Semiconductor device

USD1054390SActive Publication Date: 2024-12-17NEC CORP

Patent Information

Application Number
US29/865043
Authority / Receiving Office
US · United States
Patent Type
Designs(United States)
Current Assignee / Owner
Priority Date
2022-01-05
Filing Date
2022-07-05
Publication Date
2024-12-17
Estimated Expiration
2039-12-17

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Description

[0001] FIG. 1 is a front view of a semiconductor device showing our new design;

[0002] FIG. 2 is a rear elevational view thereof;

[0003] FIG. 3 is a left side view thereof;

[0004] FIG. 4 is a right view thereof;

[0005] FIG. 5 is a top plan view view thereof; and,

[0006] FIG. 6 is a bottom plan view thereof.

[0007] The dash-dash broken lines in the drawings illustrate portions of the article that form no part of the claimed design.

[0008] The dot-dash broken lines in the drawings illustrate the bounds of the claim and form no part of the claimed design.

Claims

The ornamental design for a semiconductor device as shown and described.

Citation Information

Patent Citations

  • Semiconductor apparatus

    US20090057925A1

  • Compound metal lid for semiconductor chip package

    US20230068670A1

  • Semiconductor package with metal posts from structured leadframe

    US20230170226A1

  • TAB tape and semiconductor device including TAB tape

    US5801434A

  • Semiconductor device

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