Power semiconductor module

USD1056861SActive Publication Date: 2025-01-07ROHM CO LTD

Patent Information

Application Number
US29/808482
Authority / Receiving Office
US · United States
Patent Type
Designs(United States)
Current Assignee / Owner
Priority Date
2021-03-23
Filing Date
2021-09-20
Publication Date
2025-01-07
Estimated Expiration
2040-01-07

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Description

[0001] FIG. 1 is a front, top and right side perspective view of a second embodiment of a power semiconductor module showing our new design;

[0002] FIG. 2 is a front view thereof, the rear view being an identical image of FIG. 2;

[0003] FIG. 3 is a top plan view thereof;

[0004] FIG. 4 is a bottom plan view thereof; and,

[0005] FIG. 5 is a right side view thereof, the left side view being an identical image of FIG. 5.

[0006] The broken lines illustrate portions of the power semiconductor module that form no part of the claimed design.

Claims

The ornamental design for a power semiconductor module, as shown and described.

Citation Information

Patent Citations

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    JP1664282S

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    US11522058B2

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    US11538936B2

  • Semiconductor chip mounting substrate, semiconductor chip mounting body, semiconductor chip stacked module, and semiconductor chip mounting substrate manufacturing method

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