Heat sink for memory module
Patent Information
- Application Number
- US29/814021
- Authority / Receiving Office
- US · United States
- Patent Type
- Designs(United States)
- Current Assignee / Owner
- Filing Date
- 2021-11-02
- Publication Date
- 2025-03-11
- Estimated Expiration
- 2040-03-11
Smart Images

Figure USD1066274-D00000_ABST
Description
[0001] FIG. 1 is a perspective view of a heat sink for memory module showing the claimed design;
[0002] FIG. 2 is another perspective view thereof;
[0003] FIG. 3 is a front elevational view thereof;
[0004] FIG. 4 is a rear elevational view thereof;
[0005] FIG. 5 is an enlarged left side elevational view thereof;
[0006] FIG. 6 is an enlarged right side elevational view thereof;
[0007] FIG. 7 is a top plan view thereof;
[0008] FIG. 8 is a bottom plan view thereof;
[0009] FIG. 9 is an enlarged view illustrating the details of the dot-dash area “9” indicated in FIG. 1; and,
[0010] FIG. 10 is an enlarged view illustrating the details of the dot-dash area “10” indicated in FIG. 8.
[0011] The dash-dash broken lines in the drawings illustrate environmental subject matter and portions of the article that form no part of the claimed design.
[0012] The dot-dash lines in the figures represent the boundaries of the enlarged areas in which the dot-dash lines, lead line and numeral designation form no part of the claimed design.
Claims
The ornamental design for a heat sink for memory module as shown and described.
Citation Information
Patent Citations
Heat transfer apparatus
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Memory heat sink device
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Heat sink for memory
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Orthogonally hinged individualized memory module cooling
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Heat-dissipating device for memory
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