

[0427] The user's finger FNG may access a fingerprint authentication device 3810 of the wearable device 3800. The fingerprint authentication device 3810 may be disposed in the wearable device 3800 separately from the first element layer DSL1 and the second element layer DSL2. For example, fingerprint authentication device 3810 may be disposed on a side of wearable device 3800. Fingerprint authentication may be performed by the fingerprint authentication device 3810.

[0428] If fingerprint authentication is successful in the wearable device 3800, bio-signal sensing data may be obtained by the light-emitting element LD_DSL2 and the photosensor PHS_DSL2 located in the second element layer DSL2.

[0429] Light emitted from the light-emitting element LD_DSL2 may provide light to the user's wrist WST. A blood vessel BV is positioned below the user's wrist WST, and reflected light reflected from the blood vessel BV may be input to the photosensor PHS_DSL2.

[0430] The wearable device 3800 may generate bio-signal sensing data using a digital value DSEN (see FIG. 15) generated from the photosensor PHS_DSL2 located in the second element layer DSL2.

[0431] FIG. 39 is a flowchart illustrating a method 3900 of driving an electronic device in which a bio-signal sensing application is executed according to an embodiment.

[0432] In operation S3910, a bio-signal may be measured.

[0433] In operation S3920, the measured bio-signal may be stored.

[0434] In operation S3930, fingerprint authentication may be performed.

[0435] In operation S3940, it may be determined whether fingerprint authentication has been passed.

[0436] If the fingerprint authentication is not passed, the stored bio-signal may be deleted in operation S3950.

[0437] According to embodiments of the present disclosure, security may be enhanced by generating bio-signal sensing data in association with fingerprint authentication.

[0438] FIG. 40 is a block diagram of an electronic device 4000 according to an embodiment of the present disclosure.

[0439] Referring to FIG. 40, an electronic device 4000 according to an embodiment may include a display module 4010, a processor 4020, a memory 4030, and a power module 4040.

[0440] The processor 4020 may include at least one of, for example, a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), a communication processor (CP), an image signal processor (ISP), and a controller.

[0441] The memory 4030 may store data information utilized for operation of the processor 4020 or the display module 4010. When the processor 4020 executes an application stored in the memory 4030, an image data signal and / or an input control signal are transmitted to the display module 4010, and the display module 4010 may process the received signal and output image information through a display screen.

[0442] The power module 4040 may include a power supply module such as, for example, a power adapter or a battery device, and a power conversion module that converts power supplied by the power supply module to generate power used for operation of the electronic device 4000.

[0443] At least one of the above-described components of the electronic device 4000 may be included in the display device 110 (see FIG. 1) according to the above-described embodiments. In addition, some of the individual modules functionally included in one module may be included in the display device 110, and others may be provided separately from the display device 110. For example, the display device 110 may include a display module 4010, and the processor 4020, the memory 4030, and the power module 4040 may be provided in the form of other devices in the electronic device 4000 other than the display device.

[0444] In an embodiment, the processor 4020 according to embodiments of the present disclosure may correspond to the above-described processor 130 (see FIG. 1).

[0445] FIG. 41 is a schematic diagram of an electronic device 4000 according to various embodiments.

[0446] Referring to FIG. 41, various electronic devices to which a display device according to embodiments is applied may include not only an electronic device for displaying an image, such as a smartphone 4000_1a, a tablet PC 4000_1b, a laptop 4000_1c, a TV 4000_1d, and a desk monitor 4000_1e, but also a wearable electronic device including a display module, such as smart glasses 4000_2a, a head mounted display 4000_2b, and a smart watch 4000_2c, an electronic device for a vehicle 4000_3 including a display module such as a CID (Center Information Display) disposed on an instrument panel, a center fascia, and a dashboard of a vehicle, a room mirror display, and the like.

[0447] As is traditional in the field of the present disclosure, embodiments are described, and illustrated in the drawings, in terms of functional blocks, units and / or modules. Those skilled in the art will appreciate that these blocks, units and / or modules are physically implemented by electronic (or optical) circuits such as logic circuits, discrete components, microprocessors, hard-wired circuits, memory elements, wiring connections, etc., which may be formed using semiconductor-based fabrication techniques or other manufacturing technologies. In the case of the blocks, units and / or modules being implemented by microprocessors or similar, they may be programmed using software (e.g., microcode) to perform various functions discussed herein and may optionally be driven by firmware and / or software. Alternatively, each block, unit and / or module may be implemented by dedicated hardware, or as a combination of dedicated hardware to perform some functions and a processor (e.g., one or more programmed microprocessors and associated circuitry) to perform other functions.

[0448] According to the display device, the electronic device including the same, and the driving method thereof according to embodiments of the present disclosure, security may be enhanced by way of an operation of collecting biometric information (or bio-signal sensing data) of a user.

[0449] While the present disclosure has been particularly shown and described with reference to embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the present disclosure as defined by the following claims.

Examples

Embodiment Construction

[0062]Embodiments of the present disclosure will be described more fully hereinafter with reference to the accompanying drawings. Like reference numerals may refer to like elements throughout the accompanying drawings.

[0063]It will be understood that the terms “first,”“second,”“third,” etc. are used herein to distinguish one element from another, and the elements are not limited by these terms. Thus, a “first” element in an embodiment may be described as a “second” element in another embodiment.

[0064]It should be understood that descriptions of features or aspects within each embodiment should typically be considered as available for other similar features or aspects in other embodiments, unless the context clearly indicates otherwise.

