Plating apparatus

Abstract

Provided is a technique capable of reducing the influence of blocking an electric field by a beam member of a paddle, or a technique capable of removing gas bubbles adhered to holes of an ionically resistive element.A plating apparatus 1000 includes a paddle 70 disposed between an anode 11 and a substrate Wf and configured to reciprocate parallel to the substrate in a first direction and a second direction to agitate a plating solution Ps. The paddle includes a plurality of beam members 71 extending in a direction perpendicular to a reciprocation direction of the paddle. The reciprocation of the paddle in the first direction and the second direction includes reciprocation of the paddle in a first reciprocation aspect. In the first reciprocation aspect, the paddle moves in the second direction with a stroke different from a stroke when moving in the first direction to change positions of the plurality of beam members when the paddle changes a moving direction from the second direction to the first direction and positions of the plurality of beam members when the paddle changes the moving direction from the first direction to the second direction.

Description

TECHNICAL FIELD

[0001] The present invention relates to a plating apparatus.BACKGROUND ART

[0002] Conventionally, there has been known a plating apparatus that can perform a plating process on a substrate (for example, see PTL 1). Such a plating apparatus includes a plating tank and a paddle. The plating tank stores a plating solution, and includes an anode disposed in the plating solution and a substrate disposed to be opposed to the anode in the plating solution. The paddle is disposed between the anode and the substrate, and configured to reciprocate parallel to the substrate in a first direction and a second direction opposite to the first direction to agitate the plating solution.

[0003] Conventionally, as a paddle, there has been known a paddle including a plurality of beam members extending in a direction perpendicular to a reciprocation direction of the paddle (for example, see PTL 1).CITATION LISTPatent Literature

[0004] PTL 1: Japanese Unexamined Patent Application Publication No. 2021-130848SUMMARY OF INVENTIONTechnical Problem

[0005] In the conventional plating tank as described above, a paddle stroke during the reciprocation of the paddle is constant. In this case, when the paddle changes the moving direction from the second direction to the first direction, and when the paddle changes the moving direction from the first direction to the second direction, the beam members of the paddle stop at the same position. In this case, an average dwelling time of the beam members of the paddle during the plating process is not uniformed, and a degree of blocking an electric field between the anode and the substrate possibly differs depending on the position of the paddle. Consequently, the plating quality of the substrate possibly deteriorates.

[0006] Alternatively, in the case of the conventional plating apparatus, a large amount of gas bubbles included in the plating solution in the plating tank possibly adhere to holes of an ionically resistive element disposed between the anode and the substrate. When the plating process is performed on the substrate in this state, the gas bubbles possibly cause the deterioration of the plating quality of the substrate.

[0007] The present invention has been made in view of the above, and it is one of the objects to provide a technique capable of reducing the influence of blocking an electric field by a beam member of a paddle, or a technique capable of removing gas bubbles adhered to holes of an ionically resistive element.Solution to Problem(Aspect 1)

[0008] To achieve the above-described object, a plating apparatus according to one aspect of the present invention includes a plating tank and a paddle. The plating tank is configured to store a plating solution, and includes an anode disposed in the plating solution and a substrate disposed to be opposed to the anode in the plating solution. The paddle is disposed between the anode and the substrate, and configured to reciprocate parallel to the substrate in a first direction and a second direction opposite to the first direction to agitate the plating solution. The paddle includes a plurality of beam members extending in a direction perpendicular to a reciprocation direction of the paddle. The reciprocation of the paddle in the first direction and the second direction includes reciprocation of the paddle in a first reciprocation aspect. In the first reciprocation aspect, the paddle moves in the second direction with a stroke different from a stroke when moving in the first direction to change positions of the plurality of beam members when the paddle changes a moving direction from the second direction to the first direction and positions of the plurality of beam members when the paddle changes the moving direction from the first direction to the second direction.

[0009] According to this aspect, when the paddle changes the moving direction from the second direction to the first direction, and when the paddle changes the moving direction from the first direction to the second direction, it can be avoided that the beam members of the paddle are located at the same position. This enables reducing the influence of blocking the electric field by the beam members of the paddle. Consequently, the plating quality of the substrate can be improved.(Aspect 2)

[0010] In the above-described aspect 1, the reciprocation of the paddle in the first direction and the second direction may include reciprocation of the paddle in a second reciprocation aspect after multiple times of the reciprocation in the first reciprocation aspect. In the first reciprocation aspect, the stroke of the paddle when the paddle moves in the second direction may be shorter than the stroke of the paddle when the paddle moves in the first direction. In the second reciprocation aspect, the paddle may move in the second direction with the stroke longer than the stroke when moving in the first direction to change the positions of the plurality of beam members when the paddle changes the moving direction from the second direction to the first direction and the positions of the plurality of beam members when the paddle changes the moving direction from the first direction to the second direction.(Aspect 3)

[0011] In the above-described aspect 1, the reciprocation of the paddle in the first direction and the second direction may include reciprocation of the paddle in a second reciprocation aspect after multiple times of the reciprocation in the first reciprocation aspect. In the first reciprocation aspect, the stroke of the paddle when the paddle moves in the second direction may be longer than the stroke of the paddle when the paddle moves in the first direction. In the second reciprocation aspect, the paddle may move in the second direction with the stroke shorter than the stroke when moving in the first direction to change the positions of the plurality of beam members when the paddle changes the moving direction from the second direction to the first direction and the positions of the plurality of beam members when the paddle changes the moving direction from the first direction to the second direction.(Aspect 4)

[0012] In any one aspect of the above-described aspects 1 to 3, the substrate may be disposed above the anode, and an ionically resistive element with a plurality of holes may be disposed above the anode and below the paddle in the plating solution.(Aspect 5)

[0013] In the above-described aspect 4, the reciprocation of the paddle in the first direction and the second direction may include that the paddle moves in the first direction multiple times at different speeds, or that the paddle moves in the second direction multiple times at different speeds.

[0014] According to this aspect, gas bubbles adhered to the holes of the ionically resistive element can be effectively removed. Accordingly, the plating quality of the substrate can be improved.(Aspect 6)

[0015] In the above-described aspect 4, the reciprocation of the paddle in the first direction and the second direction may include that the paddle moves in the first direction at a first speed and then moves in the second direction at a second speed different from the first speed.

