Headphone module

USD1090482SActive Publication Date: 2025-08-26TYMPHANY HK LTD
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Patent Information

Application Number
US29/907823
Authority / Receiving Office
US · United States
Patent Type
Designs(United States)
Current Assignee / Owner
Priority Date
2024-01-04
Filing Date
2024-01-09
Publication Date
2025-08-26
Estimated Expiration
2040-08-26

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Description

[0001] FIG. 1 is a front, left perspective view of a headphone module showing the new design;

[0002] FIG. 2 is a front elevation view thereof;

[0003] FIG. 3 is a rear elevation view thereof;

[0004] FIG. 4 is a left side view thereof;

[0005] FIG. 5 is a right side view thereof;

[0006] FIG. 6 is a top plan view thereof;

[0007] FIG. 7 is a bottom plan view thereof; and,

[0008] FIG. 8 is an alternative front elevation view thereof, with the ear cups in a retracted position.

[0009] The broken dashed lines form no part of the claimed design.

Claims

The ornamental design for a headphone module, as shown and described.

Citation Information

Patent Citations

  • Headphones

    CN308879614S

  • The main body of the headset

    CN309028304S

  • Communication device and system for connecting communication device to hearing protection equipment

    US11736855B1

  • Bluetooth headset for helmet having inter-communication function

    US20120077438A1

  • Bone conduction commjnications headset with hearing protection

    US20130202135A1