[0065]As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0066]Spatially relative terms, such as “beneath”, “below”, “lower”, “under”, “above”, “upper”...

Claims

1. A display device, comprising:a display panel in which a plurality of unit pixels are arranged, at least one of the plurality of unit pixels including a plurality of sub-pixels and at least one photosensor;a data driving circuit configured to output a data signal to display an image using the plurality of sub-pixels;a readout circuit configured to read a sensing signal from the at least one photosensor;a scan driving circuit configured to output a scan signal to the plurality of sub-pixels and the at least one photosensor; anda timing controller configured to control driving timings of the data driving circuit, the readout circuit, and the scan driving circuit in response to a control signal,wherein the timing controller is configured to:control a plurality of sub-pixels located in a first area of the display panel to display an image of a first pattern;read a plurality of sensing signals from a plurality of photosensors located in the first area while the first pattern is displayed, and generate a fingerprint image based on the plurality of sensing signals; andwhen fingerprint authentication based on the fingerprint image passes, control a plurality of sub-pixels located in a second area of the display panel to display an image of a second pattern, and read a plurality of sensing signals from a plurality of photosensors located in a third area around the second area while the second pattern is displayed.

2. The display device of claim 1, further comprising:a touch panel on which a touch electrode is arranged; anda touch driving circuit configured to detect a touch position and a touch coordinate based on a signal of the touch electrode,wherein the timing controller controls an image of the first pattern to be displayed in the first area including a periphery of a sensed touch area, and controls photosensors located in the first area to be read while the first pattern is displayed.

3. The display device of claim 2, wherein an area including the second area and the third area includes the first area.

4. An electronic device, comprising:a display device including a display panel in which a plurality of sub-pixels and a plurality of photosensors are arranged;a memory on which a bio-signal sensing application is loaded; anda processor configured to execute the bio-signal sensing application loaded on the memory, perform fingerprint authentication on the display device, and sequentially detect a bio-signal proximate to an area in which the fingerprint authentication is performed.

5. The electronic device of claim 4, wherein the display device further includes a touch panel including a plurality of touch electrodes, andwherein the processor is further configured to detect a touch area sensed by the touch panel.

6. The electronic device of claim 5, wherein the processor is further configured to:set a first area including the touch area which is sensed; andcontrol the plurality of sub-pixels in the first area to display an image of a first pattern.

7. The electronic device of claim 6, wherein the image of the first pattern is a green image.

8. The electronic device of claim 6, wherein the processor is further configured to:read sensing signals from the photosensors located in the first area while the first pattern is displayed; andgenerate a fingerprint image based on the sensing signals.

9. The electronic device of claim 8, wherein the processor is further configured to:compare the fingerprint image with a reference fingerprint image; andgenerate the bio-signal when the fingerprint image matches the reference fingerprint image.

10. The electronic device of claim 6, wherein the processor is further configured to:set a second area and a third area, wherein the sensed touch area is included in the second area and third area;control the display device to display an image of a second pattern in the second area; andcontrol the display device to display an image of a third pattern in the third area.

11. The electronic device of claim 10, wherein the image of the second pattern is a green image.

12. The electronic device of claim 10, wherein the image of the third pattern is a black image.

13. The electronic device of claim 10, wherein the processor is further configured to read at least one photosensor located in the third area among the plurality of photosensors, and generate bio-signal sensing data corresponding to the bio-signal based on reading the at least one photosensor.

14. The electronic device of claim 13, wherein the bio-signal sensing data includes at least one of cardiovascular health information, blood pressure, atrial rhythm, atrial fibrillation, heart rate, and respiratory rate, which are associated with a user of the electronic device.

15. The electronic device of claim 10, wherein the display device includes a plurality of unit pixels,wherein each unit pixel includes a first sub-pixel, a second sub-pixel, and a third sub-pixel among the plurality of sub-pixels, which emit light of different wavelength bands, and any one of the plurality of photosensors.

16. The electronic device of claim 15, wherein the first pattern is a pattern in which the second sub-pixel emits light of a green wavelength band while the photosensor in a same unit pixel as the second sub-pixel emitting the light of the green wavelength band is read.

17. The electronic device of claim 15, wherein the second pattern is a pattern in which the second sub-pixel emits light of a green wavelength band while the photosensor in a same unit pixel as the second sub-pixel emitting the light of the green wavelength band is not read.

18. The electronic device of claim 15, wherein the third pattern is a pattern in which the first to third sub-pixels do not emit light and the photosensors in a same unit pixel as the first to third sub-pixels are read.

19. A driving method of an electronic device including a processor for loading a bio-signal sensing application into a memory and executing the bio-signal sensing application which is loaded, the driving method comprising:performing fingerprint authentication;determining whether the fingerprint authentication has passed;measuring a bio-signal when it is determined that the fingerprint authentication has passed; andstoring the measured bio-signal.

20. The driving method of an electronic device of claim 19, wherein the electronic device further includes a display device that is controlled by the processor and displays an image for fingerprint authentication and an image for measuring the bio-signal,wherein performing the fingerprint authentication includes:detecting a touch area;displaying, by the display device, an image of a first pattern in a first area that includes the detected touch area; andreading sensing signals from photosensors located in the first area while the first pattern is displayed to generate a fingerprint image,wherein measuring the bio-signal includes:displaying, by the display device, an image of a second pattern in a second area that includes the detected touch area; andreading sensing signals from photosensors located in a third area around the second area while the second pattern is displayed.

Images