[0016] According to this aspect, the gas bubbles adhered to the holes of the ionically resistive element can be effectively removed. Accordingly, the plating quality of the substrate can be improved.(Aspect 7)

[0017] To achieve the above-described object, a plating apparatus according to one aspect of the present invention includes a plating tank and a paddle. The plating tank is configured to store a plating solution, and includes an anode disposed in the plating solution and a substrate disposed to be opposed to the anode in the plating solution. The paddle is disposed between the anode and the substrate, and configured to reciprocate parallel to the substrate in a first direction and a second direction opposite to the first direction to agitate the plating solution. The substrate is disposed above the anode. An ionically resistive element with a plurality of holes is disposed above the anode and below the paddle in the plating solution. The reciprocation of the paddle in the first direction and the second direction includes that the paddle moves in the first direction at a first speed and then moves in the second direction at a second speed different from the first speed.

[0018] According to this aspect, the gas bubbles adhered to the holes of the ionically resistive element can be effectively removed. Accordingly, the plating quality of the substrate can be improved.BRIEF DESCRIPTION OF DRAWINGS

[0019] FIG. 1 is a perspective view illustrating an overall configuration of a plating apparatus according to an embodiment.

[0020] FIG. 2 is a plan view illustrating the overall configuration of the plating apparatus according to the embodiment.

[0021] FIG. 3 is a schematic diagram illustrating a configuration of a plating module of the plating apparatus according to the embodiment.

[0022] FIG. 4 is a schematic diagram illustrating a state where a substrate is immersed in a plating solution according to the embodiment.

[0023] FIG. 5 is a schematic plan view of a paddle according to the embodiment.

[0024] FIG. 6 is a flowchart for describing a sequence of operations from the supply of the plating solution to the start of a plating process according to the embodiment.

[0025] FIG. 7 is an example of a flowchart for describing details of the operation of the paddle according to the embodiment.

[0026] FIG. 8 (A) and 8 (B) are schematic diagrams for describing a plating apparatus according to Modification 1 of the embodiment.

[0027] FIG. 9 (A) and 9 (B) are schematic diagrams for describing a plating apparatus according to Modification 2 of the embodiment.DESCRIPTION OF EMBODIMENTS

[0028] The following describes embodiments of the present invention with reference to the drawings. Note that the drawings give schematic illustrations to facilitate understanding of features of constituent elements, and the dimensional ratio and the like of each constituent element are not necessarily the same as actual ones. In some drawings, X-Y-Z orthogonal coordinates are illustrated for reference purposes. Of the X-Y-Z orthogonal coordinates, the Z-direction corresponds to the upper side, and the-Z-direction corresponds to the lower side (a direction in which gravity acts).

[0029] FIG. 1 is a perspective view illustrating the overall configuration of a plating apparatus 1000 of this embodiment. FIG. 2 is a plan view (a top view) illustrating the overall configuration of the plating apparatus 1000 of this embodiment. As illustrated in FIGS. 1 and 2, the plating apparatus 1000 includes load ports 100, a transfer robot 110, aligners 120, pre-wet modules 200, pre-soak modules 300, plating modules 400, cleaning modules 500, spin rinse dryers 600, a transfer device 700, and a control module 800.

[0030] The load port 100 is a module for loading a substrate housed in a cassette, such as a FOUP, (not illustrated) to the plating apparatus 1000 and unloading the substrate from the plating apparatus 1000 to the cassette. While the four load ports 100 are arranged in the horizontal direction in this embodiment, the number of load ports 100 and arrangement of the load ports 100 are arbitrary. The transfer robot 110 is a robot for transferring the substrate that is configured to grip or release the substrate between the load port 100, the aligner 120, the pre-wet module 200, and the spin rinse dryer 600. The transfer robot 110 and the transfer device 700 can perform delivery and receipt of the substrate via a temporary placement table (not illustrated) to grip or release the substrate between the transfer robot 110 and the transfer device 700.

[0031] The aligner 120 is a module for adjusting a position of an orientation flat, a notch, and the like of the substrate in a predetermined direction. While the two aligners 120 are disposed to be arranged in the horizontal direction in this embodiment, the number of aligners 120 and arrangement of the aligners 120 are arbitrary. The pre-wet module 200 wets a surface to be plated of the substrate before a plating process with a process liquid, such as pure water or deaerated water, to replace air inside a pattern formed on the surface of the substrate with the process liquid. The pre-wet module 200 is configured to perform a pre-wet process to facilitate supplying a plating solution to the inside of the pattern by replacing the process liquid inside the pattern with the plating solution during plating. While the two pre-wet modules 200 are disposed to be arranged in the vertical direction in this embodiment, the number of pre-wet modules 200 and arrangement of the pre-wet modules 200 are arbitrary.

[0032] For example, the pre-soak module 300 is configured to remove an oxidized film having a large electrical resistance present on a surface of a seed layer formed on the surface to be plated of the substrate before the plating process by etching with a process liquid, such as sulfuric acid and hydrochloric acid, and perform a pre-soak process that cleans or activates a surface of a plating base layer. While the two pre-soak modules 300 are disposed to be arranged in the vertical direction in this embodiment, the number of pre-soak modules 300 and arrangement of the pre-soak modules 300 are arbitrary. The plating module 400 performs the plating process on the substrate. There are two sets of the 12 plating modules 400 arranged by three in the vertical direction and by four in the horizontal direction, and the total 24 plating modules 400 are disposed in this embodiment, but the number of plating modules 400 and arrangement of the plating modules 400 are arbitrary.

[0033] The cleaning module 500 is configured to perform a cleaning process on the substrate to remove the plating solution or the like left on the substrate after the plating process. While the two cleaning modules 500 are disposed to be arranged in the vertical direction in this embodiment, the number of cleaning modules 500 and arrangement of the cleaning modules 500 are arbitrary. The spin rinse dryer 600 is a module for rotating the substrate after the cleaning process at high speed and drying the substrate. While the two spin rinse dryers 600 are disposed to be arranged in the vertical direction in this embodiment, the number of spin rinse dryers 600 and arrangement of the spin rinse dryers 600 are arbitrary. The transfer device 700 is a device for transferring the substrate between the plurality of modules inside the plating apparatus 1000. The control module 800 is configured to control the plurality of modules in the plating apparatus 1000 and can be configured of, for example, a general computer including input / output interfaces with an operator or a dedicated computer.

