Semiconductor device
USD1054390SActive Publication Date: 2024-12-17NEC CORP
Patent Information
- Application Number
- US29/865043
- Authority / Receiving Office
- US · United States
- Patent Type
- Designs(United States)
- Current Assignee / Owner
- Priority Date
- 2022-01-05
- Filing Date
- 2022-07-05
- Publication Date
- 2024-12-17
- Estimated Expiration
- 2039-12-17
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Figure USD1054390-D00000_ABST
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Description
[0001] FIG. 1 is a front view of a semiconductor device showing our new design;
[0002] FIG. 2 is a rear elevational view thereof;
[0003] FIG. 3 is a left side view thereof;
[0004] FIG. 4 is a right view thereof;
[0005] FIG. 5 is a top plan view view thereof; and,
[0006] FIG. 6 is a bottom plan view thereof.
[0007] The dash-dash broken lines in the drawings illustrate portions of the article that form no part of the claimed design.
[0008] The dot-dash broken lines in the drawings illustrate the bounds of the claim and form no part of the claimed design.
Claims
The ornamental design for a semiconductor device as shown and described.
Citation Information
Patent Citations
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US20230170226A1
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US6097082A
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