Furnace for substrate processing apparatus

USD1070797SActive Publication Date: 2025-04-15KOKUSAI DENKI KK
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Patent Information

Application Number
US29/849023
Authority / Receiving Office
US · United States
Patent Type
Designs(United States)
Current Assignee / Owner
Priority Date
2022-03-15
Filing Date
2022-08-08
Publication Date
2025-04-15
Estimated Expiration
2040-04-15

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Description

[0001] FIG. 1 is a front, top and left side perspective view of a furnace for substrate processing apparatus showing our new design;

[0002] FIG. 2 is a front elevational view thereof;

[0003] FIG. 3 is a rear elevational view thereof;

[0004] FIG. 4 is a right side elevational view thereof;

[0005] FIG. 5 is a left side elevational view thereof;

[0006] FIG. 6 is a top plan view thereof;

[0007] FIG. 7 is a bottom plan view thereof; and,

[0008] FIG. 8 is a cross-sectional view taken along line 8-8 in FIG. 6.

[0009] The broken lines are included for the purpose of illustrating portions of the article that form no part of the claimed design.

Claims

The ornamental design for a furnace for substrate processing apparatus, as shown and described.

Citation Information

Patent Citations

  • Heater of substrate processing apparatus

    USD823363S

  • Furnace opening structure, substrate processing apparatus and method of manufacturing semiconductor device

    US20230089509A1

  • Vertical furnace for the treatment of semiconductor substrates

    US6225602B1

  • Furnace for substrate processing apparatus

    USD1053156S

  • Processing tube for use in a semiconductor wafer heat processing apparatus

    USD406113S