Light emitting chip scale package
Patent Information
- Application Number
- US29/884199
- Authority / Receiving Office
- US · United States
- Patent Type
- Designs(United States)
- Current Assignee / Owner
- Filing Date
- 2023-02-08
- Publication Date
- 2025-01-14
- Estimated Expiration
- 2040-01-14
Smart Images

Figure USD1057674-D00000_ABST
Description
[0001] FIG. 1 is a perspective view of the light emitting chip scale package;
[0002] FIG. 2 is a front view of the light emitting chip scale package shown in FIG. 1;
[0003] FIG. 3 is a rear view of the light emitting chip scale package shown in FIG. 1;
[0004] FIG. 4 is a left side view of the light emitting chip scale package shown in FIG. 1;
[0005] FIG. 5 is a right side view of the light emitting chip scale package shown in FIG. 1;
[0006] FIG. 6 is a top view of the light emitting chip scale package shown in FIG. 1; and,
[0007] FIG. 7 is a bottom view of the light emitting chip scale package shown in FIG. 1.
[0008] The broken lines illustrate portions of the design that form no part of the claim.
Claims
The ornamental design for a light emitting chip scale package as shown and described.
Citation Information
Patent Citations
Surface-mounting semiconductor device and method of making the same
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Light-emitting element package and display device having same
US20190067255A1
Semiconductor device package, optical package, and method for manufacturing the same
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Light emitting element for pixel and LED display module
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