Package structure for a semiconductor element
USD1059315SActive Publication Date: 2025-01-28GANRICH SEMICONDUCTOR CORP INC
Patent Information
- Application Number
- US29/890845
- Authority / Receiving Office
- US · United States
- Patent Type
- Designs(United States)
- Current Assignee / Owner
- Priority Date
- 2022-11-02
- Filing Date
- 2023-04-27
- Publication Date
- 2025-01-28
- Estimated Expiration
- 2040-01-28
Smart Images
Figure USD1059315-D00000_ABST
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Description
[0001] FIG. 1 is a top perspective view of a package structure for a semiconductor element, showing our new design;
[0002] FIG. 2 is a bottom perspective view thereof;
[0003] FIG. 3 is a front elevational view thereof;
[0004] FIG. 4 is a rear elevational view thereof;
[0005] FIG. 5 is a right side elevational view thereof;
[0006] FIG. 6 is a left side elevational view thereof;
[0007] FIG. 7 is a top plan view thereof; and,
[0008] FIG. 8 is a bottom plan view thereof.
Claims
The ornamental design for a package structure for a semiconductor element, as shown and described.
Citation Information
Patent Citations
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