[0034] An example of a sequence of the plating processes by the plating apparatus 1000 will be described. First, the substrate housed in the cassette is loaded on the load port 100. Subsequently, the transfer robot 110 grips the substrate from the cassette at the load port 100 and transfers the substrate to the aligner 120. The aligner 120 adjusts the position of the orientation flat, the notch, or the like of the substrate in the predetermined direction. The transfer robot 110 grips or releases the substrate whose direction is adjusted with the aligner 120 to the pre-wet module 200.

[0035] The pre-wet module 200 performs the pre-wet process on the substrate. The transfer device 700 transfers the substrate on which the pre-wet process has been performed to the pre-soak module 300. The pre-soak module 300 performs the pre-soak process on the substrate. The transfer device 700 transfers the substrate on which the pre-soak process has been performed to the plating module 400. The plating module 400 performs the plating process on the substrate.

[0036] The transfer device 700 transfers the substrate on which the plating process has been performed to the cleaning module 500. The cleaning module 500 performs the cleaning process on the substrate. The transfer device 700 transfers the substrate on which the cleaning process has been performed to the spin rinse dryer 600. The spin rinse dryer 600 performs the drying process on the substrate. The transfer robot 110 receives the substrate from the spin rinse dryer 600 and transfers the substrate on which the drying process has been performed to the cassette at the load port 100. Finally, the cassette housing the substrate is unloaded from the load port 100.

[0037] The configuration of the plating apparatus 1000 described in FIG. 1 and FIG. 2 is merely an example, and the configuration of the plating apparatus 1000 is not limited to the configuration of FIG. 1 and FIG. 2.

[0038] Subsequently, the plating module 400 will be described. Since a plurality of the plating modules 400 included in the plating apparatus 1000 according to this embodiment have similar configurations, only one plating module 400 will be described.

[0039] FIG. 3 is a schematic diagram illustrating the configuration of the plating module 400 of the plating apparatus 1000 according to this embodiment. Specifically, FIG. 3 schematically illustrates the plating module 400 in a state before a substrate Wf is immersed in a plating solution Ps. FIG. 4 is a schematic diagram illustrating a state where the substrate Wf is immersed in the plating solution Ps.

[0040] The plating apparatus 1000 illustrated in FIG. 3 and FIG. 4 is, for example, a cup-type plating apparatus. However, the configuration is not limited thereto, and the plating apparatus 1000 according to this embodiment may be, for example, a plating apparatus of a type in which the substrate Wf having the surface direction in the vertical direction is immersed in the plating solution Ps (that is, a vertical-type plating apparatus).

[0041] The plating module 400 of the plating apparatus 1000 illustrated in FIG. 3 and FIG. 4 includes a plating tank 10, an overflow tank 20, a substrate holder 30, and a paddle 70. The plating module 400 may include a rotation mechanism 40, an inclination mechanism 45, and an elevating mechanism 50 as illustrated in FIG. 3.

[0042] The plating tank 10 according to this embodiment is configured by a container having a bottom and an opening at its upper side. Specifically, the plating tank 10 has a bottom wall 10a and an outer peripheral wall 10b that extends upward from the outer peripheral edge of this bottom wall 10a, and an upper portion of this outer peripheral wall 10b is opened. Although the shape of the outer peripheral wall 10b of the plating tank 10 is not particularly limited, the outer peripheral wall 10b according to this embodiment has a cylindrical shape as an example. The plating tank 10 internally stores the plating solution Ps.

[0043] It is only necessary that the plating solution Ps is a solution that contains metallic element ions for constituting a plating film, and the specific examples are not particularly limited. In this embodiment, a copper plating process is used as an example of the plating process, and a copper sulfate solution is used as an example of the plating solution Ps. Furthermore, the plating solution Ps may contain a predetermined additive.

[0044] The plating tank 10 includes an anode 11 disposed in the plating solution Ps. At least during the plating process of the substrate Wf, the substrate Wf is also disposed to be opposed to the anode 11 in the plating solution Ps of the plating tank 10. A specific type of the anode 11 is not particularly limited, and an insoluble anode and / or a soluble anode may be used. In this embodiment, an insoluble anode is used as an example of the anode 11. A specific type of this insoluble anode is not particularly limited, and platinum, iridium oxide, and the like can be used.

[0045] In the plating solution Ps of the plating tank 10, an ionically resistive element 12 may be disposed above the anode 11 and below the substrate Wf (specifically, in this embodiment, further below the paddle 70). Specifically, as illustrated in FIG. 4 (an enlarged view of part B1), the ionically resistive element 12 is configured of a porous plate member having a plurality of holes 12a (pores). The holes 12a are provided to cause a lower surface to communicate with an upper surface of the ionically resistive element 12.

[0046] As illustrated in FIG. 3, a region in which the plurality of holes 12a are formed in the ionically resistive element 12 is referred to as a “hole-formed area PA.” The hole-formed area PA according to this embodiment has a circular shape in plan view. The hole-formed area PA according to this embodiment has an area that is the same as the area of a surface to be plated Wfa of the substrate Wf or greater than the area of the surface to be plated Wfa. However, it is not limited to this configuration, and the hole-formed area PA may have an area that is smaller than the area of the surface to be plated Wfa of the substrate Wf.

[0047] The ionically resistive element 12 is disposed to attempt the homogenization of an electric field formed between the anode 11 and the substrate Wf. By the ionically resistive element 12 being arranged in the plating tank 10 as in this embodiment, the uniformization of the film thickness of the plating film (a plated layer) formed on the substrate Wf can be easily attempted.

