Upper chamber for a plasma processing device

USD1094319SActive Publication Date: 2025-09-23HITACHI HIGH TECH CORP
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Patent Information

Application Number
US29/847251
Authority / Receiving Office
US · United States
Patent Type
Designs(United States)
Current Assignee / Owner
Priority Date
2022-02-10
Filing Date
2022-07-22
Publication Date
2025-09-23
Estimated Expiration
2040-09-23

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Description

[0001] FIG. 1 is a front, top and left side perspective view of an upper chamber for a plasma processing device according to the design;

[0002] FIG. 2 is a front view thereof;

[0003] FIG. 3 is a rear view thereof;

[0004] FIG. 4 is a right side view thereof;

[0005] FIG. 5 is a left side view thereof;

[0006] FIG. 6 is a top plan view thereof;

[0007] FIG. 7 is a bottom plan view thereof;

[0008] FIG. 8 is a cross-sectional view taken along line 8-8 of FIG. 2; and,

[0009] FIG. 9 is an enlarged view of the portion shown in box, labeled, “FIG. 9,” in FIG. 8.

[0010] The broken line box shown in FIG. 8 defines the enlarged portion view shown in FIG. 9 and forms no part of the claimed design.

Claims

The ornamental design for an upper chamber for a plasma processing device as shown and described.

Citation Information

Patent Citations

  • Plasma reactor with chamber wall temperature control

    US20130105085A1

  • Plasma thermal shield for heat dissipation in plasma chamber

    US20150170885A1

  • Universal vacuum chamber including equipment modules such as a plasma generating source, vacuum pumping arrangement and / or cantilevered substrate support

    US5820723A

  • Semiconductor processing equipment having tiled ceramic liner

    US6408786B1

  • Inner wall shield for a process chamber for manufacturing semiconductors

    USD491963S

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