Wafer support of semiconductor manufacturing apparatus

Description

[0001] FIG. 1 is a front, top and right side perspective view of a wafer support of semiconductor manufacturing apparatus-showing our new design;

[0002] FIG. 2 is a front elevational view thereof;

[0003] FIG. 3 is a left side elevational view thereof;

[0004] FIG. 4 is a right side elevational view thereof;

[0005] FIG. 5 is a top plan view thereof;

[0006] FIG. 6 is a bottom plan view thereof.

[0007] FIG. 7 is a rear elevational view thereof;

[0008] FIG. 8 is a cross-sectional view taken along line 8-8 in FIG. 2;

[0009] FIG. 9 is a cross-sectional view taken along line 9-9 in FIG. 2;

[0010] FIG. 10 is an enlarged portion view taken from encircled portion labeled, “FIG. 10,” in FIG. 2;

[0011] FIG. 11 is a perspective view of FIG. 8, shown without broken line environment, for ease of illustration;

[0012] FIG. 12 is a front elevational view of FIG. 11;

[0013] FIG. 13 is a left side elevational view of FIG. 11;

[0014] FIG. 14 is a right side elevational view of FIG. 11;

[0015] FIG. 15 is a top plan view of FIG. 11;

[0016] FIG. 16 is a bottom plan view of FIG. 11; and,

[0017] FIG. 17 is a rear elevational view of FIG. 11.

[0018] The even dashed broken lines in the drawings are for the purpose of illustrating portions of the article that form no part of the claimed design.

[0019] The dot, dot dashed broken lines in the drawings are for the purpose of illustrating the boundaries of the enlarged portion view of FIG. 10 in FIGS. 2 and 10 and form no part of the claimed design.

[0020] The single dot dashed lines in the drawings represent the boundary between the part for which the design is claimed and the part not claimed.

Claims

The ornamental design for a wafer support of semiconductor manufacturing apparatus, as shown and described.

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