[0048] As illustrated in FIG. 3 and FIG. 4, inside the plating tank 10, at a position above the anode 11 and below the ionically resistive element 12, a membrane 16 may be arranged. In this case, the inside of the plating tank 10 is partitioned by the membrane 16 into an anode chamber 17a below the membrane 16 and a cathode chamber 17b above the membrane 16. The anode 11 is arranged in the anode chamber 17a, and the ionically resistive element 12 and the substrate Wf are arranged in the cathode chamber 17b. The membrane 16 is configured to allow ion species including metal ions included in the plating solution Ps to pass through the membrane 16 while inhibiting nonionic plating additives included in the plating solution Ps from passing through the membrane 16. As the membrane 16, an ion exchange membrane can be used, for example.

[0049] The plating tank 10 is provided with a supply port for supplying the plating solution Ps to the plating tank 10. Specifically, the outer peripheral wall 10b of the plating tank 10 according to this embodiment is provided with a first supply port 13a for supplying the plating solution Ps to the anode chamber 17a and a second supply port 13b for supplying the plating solution Ps to the cathode chamber 17b.

[0050] The plating tank 10 is provided with a first discharge port 14a for discharging the plating solution Ps in the anode chamber 17a to the outside of the plating tank 10. The plating solution Ps discharged from the first discharge port 14a is pressure-fed by a pump (not illustrated) and supplied to the anode chamber 17a from the first supply port 13a again.

[0051] The overflow tank 20 is disposed outside the plating tank 10 and configured by a container with a bottom. The overflow tank 20 is disposed for temporarily storing the plating solution Ps that has flowed over an upper end of the outer peripheral wall 10b of the plating tank 10 (that is, the plating solution Ps that has overflowed the plating tank 10). The plating solution Ps stored in the overflow tank 20 is pressure-fed by a pump (not illustrated) after discharged from a second discharge port 14b and supplied to the cathode chamber 17b from the second supply port 13b again.

[0052] The substrate holder 30 holds the substrate Wf as a cathode such that the surface to be plated Wfa of the substrate Wf is opposed to the anode 11. In this embodiment, specifically, the surface to be plated Wfa of the substrate Wf is disposed on a surface (a lower surface) of the substrate Wf oriented to a lower side.

[0053] As illustrated in FIG. 3, the substrate holder 30 may include a ring 31 disposed so as to project below an outer peripheral edge of the surface to be plated Wfa of the substrate Wf. Specifically, the ring 31 according to this embodiment has a ring shape in bottom view.

[0054] The substrate holder 30 is connected to the rotation mechanism 40. The rotation mechanism 40 is a mechanism for rotating the substrate holder 30. “R1” denoted in FIG. 3 is an exemplary rotation direction of the substrate holder 30. As the rotation mechanism 40, a known rotation motor and the like can be used. The inclination mechanism 45 is a mechanism for inclining the rotation mechanism 40 and the substrate holder 30. The elevating mechanism 50 is supported by a spindle 51 that extends in the vertical direction. The elevating mechanism 50 is a mechanism for moving up and down the substrate holder 30, the rotation mechanism 40, and the inclination mechanism 45. As the elevating mechanism 50, a known elevating mechanism, such as a linear motion type actuator, can be used.

[0055] The control module 800 includes a microcomputer, which includes a processor 801, a storage device 802 as a non-transitory storage medium, and the like. By the processor 801 operating based on commands of a program stored in the storage device 802, the control module 800 controls the operation of the plating module 400.

[0056] FIG. 5 is a schematic plan view of the paddle 70. With reference to FIG. 3, FIG. 4, and FIG. 5, the paddle 70 is located at a position between the anode 11 and the substrate Wf inside the plating tank 10. Specifically, the paddle 70 according to this embodiment is located between the ionically resistive element 12 disposed above the anode 11 and the substrate Wf.

[0057] With reference to FIG. 5, the paddle 70 is driven by a driving device 77. The operation of the driving device 77 is controlled by the control module 800. By driving the paddle 70, the plating solution Ps in the plating tank 10 is agitated.

[0058] On receiving instructions from the control module 800, the driving device 77 according to this embodiment moves the paddle 70 alternately in a “first direction (in this embodiment, for example, the X-direction)” and a “second direction (in this embodiment, for example, the-X-direction)” opposite to the first direction, which are directions parallel to the substrate Wf (or the anode 11). That is, the paddle 70 according to this embodiment reciprocates in the first direction and the second direction.

[0059] The driving device 77 according to this embodiment is configured to change a stroke when the paddle 70 is moved in the first direction and a stroke when the paddle 70 is moved in the second direction. The mechanical structure itself of the driving device 77 is not particularly limited, and a known driving device (for example, Japanese Unexamined Patent Application Publication No. 2019-151874) can be used. As a specific example, the driving device 77 according to this embodiment includes a linear motor 77a connected to the paddle 70, and is configured to reciprocate the paddle 70 by the linear motor 77a (that is, the driving device 77 according to this embodiment is, for example, a driving device of a linear motor type).

[0060] The paddle 70 according to this embodiment moves, for example, in the first direction and the second direction at a constant speed (mm / sec or rpm). Further, for example, the speed when the paddle 70 according to this embodiment moves in the first direction and the speed when the paddle 70 according to this embodiment moves in the second direction have the same value. When the speed of the paddle 70 during the reciprocation is expressed with a unit of rpm, for example, the speed of the paddle 70 of N (rpm) means that one reciprocation of the paddle 70 is performed N times in one minute.

[0061] As illustrated in FIG. 5, the paddle 70 according to this embodiment includes a plurality of beam members 71 extending in a direction (the Y-axis direction) perpendicular to the first direction (and the second direction). A clearance is provided between the adjacent beam members 71. One ends of the plurality of beam members 71 are coupled to a first coupling member 72a, and the other ends are coupled to a second coupling member 72b. When the paddle 70 is driven, specifically, the beam members 71 of the paddle 70 agitate the plating solution Ps. That is, the beam members 71 have a function as an “agitating portion.” The paddle 70 according to this embodiment has a paddle width (in FIG. 5, a length in the X-direction of the paddle 70) that is a length in the reciprocation direction, and that is smaller than a “substrate width D1 (this reference numeral is illustrated in FIG. 3)” that is a maximum value of a distance between an outer edge in the first direction and an outer edge in the second direction of the surface to be plated Wfa of the substrate Wf, but the configuration is not limited thereto. The paddle width of the paddle 70 may be the same as the substrate width D1 or larger than the substrate width D1.

