Heat sink for memory module
Patent Information
- Application Number
- US29/863507
- Authority / Receiving Office
- US · United States
- Patent Type
- Designs(United States)
- Current Assignee / Owner
- Filing Date
- 2022-12-20
- Publication Date
- 2025-04-15
- Estimated Expiration
- 2040-04-15
Smart Images

Figure USD1070863-D00000_ABST
Description
[0001] FIG. 1 is a perspective view of a heat sink for memory module of the claimed design;
[0002] FIG. 2 is another perspective view thereof;
[0003] FIG. 3 is a front elevational view thereof;
[0004] FIG. 4 is a rear elevational view thereof;
[0005] FIG. 5 is a left side elevational view thereof;
[0006] FIG. 6 is a right side elevational view thereof;
[0007] FIG. 7 is a top plan view thereof;
[0008] FIG. 8 is a bottom plan view thereof; and,
[0009] FIG. 9 is an enlarged view illustrating the details of the dot-dash area “9” shown in FIG. 1.
[0010] The broken lines in the drawings depict portions of the heat sink for memory module that form no part of the claimed design.
[0011] The dot-dash lines in the figures represent the boundaries of the enlarged areas in which the dot-dash lines form no part of the claimed design.
Claims
The ornamental design for a heat sink for memory module, as shown and described.
Citation Information
Patent Citations
Heat sink for a printed circuit board
US11570885B2
Heat sink for memory
US20060268523A1
Data storage device
US20230048165A1
Computer memory module
USD1005295S
Heat sink for memory module
USD1035597S
Cited By
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