Heat sink for memory module

USD1070863SActive Publication Date: 2025-04-15KINGSTON DIGITAL INC

Patent Information

Application Number
US29/863507
Authority / Receiving Office
US · United States
Patent Type
Designs(United States)
Current Assignee / Owner
Filing Date
2022-12-20
Publication Date
2025-04-15
Estimated Expiration
2040-04-15

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Description

[0001] FIG. 1 is a perspective view of a heat sink for memory module of the claimed design;

[0002] FIG. 2 is another perspective view thereof;

[0003] FIG. 3 is a front elevational view thereof;

[0004] FIG. 4 is a rear elevational view thereof;

[0005] FIG. 5 is a left side elevational view thereof;

[0006] FIG. 6 is a right side elevational view thereof;

[0007] FIG. 7 is a top plan view thereof;

[0008] FIG. 8 is a bottom plan view thereof; and,

[0009] FIG. 9 is an enlarged view illustrating the details of the dot-dash area “9” shown in FIG. 1.

[0010] The broken lines in the drawings depict portions of the heat sink for memory module that form no part of the claimed design.

[0011] The dot-dash lines in the figures represent the boundaries of the enlarged areas in which the dot-dash lines form no part of the claimed design.

Claims

The ornamental design for a heat sink for memory module, as shown and described.

Citation Information

Patent Citations

  • Heat sink for a printed circuit board

    US11570885B2

  • Heat sink for memory

    US20060268523A1

  • Data storage device

    US20230048165A1

  • Computer memory module

    USD1005295S

  • Heat sink for memory module

    USD1035597S

Cited By

  • Heat sink for memory module

    USD1080566S