[0062] The paddle width of the paddle 70 according to this embodiment is set to a size enough to avoid collision of the paddle 70 with an inner surface of the outer peripheral wall 10b of the plating tank 10 when the paddle 70 reciprocates in a first reciprocation aspect and a second reciprocation aspect described later.

[0063] The paddle 70 is preferred to be configured such that a moving region MA of the paddle 70 (that is, a range in which the paddle 70 reciprocates) when the paddle 70 agitates the plating solution Ps covers the entire hole-formed area PA of the ionically resistive element 12 in plan view. With this configuration, the plating solution Ps above the hole-formed area PA of the ionically resistive element 12 can be effectively agitated with the paddle 70.

[0064] Note that it is only necessary that the paddle 70 is arranged inside the plating tank 10 at least when agitating the plating solution Ps, and the paddle 70 need not be arranged inside the plating tank 10 constantly. For example, in a case where the driving of the paddle 70 is stopped and the agitating of the plating solution Ps with the paddle 70 is not performed, a configuration in which the paddle 70 is arranged outside the plating tank 10 is allowed.

[0065] FIG. 6 is a flowchart for describing a sequence of operations from the supply of the plating solution to the start of the plating process according to this embodiment. First, the plating solution Ps is supplied to the plating tank 10 (Step S10). Specifically, the plating solution Ps is supplied to the plating tank 10 so as to immerse the anode 11 and the ionically resistive element 12 in the plating solution Ps. More specifically, in this embodiment, the plating solution Ps is supplied to the plating tank 10 from the first supply port 13a and the second port 13b.

[0066] Next, the substrate Wf is immersed in the plating solution Ps (Step S20). Specifically, in this embodiment, the elevating mechanism 50 moves down the substrate holder 30, thereby immersing at least the surface to be plated Wfa of the substrate Wf in the plating solution Ps.

[0067] Next, the driving device 77 starts the driving of the paddle 70, thereby starting the agitating of the plating solution Ps with the paddle 70 (Step S30).

[0068] By agitating the plating solution Ps with the paddle 70, the uniformity of the plating solution Ps can be enhanced. By agitating the plating solution Ps with the paddle 70, effects described below can be provided.

[0069] Specifically, gas bubbles Bu are generated in the plating solution Ps of the plating tank 10 in some cases. For example, when the plating solution Ps is supplied to the plating tank 10, and air flows into the plating tank 10 together with the plating solution Ps, this air possibly becomes the gas bubbles Bu.

[0070] As described above, when the gas bubbles Bu are generated in the plating solution Ps of the plating tank 10, the gas bubbles Bu adhere to the holes 12a of the ionically resistive element 12 in some cases (see FIG. 4). If the plating solution Ps is not agitated with the paddle 70, a large amount of the gas bubbles Bu possibly adhere to the holes 12a. When the plating process is performed on the substrate Wf in such a state, the plating quality of the substrate Wf possibly deteriorates due to the gas bubbles Bu.

[0071] In contrast, according to this embodiment, agitating the plating solution Ps with the paddle 70 enables encouraging the gas bubbles Bu adhered to the holes 12a of the ionically resistive element 12 to move upward. This enables suctioning the gas bubbles Bu adhered to the holes 12a upward and removing them from the holes 12a. Consequently, the deterioration of the plating quality of the substrate Wf due to the gas bubbles Bu adhered to the holes 12a can be reduced.

[0072] With reference to FIG. 6, after Step S30, an energization device (not illustrated) is used to electrically connect the anode 11 and the substrate Wf, thereby starting the plating process on the substrate Wf (Step S40). Thus, the formation of the plating film on the surface to be plated Wfa of the substrate Wf is started. Specifically, in this embodiment, also during the execution of the plating process on the substrate Wf according to Step S40, the agitating of the plating solution Ps with the paddle 70 according to Step S30 is performed (that is, while the plating solution Ps is agitated, the formation of the plating film on the surface to be plated Wfa is performed).

[0073] The timing of the agitating of the plating solution Ps with the paddle 70 is not limited to the above-described timing. For example, also at a timing between Step S10 and Step S20 (that is, a timing after the plating solution Ps is supplied to the plating tank 10 and before the substrate Wf is immersed in the plating solution Ps), the plating solution Ps may be agitated with the paddle 70.

[0074] FIG. 7 is an example of a flowchart for describing details of the operation of the paddle 70. Specifically, FIG. 7 illustrates details of the operation of the paddle 70 in Step S30 of FIG. 6. With reference to mainly FIG. 5 and FIG. 7, details of the operation of the paddle 70 is described below.

[0075] First, with reference to FIG. 5, assume that an arrangement pitch in the first direction of the respective beam members 71 is “d (mm),” a width in the first direction of each beam member 71 is “W (mm),” and the number of times of reciprocation of the paddle 70 is “n (times).” The number of times of reciprocation is counted as, for example, “once” when the paddle 70 moves in the first direction, and then moves in the second direction.

[0076] With reference to FIG. 7, first, the paddle 70 is driven by the driving device 77 that has received the instructions from the control module 800, thereby reciprocating in the “first reciprocation aspect” described below (Step S31).

[0077] In the first reciprocation aspect, the paddle 70 moves in the second direction with a stroke different from a stroke when moving in the first direction, thus changing positions of the beam members 71 when the paddle 70 changes the moving direction from the second direction to the first direction (that is, a move start position (that is, a “starting point”) when the paddle 70 reciprocates once) and positions of the beam members 71 when the paddle 70 changes the moving direction from the first direction to the second direction (that is, a turning position (that is, an “ending point”) when the paddle 70 reciprocates once). Thus, an average dwelling time of the beam members 71 during the plating process is uniformed.

[0078] For example, in this embodiment, in the first reciprocation aspect, the stroke of the paddle 70 when the paddle 70 moves in the second direction is shorter than the stroke of the paddle 70 when the paddle 70 moves in the first direction. Specifically, as an example of the first reciprocation aspect, the paddle 70 according to this embodiment moves in the first direction with a stroke of “A (mm),” then moves in the second direction with a stroke of “A-W (mm),” and performs this move once or more.

