Heat sink for memory module

USD1066274SActive Publication Date: 2025-03-11KINGSTON DIGITAL INC

Patent Information

Application Number
US29/814021
Authority / Receiving Office
US · United States
Patent Type
Designs(United States)
Current Assignee / Owner
Filing Date
2021-11-02
Publication Date
2025-03-11
Estimated Expiration
2040-03-11

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Description

[0001] FIG. 1 is a perspective view of a heat sink for memory module showing the claimed design;

[0002] FIG. 2 is another perspective view thereof;

[0003] FIG. 3 is a front elevational view thereof;

[0004] FIG. 4 is a rear elevational view thereof;

[0005] FIG. 5 is an enlarged left side elevational view thereof;

[0006] FIG. 6 is an enlarged right side elevational view thereof;

[0007] FIG. 7 is a top plan view thereof;

[0008] FIG. 8 is a bottom plan view thereof;

[0009] FIG. 9 is an enlarged view illustrating the details of the dot-dash area “9” indicated in FIG. 1; and,

[0010] FIG. 10 is an enlarged view illustrating the details of the dot-dash area “10” indicated in FIG. 8.

[0011] The dash-dash broken lines in the drawings illustrate environmental subject matter and portions of the article that form no part of the claimed design.

[0012] The dot-dash lines in the figures represent the boundaries of the enlarged areas in which the dot-dash lines, lead line and numeral designation form no part of the claimed design.

Claims

The ornamental design for a heat sink for memory module as shown and described.

Citation Information

Patent Citations

  • Heat transfer apparatus

    US20030011993A1

  • Memory heat sink device

    US20030026076A1

  • Heat sink for memory

    US20060268523A1

  • Orthogonally hinged individualized memory module cooling

    US20150212555A1

  • Heat-dissipating device for memory

    USD626521S

Cited By

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