Stamp component for transferring microstructure
Patent Information
- Application Number
- US29/835030
- Authority / Receiving Office
- US · United States
- Patent Type
- Designs(United States)
- Current Assignee / Owner
- Priority Date
- 2021-10-15
- Filing Date
- 2022-04-15
- Publication Date
- 2025-04-15
- Estimated Expiration
- 2040-04-15
Smart Images
Figure USD1070795-D00000_ABST
Description
[0001] FIG. 1 is a perspective view of a stamp component for transferring microstructure, showing our new design;
[0002] FIG. 2 is a front elevational view thereof, the rear elevational view being identical;
[0003] FIG. 3 is a left side elevational view thereof, the right side elevational view being identical;
[0004] FIG. 4 is a top plan view thereof;
[0005] FIG. 5 is a bottom plan view thereof;
[0006] FIG. 6 is an enlarged portion view labeled, “6,” in FIG. 1; and,
[0007] FIG. 7 is an enlarged portion view labeled, “7,” in FIG. 2.
[0008] The dot-dashed lines depict the boundaries of the enlarged portion views of FIGS. 6 and 7 in FIGS. 1, 2, 6 and 7 and form no part of the claimed design.
Claims
The ornamental design for a stamp component for transferring microstructure, as shown and described.
Citation Information
Patent Citations
Transfer method of minute structure
JP2008227107A
Microstructure transfer device, stamp head unit, microstructure transfer stamp component, and microstructure integrated component transfer method
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