[0079] That is, in the first reciprocation aspect, the paddle 70 moves in the first direction by “A (mm),” and then moves in the second direction by “A-W (mm).” Thus, in the first reciprocation aspect, a distance of moving in the second direction of the paddle 70 is shorter than a distance of moving in the first direction of the paddle 70 by “W (mm).” As a result, in the first reciprocation aspect, the position at which the paddle 70 starts reciprocation is shifted in the first direction by “W (mm)” for each reciprocation.

[0080] However, Step S31 is not limited to the above-described configuration, and for example, in Step S31, the stroke in the second direction may have a value shorter than “A (mm)” and larger than “A-W (mm).”

[0081] Subsequently, the control module 800 determines whether or not the paddle 70 has reciprocated multiple times (Step S32). For example, the control module 800 according to this embodiment determines whether or not a relation of “W×n>d” is satisfied. That is, in Step S32, the control module 800 determines whether or not a value obtained by multiplying the width (W) of the beam member 71 by the number (n) of times of reciprocation of the paddle 70 is larger than the arrangement pitch (d) of the beam members 71.

[0082] Usually, the reciprocation of the paddle 70 in the first reciprocation aspect according to Step S31 is performed until the determination of Yes is obtained in Step S32.

[0083] When the determination is Yes in Step S32 (that is, when the relation of “W×n>d” is satisfied), the paddle 70 is driven by the driving device 77 that has received the instructions from the control module 800, thereby reciprocating in the “second reciprocation aspect” described below (Step S33). That is, the paddle 70 according to this embodiment reciprocates multiple times in the first reciprocation aspect, and then reciprocates in the second reciprocation aspect.

[0084] In the second reciprocation aspect, the paddle 70 moves in the second direction with a stroke longer than the stroke when moving in the first direction, thus changing the positions of the beam members 71 when the paddle 70 changes the moving direction from the second direction to the first direction (the starting point) and the positions of the beam members 71 when the paddle 70 changes the moving direction from the first direction to the second direction (ending point). Thus, the average dwelling time of the beam members 71 during the plating process is uniformed.

[0085] Specifically, as an example of the second reciprocation aspect, the paddle 70 according to this embodiment moves in the first direction with the stroke of “A-W (mm),” then moves in the second direction with the stroke of “A (mm),” and performs this move once or more.

[0086] That is, in the second reciprocation aspect, the paddle 70 moves in the first direction by “A-W (mm),” and then moves in the second direction by “A (mm).” That is, in the second reciprocation aspect, the distance of moving in the first direction of the paddle 70 is shorter than the distance of moving in the second direction of the paddle 70 by “W (mm).” As a result, in the second reciprocation aspect, the position at which the paddle 70 starts reciprocation is shifted in the second direction by “W (mm)” for each reciprocation.

[0087] However, Step S33 is not limited to the above-described configuration, and for example, in Step S33, the stroke in the first direction may have a value shorter than “A (mm)” and larger than “A-W (mm).”

[0088] While the timing of ending the reciprocation of the paddle 70 in the second reciprocation aspect is not particularly limited, the control module 800 according to this embodiment ends the reciprocation of the paddle 70 in the second reciprocation aspect, for example, when the number of times of reciprocation of the paddle 70 after the start of the reciprocation of the paddle 70 in the second reciprocation aspect becomes “n (times) (this is the same value as n in Step S32).”

[0089] When the reciprocation of the paddle 70 in the second reciprocation aspect ends, the control module 800 may execute the flowchart of FIG. 7 from Step S31 again (that is, the flowchart of FIG. 7 may be repeatedly executed). When the control module 800 receives a drive stop request to forcibly stop the driving of the paddle 70 at any timing of the flowchart of FIG. 7, the control module 800 may forcibly end the execution of the flowchart of FIG. 7 and stop the driving of the paddle 70.

[0090] According to this embodiment as described above, since the aspect of the reciprocation of the paddle 70 includes the first reciprocation aspect, when the paddle 70 changes the moving direction from the first direction to the second direction, and when the paddle 70 changes the moving direction from the second direction to the first direction (that is, when the speed of the paddle 70 during the reciprocation becomes zero), it can be avoided that the beam members 71 of the paddle 70 are located at the same position. Accordingly, the influence of blocking the electric field by the beam members 71 of the paddle 70 can be reduced. Consequently, the plating quality of the substrate Wf can be improved. Specifically, for example, the uniformity of the film thickness of the plating film formed on the substrate Wf can be enhanced.

[0091] Furthermore, according to this embodiment, since the aspect of the reciprocation of the paddle 70 further includes the second reciprocation aspect, the influence of blocking the electric field by the beam members 71 of the paddle 70 can be more reduced. Consequently, the plating quality of the substrate Wf can be more improved.

[0092] The configuration of this embodiment is not limited to the above-described configuration, and for example, in the second reciprocation aspect, the stroke of the paddle 70 during the reciprocation may be constant. Specifically, in this case, in the second reciprocation aspect, the paddle 70 may move in the first direction and the second direction with the stroke of A (mm). Even in this case, insofar as the reciprocation of the paddle 70 includes the above-described first reciprocation aspect, the influence of blocking the electric field by the beam members 71 of the paddle 70 can be reduced.

[0093] In the first reciprocation aspect, the stroke when the paddle 70 moves in the second direction may be longer than the stroke when the paddle 70 moves in the first direction. For example, in this case, in the first reciprocation aspect, the paddle 70 may move in the first direction with the stroke of “A-W (mm),” and then move in the second direction with the stroke of “A (mm).” Then, in this case, in the second reciprocation aspect, the stroke when the paddle 70 moves in the second direction is preferably shorter than the stroke when the paddle 70 moves in the first direction. For example, in this case, in the second reciprocation aspect, the paddle 70 only needs to move in the first direction with the stroke of “A (mm),” and then move in the second direction with the stroke of “A-W (mm).”(Modification 1)

[0094] FIG. 8A and FIG. 8B are schematic diagrams for describing a plating apparatus 1000 according to Modification 1 of the embodiment. Specifically, FIG. 8A and FIG. 8B are schematic cross-sectional views of an enlarged peripheral configuration of an ionically resistive element 12 of the plating apparatus 1000 according to this modification. In FIG. 8A and FIG. 8B, the paddle 70 is illustrated with one beam member 71.

