Light emitting chip scale package

USD1057674SActive Publication Date: 2025-01-14AUTOSYSTEMS BELLEVILLE INC

Patent Information

Application Number
US29/884199
Authority / Receiving Office
US · United States
Patent Type
Designs(United States)
Current Assignee / Owner
Filing Date
2023-02-08
Publication Date
2025-01-14
Estimated Expiration
2040-01-14

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Description

[0001] FIG. 1 is a perspective view of the light emitting chip scale package;

[0002] FIG. 2 is a front view of the light emitting chip scale package shown in FIG. 1;

[0003] FIG. 3 is a rear view of the light emitting chip scale package shown in FIG. 1;

[0004] FIG. 4 is a left side view of the light emitting chip scale package shown in FIG. 1;

[0005] FIG. 5 is a right side view of the light emitting chip scale package shown in FIG. 1;

[0006] FIG. 6 is a top view of the light emitting chip scale package shown in FIG. 1; and,

[0007] FIG. 7 is a bottom view of the light emitting chip scale package shown in FIG. 1.

[0008] The broken lines illustrate portions of the design that form no part of the claim.

Claims

The ornamental design for a light emitting chip scale package as shown and described.

Citation Information

Patent Citations

  • Surface-mounting semiconductor device and method of making the same

    US20040164395A1

  • Light-emitting element package and display device having same

    US20190067255A1

  • Semiconductor device package, optical package, and method for manufacturing the same

    US20190115505A1

  • Light emitting element for pixel and LED display module

    US20200013759A1

  • Photocoupler

    US20200091367A1

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