Wafer support of semiconductor manufacturing apparatus

Description

[0001] FIG. 1 is a front, top and right side perspective view of a wafer support of semiconductor manufacturing apparatus showing my new design;

[0002] FIG. 2 is a front elevational view thereof;

[0003] FIG. 3 is a rear elevational view thereof;

[0004] FIG. 4 is a right side elevational view thereof;

[0005] FIG. 5 is a left side elevational view thereof;

[0006] FIG. 6 is a top plan view thereof;

[0007] FIG. 7 is a bottom plan view thereof;

[0008] FIG. 8 is a cross-sectional view taken along line 8-8 in FIG. 2 thereof;

[0009] FIG. 9 is an enlarged cross-sectional view taken along line 9-9 in FIG. 2 thereof;

[0010] FIG. 10 is an enlarged cross-sectional view taken along line 10-10 in FIG. 2 thereof; and,

[0011] FIG. 11 is an enlarged view taken from the broken line box labeled 11 in FIG. 1.

[0012] The broken lines in FIG. 1 and FIG. 11 show the boundary of the enlarged portion views and form no part of the claimed design.

Claims

The ornamental design for a wafer support of semiconductor manufacturing apparatus, as shown and described.

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