[0095] This modification is different from the above-described embodiment in that in at least one of the first reciprocation aspect and the second reciprocation aspect, when the paddle 70 moves in the first direction multiple times, or when the paddle 70 moves in the second direction multiple times, the paddle 70 moves at different speeds.

[0096] As a specific example of this, in this the modification, in “both” of the first reciprocation aspect and the second reciprocation aspect, when the paddle 70 moves in the first direction multiple times, or when the paddle 70 moves in the second direction multiple times, the paddle 70 move at different speeds.

[0097] As an example of this, FIG. 8A and FIG. 8B illustrate a state where the paddle 70 moves at different speeds when the paddle 70 moves in the “first direction” multiple times. Specifically, the first reciprocation aspect and the second reciprocation aspect according to this modification include that the paddle 70 moves in the first direction at a “first speed V1 (mm / sec or rpm)” as illustrated in FIG. 8A, and that the paddle 70 moves in the first direction at a “second speed V2 (mm / sec or rpm)” faster than the first speed V1 as illustrated in FIG. 8B.

[0098] Specifically, when the driving device 77 that has received the instructions from the control module 800 according to this modification moves the paddle 70 in the first direction multiple times in the first reciprocation aspect and the second reciprocation aspect, the driving device 77 moves the paddle 70 at the first speed V1 in some times of the reciprocation and moves the paddle 70 at the second speed V2 in the other times of the reciprocation among the multiple times of the reciprocation in the first direction.

[0099] In the above-described case, when moving the paddle 70 in the second direction, the driving device 77 only needs to move the paddle 70, for example, at one speed (that is, a constant speed) selected from the first speed V1 and the second speed V2.

[0100] Alternatively, this modification can have a configuration in which the paddle 70 moves in the “second direction” multiple times at different speeds. Specifically, in this case, at least one of the first reciprocation aspect and the second reciprocation aspect includes that the paddle 70 moves in the second direction at the first speed V1, and that the paddle 70 moves in the second direction at the second speed V2.

[0101] According to this modification, with the paddle 70 moving in the first direction multiple times at different speeds or moving in the second direction multiple times at different speeds, the gas bubbles Bu adhered to the holes 12a of the ionically resistive element 12 can be effectively removed. Accordingly, the deterioration of the plating quality of the substrate Wf due to the gas bubbles Bu adhered to the holes 12a of the ionically resistive element 12 can be reduced (that is, the plating quality of the substrate Wf can be improved).

[0102] Specifically, according to this modification, as illustrated in FIG. 8A, when the paddle 70 moves at a relatively low speed, the relatively large gas bubbles Bu adhered to the holes 12a of the ionically resistive element 12 can be suctioned upward and effectively removed from the holes 12a.

[0103] Meanwhile, as illustrated in FIG. 8B, when the paddle 70 moves at a relatively high speed, the relatively small gas bubbles Bu adhered to the holes 12a of the ionically resistive element 12 (that is, the gas bubbles Bu having sizes with which the gas bubbles Bu are not suctioned when the paddle 70 moves at a low speed) can be suctioned and effectively removed from the holes 12a.

[0104] Specifically, in this case, the paddle 70 moving at the second speed V2 enables effectively forming a vortex flow Sw of the plating solution Ps between the beam members 71 of the paddle 70 and the upper surface of the ionically resistive element 12. With this vortex flow Sw, even when the size of the gas bubbles Bu adhered to the holes 12a is small, the gas bubbles Bu can be effectively suctioned and removed from the holes 12a. Thus, according to this modification, the gas bubbles Bu different in sizes adhered to the holes 12a of the ionically resistive element 12 can be effectively removed.

[0105] While the specific value of the first speed V1 is not particularly limited, for example, a speed capable of removing the gas bubbles Bu having a size (a maximum outside dimension) of a reference value or more from the holes 12a of the ionically resistive element 12 can be used.

[0106] For the first speed V1, for example, it is only necessary to obtain an appropriate value by an experiment or the like. While the specific value of the second speed V2 is not particularly limited insofar as the second speed V2 is a speed faster than the first speed V1, for example, a speed capable of removing the gas bubbles Bu having a size of less than the reference value from the holes 12a can be used. Also for the second speed V2, for example, it is only necessary to obtain an appropriate value by an experiment or the like.

[0107] As an example of an appropriate ratio between the first speed V1 and the second speed V2, a speed of about 1.5 times or more the first speed V1 can be used as the second speed V2.(Modification 2)

[0108] FIG. 9A and FIG. 9B are schematic diagrams for describing a plating apparatus 1000 according to Modification 2 of the embodiment. Specifically, FIG. 9A and FIG. 9B are schematic cross-sectional views of an enlarged peripheral configuration of an ionically resistive element 12 of the plating apparatus 1000 according to this modification. In FIG. 9A and FIG. 9B, the paddle 70 is illustrated with one beam member 71.

[0109] This modification is different from the above-described embodiment and Modification 1 in that in at least one of the first reciprocation aspect and the second reciprocation aspect, the paddle 70 moves in the first direction at the “first speed V1” (see FIG. 9A), and then moves in the second direction at the “second speed V2” different from the first speed (see FIG. 9B).

[0110] That is, the driving device 77 that has received the instructions from the control module 800 according to this modification moves the paddle 70 in the first direction at the first speed V1, then moves the paddle 70 in the second direction at the second speed V2, and repeatedly performs this move multiple times in at least one of the first reciprocation aspect and the second reciprocation aspect.

[0111] In this modification, the second speed V2 is, for example, a speed faster than the first speed V1. However, the configuration is not limited thereto, and the second speed V2 may be a speed slower than the first speed V1.

[0112] According to this modification, in one reciprocation of the paddle 70, the paddle 70 can move at the first speed V1 and the second speed V2. This enables effectively removing the gas bubbles Bu adhered to the holes 12a of the ionically resistive element 12. As a result, the plating quality of the substrate Wf can be improved.

