Dual-layered microneedle carrier

USD1090832SActive Publication Date: 2025-08-26LIN KENNETH SC
View PDF 14 Cites 0 Cited by

Patent Information

Application Number
US29/989600
Authority / Receiving Office
US · United States
Patent Type
Designs(United States)
Current Assignee / Owner
Filing Date
2025-02-13
Publication Date
2025-08-26
Estimated Expiration
2040-08-26

Smart Images

  • Figure USD1090832-D00000_ABST
    Figure USD1090832-D00000_ABST
Patent Text Reader
Need to check novelty before this filing date? Find Prior Art

Description

[0001] FIG. 1 is a top perspective view of a dual-layered microneedle carrier showing my design.

[0002] FIG. 2 is a bottom perspective view of the dual-layered microneedle carrier showing my design.

[0003] FIG. 3 is a front view of the dual-layered microneedle carrier showing my design.

[0004] FIG. 4 is a rear view of the dual-layered microneedle carrier showing my design;

[0005] FIG. 5 is a left side view of the dual-layered microneedle carrier showing my design.

[0006] FIG. 6 is a right-side view of the dual-layered microneedle carrier showing my design.

[0007] FIG. 7 is a top view of the dual-layered microneedle carrier showing my design; and,

[0008] FIG. 8 is a bottom view of the dual-layered microneedle carrier showing my design.

[0009] The dashed lines depict portions of the dual-layered microneedle carrier that form no part of the claimed design

Claims

The ornamental design for a dual-layered microneedle carrier as shown and described.

Citation Information

Patent Citations

  • Microneedle patch and method of manufacturing microneedle patch

    US20230302265A1

  • Medical transdermal patch

    USD670395S1

  • Process for making microneedles, microneedle arrays, masters, and replication tools

    US20090099537A1

  • Microneedles, Microneedle Arrays, Methods for Making, and Transdermal and / or Intradermal Applications

    US20100121307A1

  • Method for producing silicon microneedle arrays with holes and microneedle array

    US20130165872A1