Circuit board with heat sink
Patent Information
- Application Number
- US29/890173
- Authority / Receiving Office
- US · United States
- Patent Type
- Designs(United States)
- Current Assignee / Owner
- Priority Date
- 2023-04-13
- Filing Date
- 2023-04-20
- Publication Date
- 2025-01-28
- Estimated Expiration
- 2040-01-28
Smart Images

Figure USD1059314-D00000_ABST
Description
[0001] FIG. 1 is a front, right side perspective view of a circuit board with heat sink, showing our new design;
[0002] FIG. 2 is a front view thereof;
[0003] FIG. 3 is a rear view thereof;
[0004] FIG. 4 is a top view thereof;
[0005] FIG. 5 is a bottom view thereof;
[0006] FIG. 6 is a right side view thereof;
[0007] FIG. 7 is a left side view thereof;
[0008] FIG. 8 is a rear, left side perspective view thereof;
[0009] FIG. 9 is an enlarged portion view taken from encircled portion labeled, “9,” in FIG. 6; and,
[0010] FIG. 10 is an enlarged portion view taken from encircled portion labeled, “10,” in FIG. 7.
[0011] The dash-dot broken lines represent the boundary of the enlarged portion views ofFIGS. 9 and 10 shown in FIGS. 6, 7, 9 and 10 and form no part of the claimed design. The even dashed broken lines shown in the drawings represent portions of the circuit board with heat sink that form no part of the claimed design.
Claims
The ornamental design for a circuit board with heat sink, as shown and described.
Citation Information
Patent Citations
Printed circuit assembly with determination of storage configuration based on installed paddle board
US20090268390A1
Circuit board for mounting and inter-connecting electrical components
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Circuit structure with W, WC and / or W2C layer on AlN substrate
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Circuit board
USD1001753S
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