[0113] Specifically, in one reciprocation of the paddle 70, when the paddle 70 moves at a relatively low speed (FIG. 9A), the relatively large gas bubbles Bu adhered to the holes 12a of the ionically resistive element 12 can be suctioned upward and effectively removed from the holes 12a. Meanwhile, when the paddle 70 moves at a relatively high speed (FIG. 9B), the relatively small gas bubbles Bu adhered to the holes 12a of the ionically resistive element 12 can be suctioned upward and effectively removed from the holes 12a. (Another Modification)

[0114] In Modification 1 and Modification 2 described above, the stroke when the paddle 70 reciprocates may be constant. That is, in this case, the paddle 70 may move in the first direction and the second direction by A (mm) for each direction during the reciprocation. With this configuration, while it is difficult to provide the operational advantage specific to the above-described embodiment, the operational advantage specific to Modification 1 and Modification 2 (the operational advantage of removing the gas bubbles Bu adhered to the holes 12a of the ionically resistive element 12 to improve the plating quality of the substrate Wf) can be provided.

[0115] As described above, while the details of the embodiments and modifications of the present invention have been described, the present invention is not limited to the specific embodiments and modifications, and various kinds of modifications and changes can further be made within the gist of the present invention.REFERENCE SIGNS LIST10 . . . plating tank

[0117] 11 . . . anode

[0118] 12 . . . ionically resistive element

[0119] 12a . . . hole

[0120] 30 . . . substrate holder

[0121] 70 . . . paddle

[0122] 71 . . . beam member

[0123] 77 . . . driving device

[0124] 1000 . . . plating apparatus

[0125] Wf . . . substrate

[0126] Ps . . . plating solution

[0127] Bu . . . gas bubbles

[0128] V1 . . . first speed

[0129] V2 . . . second speed

Claims

1. A plating apparatus comprising:a plating tank configured to store a plating solution, the plating tank including an anode disposed in the plating solution and a substrate disposed to be opposed to the anode in the plating solution; anda paddle disposed between the anode and the substrate and configured to reciprocate parallel to the substrate in a first direction and a second direction opposite to the first direction to agitate the plating solution, whereinthe paddle includes a plurality of beam members extending in a direction perpendicular to a reciprocation direction of the paddle,a reciprocation of the paddle in the first direction and the second direction includes reciprocation of the paddle in a first reciprocation aspect, andin the first reciprocation aspect, the paddle moves in the second direction with a stroke by a predetermined constant value different from a stroke when moving in the first direction to change positions of the plurality of beam members when the paddle changes a moving direction from the second direction to the first direction and positions of the plurality of beam members when the paddle changes the moving direction from the first direction to the second direction.

2. The plating apparatus according to claim 1, whereinthe reciprocation of the paddle in the first direction and the second direction includes reciprocation of the paddle in a second reciprocation aspect after multiple times of the reciprocation in the first reciprocation aspect,in the first reciprocation aspect, the stroke of the paddle when the paddle moves in the second direction is shorter than the stroke of the paddle when the paddle moves in the first direction by the predetermined constant value, andin the second reciprocation aspect, the paddle moves in the second direction with the stroke longer than the stroke when moving in the first direction by the predetermined constant value to change the positions of the plurality of beam members when the paddle changes the moving direction from the second direction to the first direction and the positions of the plurality of beam members when the paddle changes the moving direction from the first direction to the second direction.

3. The plating apparatus according to claim 1, whereinthe reciprocation of the paddle in the first direction and the second direction includes reciprocation of the paddle in a second reciprocation aspect after multiple times of the reciprocation in the first reciprocation aspect,in the first reciprocation aspect, the stroke of the paddle when the paddle moves in the second direction is longer than the stroke of the paddle when the paddle moves in the first direction by the predetermined constant value, andin the second reciprocation aspect, the paddle moves in the second direction with the stroke shorter than the stroke when moving in the first direction by the predetermined constant value to change the positions of the plurality of beam members when the paddle changes the moving direction from the second direction to the first direction and the positions of the plurality of beam members when the paddle changes the moving direction from the first direction to the second direction.

4. The plating apparatus according to claim 1, whereinthe substrate is disposed above the anode, andan ionically resistive element with a plurality of holes is disposed above the anode and below the paddle in the plating solution.

5. The plating apparatus according to claim 4, wherein the reciprocation of the paddle in the first direction and the second direction includes that the paddle moves in the first direction multiple times at different speeds, or that the paddle moves in the second direction multiple times at different speeds.

6. The plating apparatus according to claim 4, wherein the reciprocation of the paddle in the first direction and the second direction includes that the paddle moves in the first direction at a first speed and then moves in the second direction at a second speed different from the first speed.

7. A plating apparatus comprising:a plating tank configured to store a plating solution, the plating tank including an anode disposed in the plating solution and a substrate disposed to be opposed to the anode in the plating solution; anda paddle disposed between the anode and the substrate and configured to reciprocate parallel to the substrate in a first direction and a second direction opposite to the first direction to agitate the plating solution, whereinthe substrate is disposed above the anode,an ionically resistive element with a plurality of holes is disposed above the anode and below the paddle in the plating solution,a reciprocation of the paddle in the first direction and the second direction includes that the paddle moves in the first direction at a first speed and then moves in the second direction at a second speed faster than the first speed; andthe paddle is configured to move at the first speed to suction gas bubbles of a predetermined size adhering to the holes of the ionically resistive element and remove them from the holes, and the paddle is configured to move at the second speed to suction gas bubbles of a size smaller than the predetermined size adhering to the holes of the ionically resistive element and remove them from the holes.

8. The plating apparatus according to claim 2, whereinin the second reciprocation aspect, the paddle reciprocates a same number of times as a number of a reciprocation of the paddle in the first reciprocation aspect to end a reciprocation of the paddle in the second reciprocating aspect.

9. The plating apparatus according to claim 3, whereinin the second reciprocation aspect, the paddle reciprocates a same number of times as a number of a reciprocation of the paddle in the first reciprocation aspect to end a reciprocation of the paddle in the second reciprocating aspect.

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