Carrier substrate for handling
Patent Information
- Application Number
- US29/835098
- Authority / Receiving Office
- US · United States
- Patent Type
- Designs(United States)
- Current Assignee / Owner
- Priority Date
- 2021-10-15
- Filing Date
- 2022-04-15
- Publication Date
- 2024-12-17
- Estimated Expiration
- 2039-12-17
Smart Images

Figure USD1054388-D00000_ABST
Description
[0001] FIG. 1 is a perspective view of a first embodiment of a carrier substrate for handling, showing our new design;
[0002] FIG. 2 is a front elevational view thereof;
[0003] FIG. 3 is a rear elevational view thereof;
[0004] FIG. 4 is a left-side elevational view thereof, the right-side elevational view being a mirror image thereof;
[0005] FIG. 5 is a top plan view thereof;
[0006] FIG. 6 is a bottom plan view thereof;
[0007] FIG. 7 is an enlarged view taken from encircled portion labeled, “FIG. 7,” in FIG. 1;
[0008] FIG. 8 is an enlarged view taken from encircled portion labeled, “FIG. 8,” in FIG. 1;
[0009] FIG. 9 is an enlarged view taken from encircled portion labeled, “FIG. 9,” in FIG. 2; and
[0010] FIG. 10 is an enlarged view taken from encircled portion labeled, “FIG. 10,” in FIG. 4.
[0011] FIG. 11 is a perspective view of a second embodiment of a carrier substrate for handling, showing our new design;
[0012] FIG. 12 is a front elevational view thereof;
[0013] FIG. 13 is a rear elevational view thereof;
[0014] FIG. 14 is a left-side elevational view thereof, the right-side elevational view being a mirror image thereof;
[0015] FIG. 15 is a top plan view thereof;
[0016] FIG. 16 is a bottom plan view thereof;
[0017] FIG. 17 is an enlarged view taken from encircled portion labeled, “FIG. 17,” in FIG. 11; and,
[0018] FIG. 18 is an enlarged view taken from encircled portion labeled, “FIG. 18,” in FIG. 14.
[0019] The evenly-spaced broken lines depict parts of the carrier substrate for handling that form no part of the claimed design. The dot-dash broken lines depict boundaries of the enlarged portion views shown in FIGS. 1, 2, 4, 7-11, 14, 17, and 18, and form no part of the claimed design.
Claims
The ornamental design for a carrier substrate for handling as shown and described.
Citation Information
Patent Citations
Manufacturing method of stationary carrier
JP2006310616A
Transfer method of minute structure
JP2008227107A
Microstructure transfer device, stamp head unit, microstructure transfer stamp component, and microstructure integrated component transfer method
JP2020129638A
Part of the substrate processing apparatus for the crystal boat
TWD208179S
Semiconductor device and method of controlling warpage in reconstituted wafer
TWI689017B
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